CS8101 Micropower 5.0 V, 100 mA Low Dropout Linear Regulator with RESET and ENABLE The CS8101 is a precision 5.0 V micropower voltage regulator with very low quiescent current (70 µA typ at 100 µA load). The 5.0 V output is accurate within ±2.0% and supplies 100 mA of load current with a typical dropout voltage of only 400 mV. Microprocessor control logic includes an ENABLE input and an active RESET. This combination of low quiescent current, outstanding regulator performance and control logic makes the CS8101 ideal for any battery operated, microprocessor controlled equipment. The active RESET circuit includes hysteresis, and operates correctly at an output voltage as low as 1.0 V. The RESET function is activated during the power up sequence or during normal operation if the output voltage drops outside the regulation limits by more than 200 mV typ. The logic level compatible ENABLE input allows the user to put the regulator into a shutdown mode where it draws only 20 µA typical of quiescent current. The regulator is protected against reverse battery, short circuit, over voltage, and thermal overload conditions. The device can withstand load dump transients making it suitable for use in automotive environments. The CS8101 is functionally equivalent to the National Semiconductor LP2951 series low current regulators. Features • 5.0 V ±2.0% Output • Low 70 µA Quiescent Current • Active RESET • ENABLE Input for ON/OFF and Active/Sleep Mode Control • 100 mA Output Current Capability • Fault Protection – +60 V Peak Transient Voltage – –15 V Reverse Voltage Short Circuit Thermal Overload • Low Reverse Current (Output to Input) • Internally Fused Leads Available in SO–20L Package http://onsemi.com TO–220 FIVE LEAD T SUFFIX CASE 314D 1 5 TO–220 FIVE LEAD TVA SUFFIX CASE 314K 1 TO–220 FIVE LEAD THA SUFFIX CASE 314A 1 5 SO–20L DWF SUFFIX CASE 751D 20 1 8 1 SO–8 D SUFFIX CASE 751 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 9 of this data sheet. Semiconductor Components Industries, LLC, 2001 April, 2001 – Rev. 13 1 Publication Order Number: CS8101/D CS8101 PIN CONNECTIONS TO–220 5 LEAD Pin 1. VOUT 2. ENABLE 3. GND 4. RESET 5. VIN Tab = GND VOUT 1 SO–8 VOUTSense ENABLE 8 ENABLE NC NC GND GND GND GND NC NC RESET VIN NC NC GND RESET 1 1 SO–20L 20 VOUT VIN NC GND GND GND GND NC NC NC VOUT VIN Current Source (Circuit Bias) Over Voltage Shutdown Internally connected on 5 lead TO–220 ENABLE Current Limit Sense + – Error Amplifier VOUT Sense Thermal Protection Bandgap Reference RESET + – Reset Comparator GND Figure 1. Block Diagram http://onsemi.com 2 CS8101 ABSOLUTE MAXIMUM RATINGS* Rating Value Unit Internally Limited – –15, 60 V Internally Limited – 2.0 kV Operating Temperature –40 to +125 °C Junction Temperature Range –40 to +150 °C Storage Temperature Range –55 to +150 °C 260 peak 230 peak °C °C Power Dissipation Peak Transient Voltage (46 V Load Dump @ VIN = 14 V) Output Current ESD Susceptibility (Human Body Model) Lead Temperature Soldering: Wave Solder (through hole styles only) (Note 1.) Reflow (SMD styles only) (Note 2.) 1. 10 second maximum. 2. 60 second maximum above 183°C. *The maximum package power dissipation must be observed. ELECTRICAL CHARACTERISTICS (6.0 V ≤ VIN ≤ 26 V; IOUT = 1.0 mA; –40 ≤ TA ≤ 125, –40°C ≤ TJ ≤ 150°C, unless otherwise noted.) Characteristic Test Conditions Min Typ Max Unit Output Voltage, VOUT 9.0 V < VIN < 16 V, 100 µA ≤ IOUT ≤ 100 mA 6.0 V < VIN < 26 V, 100 µA ≤ IOUT ≤ 100 mA 4.90 4.85 5.00 5.00 5.10 5.15 V V Dropout Voltage (VIN – VOUT) IOUT = 100 mA IOUT = 100 µA – – 400 100 600 150 mV mV Load Regulation VIN = 14 V, 100 µA ≤ IOUT ≤ 100 mA – 5.0 50 mV Line Regulation 6.0 < V < 26 V, IOUT = 1.0 mA – 5.0 50 mV Quiescent Current, (IQ) Active Mode IOUT = 100 µA, VIN = 6.0 V IOUT = 50 mA IOUT = 100 mA – – – 70 4.0 12 140 6.0 20 µA mA mA Quiescent Current, (IQ) Sleep Mode VOUT = OFF, VIN = 6.0 V, VENABLE = 2.0 V – 20 50 µA Ripple Rejection 7.0 ≤ VIN ≤ 17 V, IOUT = 100 mA, f = 120 Hz 60 75 – dB – 105 200 – mA 25 125 – mA 150 180 – °C Output Stage Current Limit Short Circuit Output Current VOUT = 0 V Thermal Shutdown – Overvoltage Shutdown VOUT ≤ 1.0 V 30 34 38 V Reverse Current VOUT = 5.0 V, VIN = 0 V – 100 200 µA – 0.6 1.4 1.4 2.0 – V V – 30 100 µA ENABLE Input (ENABLE) Threshold HIGH LOW (VOUT OFF) (VOUT ON) Input Current VENABLE = 2.4 V http://onsemi.com 3 CS8101 ELECTRICAL CHARACTERISTICS (continued) (6.0 V ≤ VIN ≤ 26 V; IOUT = 1.0 mA; –40 ≤ TA ≤ 125, –40°C ≤ TJ ≤ 150°C, unless otherwise noted.) Characteristic Test Conditions Min Typ Max Unit 4.525 4.500 4.75 4.70 VOUT – 0.05 VOUT – 0.075 V V Reset Functions (RESET) RESET Threshold HIGH (VRH) LOW (VRL) VOUT Increasing VOUT Decreasing RESET Hysteresis (HIGH – LOW) 25 50 100 mV Reset Output Leakage RESET = HIGH VOUT ≥ VRH – – 25 µA 1.0 V ≤ VOUT ≤ VRL, RRESET = 10 k VOUT, Power up, Power down, RRESET = 10 k – – 0.1 0.6 0.4 1.0 V V Output Voltage Low (VRLO) Low (VRPEAK) PACKAGE LEAD DESCRIPTION PACKAGE LEAD # TO–220 5 LEAD SO–20L SO–8 LEAD SYMBOL 1 20 1 VOUT – – 2 VOUTSENSE 2 1 3 ENABLE 3 4, 5, 6, 7 14, 15, 16, 17 4 GND 4 10 5 RESET – 2, 3, 8, 9, 11, 12, 13, 18 6,7 NC No Connection. 5 19 8 VIN Input voltage. FUNCTION 5.0 V, ±2.0%, 100 mA output. Kelvin connection which allows remote sensing of output voltage for improved regulation. If remote sensing is not required, connect to VOUT. Logic level switches output off when toggled HIGH. Ground. All GND leads must be connected to Ground. Active reset (accurate to VOUT ≥ 1.0 V) http://onsemi.com 4 CS8101 TYPICAL PERFORMANCE CHARACTERISTICS 0.6 0.5 Dropout Voltage 125C 0.4 25°C 0.3 –40°C 0.2 0.1 0 0 10 20 30 40 50 60 70 80 90 100 Load (mA) Figure 2. CS8101 Dropout Voltage vs. Load Over Temperature CIRCUIT DESCRIPTION VOLTAGE REFERENCE AND OUTPUT CIRCUITRY For 7.0 V < VIN < 26 V Output Stage Protection The output stage is protected against overvoltage, short circuit and thermal runaway conditions (Figure 3). VIN ENABLE VIN(H) > 30 V VRH VIN VOUT VOUT VRL (1) VRPEAK (2) VRPEAK VRLO RESET IOUT (1) = No Reset Delay Capacitor (2) = With Reset Delay Capacitor Load Dump Current Limit Short Circuit Figure 4. Circuit Waveform Figure 3. Typical Circuit Waveforms for Output Stage Protection ENABLE Function The ENABLE function switches the output transistor ON and OFF. When the voltage on the ENABLE lead exceeds 1.4 V typ, the output pass transistor turns off, leaving a high impedance facing the load. The IC will remain in Sleep mode, drawing only 50 µA, until the voltage on this input drops below the ENABLE threshold. If the input voltage rises above 30 V (e.g. load dump), the output shuts down. This response protects the internal circuitry and enables the IC to survive unexpected voltage transients. Should the junction temperature of the power device exceed 180°C (typ) the load current capability is reduced thereby preventing thermal overload. This thermal management function is an effective means to prevent die overheating since the load current is the principle heat source in the IC. RESET Function A RESET signal (low voltage) is generated as the IC powers up until VOUT is within 250 mV of the regulated output voltage, or when VOUT drops out of regulation, and is lower than 300 mV below the regulated output voltage. A hysteresis of 50 mV is included in the function to minimize oscillations. REGULATOR CONTROL FUNCTIONS The CS8101 contains two microprocessor compatible control functions: ENABLE and RESET (Figure 4). http://onsemi.com 5 CS8101 VT = RESET threshold. The circuit depicted in Figure 6 lets the microprocessor control its power source, the CS8101 regulator. An I/O port on the µP and the SWITCH port are used to drive the base of Q1. When Q1 is driven into saturation, the voltage on the ENABLE lead falls below its lower threshold. The regulator’s output is enabled. When the drive current is removed, the voltage on the ENABLE lead rises, the output is switched off and the IC moves into Sleep mode where it draws 50 µA (max). By coupling these two controls with the ENABLE lead, the system has added flexibility. Once the system is running, the state of the SWITCH is irrelevant as long as the I/O port continues to drive Q1. The microprocessor can turn off its own power by withdrawing drive current, once the SWITCH is open. This software control at the I/O port allows the microprocessor to finish key housekeeping functions before power is removed. The logic options are summarized in Table 1. The RESET output is an open collector NPN transistor, controlled by a low voltage detection circuit. The circuit is functionally independent of the rest of the IC thereby guaranteeing that the RESET signal is valid for VOUT as low as 1.0 V. 5.0 V to µP and System Power VOUT COUT RRST CS8101 to µP RESET Port RESET CRST Figure 5. RC Network for RESET Delay An external RC network on the lead (Figure 5) provides a sufficiently long delay for most microprocessor based applications. RC values can be chosen using the following formula: RTOTCRST –tDelay lnV VTVOUT RSTVOUT Table 1. Logic Control of CS8101 Output where: RRST = RESET Delay resistor RIN = µP port impedance RTOT = RRST in parallel with RIN CRST = RESET Delay capacitor tDelay = desired delay time VRST = VSAT of RESET lead (0.7 V @ turn – ON) Microprocessor I/O Drive Switch ENABLE Output ON Closed LOW ON Open LOW ON OFF Closed LOW ON Open HIGH OFF The I/O port of the microprocessor typically provides 50 µA to Q1. In automotive applications the SWITCH is connected to the ignition switch. APPLICATION NOTES VIN VBAT VOUT VCC 0.1 µF CS8101 500 kΩ ENABLE GND COUT RRST RESET µP RESET CRST Q1 100 kΩ 500 kΩ 100 kΩ SWITCH Figure 6. Microprocessor Control of CS8101 Using External Switching Transistor Q1 http://onsemi.com 6 I/O Port CS8101 STABILITY CONSIDERATIONS the greatest oscillation. This represents the worst case load conditions for the regulator at low temperature. Step 4: Maintain the worst case load conditions set in step 3 and vary the input voltage until the oscillations increase. This point represents the worst case input voltage conditions. Step 5: If the capacitor is adequate, repeat steps 3 and 4 with the next smaller valued capacitor. A smaller capacitor will usually cost less and occupy less board space. If the output oscillates within the range of expected operating conditions, repeat steps 3 and 4 with the next larger standard capacitor value. Step 6: Test the load transient response by switching in various loads at several frequencies to simulate its real working environment. Vary the ESR to reduce ringing. Step 7: Raise the temperature to the highest specified operating temperature. Vary the load current as instructed in step 5 to test for any oscillations. The output or compensation capacitor helps determine three main characteristics of a linear regulator: start–up delay, load transient response and loop stability. VIN VOUT CIN* 0.1 µF CS8101 RRST COUT** 10 µF RESET ENABLE *CIN required if regulator is located far from the power supply filter. *COUT required for stability. Capacitor must operate at minimum temperature expected. Figure 7. Test and Application Circuit Showing Output Compensation Once the minimum capacitor value with the maximum ESR is found, a safety factor should be added to allow for the tolerance of the capacitor and any variations in regulator performance. Most good quality aluminum electrolytic capacitors have a tolerance of ± 20% so the minimum value found should be increased by at least 50% to allow for this tolerance plus the variation which will occur at low temperatures. The ESR of the capacitor should be less than 50% of the maximum allowable ESR found in step 3 above. The capacitor value and type should be based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution, but, if the circuit operates at low temperatures (–25°C to –40°C), both the value and ESR of the capacitor will vary considerably. The capacitor manufacturers data sheet usually provides this information. The value for the output capacitor COUT shown in Figure 7 should work for most applications, however it is not necessarily the optimized solution. To determine an acceptable value for COUT for a particular application, start with a tantalum capacitor of the recommended value and work towards a less expensive alternative part. Step 1: Place the completed circuit with a tantalum capacitor of the recommended value in an environmental chamber at the lowest specified operating temperature and monitor the outputs with an oscilloscope. A decade box connected in series with the capacitor will simulate the higher ESR of an aluminum capacitor. Leave the decade box outside the chamber, the small resistance added by the longer leads is negligible. Step 2: With the input voltage at its maximum value, increase the load current slowly from zero to full load while observing the output for any oscillations. If no oscillations are observed, the capacitor is large enough to ensure a stable design under steady state conditions. Step 3: Increase the ESR of the capacitor from zero using the decade box and vary the load current until oscillations appear. Record the values of load current and ESR that cause CALCULATING POWER DISSIPATION IN A SINGLE OUTPUT LINEAR REGULATOR The maximum power dissipation for a single output regulator (Figure 8) is: PD(max) VIN(max) VOUT(min)IOUT(max) VIN(max)IQ (1) where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current for the application, and IQ is the quiescent current the regulator consumes at IOUT(max). Once the value of PD(max) is known, the maximum permissible value of RΘJA can be calculated: RJA 150°C TA PD (2) The value of RΘJA can then be compared with those in the package section of the data sheet. Those packages with RΘJA’s less than the calculated value in equation 2 will keep the die temperature below 150°C. http://onsemi.com 7 CS8101 HEAT SINKS In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heatsink will be required. IIN VIN A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RΘJA. IOUT VOUT SMART REGULATOR Control Features RJA RJC RCS RSA (3) where: RΘJC = the junction–to–case thermal resistance, RΘCS = the case–to–heatsink thermal resistance, and RΘSA = the heatsink–to–ambient thermal resistance. RΘJC appears in the package section of the data sheet. Like RΘJA, it is a function of package type. RΘCS and RΘSA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heat sink manufacturers. IQ Figure 8. Single Output Regulator With Key Performance Parameters Labeled http://onsemi.com 8 CS8101 ORDERING INFORMATION† Device CS8101YD8 CS8101YDR8 CS8101YDWF20 CS8101YDWFR20 Description Shipping SO–8 95 Units/Rail SO–8 2500 Tape & Reel SO–20L 37 Units/Rail SO–20L 1000 Tape & Reel CS8101YT5 TO–220 FIVE LEAD STRAIGHT 50 Units/Rail CS8101YTVA5 TO–220 FIVE LEAD VERTICAL 50 Units/Rail CS8101YTHA5 TO–220 FIVE LEAD HORIZONTAL 50 Units/Rail †Contact your local sales representative for D2PAK package option. MARKING DIAGRAMS TO–220 FIVE LEAD T SUFFIX CASE 314D TO–220 FIVE LEAD TVA SUFFIX CASE 314K TO–220 FIVE LEAD THA SUFFIX CASE 314A SO–20L DWF SUFFIX CASE 751D SO–8 D SUFFIX CASE 751 8 20 8101 ALYW CS8101 AWLYYWW CS8101 AWLYWW CS8101 AWLYWW CS8101 AWLYWW 1 1 1 A WL, L YY, Y WW, W 1 = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 9 1 CS8101 PACKAGE DIMENSIONS TO–220 FIVE LEAD T SUFFIX CASE 314D–04 ISSUE E –T– –Q– SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. C B E A U L K J H G D DIM A B C D E G H J K L Q U 1234 5 5 PL 0.356 (0.014) M T Q M INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.067 BSC 0.087 0.112 0.015 0.025 0.990 1.045 0.320 0.365 0.140 0.153 0.105 0.117 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 1.702 BSC 2.210 2.845 0.381 0.635 25.146 26.543 8.128 9.271 3.556 3.886 2.667 2.972 TO–220 FIVE LEAD TVA SUFFIX CASE 314K–01 ISSUE O –T– SEATING PLANE C B –Q– E W A U F L 1 2 3 4 K 5 M D 0.356 (0.014) M J 5 PL T Q M G S R http://onsemi.com 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. DIM A B C D E F G J K L M Q R S U W INCHES MIN MAX 0.560 0.590 0.385 0.415 0.160 0.190 0.027 0.037 0.045 0.055 0.530 0.545 0.067 BSC 0.014 0.022 0.785 0.800 0.321 0.337 0.063 0.078 0.146 0.156 0.271 0.321 0.146 0.196 0.460 0.475 5° MILLIMETERS MIN MAX 14.22 14.99 9.78 10.54 4.06 4.83 0.69 0.94 1.14 1.40 13.46 13.84 1.70 BSC 0.36 0.56 19.94 20.32 8.15 8.56 1.60 1.98 3.71 3.96 6.88 8.15 3.71 4.98 11.68 12.07 5° CS8101 TO–220 FIVE LEAD THA SUFFIX CASE 314A–03 ISSUE E –T– B –P– Q C E OPTIONAL CHAMFER A U F L G 5X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. SEATING PLANE DIM A B C D E F G J K L Q S U K 5X J S D 0.014 (0.356) T P M M SO–8 D SUFFIX CASE 751–07 ISSUE W A 5 0.25 (0.010) S B 1 M Y M 4 K –Y– G C N X 45 SEATING PLANE –Z– 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M S http://onsemi.com 11 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 14.478 14.859 1.702 BSC 0.381 0.635 18.542 18.923 8.128 9.271 3.556 3.886 5.334 6.604 11.888 12.827 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. –X– 8 INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.570 0.585 0.067 BSC 0.015 0.025 0.730 0.745 0.320 0.365 0.140 0.153 0.210 0.260 0.468 0.505 J DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 CS8101 SO–20L DWF SUFFIX CASE 751D–05 ISSUE F A 20 X 45 h H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B 0.25 DIM A A1 B C D E e H h L B M T A S B S L A 18X e A1 SEATING PLANE C T MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0 7 PACKAGE THERMAL DATA Parameter TO–220 FIVE LEAD SO–8 SO–20L Unit RΘJC Typical 3.3 45 9.0 °C/W RΘJA Typical 50 165 55 °C/W SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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