VISHAY SI7407DN

Si7407DN
New Product
Vishay Siliconix
P-Channel 12-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
-12
rDS(on) (W)
ID (A)
0.012 @ VGS = -4.5 V
-15.6
0.016 @ VGS = -2.5 V
- 13.5
0.024 @ VGS = -1.8 V
- 11
D TrenchFETr Power MOSFETS: 1.8-V Rated
D New Low Thermal Resistance PowerPAKt
Package with Low 1.07-mm Profile
D Ultra-Low rDS(on)
APPLICATIONS
D Load Switch
D PA Switch
D Battery Switch
PowerPAKt 1212-8
S
S
3.30 mm
3.30 mm
1
S
2
S
3
G
G
4
D
8
D
7
D
6
D
D
5
P-Channel MOSFET
Bottom View
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
-12
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
V
- 15.6
-9.9
- 11.2
-7.2
ID
TA = 85_C
Pulsed Drain Current
IDM
continuous Source Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
Unit
TA = 85_C
Operating Junction and Storage Temperature Range
PD
A
-30
-3.2
-1.3
3.8
1.5
2.0
0.8
TJ, Tstg
W
_C
-55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Case
Steady State
Steady State
RthJA
RthJC
Typical
Maximum
26
33
65
81
1.9
2.4
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71912
S-22122—Rev. B, 25-Nov-02
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Si7407DN
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = -400 mA
-0.40
Typ
Max
Unit
-1.0
V
"100
nA
Static
Gate Threshold Voltage
VDS = 0 V, VGS = "8 V
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Diode Forward
Voltagea
-1
VDS = -9.6 V, VGS = 0 V, TJ = 85_C
-5
VDS v -5 V, VGS = -4.5 V
m
mA
-30
A
VGS = -4.5 V, ID = -15.6 A
0.009
0.012
VGS = -2.5 V, ID = -13.5 A
0.013
0.016
VGS = -1.8 V, ID = -5 A
0.019
0.024
gfs
VDS = -6 V, ID = -15.6 A
52
VSD
IS = -3.2 A, VGS = 0 V
-0.7
-1.2
39
59
rDS(on)
Forward Transconductancea
VDS = -9.6 V, VGS = 0 V
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
11
Turn-On Delay Time
td(on)
30
tr
50
75
200
300
165
250
60
90
Rise Time
Turn-Off Delay Time
VDS = -6 V, VGS = -4.5 V, ID = -15.6 A
VDD = -6 V, RL = 6 W
ID ^ -1 A, VGEN = -4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
6
IF = -3.2 A, di/dt = 100 A/ms
nC
45
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
30
30
VGS = 5 thru 2 V
25
I D - Drain Current (A)
I D - Drain Current (A)
25
20
1.5 V
15
10
5
20
15
10
TC = 125_C
5
25_C
1V
-55 _C
0
0
1
2
3
VDS - Drain-to-Source Voltage (V)
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2
4
0
0.0
0.4
0.8
1.2
1.6
2.0
VGS - Gate-to-Source Voltage (V)
Document Number: 71912
S-22122—Rev. B, 25-Nov-02
Si7407DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
5000
4000
0.03
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
0.04
VGS = 1.8 V
0.02
VGS = 2.5 V
Ciss
3000
2000
Coss
0.01
1000
VGS = 4.5 V
0.00
Crss
0
0
5
10
15
20
25
30
0
2
6
8
10
12
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
Gate Charge
On-Resistance vs. Junction Temperature
5
1.3
VDS = 6 V
ID = 15.6 A
4
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
4
3
2
1
0
0
9
18
27
36
VGS = 4.5 V
ID = 15.6 A
1.2
1.1
1.0
0.9
0.8
-50
45
-25
0
Qg - Total Gate Charge (nC)
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.04
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
30
TJ = 150_C
10
TJ = 25_C
1
0.0
0.03
ID = 15.6 A
0.02
ID = 5 A
0.01
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 71912
S-22122—Rev. B, 25-Nov-02
1.2
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
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Si7407DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power, Juncion-To-Ambient
0.4
50
ID = 250 mA
40
0.2
Power (W)
V GS(th) Variance (V)
0.3
0.1
30
20
0.0
10
-0.1
-0.2
-50
0
-25
0
25
50
75
100
125
150
0.01
0.1
1
TJ - Temperature (_C)
10
100
600
Time (sec)
Safe Operating Area, Junction-To-Ambient
100
rDS(on) Limited
IDM Limited
1 ms
I D - Drain Current (A)
10
10 ms
1
ID(on)
Limited
100 ms
1s
10 s
0.1
dc
TC = 25_C
Single Pulse
BVDSS Limited
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 65_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10- 4
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4
10- 3
10- 2
10- 1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 71912
S-22122—Rev. B, 25-Nov-02
Si7407DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
Single Pulse
0.05
0.02
0.01
10- 4
Document Number: 71912
S-22122—Rev. B, 25-Nov-02
10- 3
10- 2
Square Wave Pulse Duration (sec)
10- 1
1
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