TB2924FG TOSHIBA Bi-CMOS Digital Integrated Circuit Silicon Monolithic TB2924FG Class D, 20 W × 2-channel (BTL) Low-Frequency Power Amplifier IC The TB2924FG is an audio output IC that employs the highly efficient class D method, developed for TV and home audio applications. The TB2924FG eliminates the need for heatsink(Note), thus allowing the design of an end product with a small footprint. It also incorporates a range of features, such as standby and muting, as well as different protective circuits. Features • Weight: 0.85 g (typ.) Output: POUT = 13 W × 2ch (typ.) BTL VCC = 12 V, RL = 4 Ω, THD = 10%, f = 1 kHz POUT = 7.5 W × 2ch (typ.) BTL VCC = 12 V, RL = 8 Ω, THD = 10%, f = 1 kHz POUT = 19.5 W × 2ch (typ.) BTL VCC = 15 V, RL = 4 Ω, THD = 10%, f = 1 kHz POUT = 21 W × 2ch (typ.) BTL VCC = 20 V, RL = 8 Ω, THD = 10%, f = 1 kHz • High efficiency: When output is 10 W η = 88% (VCC = 15 V, RL = 8 Ω) • Distortion: 0.1% (1 W output, f = 1 kHz) • Gain: 34dB (typ.) • Small flat package: HSOP36-P-450-0.65 • Muting/standby features • Thermal AGC features • Master and slave oscillation frequencies • Oscillation frequency: fsw = 200 kHz (typ.) • Operating supply voltage range: VCC (opr) = 11 V to 18V (Topr = 0°C to 75°C), (4 Ω) VCC (opr) = 11.4 V to 18 V (Topr = −20°C to 75°C) • Operating supply voltage range: VCC (opr) = 11 V to 20V (Topr = 0°C to 75°C), (8 Ω) VCC (opr) = 11.4 V to 20 V (Topr = −20°C to 75°C) • Protective circuits: thermal shutdown, short-circuit protection (load) These protection functions are intended to avoid some output short circuits or other abnormal conditions temporarily. These protect functions do not warrant to prevent the IC from being damaged. In case of the product would be operated with exceeded guaranteed operating ranges, these protection features may not operate and some output short circuits may result in the IC being damaged. The TB2924FG does not contain protection circuitry for shorts against VCC and ground. Extra care should be exercised when output pins serve as line output or adjacent pins are shorted together on the board. Note: Generally, the average power of the audio signal constitutes only one-fifth to one-tenth of the maximum output power, and in practice, will not exceed the permissible loss. However, care should be exercised so that it will not be really exceeded, considering the board’s thermal resistance, ambient temperature, average output power and so forth. Toshiba has verified that the TB2924FG works properly without a heatsink on the Toshiba PC board for up to 10-watt by 2-channel output typical (VCC = 15 V, RL = 8 Ω, THD = 10%, f = 1 kHz) with a sine-wave input. This product are sensitive to electrostatic discharge. When handling this product, protect the environment to avoid electrostatic discharge.(MM:±200V OK,HBM:±1500V OK) Install the product correctly. Otherwise, it may result in break down, damage and/or degradation to the product or equipment. 1 2006-01-25 TB2924FG Pin Assignment and Block Diagram NC 36 BOOT OUT PW OUT 2 (+) 2 (+) GND2 2 (−) 35 34 33 32 NC NC 31 30 Pre OSC FEEDFEED OSC OSC Pre GND2 SW IN2 2 (−) 2 (+) OUT IN VCC BOOT PW 2 (−) VCC2 29 28 27 26 25 24 23 NC 22 21 20 19 15 16 17 18 AGC VCC/2 VCC/2 AGC AGC VCC/2 VCC/2 AGC 1 2 3 VREG BOOT OUT 1 (+) 1 (+) 4 NC 5 6 PW OUT GND1 1 (−) 7 8 9 10 11 12 Pre Rip/F NC GND1 NC BOOT PW 1 (−) VCC1 13 14 IN1 FEED FEED STBY MUTE VCC/2 1 (−) 1 (+) *: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose. 2 2006-01-25 TB2924FG Pin Functions Pin No. Symbol 1 VREG 2 BOOT1 (+) 3 OUT1 (+) Description Reference supply voltage CH1 bootstrap pin (+) CH1 main amplifier output pin (+) 4 NC 5 PW GND1 GND for CH1 main amplifier output stage No-connection pin (not connected inside the IC) 6 OUT1 (−) CH1 main amplifier output pin (−) 7 NC 8 BOOT1 (−) CH1 bootstrap pin (−) 9 PW VCC1 Power supply pin for CH1 main amplifier output stage 10 Pre-GND1 Signal GND 11 Rip/F 12 NC No-connection pin (not connected inside the IC) 13 IN1 CH1 main amplifier input pin 14 FEED1 (−) CH1 main amplifier feedback pin (−) 15 FEED1 (+) CH1 main amplifier feedback pin (+) 16 STBY Standby control pin 17 MUTE Muting control pin 18 VCC/2 Midpoint potential pin 19 NC 20 Pre VCC Signal power supply pin 21 OSC IN PWM oscillation frequency input pin 22 OSC OUT PWM oscillation frequency output pin 23 FEED2 (+) CH2 main amplifier feedback pin (+) 24 FEED2 (−) CH2 main amplifier feedback pin (−) 25 IN2 26 OSC SW 27 Pre-GND2 Signal GND 28 PW VCC2 Power supply pin for CH2 main amplifier output stage 29 BOOT2 (−) CH2 bootstrap pin (−) 30 NC No-connection pin (not connected inside the IC) 31 NC No-connection pin (not connected inside the IC) 32 OUT2 (−) CH2 main amplifier output pin (−) 33 PW GND2 GND for CH2 main amplifier output stage 34 OUT2 (+) CH2 main amplifier output pin (+) 35 BOOT2 (+) 36 NC No-connection pin (not connected inside the IC) Ripple filter pin No-connection pin (not connected inside the IC) CH2 main amplifier input pin Oscillator on/off switch pin CH2 bootstrap pin (+) No-connection pin (not connected inside the IC) 3 2006-01-25 TB2924FG Supplementary Explanation (preliminary) <Control switches> 1. Pin 17 (muting switch) • Enable or disable audio muting. • The input amplifier is switched to a dummy amplifier within the IC, so that the audio output is muted with the amplifier still operating (PWM switched operation with 50% duty ratio). • Pin 17 outputs a voltage of approximately 2.4 V (approx. 4 VF) when open, while VTH for the built-in switch is lower than 1.8 V. Leaving the pin open, therefore, disables muting. • Logic “H” or open: Demute “L” (GND): Mute on 2. Pin 16 (standby switch) • When the voltage on pin 16 becomes 1.8 V or higher, the bias circuit activates, enabling the IC to operate. • Logic “H”: IC active “L” (GND): IC standby on <Others> 3. Thermal AGC Function and Thermal Shutdown Circuit • If the chip temperature exceeds the junction temperature (150°C min.), the thermal AGC function attenuates the input signal to maintain the chip temperature below the junction temperature. • If the chip temperature further increases, the thermal shutdown circuit activates. The chip recovers from the thermal shutdown state once the chip temperature falls below the junction temperature. 4. Master and Slave Oscillation Frequencies (OSC IN, OSC OUT, OSC SW) • When configuring a multichannel amplifier system with three or more channels, the oscillation frequency for a single IC can be used as a master and supplied to other ICs to prevent a beat due to a difference among switching frequencies.(Max.6ch (3ICs)) • The oscillators for slave ICs should be turned off using the OSC SW pin. “H”: Turn the oscillator on “L” (GND): Turn the oscillator off (Example with multiple ICs) Pre VCC 470 pF VCC/2 26 22 OSC SW OSC OUT 21 OSC IN Pre GND Open 26 22 OSC SW OSC OUT 21 OSC IN Slave IC Master IC 4 2006-01-25 TB2924FG 5. Reduction of Pop Noise Generated when Turning on and Off the Power Supply • To reduce pop noise, it is recommended to enable muting by setting pin 17 (mute switch) to logic low before turning on or off the power supply or standby mode. When turning on or off the standby mode (When the power supply is not turned on or off) Mute Pin Standby Pin Turn on or off the standby mode after turning on muting. When the power supply is off Mute Pin Standby Pin Power Supply Pin Turn off the power supply after turning on muting. Don’t turn off the standby mode before turning off the power supply. When the power supply is on Mute Pin Standby Pin Turn on the power supply after turning on muting. Timing charts may be simplified for explanatory purpose. 6. Board Mounting Consideration The switching of the TB2924FG is controlled with a rectangular-wave signal of approximately 200 kHz (typical). It is recommended to place the TB2924FG far from the tuner portion, etc. that might be affected. 5 2006-01-25 TB2924FG Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Power supply VCC 23 V Output current Io(peak) 8 A Power dissipation PD 14.7 (Note) W Operating temperature Topr −20 to 75 °C Storage temperature Tstg −55 to 150 °C Note: When the IC is used at 25°C or higher with infinite heat sink, reduce 117.6 mW per 1°C. The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage and/or degradation to any other equipment. Applications using the device should be designed such that each maximum rating will never be exceeded in any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this documents. 6 2006-01-25 TB2924FG Electrical Characteristics 1 (unless otherwise specified, VCC = 15 V, f = 1 kHz, Rg = 600 Ω, RL = 8 Ω, Ta = 25°C) Symbol Test Circuit ICCQ 1 POUT (1) Min Typ. Max Unit Vin = 0 ⎯ 55 70 mA 1 THD = 10% 9 10.5 ⎯ POUT (2) 1 VCC = 18 V, THD = 10% 12.5 15 ⎯ POUT (3) 1 RL = 4 Ω, VCC = 12 V, THD = 10% 11.5 13 ⎯ POUT (4) 1 RL = 4 Ω, VCC = 15 V, THD = 10% 18 19.5 ⎯ η (1) 1 POUT = 10 W 80 88 ⎯ η (2) 1 POUT = 1.0 W 63 66 ⎯ THD 1 POUT = 1 W ⎯ 0.1 0.3 % Voltage gain GV 1 VOUT = 0.775 Vrms 32.5 34 35.5 dB Channel Balance CB 1 VOUT = 0.775 Vrms −1.0 0 1.0 dB Input impedance RIN 1 ⎯ 30 ⎯ kΩ Crosstalk C.T. 1 Rg = 10 kΩ, VOUT = 0.775 Vrms −56 −65 ⎯ dB Output noise voltage VNO 1 Rg = 10 kΩ, B.W. = DIN AUDIO ⎯ 0.2 0.3 mVrms Switching frequency fsw 1 160 200 300 kHz ISTB 1 ⎯ 0.2 0.34 mA RDS-ON 1 ⎯ 0.3 ⎯ Ω Mute attenuation level ATTMUTE 1 0dB = VOUT = 0.775 Vrms −71 −78 ⎯ dB Control voltage for pin 17 muting switch VMUTE off 1 Not muted 1.8 ⎯ VCC VMUTE on 1 Muted GND ⎯ 0.9 Control voltage for pin 16 standby switch VSTB off 1 Amplifier operating (not standby) 1.8 ⎯ VCC VSTB on 1 Amplifier stopped (standby on) GND ⎯ 1.1 VOSC on 1 Oscillator operating 1.8 ⎯ VCC VOSC off 1 Oscillator stopped GND ⎯ 0.5 Characteristics Quiescent supply current Output power Efficiency Total harmonics distortion Standby supply current Power transistor ON resistance Control voltage for pin 26 oscillator on/off switch Test Condition ⎯ ⎯ During standby ⎯ 7 W % V V V 2006-01-25 TB2924FG Test Circuit Diagram 1 GND Test point VCC 2200 µF 330 µF C7 1 µF C8 BOOT OUT VREG 1 (+) 1 (+) 3 30 NC BOOT PW 2 (−) VCC2 Heat sink BOOT PW PW OUT1 NC 1 (−) VCC1 NC GND1 (−) 4 5 6 7 8 9 27 26 Pre GND1 Rip/F NC Heat sink 10 11 C21 C24 0.1 µF 4.7 µF OUT1 (+) Out C Out C C19 C20 RL 8 Ω 23 C12 470 pF 22 21 20 12 19 NC FEED FEED 1 (−) 1 (+) STBY MUTEVCC/2 IN1 13 1 µF L4 150 C18 L3 R4 560 pF C17 150 24 Out L C16 560 pF R3 25 Pre OSC IN2 FEED FEED OSC OSC Pre GND2 SW 2 (−) 2 (+) OUT IN VCC 0.1 µF Out L C15 0.47 µF 2 29 28 31 NC 14 15 16 17 18 Standby ON 100 k 1 µF R5 MUTE C28 ON C29 470 µF /50 V 32 C27 33 C11 C6 34 NC BOOT OUT PW OUT 2 (+) 2 (+) GND2 2 (−) 1 0.1 µF C5 35 1 µF C4 0.1 µF C26 1800 pF 150 C10 1800 pF R2 560 pF 150 C25 C3 1800 pF 560 pF R1 OSC OFF C2 C13 C14 Out L C1 L2 Out C L1 Out L Out C 1 µF OUT2 (−) IN2 1800 pF RL 8 Ω OUT2 (+) 36 330 µF LPF * C9 * LPF OUT1 (−) 1 µF C22 330 µF C23 IN1 LPF * * LPF Test point *: Output L (4 Ω): 10 µH (A7502BY-180M: TOKO, INC.) *: Output C (4 Ω): 1.0 µF *: Output L (8 Ω): 18 µH (A7502BY-180M: TOKO, INC.) *: Output C (8 Ω): 0.47 µF *: Components in the test circuits are only used to obtain and confirm the device characteristics. These components and circuits do not warrant to prevent the application equipment from malfunction or failure. *: In addition to the low-pass filters (chebyshev LPFs) shown above, a fourth low-pass filter with a cut-off frequency of 30 kHz is used for device characterization. 8 2006-01-25 TB2924FG Example Application Circuit GND VCC 1 µF 1000 µF 3 5 6 0.1 µF 7 8 9 OUT1 (+) ΟυτＣ RL 8 Ω 25 Pre GND1 Rip/F NC Heat sink 0.1 µF ΟυτＣ 26 24 23 470 pF 22 21 20 19 Pre OSC IN2 FEED FEED OSC OSC Pre GND2 SW 2 (−) 2 (+) OUT IN VCC PW OUT1 BOOT PW NC GND1 (−) NC 1 (−) VCC1 4 27 1800 pF 1 µF OSC OFF Heat sink 10 11 12 IN1 13 4.7 µF NC FEED FEED 1 (−) 1 (+) STBY MUTEVCC/2 14 15 16 17 18 220 µF 2 OutＬ 0.47 µF 1 30 NC BOOT PW 2 (−) VCC2 ON BOOT OUT VREG 1 (+) 1 (+) 29 28 31 NC Standby ON 100 k MUTE 1 µF 32 1800 pF 33 1800 pF 34 1 µF 35 NC BOOT OUT PW OUT 2 (+) 2 (+) GND2 2 (−) OutＬ 36 0.1 µF 0.1 µF IN2 1 µF OutＬ ΟυτＣ OutＬ ΟυτＣ OUT2 (−) 1800 pF RL 8 Ω OUT2 (+) OUT1 (−) 1 µF IN1 *: Output L (4 Ω ): 10 µH (A7502BY-180M: TOKO, INC.) *: Output C (4 Ω): 1.0 µF *: Output L (8 Ω): 18 µH (A7502BY-180M: TOKO, INC.) *: Output C (8 Ω): 0.47 µF *: The application circuits shown in this document are provided for reference purposes only. Especially, thorough evaluation is required on the phase of mass production design. Toshiba dose not grant the use of any industrial property rights with these examples of application circuits. *: When no signal is present, the power supply current varies with the characteristics of the output inductance (Out L). *: For all capacitors that are not indicated by the electrolytic capacitor symbol, use ceramic capacitors with an appropriate withstand voltage. 9 2006-01-25 TB2924FG Toshiba’s PC Board Layout (Mounting side) (Back side) 10 2006-01-25 TB2924FG DATAs for reference (Typ.) THD – POUT_f THD – POUT_VCC 50 30 f = 1 kHz RL = 8 Ω 10 1 k: 400 to 30 k 5 3 OUT2_10 k THD (%) THD (%) 50 VCC = 15 V 30 RL = 8 Ω 100: to 30 k 10 1 k: 400 to 30 k 5 10k: 400 to 3 30 kHz LPF OUT1_10 k 1 0.5 0.3 OUT2_1 k OUT1_1 k 1 0.5 0.3 0.1 0.1 0.05 0.03 0.05 0.03 0.03 0.1 OUT1_12 V OUT1_15 V OUT2_15 V OUT2_100 OUT1_100 0.01 0.01 30 kHz LPF 0.3 1 POUT 3 OUT2_12 V 10 30 0.01 0.01 100 0.03 0.1 0.3 (W) POUT 3 10 30 100 (W) POUT_VCC 25 (W) 20 POUT THD (%) THD –f 50 30 VCC = 15 V RL = 8 Ω 10 POUT = 1 W Filtr: to 30 k (f = 20~800) 5 400 to 30 k (f = 1 k to 2 k) 3 400 to 80 k (f = 4 k to 6 k) 400 to (f = 8 k to 40 k) 1 0.5 0.3 1 OUT2 f = 1 kHz RL = 8 Ω THD = 10% Analyzer filter: 400 Hz to 30 kHz Output: 30 k LPF OUT1 15 OUT2 10 0.1 5 0.05 0.03 OUT1 0.01 10 100 1000 f 10000 0 0 100000 5 10 (Hz) VCC 80 4 60 3 PD (W) 5 40 20 0 0 4 6 8 POUT 10 (V) 12 14 VCC = 15 V f = 1 kHz RL = 8 Ω 2 1 VCC = 15 V f = 1 kHz RL = 8 Ω 2 20 PD – POUT 100 η (％) η – POUT 15 0 0 16 (W) 2 4 6 POUT 11 8 10 12 (W) 2006-01-25 TB2924FG GV – f ICCQ – VCC 40 140 OUT1 35 120 30 100 15 5 (mA) 20 80 ICCQ 25 GV (dB) OUT2 10 RL = 8 Ω VIN = 0 V L = 18 µH 60 40 VCC = 15 V RL = 8 Ω VOUT = 0.775 Vrms Output: 30 k LPF 0 10 20 100 1000 f 10000 0 0 100000 5 10 (Hz) VCC ISTBY – VSTB 20 25 30 (V) ATTMUTE – VMUTE 60 20 VCC = 15 V 50 15 f=1k RL = 8 Ω VIN = 0 V 0 RL = 8 Ω VOUT = 1Vrms 20 (dB) (mA) ISTB 30 −20 ATTMUTE VCC = 15 V 40 −40 −80 10 0 0 −60 0.5 1.0 1.5 2.0 2.5 3.0 −100 0 3.5 0.5 1.0 VSTB (V) VMUTE C.T. – f f=1k RL = 8 Ω −10 Vrip = 0.775 Vrms VCC = 15 V −20 RL = 8 Ω Rg = 10 kΩ (dB) VOUT = 0.775 Vrms C.T. −40 C.T. (dB) (V) 0 VCC = 15 V −30 −40 −50 OUT1 → OUT2 −60 OUT2 → OUT1 −60 OUT2 → OUT1 −80 10 2.0 C.T. – Rg 0 −20 1.5 100 1000 f 10000 OUT1 → OUT2 −70 −80 10 100000 (Hz) 100 1000 Rg 12 10000 (Ω) 2006-01-25 TB2924FG VNO – VCC 0.5 0.4 VNO – Rg 1 RL = 8 Ω Rg = 10 kΩ RL = 8 Ω VCC = 15 V VIN = 0 V 0.8 (mVrms) 0.3 OUT1 VNO VNO (mVrms) Filt: DIN_AUDIO 0.2 0.6 0.4 OUT1 OUT2 0.1 0.2 OUT2 0 0 5 10 VCC 15 0 10 20 100 (V) Rg R.R. – f ripp (Ω) 0 Rg = 620 Ω RL = 8 Ω −10 Vrip = 0.775 Vrms VCC = 15 V −10 Ripple Rejection R.R. (dB) Ripple Rejection R.R. (dB) 10000 R.R. – Rg 0 −20 −30 −40 OUT2 −50 100 1000 f ripp Rg = 620 Ω RL = 8 Ω Vrip = 0.775 Vrms VCC = 15 V −20 −30 −40 OUT2 −50 OUT1 −60 10 1000 −60 10 10000 (Hz) OUT1 100 1000 Rg 10000 100000 (Ω) PD – Ta Allowable power dissipation PD (W) 16 14 (1) Infinite heat sink 12 10 8 6 4 (2) No heat sink (when mounted on Toshiba’s PC Board) 2 0 0 25 50 75 Ambient temperature 100 125 150 Ta (°C) 13 2006-01-25 TB2924FG Package Dimensions Weight: 0.85 g (typ.) 14 2006-01-25 TB2924FG Strong Electrical and Magnetic Fields Devices exposed to strong magnetic fields can undergo a polarization phenomenon in their plastic material, or within the chip, which gives rise to abnormal symptoms such as impedance changes or increased leakage current. Failures have been reported in LSIs mounted near malfunctioning deflection yokes in TV sets. In such cases the device’s installation location must be changed or the device must be shielded against the electrical or magnetic field. Shielding against magnetism is especially necessary for devices used in an alternating magnetic field because of the electromotive forces generated in this type of environment. 15 2006-01-25 TB2924FG 16 2006-01-25