ETC HAF2014

HAF2014
Silicon N Channel MOS FET Series
Power Switching
ADE-208-953 (Z)
1st.Edition
July 2000
This FET has the over temperature shut–down capability sensing to the junction temperature. This FET has
the built–in over temperature shut–down circuit in the gate area. And this circuit operation to shut–down
the gate voltage in case of high junction temperature like applying over power consumption, over current
etc.
Features
•
•
•
•
Logic level operation (4 to 6 V Gate drive)
High endurance capability against to the short circuit
Built–in the over temperature shut–down circuit
Latch type shut–down operation (Need 0 voltage recovery)
Outline
TO-220AB
4
D
Gate resistor
G
Tempe
rature
Sencing
Circuit
Latch
Circuit
Gate
Shut
down
Circuit
1
2
S
3
1. Gate
2. Drain
3. Source
4. Drain
HAF2014
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Drain to source voltage
VDSS
60
V
Gate to source voltage
VGSS
16
V
Gate to source voltage
VGSS
–2.5
V
Drain current
ID
40
A
80
A
40
A
50
W
Drain peak current
I D(pulse)
Body-drain diode reverse drain current
I DR
Note1
Note2
Channel dissipation
Pch
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
Note:
1. PW ≤ 10µs, duty cycle ≤ 1 %
2. Value at Ta = 25°C
Typical Operation Characteristics
Item
Symbol
Min
Typ
Max
Unit
Input voltage
VIH
3.5
—
—
V
VIL
—
—
1.2
V
Input current
I IH1
—
—
100
µA
Vi = 8V, VDS = 0
(Gate non shut down)
I IH2
—
—
50
µA
Vi = 3.5V, VDS = 0
I IL
—
—
1
µA
Vi = 1.2V, VDS = 0
Input current
I IH(sd)1
—
0.8
—
mA
Vi = 8V, VDS = 0
(Gate shut down)
I IH(sd)2
—
0.35
—
mA
Vi = 3.5V, VDS = 0
Shut down temperature
Tsd
—
175
—
°C
Channel temperature
Gate operation voltage
VOP
3.5
—
12
V
2
Test Conditions
HAF2014
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Drain current
I D1
15
—
—
A
VGS = 3.5V, VDS = 2V
Drain current
I D2
—
—
10
mA
VGS = 1.2V, VDS = 2V
Drain to source breakdown
voltage
V(BR)DSS
60
—
—
V
I D = 10mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GSS
16
—
—
V
I G = 300µA, VDS = 0
Gate to source breakdown
voltage
V(BR)GSS
–2.5
—
—
V
I G = –100µA, VDS = 0
Gate to source leak current
I GSS1
—
—
100
µA
VGS = 8V, VDS = 0
I GSS2
—
—
50
µA
VGS = 3.5V, VDS = 0
I GSS3
—
—
1
µA
VGS = 1.2V, VDS = 0
I GSS4
—
—
–100
µA
VGS = –2.4V, VDS = 0
I GS(op)1
—
0.8
—
mA
VGS = 8V, VDS = 0
I GS(op)2
—
0.35
—
mA
VGS = 3.5V, VDS = 0
I DSS
—
—
10
µA
VDS = 60 V, VGS = 0
Gate to source cutoff voltage VGS(off)
1.0
—
2.25
V
I D = 1mA, VDS = 10V
Static drain to source on state RDS(on)
resistance
—
25
33
mΩ
I D = 20A, VGS = 4V Note3
Static drain to source on state RDS(on)
resistance
—
15
20
mΩ
I D = 20A, VGS = 10V Note3
Forward transfer admittance
|yfs|
8
16
—
S
I D = 20A, VDS = 10V Note3
Output capacitance
Coss
—
940
—
pF
VDS = 10V , VGS = 0
f = 1 MHz
Turn-on delay time
t d(on)
—
10.7
—
µs
I D = 20A, VGS = 5V
Rise time
tr
—
66
—
µs
RL = 1.5Ω
Turn-off delay time
t d(off)
—
15.5
—
µs
Fall time
tf
—
19
—
µs
Body–drain diode forward
voltage
VDF
—
1
—
V
I F = 40A, VGS = 0
Body–drain diode reverse
recovery time
t rr
—
200
—
ns
I F = 40A, VGS = 0
Over load shut down
opration time Note4
t os1
Input current (shut down)
Zero gate voltage drain
current
diF/ dt =50A/µs
—
1
—
ms
VGS = 5V, VDD = 16V
Note:
3. Pulse test
4. Including the junction temperature rise of the over loaded condition.
See characteristic curve of HAF2005.
3
HAF2014
Main Characteristics
Power vs. Temperature Derating
Thermal shut down
200 Operation area
Drain Current I D (A)
Pch (W)
Channel Dissipation
Maximum Safe Operation Area
500
80
60
40
20
0
50
100
150
Case Temperature
50
1
20
DC
10
PW
Op
er
5
0
m
s
=
10
µs
m
s
at
ion
10
(T
2 Operation in this area c =
25
1 is limited by R DS(on)
°C
)
0.5 Ta = 25°C
0.3
200
10 µs
100
0.5 1 2
5 10 20
50 100
Drain to Source Voltage V DS (V)
Tc (°C)
Normalized Transient Thermal Impedance γs (t)
Normalized Transient Thermal Impedance vs. Pulse Width
3
Tc = 25°C
1
D=1
0.5
0.3
0.2
0.1
θch - c(t) = γs (t) • θ ch - c
θch - c = 2.5°C/W, Tc = 25°C
0.1
0.05
0.03
0.01
10 µ
PDM
0.02
1
lse
0.0 t pu
ho
1s
100 µ
PW
T
PW
T
1m
10 m
Pulse Width PW (S)
4
D=
100 m
1
10
HAF2014
Package Dimensions
As of January, 2001
Unit: mm
11.5 MAX
2.79 ± 0.2
10.16 ± 0.2
9.5
φ 3.6 -0.08
+0.1
1.26 ± 0.15
15.0 ± 0.3
6.4
18.5 ± 0.5
1.27
+0.2
–0.1
8.0
4.44 ± 0.2
7.8 ± 0.5
1.5 MAX
0.76 ± 0.1
2.54 ± 0.5
2.54 ± 0.5
14.0 ± 0.5
2.7 MAX
0.5 ± 0.1
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
TO-220AB
Conforms
Conforms
1.8 g
5
HAF2014
Cautions
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copyright, trademark, or other intellectual property rights for information contained in this document.
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intellectual property rights, in connection with use of the information contained in this document.
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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written approval from Hitachi.
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products.
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Copyright  Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
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6