ONSEMI NB6L11SMNR2G

NB6L11S
2.5 V 1:2 AnyLevelt Input
to LVDS Fanout Buffer /
Translator
The NB6L11S is a differential 1:2 Clock or Data Receiver and will
accept AnyLevelt input signals: LVPECL, CML, LVCMOS,
LVTTL, or LVDS. These signals will be translated to LVDS and two
identical copies of Clock or Data will be distributed, operating up to
2.0 GHz or 2.5 Gb/s, respectively. As such, the NB6L11S is ideal for
SONET, GigE, Fiber Channel, Backplane and other Clock or Data
distribution applications.
The NB6L11S has a wide input common mode range from
GND + 50 mV to VCC − 50 mV. Combined with the 50 W internal
termination resistors at the inputs, the NB6L11S is ideal for translating
a variety of differential or single−ended Clock or Data signals to
350 mV typical LVDS output levels.
The NB6L11S is the 2.5 V version of the NB6N11S and is offered in
a small 3 mm X 3 mm 16−QFN package. Application notes, models,
and support documentation are available at www.onsemi.com.
http://onsemi.com
MARKING
DIAGRAM*
16
1
1
QFN−16
MN SUFFIX
CASE 485G
A
L
Y
W
G
Features
•
•
•
•
•
•
•
•
Maximum Input Clock Frequency > 2.0 GHz
Maximum Input Data Rate > 2.5 Gb/s
1 ps Maximum of RMS Clock Jitter
Typically 10 ps of Data Dependent Jitter
380 ps Typical Propagation Delay
120 ps Typical Rise and Fall Times
Single Power Supply; VCC = 2.5 V " 5%
These are Pb−Free Devices
NB6L
11S
ALYW G
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
Q0
VTD
Q0
D
D
VOLTAGE (130 mV/div)
VTD
Q1
Q1
Figure 1. Logic Diagram
Device DDJ = 10 ps
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
TIME (58 ps/div)
Figure 2. Typical Output Waveform at 2.488 Gb/s with
PRBS 223−1 (VINPP = 400 mV; Input Signal DDJ = 14 ps)
© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 2
1
Publication Order Number:
NB6L11S/D
NB6L11S
Exposed Pad (EP)
VCC VCC VCC VCC
16
Q0
1
Q0
2
15
14
13
12 VTD
11 D
NB6L11S
Q1
3
10 D
Q1
4
9
5
6
7
VCC
NC
VEE
VTD
8
VEE
Figure 3. NB6L11S Pinout, 16−pin QFN (Top View)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
1
Q0
LVDS Output
Non−inverted D output. Typically loaded with 100 W receiver termination
resistor across differential pair.
2
Q0
LVDS Output
Inverted D output. Typically loaded with 100 W receiver termination resistor
across differential pair.
3
Q1
LVDS Output
Non−inverted D output. Typically loaded with 100 W receiver termination
resistor across differential pair.
4
Q1
LVDS Output
Inverted D output. Typically loaded with 100 W receiver termination resistor
across differential pair.
5
VCC
−
6
NC
No Connect.
7
VEE
Negative Supply Voltage.
8
VEE
9
VTD
−
10
D
LVPECL, CML, LVDS,
LVCMOS, LVTTL
Inverted Differential Clock/Data Input (Note 1).
11
D
LVPECL, CML, LVDS,
LVCMOS, LVTTL
Non−inverted Differential Clock/Data Input (Note 1).
12
VTD
−
Internal 50 W termination pin for D.
13
VCC
−
Positive Supply Voltage.
14
VCC
−
Positive Supply Voltage.
15
VCC
−
Positive Supply Voltage.
16
VCC
−
Positive Supply Voltage.
EP
Description
Positive Supply Voltage.
Negative Supply Voltage.
Internal 50 W termination pin for D.
Exposed pad. The exposed pad (EP) on the package bottom must be
attached to a heat−sinking conduit. The exposed pad may only be
electrically connected to VEE.
1. In the differential configuration when the input termination pins(VTD0/VTD0, VTD1/ VTD1) are connected to a common termination voltage
or left open, and if no signal is applied on D0/D0, D1/D1 input, then the device will be susceptible to self−oscillation.
http://onsemi.com
2
NB6L11S
Table 2. ATTRIBUTES
Characteristic
ESD Protection
Value
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity (Note 2)
> 2 kV
> 200 V
> 1 kV
Pb−Free Pkg
QFN−16
Flammability Rating Oxygen Index: 28 to 34
Level 1
UL 94 V−0 @ 0.125 in
Transistor Count
225
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
2. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
VCC
Positive Power Supply
GND = 0 V
VIN
Positive Input
GND = 0 V
IIN
Input Current Through RT (50 W Resistor)
Static
Surge
IOSC
Output Short Circuit Current
Line−to−Line (Q to Q)
Line−to−End (Q or Q to GND)
Q or Q to GND
Q to Q
TA
Operating Temperature Range
QFN−16
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient) (Note 3)
0 lfpm
500 lfpm
qJC
Thermal Resistance (Junction−to−Case)
1S2P (Note 3)
Tsol
Wave Solder
Condition 2
VIN ≤ VCC
Rating
Unit
3.8
V
3.8
V
35
70
mA
mA
mA
Pb−Free
Continuous
Continuous
12
24
−40 to +85
°C
−65 to +150
°C
QFN−16
QFN−16
41.6
35.2
°C/W
°C/W
QFN−16
4.0
°C/W
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. JEDEC standard multilayer board − 1S2P (1 signal, 2 power) with 8 filled thermal vias under exposed pad.
http://onsemi.com
3
NB6L11S
Table 4. DC CHARACTERISTICS, CLOCK INPUTS, LVDS OUTPUTS VCC = 2.375 V to 2.625 V, GND = 0 V,
TA = −40°C to +85°C
Symbol
ICC
Characteristic
Min
Power Supply Current (Note 8)
Typ
Max
Unit
30
45
mA
DIFFERENTIAL INPUTS DRIVEN SINGLE−ENDED (Figures 11, 12, 16, and 18)
Vth
Input Threshold Reference Voltage Range (Note 7)
GND +100
VCC − 100
mV
VIH
Single−ended Input HIGH Voltage
Vth + 100
VCC
mV
VIL
Single−ended Input LOW Voltage
GND
Vth − 100
mV
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (Figures 7, 8, 9, 10, 17, and 19)
VIHD
Differential Input HIGH Voltage
100
VCC
mV
VILD
Differential Input LOW Voltage
GND
VCC − 100
mV
VCMR
Input Common Mode Range (Differential Configuration)
GND + 50
VCC − 50
mV
VID
Differential Input Voltage (VIHD − VILD)
100
VCC
mV
RTIN
Internal Input Termination Resistor
40
60
W
450
mV
25
mV
1375
mV
1
25
mV
1425
1600
mV
50
LVDS OUTPUTS (Note 4)
VOD
Differential Output Voltage
250
DVOD
Change in Magnitude of VOD for Complementary Output States (Note 9)
VOS
Offset Voltage (Figure 15)
DVOS
Change in Magnitude of VOS for Complementary Output States (Note 9)
VOH
Output HIGH Voltage (Note 5)
VOL
Output LOW Voltage (Note 6)
0
1
1125
0
900
1075
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. LVDS outputs require 100 W receiver termination resistor between differential pair. See Figure 14.
5. VOHmax = VOSmax + ½ VODmax.
6. VOLmax = VOSmin − ½ VODmax.
7. Vth is applied to the complementary input when operating in single−ended mode.
8. Input termination pins open, D/D at the DC level within VCMR and output pins loaded with RL = 100 W across differential.
9. Parameter guaranteed by design verification not tested in production.
http://onsemi.com
4
NB6L11S
Table 5. AC CHARACTERISTICS VCC = 2.375 V to 2.625 V, GND = 0 V; (Note 10)
−40°C
Symbol
Characteristic
Min
VOUTPP
Output Voltage Amplitude (@ VINPPmin) fin ≤ 1.0 GHz
(Figure 4)
fin= 1.5 GHz
fin= 2.0 GHz
220
200
170
350
300
270
fDATA
Maximum Operating Data Rate
1.5
2.5
tPLH,
tPHL
Differential Input to Differential Output
Propagation Delay
250
tSKEW
Duty Cycle Skew (Note 11)
Within Device Skew (Note 16)
Device−to−Device Skew (Note 15)
8
5
30
tJITTER
RMS Random Clock Jitter (Note 13)
0.5
0.5
6
7
10
Deterministic Jitter (Note 14)
fin = 1.0 GHz
fin = 1.5 GHz
fDATA = 622 Mb/s
fDATA = 1.5 Gb/s
fDATA = 2.488 Gb/s
VINPP
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 12)
tr
tf
Output Rise/Fall Times @ 250 MHz
(20% − 80%)
Typ
450
100
Q, Q
70
25°C
Max
120
Min
Typ
220
200
170
350
300
270
1.5
2.5
250
45
25
100
85°C
Max
450
8
5
30
Min
Typ
220
200
170
350
300
270
1.5
2.5
250
45
25
100
8
5
30
0.5
0.5
6
7
10
VCC−
GND
100
170
70
120
Max
mV
Gb/s
450
ps
45
25
100
ps
0.5
0.5
6
7
10
VCC−
GND
100
170
70
120
Unit
ps
VCC−
GND
mV
170
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
10. Measured by forcing VINPPmin with 50% duty cycle clock source and VCC − 1400 mV offset. All loading with an external RL = 100 W across
“D” and “D” of the receiver. Input edge rates 150 ps (20%−80%).
11. See Figure 13 differential measurement of tskew = |tPLH − tPHL| for a nominal 50% differential clock input waveform @ 250 MHz.
12. Input voltage swing is a single−ended measurement operating in differential mode.
13. RMS jitter with 50% Duty Cycle input clock signal.
14. Deterministic jitter with input NRZ data at PRBS 223−1 and K28.5.
15. Skew is measured between outputs under identical transition @ 250 MHz.
16. The worst case condition between Q0/Q0 and Q1/Q1 from either D0/D0 or D1/D1, when both outputs have the same transition.
OUTPUT VOLTAGE AMPLITUDE (mV)
400
350
300
−40°C
250
85°C
200
25°C
150
100
50
0
0
0.5
1
1.5
2
2.5
INPUT CLOCK FREQUENCY (GHz)
Figure 4. Output Voltage Amplitude (VOUTPP) versus
Input Clock Frequency (fin) and Temperature (@ VCC = 2.5 V)
http://onsemi.com
5
3
VOLTAGE (63.23 mV/div)
NB6L11S
Device DDJ = 10 ps
TIME (58 ps/div)
Figure 5. Typical Output Waveform at 2.488 Gb/s with PRBS 223−1 and OC48 mask
(VINPP = 100 mV; Input Signal DDJ = 14 ps)
RC
RC
1.25 kW
1.25 kW
Dx
50 W
1.25 kW
1.25 kW
I
VTDx
VTDx
50 W
Dx
Figure 6. Input Structure
http://onsemi.com
6
NB6L11S
VCC = 3.3 V
or 2.5 V
VCC = 2.5 V
NB6L11S
D
Zo = 50 W
LVPECL
Driver
VCC = 3.3 V
or 2.5 V
VCC = 2.5 V
50 W*
VTD
VTD
50 W*
VTD
LVDS
Driver
50 W*
Zo = 50 W
NB6L11S
D
Zo = 50 W
VTD
50 W*
Zo = 50 W
D
D
VTD = VTD
VTD = VTD = VCC − 2.0 V
GND
GND
GND
Figure 7. LVPECL Interface
VCC = 2.5 V
CML
Driver
Figure 8. LVDS Interface
VCC = 3.3 V
or 2.5 V
VCC = 2.5 V
VCC = 2.5 V
NB6L11S
D
Zo = 50 W
VCC
VTD
Zo = 50 W
VTD
50 W*
VTD
HSTL
Driver
50 W*
VTD
Zo = 50 W
D
VTD = VTD = VCC
GND
GND
GND
Figure 9. Standard 50 W Load CML Interface
VCC = 2.5 V
D
VTD = VTD = GND or VDD/2
Depending on Driver.
VCC = 2.5 V
NB6L11S
D
GND
VCC = 2.5 V
Zo = 50 W
50 W*
VTD
50 W*
Figure 10. HSTL Interface
VCC = 2.5 V
Zo = 50 W
VTD
LVTTL
Driver
VTD
VTD
50 W*
D
NB6L11S
D
50 W*
50 W*
D
2.5 kW*
GND
NB6L11S
D
50 W*
Zo = 50 W
LVCMOS
Driver
GND
1.5 kW*
GND
GND
GND
GND
VTD = OPEN
D = GND
VTD = VTD = OPEN
D = GND
Figure 11. LVCMOS Interface
Figure 12. LVTTL Interface
*RTIN, Internal Input Termination Resistor.
http://onsemi.com
7
GND
NB6L11S
D
VINPP = VIH(D) − VIL(D)
D
Q
VOUTPP = VOH(Q) − VOL(Q)
Q
tPHL
tPLH
Figure 13. AC Reference Measurement
Q
LVDS
Driver
Device
Zo = 50 W
D
100 W
Q
Zo = 50 W
LVDS
Receiver
Device
D
Figure 14. Typical LVDS Termination for Output Driver and Device Evaluation
QN
VOH
VOS
VOD
VOL
QN
Figure 15. LVDS Output
D
D
VIH
Vth
VIL
D
D
Vth
Figure 16. Differential Input Driven
Single−Ended
Figure 17. Differential Inputs Driven
Differentially
VCC
VCC
VIHmax
Vthmax
D
VIL
VILmax
VCMR
Vth
VIH
VINPP = VIHD − VILD
VIL
VIHmin
Vthmin
GND
VIH(MAX)
D
VIH
VILmin
GND
Figure 18. Vth Diagram
VIL(MIN)
Figure 19. VCMR Diagram
http://onsemi.com
8
NB6L11S
ORDERING INFORMATION
Package
Shipping †
NB6L11SMNG
QFN−16, 3 X 3 mm
(Pb−Free)
123 Units / Rail
NB6L11SMNR2G
QFN−16, 3 X 3 mm
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
9
NB6L11S
PACKAGE DIMENSIONS
16 PIN QFN
CASE 485G−01
ISSUE C
D
PIN 1
LOCATION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
A
B
ÇÇ
ÇÇ
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
0.15 C
TOP VIEW
0.15 C
(A3)
0.10 C
A
16 X
0.08 C
SIDE VIEW
SEATING
PLANE
A1
SOLDERING FOOTPRINT*
C
D2
16X
0.575
0.022
e
L
5
NOTE 5
EXPOSED PAD
8
4
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.65
1.85
3.00 BSC
1.65
1.85
0.50 BSC
0.18 TYP
0.30
0.50
3.25
0.128
0.30
0.012
EXPOSED PAD
9
E2
16X
K
12
1
16
16X
13
b
0.10 C A B
0.05 C
1.50
0.059
3.25
0.128
e
BOTTOM VIEW
0.50
0.02
NOTE 3
0.30
0.012
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NB6L11S/D