CS9202
Micropower 3.3 V, 100 mA
Linear Regulator with
NOCAP
The CS9202 is a precision 3.3 V, 100 mA voltage regulator with low
quiescent current (450 A typ. @ 100 A load). The 3.3 V output is
accurate within ±2% and supplies 100 mA of load current.
The regulator is protected against reverse battery, short circuit, over
voltage, and over temperature conditions. The device can withstand
74 V peak transients making it suitable for use in automotive
environments. ON’s proprietary NOCAP solution is the first
technology which allows the output to be stable without the use of an
external capacitor. NOCAP is suitable for slow switching or steady
loads.
1
PIN CONNECTIONS AND
MARKING DIAGRAM
VOUT
NC
A
WL, L
YY, Y
WW, W
8
VIN
GND
GND
NC
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
VOUT
Over
Voltage
Shutdown
Package
Shipping†
CS9202YDF8
SO−8
98 Units/Rail
CS9202YDFR8
SO−8
2500 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Current Source
(Circuit Bias)
NOCAP
+
1
GND
GND
Device
VIN
SO−8
DF SUFFIX
CASE 751
8
CS920
ALYW2
Features
NOCAP
Low Quiescent Current (450 Α typ. @ 100 A load)
3.3 V, ±2% Output
100 mA Output Current Capability
Fault Protection
− 74 V Peak Transient Voltage
− −15 V Reverse Voltage
− Short Circuit
− Thermal Shutdown
− Overvoltage Shutdown
• Internally Fused Leads
•
•
•
•
•
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Current Limit
Sense
Sense(1)
− Error
Amplifier
Thermal
Shutdown
Bandgap
Reference
(1)
GND
Contact factory for optional Sense lead.
Figure 1. Block Diagram
Semiconductor Components Industries, LLC, 2004
May, 2004 − Rev. 12
1
Publication Order Number:
CS9202/D
CS9202
MAXIMUM RATINGS*
Parameter
Value
Unit
Internally Limited
−
−15 to 36
74
V
V
Internally Limited
−
ESD Susceptibility (Human Body Model)
4.0
kV
Package Thermal Resistance:
Junction−to−Case, RθJC
Junction−to−Ambient, RθJA
25
110
°C/W
°C/W
Junction Temperature
−40 to +150
°C
Storage Temperature
−55 to +150
°C
230 Peak
°C
Power Dissipation
Input Voltage (VIN):
DC
Peak Transient Voltage (60 V Load Dump @ VIN = 14 V)
Output Current
Lead Temperature Soldering:
Reflow (SMD styles only) Note 1
1. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
ELECTRICAL CHARACTERISTICS (4.5 V ≤ VIN ≤ 26 V, IOUT = 1.0 mA, −40°C ≤ TJ ≤ 125°C; unless otherwise stated.)
Parameter
Test Conditions
Min
Typ
Max
Unit
3.234
3.201
3.300
3.300
3.366
3.399
V
V
Output Stage
Output Voltage, VOUT
9.0 V < VIN < 16 V, 100 A ≤ IOUT ≤ 100 mA
4.5 V < VIN < 26 V, 100 A ≤ IOUT ≤ 100 mA
Load Regulation
VIN = 14 V, 100 A ≤ IOUT ≤ 100 mA
−
5
50
mV
Line Regulation
4.5 V < V < 26 V, IOUT = 1.0 mA
−
5
50
mV
Quiescent Current, (IQ)
IOUT = 100 A, VIN = 12 V
IOUT ≤ 50 mA
IOUT ≤ 100 mA
−
450
4
12
750
6
20
A
mA
mA
Ripple Rejection
7.0 V ≤ VIN ≤ 17 V, IOUT = 100 mA, f = 120 Hz
60
75
−
dB
−
105
200
−
mA
25
125
−
mA
150
180
−
°C
28
32
36
V
Current Limit
Short Circuit Output Current
VOUT = 0 V
Thermal Shutdown (Note 2)
Overvoltage Shutdown
−
VOUT ≤ 1.0 V
2. This parameter is guaranteed by design, but not parametrically tested in production.
PACKAGE LEAD DESCRIPTION
Package Lead Number
SO−8
Lead Symbol
1
VOUT
3.3 V, ± 2%, 100 mA output.
2, 3, 6, 7
GND
Ground.
4, 5
NC
No connection.
8
VIN
Input voltage.
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2
Function
CS9202
TYPICAL PERFORMANCE CHARACTERISTICS
3.320
14
3.315
−40°C
10
Output Voltage (V)
Load Regulation (mV)
12
8
6
125°C
4
25°C
2
0
100 mA
3.310
3.305
3.300
3.295
100 µA
20 mA
3.290
3.285
−2
0
10
20
30
40
50
60
70
80
90
3.280
−40 −20
100
0
20
8
125°C
100
120
140
0.9
Quiescent Current (mA)
Line Regulation (mV)
80
1
6
4
2
−40°C
0
25°C
−2
−4
125°C
0.8
0.7
0.6
25°C
0.5
0.4
−6
−8
6
8
10
12
14
16
18
20
22
24
−40°C
0.3
0
26
1
2
3
4
5
6
7
8
9
10
Output Current (mA)
Input Voltage (V)
Figure 5. Quiescent Current vs. Output
Current (Lightly Loaded) VIN = 14 V
Figure 4. Line Regulation vs. Input
Voltage IOUT = 100 µA
0.70
12
0.65
Quiescent Current (mA)
10
Quiescent Current (mA)
60
Figure 3. Output Voltage vs. Temperature
VIN = 14 V
Figure 2. Load Regulation vs. Output
Current VIN = 14 V
125°C
8
6
25°C
4
−40°C
2
0
40
Temperature (°C)
Output Current (mA)
−40°C
0.60
0.55
125°C
0.50
0.45
0.40
25°C
0.35
0
10
20
30
40
50
60
70
80
0.30
90 100
4
6
8
10 12
14
16
18
20
22
Input Voltage (V)
Output Current (mA)
Figure 7. Quiescent Current vs. Input
Voltage IOUT = 100 µA
Figure 6. Quiescent Current vs. Output
Current VIN = 14 V
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3
24 26
CS9202
CIRCUIT DESCRIPTION
> 32 V
VOLTAGE REFERENCE AND OUTPUT
CIRCUITRY
VIN
Output Stage Protection
VOUT
The output stage is protected against overvoltage, short
circuit and thermal runaway conditions (Figure 8).
If the input voltage rises above 32 V (typ), the output shuts
down. This response protects the internal circuitry and
enables the IC to survive unexpected voltage transients.
Should the junction temperature of the power device
exceed 180°C (typ) the power transistor is turned off.
Thermal shutdown is an effective means to prevent die
overheating since the power transistor is the principle heat
source in the IC.
IOUT
Load
Dump
Thermal
Shutdown
Figure 8. Typical Circuit Waveforms for Output
Stage Protection
VIN
C1 *
0.1 µF
Short
Circuit
VOUT
CS9202
GND
* C1 is required if regulator is distant from power source filter.
Figure 9. Application and Test Diagram
APPLICATION NOTES
STABILITY CONSIDERATIONS / NOCAP
NOCAP is an ON Semiconductor exclusive output stage
which internally compensates the regulator over
temperature, load and line variations without the need for an
expensive external capacitor
NOCAP is ideally suited for slow switching or steady
loads. If the load is characterized by transient current events,
an output storage capacitor may be needed. If this is the case,
the capacitor should be no larger than 100 nF. With loads
that require greater transient suppression, a regulator with a
traditional output stage (such as the CS8221) may be better
suited for proper operation.
Normally a linear regulator (with a slow lateral PNP in the
control loop) necessitates a large external compensation
capacitor at the output of the IC. The external capacitor is
also used to curtail offshoot, determine startup delay time
and load transient response.
Traditional regulators typically have low unity gain
bandwidth, display overshoot and poor ripple rejection.
Compensation is also an issue and depends on the external
capacitor value, ESR (Equivalent Series Resistance) and
board layout parasitics that all can create oscillations if not
properly accounted for.
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4
CS9202
CALCULATING POWER DISSIPATION IN A
SINGLE OUTPUT LINEAR REGULATOR
The value of RΘJA can then be compared with those in the
package section of the data sheet. Those packages with
RΘJA ’s less than the calculated value in equation 2 will keep
the die temperature below 150°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
The maximum power dissipation for a single output
regulator (Figure 10) is:
PD(max) {VIN(max) VOUT(min)} IOUT(max)
VIN(max)IQ
(1)
HEAT SINKS
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current for the
application, and
IQ is the quiescent current the regulator consumes at
IOUT(max).
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RΘJA:
Once the value of PD(max) is known, the maximum
permissible value of RΘJA can be calculated:
RJA 150°C TA
PD
IIN
RJA RJC RCS RSA
where:
RΘJC = the junction−to−case thermal resistance,
RΘCS = the case−to−heatsink thermal resistance, and
RΘSA = the heatsink−to−ambient thermal resistance.
(2)
IOUT
VIN
CS9202
(3)
RΘJC appears in the package section of the data sheet.
Like RΘJA, it too is a function of package type. RΘCS and
RΘSA are functions of the package type, heatsink and the
interface between them. These values appear in heat sink
data sheets of heat sink manufacturers.
VOUT
IQ
Figure 10. Single output regulator with key
performance parameters labeled.
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5
CS9202
PACKAGE DIMENSIONS
SO−8
DF SUFFIX
CASE 751−07
ISSUE AB
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−X−
A
8
5
0.25 (0.010)
S
B
1
M
Y
M
4
K
−Y−
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 SEATING
PLANE
−Z−
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
J
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0
8
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 8 0.010
0.020
0.228
0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOCAP is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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Phone: 81−3−5773−3850
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For additional information, please contact your
local Sales Representative.
CS9202/D