TCA62735AFLG TOSHIBA CMOS INTEGRATED CIRCIUTS SILICON MONOLITHIC TCA62735AFLG Charge Pump type DC/DC Converter for White LED Driver The TCA62735AFLG is a charge pump type DC/DC Converter specially designed for constant current driving of White LED. This IC can outputs LED current 120mA or more to 2.8-4.2V input. This IC observes the power-supply voltage and the output voltage, and does an automatic change to the best of step up mode 1, 1.5 or 2 times. It is possible to prolong the battery longevity to its maximum. This IC is especially for driving back light white LEDs in LCD of PDA, Cellular Phone, or Handy Terminal Equipment. This device is Pb-free product. VQFN16-P-0404-0.65 Weight: 0.016 g (Typ.) Characteristics • • • • • • • • Fabricating with CMOS Process • Output Open Detection Function • Thermal Shut Down Function (TSD) Package : VQFN16-P-0404-0.65 Input Voltage : 2.8V (Min) Switching Frequency : 1MHz (Typ.) Output Drive Current Capability : Greater than 120mA 4 Channels Built in Constant Sink Current Drivers (3 or 4 LEDs can be driven.) Sink Current Adjustment by External Resistance Soft Start Function 1/18 2007-06-21 TCA62735AFLG ILED4 ILED3 ILED2 ILED1 Pin Assignment (top view) CTL1 C2− CTL2 C1− C1+ C2+ VIN CTL0 VOUT GND ISET EN Explanation of Terminals No Symbol Function 1 EN 2 CTL0 3 CTL1 4 CTL2 5 ISET Resistance connection terminal for setting up output current. 6 VOUT Output terminal. 7 VIN 8 C1+ 9 C1− 10 C2− 11 C2+ 12 GND 13 ILED4 14 ILED3 15 ILED2 16 ILED1 Logic input terminal. (input a chip enable signal) EN = ”H” → Operation mode, EN = ”L” → Shutdown mode Logic input terminal. (Selection of an output number) Please refer to the truth table on page 15. Power supply terminal. Capacitance connection terminal for charge pump. GND terminal. Constant Sink Current Driver terminal. 2/18 2007-06-21 TCA62735AFLG Block Diagram C2+ VIN C2– C1+ C1– Charge pump Circuit Feed Back Circuit Up Converting Time Change VOUT Feed Back ILED1 EN ILED2 CTL0 CTL1 ILED3 Control Logic ILED4 CTL2 Constant Current Regulator GND ISET 3/18 2007-06-21 TCA62735AFLG I/O Equivalent Circuits 1. ILED1~4 2. ISET VIN ILED1~4 ISET 3. EN, CTL0, CTL1, CTL2 4. VOUT VIN VIN VOUT EN,CTL0,CTL1,CTL2 5. C1+, C2+ 6. C1- C1- C1+, C2+ 7. C2- C2- 4/18 2007-06-21 TCA62735AFLG Absolute Maximum Ratings (Ta = 25°C if without notice) Characteristics Symbol Ratings Unit Power Supply Voltage VIN −0.3~+6.0 V VIN(LOGIC) −0.3~VIN+0.3(*1) mA C u r r e n t IOUT 200 mA/ch Operating Temperature Topr −40~+85 °C Storage Temperature Tstg −55~+150 °C Junction Temperature Tj 150 °C I n p u t V o l t a g e O u t p u t *1 : please do not exceed 6V. Recommended Operating Condition (Ta=-40°C to 85°C if without notice) Characteristics P o w e r Symbol Min Typ Max Unit VIN - 2.8 - 4.2 V VIN(LOGIC) EN,CTL0,CTL1,CTL2 0 - VIN V Capacitance for Charge Pump C1,C2 - 0.8 1.0 2.2 µF Capacitance for output COUT - 0.8 1.0 4.7 µF Capacitance for input CIN - 0.8 2.2 10.0 µF RSET - 8.2 12 47 kΩ Test Condition Min Typ Max Unit 2 time up converting 120 - - 1.5 time up converting 120 - - Logic R S u p p l y Test Condition Input Voltage r e s i s t a n c e S E T Electrical Characteristics DC-DC Regulator part (VIN=3.6V, Ta=25°C, if it is not specified.) C h a r a c t e r i s t i c s Symbol Test Circuits Output Current Ability IOUT(MAX) 1 1 time up converting 120 - - Consumption Current IIN(ON) 2 EN=”H”, RSET=47kΩ - 1 2 mA Stand By Consumption Current IIN(OFF) 2 EN=”L” - 0 1 µA VIH 3 EN, CTL0,CTL1,CTL2 VIN=2.8V~4.2V 0.7VIN - - - - 0.3VIN Logic Input V o l t a g e Logic T O T i g h V w VIL 3 EN,CTL0,CTL1,CTL2 VIN=2.8V~4.2V Current Ileak 3 EN,CTL0,CTL1,CTL2 - - 0.1 µA F r e q u e n c y fOSC 4 - - 1000 - kHz RON 1 1.5 time up converting - 5 10 Ω 4 LED Vf=3.6V, RSET=12kΩ VIN falling - 4.0 - V Test Condition Min Typ Max Unit RSET=47kΩ RSET=12kΩ RSET=8.2kΩ RSET=8.2kΩ VIN=3.6V center,VIN=2.8~4.2V IOUT=80mA EN="L" − − 5.1 19.6 28 0.61 2.5 5 − − − 1 − % − − 1 µA Input C l o c k H mA A L L o R O N 1X mode to 1.5X mode transition voltage VTRANS1X Constant Current Driver part (VIN=3.6V, Ta=25°C, if it is not specified.) Characteristics Symbol Test Circuits Constant Current Drive Setting ILED1~4 5 ISET Terminal Output Voltage VSET Constant Current Between Chs |ILED-LED-ERR| A c c u r a c y Between ICs |ILED-ERR| Constant Sink Current |∆ILED| Supply Voltage Regulation Output leakage current ILEAK1~4 5 5 5 5 5 5/18 mA 2007-06-21 V % % TCA62735AFLG Test Circuits Test Circuit1: Output Current Ability, TOTAL RON VIN=2.8V~4.2V CIN=2.2µF VIN COUT=1.0µF CTL2 C2+ CTL0 ILED4 GND ILED1 CTL1 ILED2 C2- ILED3 C2=1.0µF EN VOUT RON= V ISET C1- VOUT VIN C1+ C1=1.0µF V A ↓ (VIN×1.5) - VOUT IOUT=120mA IOUT Test Circuit2: Consumption Current, Stand By Consumption Current VIN=3.6V RSET=47kΩ A COUT=1.0µF ISET C1- VOUT VIN C1+ C1=1.0µF CTL2 CTL0 ILED1 C2+ ILED2 CTL1 ILED3 C2- ILED4 C2=1.0µF CIN=2.2µF EN 6/18 2007-06-21 TCA62735AFLG Test Circuit3: Logic Input Voltage, Logic Input Current VIN=2.8V~4.2V RSET=47kΩ CIN=2.2µF COUT=1.0µF ISET VOUT VIN C1+ C1=1.0µF VIN(LOGIC)=0V∼4.2V CTL2 A C2- CTL1 A C2+ CTL0 A EN A C1- VIN(LOGIC)=0V∼4.2V C2=1.0µF VIN(LOGIC)=0V∼4.2V ILED1 ILED2 ILED3 ILED4 VIN(LOGIC)=0V∼4.2V V V V V Test Circuit4: Clock Frequency, 1X mode to 1.5X mode transition voltage VIN=2.8V~4.2V RSET=12kΩ A COUT=1.0µF CTL0 GND ILED1 C2+ ILED2 CTL1 ILED3 F CTL2 C2- ILED4 C2=1.0µF ISET C1- VOUT VIN C1+ C1=1.0µF CIN=2.2µF V EN 7/18 2007-06-21 TCA62735AFLG Test Circuit5: Constant Current Drive Setting, ISET Terminal Output Voltage, Constant Current Accuracy Test Circuit5: Constant Sink Current Supply Voltage Regulation, Output leakage current RSET=47kΩ, 12kΩ, 8.2kΩ V VIN=2.8V~4.2V CIN=2.2µF COUT=1.0µF CTL2 CTL0 ILED1 C2+ ILED2 CTL1 ILED3 C2- ILED4 C2=1.0µF ISET C1- VOUT VIN C1+ C1=1.0µF A A A A EN 8/18 2007-06-21 TCA62735AFLG Reference data *This data is provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. Efficiency vs. IOUT 90 50 40 30 20 10 0 Efficiency (%) 80 VIN=3.0V VIN=3.3V VIN=3.6V LED Vf=3.3V Ta=25°C 70 60 50 40 30 VIN=3.9V 20 VIN=4.2V 10 4LEDs at 20mA LED Vf=3.51V Ta=25°C 0 0 20 40 60 80 IOUT (mA) 100 4.3 120 Quiescent Current vs. VIN 4.0 2.5 2.0 1.5 4LEDs at 30mA 4LEDs at 20mA 0.5 3.9 3.7 3.5 3.3 VIN (V) 3.1 2.9 2.7 VIN=2.7V 3.5 3.0 1.0 4.1 Quiescent Current vs. IOUT Current 4.0 Ta=25°C 3.5 Quiescent Current (mA) Efficiency vs. VIN 100 Quiescent Current (mA) Efficiency (%) 100 90 80 70 60 4LEDs at 5mA 0.0 VIN=3.6V VIN=4.3V 3.0 2.5 2.0 1.5 1.0 0.5 Ta=25°C 0.0 2.8 3.0 3.2 3.4 3.6 VIN (V) 3.8 4.0 4.2 9/18 20 40 60 80 100 IOUT Current (mA) 2007-06-21 120 TCA62735AFLG IOUT Current vs. VIN 160 4LEDs at 30mA 4LEDs at 20mA 4LEDs at 30mA 4LEDs at 20mA 35 Ta=25°C 4LEDs at 5mA 30 120 Ta=25°C 4LEDs at 5mA ILED Current (mA) IOUT Current (mA) 140 ILED Current vs. VIN 40 25 100 20 80 15 60 10 40 20 5 0 0 2.8 3.0 3.2 3.4 3.6 VIN (V) 3.8 4.0 4.2 2.8 3.0 3.2 3.4 3.6 VIN (V) 3.8 4.0 1x Mode Transition V oltage vs. ILED Current 4.1 Ta=25°C VIN_transition voltage (V) 4.0 3.9 3.8 3.7 3.6 LED Vf=3.2V,4c h ON 3.5 LED Vf=3.4V,4c h ON LED Vf=3.6V,4c h ON 3.4 5 10 15 20 ILED Current (mA ) Evaluation Circuit 25 30 VIN=2.8V~4.2V RSET=8.2kΩ~47kΩ A COUT=1.0µF C1- CTL2 ILED1 CTL0 ILED2 C2+ ILED3 CTL1 ILED4 C2- GND CIN=2.2µF ISET VOUT VIN C1+ C1=1.0µF C2=1.0µF V EN V A 10/18 • Evaluation conditions LED : NACW215 (NICHIA Corp.) : C1608JB1C225K (TDK Corp.) CIN COUT : C1608JB1C105K (TDK Corp.) C1 : C1608JB1C105K (TDK Corp.) C2 : C1608JB1C105K (TDK Corp.) 2007-06-21 4.2 TCA62735AFLG Method of setting ILED The current of the terminal ILED1 to 4 is set by resistance RSET connected with the terminal ISET. ILED can be set according to the next expression. 400 × 0.61[V] ILED[mA] = RSET[kΩ] RSET vs ILED 35 30 ILED(mA) 25 20 15 10 5 0 0 5 10 15 20 25 RSET (kΩ) 30 RSET 35 40 45 50 VIN=2.8V~4.2V CIN=2.2µF COUT=1.0µF CTL2 CTL0 GND ILED1 C2+ ILED2 CTL1 ILED3 C2- ILED4 C2=1.0µF ISET C1- VOUT VIN C1+ C1=1.0µF 11/18 EN 2007-06-21 TCA62735AFLG Method of Current Dimming control 1) Input PWM signal to SHDN terminal ILED can be set according to the next expression. ILED[mA] = 0.61[V] × 400 × ON Duty[%] RSET[kΩ] fPWM will recommend 100Hz. PWM Duty vs . IOUT 100 Ch1 : VPWM IOUT (mA) 80 Ch2 : IIN Ch3 : VOUT 60 40 20 Ch4 : IOUT 0 0 RSET=12kΩ 20 40 60 PWM Duty (%) 80 100 VIN=3.6V CIN=2.2µF COUT=1.0µF CTL2 CTL0 GND ILED1 C2+ ILED2 CTL1 ILED3 C2- ILED4 C2=1.0µF ISET C1- VOUT VIN C1+ C1=1.0µF EN PWM signal fPWM=100Hz, ON Duty50% *In this PWM control operation, This IC repeats ON/OFF. In this result, rush current is occur when ON timing with supplying charge to COUT. Please note it. 12/18 2007-06-21 TCA62735AFLG 2) Input analog voltage to ISET terminal 1. Precondition • Please set the range of the analog voltage input by 0 to 0.61V. 2. The maximum current is defined as αmA. R1[kΩ] + R2[kΩ] α[mA] = 0.61[V] × × 400 R1[kΩ] × R2[kΩ] 3. A minimum current is defined as βmA. β[mA] = 0.61[V] × 1 × 400 R2[kΩ] 4. ILED can be set according to the next expression. β[mA] - α[mA] ILED[mA] = VADJ[V] × 0.61[V] + α[mA] ILED vs. VADJ 25 ILED (mA) 20 15 10 5 0 0 0.2 0.4 0.6 VADJ (V) VADJ=0V~0.61V R2=47kΩ VIN=2.8V~4.2V R1=16kΩ CIN=2.2µF COUT=1.0µF C1- ISET CTL2 CTL0 GND ILED1 C2+ ILED2 CTL1 ILED3 C2- ILED4 C2=1.0µF VOUT C1+ VIN C1=1.0µF EN *This method is without repeating IC ON/OFF, and no need to consider holding rash current. 13/18 2007-06-21 TCA62735AFLG 3) Input Logic signal User can adjust ILED with Logic signal input as indicated in recommended circuit. The Resistor connected the ON-State Nch MOS Drain and RSET determines ILED. ILED can be set according to the next expression. ILED[mA] = 400 × 0.61[V] R[kΩ] About combined resistance R[kΩ] M1 M2 ON ON ON OFF OFF ON OFF OFF R[kΩ] RSET[kΩ] × R1[kΩ] × R2[kΩ] R1[kΩ]×RSET[kΩ] + R2[kΩ]×RSET[kΩ] + R1[kΩ]×R2[kΩ] RSET[kΩ] × R1[kΩ] RSET[kΩ] + R1[kΩ] RSET[kΩ] × R2[kΩ] RSET[kΩ] + R2[kΩ] RSET[kΩ] R2 M2 R1 M1 RSET VIN=2.8V~4.2V CIN=2.2µF CTL2 CTL0 GND ILED1 C2+ ILED2 CTL1 ILED3 C2- ILED4 C2=1.0µF VOUT VIN C1+ C1- ISET COUT=1.0µF C1=1.0µF EN *This method is without repeating IC ON/OFF, and no need to consider holding rash current. 14/18 2007-06-21 TCA62735AFLG Selection of an output number by CTL0, CTL1, and CTL2 Terminal Truth Table Input CTL2 L L L L H H H H L L L L H H H H CTL1 L L H H L L H H L L H H L L H H Output CTL0 L H L H L H L H L H L H L H L H EN H H H H H H H H L L L L L L L L ILED4 ILED3 ILED2 ILED1 Please do not set it. OFF ON OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF Attention in use *Soft Start Function This device is integrated Soft start function. When the power supply is ON or output is started to operate, the transition time is controlled in order to decrease the rush current. (Reference data: The output voltage is time 200µs of made from 0 to 4.0V at the VIN=2.8V time.) *Inrush Current of Input Current The inrush current flows when start-up and mode switching. (Reference data: Inrush current at CE1/CE2="L" to “H” is 500mA.) *Thermal Shut Down Function This device has Thermal Shutdown Function to protect from thermal damage when the output is shorted. The temperature to operate this function is set around from 140 to 160°C. (This is not guaranteed Value.) *The Selection of Capacitor for Charge Pump, Input and Output The input capacitor is effective to decrease the impedance of power supply and also input current is averaged. The input capacitor should be selected by impedance of power supply, it is better to choose with lower ESR (Equivalent Series Resistor). (i.e. ceramic capacitor etc.) Regarding to the capacitance values, it is recommended to choose in the range from 0.8 µF to 10 µF, however larger than 2.2 µF should be better. The output capacitor is effective to decrease the ripple noise of the output line. Also, it is better to choose the capacitor.) Regarding to the capacitance values, it is recommended to choose in the range from 0.8 µF to 4.7 µF, however larger than 1.0 µF should be better. The capacitor for charge pump operation is also selected the capacitor with low ESR. .) Regarding to the capacitance values, it is recommended to choose in the range from 0.8 µF to 2.2 µF, however larger than 1.0 µF should be better. 15/18 2007-06-21 TCA62735AFLG Package Dimensions Unit : mm VQFN16-P-0404-0.65 4.00Typ. 4.00Typ. 3.75Typ. 3.75Typ. 0.9MAX + 0.07 0.28 - 0.05 0.25MIN + 0.15 0.60 0.10 0.65Typ. Weight: 0.016 g (Typ.) 16/18 2007-06-21 TCA62735AFLG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 17/18 2007-06-21 TCA62735AFLG 18/18 2007-06-21