ETC HN1B01FDW1T1/D

HN1B01FDW1T1
Complementary Dual
General Purpose
Amplifier Transistor
PNP and NPN Surface Mount
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•
•
•
•
High Voltage and High Current: VCEO = 50 V, IC = 200 mA
High hFE: hFE = 200400
Moisture Sensitivity Level: 1
ESD Rating - Human Body Model: 3A
ESD Rating - Machine Model: C
(6)
(5)
(4)
Q2
Q1
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
Collector-Base Voltage
V(BR)CBO
60
Vdc
Collector-Emitter Voltage
V(BR)CEO
50
Vdc
Emitter-Base Voltage
V(BR)EBO
7.0
Vdc
IC
200
mAdc
Collector Current - Continuous
(1)
(2)
6
THERMAL CHARACTERISTICS
Characteristic
Power Dissipation
5
4
12
Symbol
Max
Unit
PD
380
mW
Junction Temperature
TJ
150
°C
Storage Temperature
Tstg
- 55 to +150
°C
(3)
3
SC-74
CASE 318F
STYLE 3
MARKING DIAGRAM
R9 M
R9 = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device Package
Shipping
HN1B01FDW1T1
SC-74
3000/Tape & Reel
†The “T1” suffix refers to a 7 inch reel.
 Semiconductor Components Industries, LLC, 2003
May, 2003 - Rev. 1
Publication Order Number:
HN1B01FDW1T1/D
HN1B01FDW1T1
Q1: PNP
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Max
Unit
Collector-Emitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0)
V(BR)CEO
-50
-
Vdc
Collector-Base Breakdown Voltage (IC = 10 Adc, IE = 0)
V(BR)CBO
-60
-
Vdc
Emitter-Base Breakdown Voltage (IE = 10 Adc, IC = 0)
V(BR)EBO
-7.0
-
Vdc
Collector-Base Cutoff Current (VCB = 45 Vdc, IE = 0)
ICBO
-
-0.1
Adc
Collector-Emitter Cutoff Current
(VCE = 10 Vdc, IB = 0)
(VCE = 30 Vdc, IB = 0)
(VCE = 30 Vdc, IB = 0, TA = 80°C)
ICEO
-
-0.1
-2.0
-1.0
Adc
Adc
mAdc
DC Current Gain (Note 1)
(VCE = 6.0 Vdc, IC = 2.0 mAdc)
hFE
-200
-400
-0.15
-0.3
Vdc
Symbol
Min
Max
Unit
Collector-Emitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0)
V(BR)CEO
50
-
Vdc
Collector-Base Breakdown Voltage (IC = 10 Adc, IE = 0)
V(BR)CBO
60
-
Vdc
Emitter-Base Breakdown Voltage (IE = 10 Adc, IC = 0)
Characteristic
Collector-Emitter Saturation Voltage (IC = 100 mAdc, IB = 10 mAdc)
VCE(sat)
-
Q2: NPN
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
V(BR)EBO
7.0
-
Vdc
Collector-Base Cutoff Current (VCB = 45 Vdc, IE = 0)
ICBO
-
0.1
Adc
Collector-Emitter Cutoff Current
(VCE = 10 Vdc, IB = 0)
(VCE = 30 Vdc, IB = 0)
(VCE = 30 Vdc, IB = 0, TA = 80°C)
ICEO
-
0.1
2.0
1.0
Adc
Adc
mAdc
DC Current Gain (Note 1)
(VCE = 6.0 Vdc, IC = 2.0 mAdc)
hFE
200
400
0.15
0.25
Collector-Emitter Saturation Voltage (IC = 100 mAdc, IB = 10 mAdc)
VCE(sat)
1. Pulse Test: Pulse Width ≤ 300 s, D.C. ≤ 2%.
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2
Vdc
HN1B01FDW1T1
Typical Electrical Characteristics: PNP Transistor
1000
-1.5 mA
-2.0 mA
-160
hFE, DC CURRENT GAIN
IC, COLLECTOR CURRENT (mA)
-200
-1.0 mA
-120
-0.5 mA
-80
IB = -0.2 mA
-40
TA = 100°C
25°C
TA = 25°C
0
VCE = -1.0 V
10
0
-1
-2
-3
-4
-5
-6
-1
-10
VCE, COLLECTOR-EMITTER VOLTAGE (V)
-25 °C
100
VCE = -6.0 V
-100
-1000
VCE(sat), MAXIMUM COLLECTOR VOLTAGE (V)
hFE, DC CURRENT GAIN
TA = 100°C
-10
-1
IC/IB = 10
TA = 100°C
25°C
-0.01
-1
-10
-100
-1000
IC, COLLECTOR CURRENT (mA)
Figure 3. DC Current Gain
Figure 4. VCE(sat) versus IC
-10
-10,000
COMMON EMITTER
VCE = 6 V
-1
TA = 25°C
IC/IB = 10
IB, BASE CURRENT (A)
BASE-EMITTER SATURATION
VOLTAGE (V)
-25 °C
-0.1
IC, COLLECTOR CURRENT (mA)
-0.1
-1
-1000
Figure 2. DC Current Gain
1000
10
-1
-100
IC, COLLECTOR CURRENT (mA)
Figure 1. Collector Saturation Region
25°C
-25 °C
100
-1000
25°C
TA = 100°C
-25 °C
-100
-10
-1
-0.1
-10
-100
0 -0.1 -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9
-1000
IC, COLLECTOR CURRENT (mA)
VBE, BASE-EMITTER VOLTAGE (V)
Figure 5. VBE(sat) versus IC
Figure 6. Base-Emitter Voltage
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-1
HN1B01FDW1T1
Typical Electrical Characteristics: NPN Transistor
1000
6.0 mA
5.0 mA
240
2.0 mA
3.0 mA
hFE, DC CURRENT GAIN
IC, COLLECTOR CURRENT (mA)
280
200
1.0 mA
160
120
0.5 mA
80
IB = 0.2 mA
TA = 100°C
25°C
-25 °C
100
40
TA = 25°C
0
0
1
2
3
VCE = 1.0 V
10
4
5
6
1
10
VCE, COLLECTOR-EMITTER VOLTAGE (V)
hFE, DC CURRENT GAIN
TA = 100°C
25°C
-25 °C
100
VCE = 6.0 V
VCE(sat), MAXIMUM COLLECTOR VOLTAGE
(V)
Figure 8. DC Current Gain
1000
1
1
IC/IB = 10
TA = 100°C
25°C
0.1
-25 °C
0.01
10
100
1000
1
10
IC, COLLECTOR CURRENT (mA)
100
1000
IC, COLLECTOR CURRENT (mA)
Figure 9. DC Current Gain
Figure 10. VCE(sat) versus IC
10
10,000
COMMON EMITTER
VCE = 6 V
IB, BASE CURRENT (A)
BASE-EMITTER SATURATION
VOLTAGE (V)
1000
IC, COLLECTOR CURRENT (mA)
Figure 7. Collector Saturation Voltage
10
100
1
TA = 25°C
IC/IB = 10
0.1
TA = 100°C
25°C
1000
-25 °C
100
10
1
0.1
1
10
100
1000
0
IC, COLLECTOR CURRENT (mA)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
VBE, BASE-EMITTER VOLTAGE (V)
Figure 11. VBE(sat) versus IC
Figure 12. Base-Emitter Voltage
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4
0.9
1
HN1B01FDW1T1
INFORMATION FOR USING THE SC-74 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to ensure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self-align when
subjected to a solder reflow process.
0.094
2.4
0.037
0.95
0.074
1.9
0.037
0.95
0.028
0.7
0.039
1.0
inches
mm
SC-74
SC-74 POWER DISSIPATION
one can calculate the power dissipation of the device which
in this case is 380 milliwatts.
The power dissipation of the SC-74 is a function of the
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RJA, the thermal resistance from
the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet for the SC-74 package, PD can be calculated as
follows:
PD =
PD =
150°C - 25°C
= 380 milliwatts
329°C/W
The 329°C/W for the SC-74 package assumes the use of
the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 380 milliwatts.
There are other alternatives to achieving higher power
dissipation from the SC-74 package. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad. Using a board material such
as Thermal Clad, an aluminum core board, the power
dissipation can be doubled using the same footprint.
TJ(max) - TA
RJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
SOLDER STENCIL GUIDELINES
SC-59, SC-74, SC-70/SOT-323, SOD-123, SOT-23,
SOT-143, SOT-223, SO-8, SO-14, SO-16, and SMB/SMC
diode packages, the stencil opening should be the same as
the pad size or a 1:1 registration.
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. For packages such as the
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HN1B01FDW1T1
SOLDERING PRECAUTIONS
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and will
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling.
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
TYPICAL SOLDER HEATING PROFILE
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density
board. The Vitronics SMD310 convection/infrared reflow
soldering system was used to generate this profile. The type
of solder used was 62/36/2 Tin Lead Silver with a melting
point between 177 -189 °C. When this type of furnace is
used for solder reflow work, the circuit boards and solder
joints tend to heat first. The components on the board are
then heated by conduction. The circuit board, because it has
a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may
be up to 30 degrees cooler than the adjacent solder joints.
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 13 shows a typical heating
profile for use when soldering a surface mount device to a
printed circuit board. This profile will vary among
soldering systems, but it is a good starting point. Factors
that can affect the profile include the type of soldering
system in use, density and types of components on the
board, type of solder used, and the type of board or
substrate material being used. This profile shows
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
STEP 2 STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
STEP 4
HEATING
ZONES 3 & 6
SOAK"
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6
VENT
205° TO 219°C
PEAK AT
SOLDER JOINT
170°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
150°C
150°C
140°C
100°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 13. Typical Solder Heating Profile
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STEP 7
COOLING
HN1B01FDW1T1
PACKAGE DIMENSIONS
SC-74
CASE 318F-05
ISSUE K
A
L
6
5
4
2
3
B
S
1
D
G
M
J
C
0.05 (0.002)
H
K
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM
LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F-01, -02, -03 OBSOLETE. NEW
STANDARD 318F-04.
DIM
A
B
C
D
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0649
0
10 0.0985 0.1181
MILLIMETERS
MIN
MAX
2.90
3.10
1.30
1.70
0.90
1.10
0.25
0.50
0.85
1.05
0.013
0.100
0.10
0.26
0.20
0.60
1.25
1.65
0
10 2.50
3.00
STYLE 3:
PIN 1. EMITTER 1
2. BASE 1
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
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HN1B01FDW1T1
Thermal Clad is a registered trademark of the Bergquist Company
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment:
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P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: [email protected]
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Phone: 81-3-5773-3850
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For additional information, please contact your local
Sales Representative.
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HN1B01FDW1T1/D