SIMTEK STK14EX8-TF45

STK14EC8
512Kx8 Autostore nvSRAM
Preliminary
FEATURES
DESCRIPTION
• 15, 25, 45 ns Read Access and R/W Cycle Time
The Simtek STK14EC8 is a fast static RAM with a
non-volatile Quantum Trap storage element
included with each memory cell.
• Unlimited Read/Write Endurance
• Automatic Non-volatile STORE on Power Loss
• Non-Volatile STORE Under Hardware or Software
Control
• Automatic RECALL to SRAM on Power Up
The SRAM provides the fast access & cycle times,
ease of use and unlimited read & write endurance of
a normal SRAM.
Data transfers automatically to the non-volatile storage cells when power loss is detected (the STORE
operation). On power up, data is automatically
restored to the SRAM (the RECALL operation). Both
STORE and RECALL operations are also available
under software control.
• Unlimited RECALL Cycles
• 200K STORE Endurance
• 20-Year Non-volatile Data Retention
• Single 3.3V +0.3V, -0.6V Power Supply
The Simtek nvSRAM is the highest performance,
most reliable non-volatile memory available.
• Commercial, Industrial Temperatures
• 44-pin 400-mil TSOPII (RoHS-Compliant)
BLOCK DIAGRAM
VCC
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
ROW DECODER
POWER
CONTROL
STORE
STATIC RAM
ARRAY
2048 X 2048
RECALL
STORE/
RECALL
CONTROL
HSB
SOFTWARE
DETECT
INPUT BUFFERS
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
VCAP
Quantum Trap
2048 X 2048
A18 – A0
COLUMN I/O
COLUMN DEC
A 0 A 1 A 2 A 3 A 4 A5 A6 A7
G
E
W
This is a product in development that has fixed target specifications that are subject to change pending characterization results.
Simtek Confidential & Proprietary
1
Document Control #ML0060 Rev 1.0
April, 2007
Preliminary
STK14EC8
NC
1
44
HSB
NC
A0
2
43
NC
3
42
NC
A1
4
41
A2
A3
5
40
A18
A17
6
39
A16
A4
7
38
A15
E
8
37
G
DQ0
9
36
DQ7
DQ1
VCC
VSS
10
35
DQ6
34
12
33
VSS
VCC
DQ2
13
32
DQ5
DQ3
14
31
DQ4
W
A5
15
30
16
29
VCAP
A14
A6
17
28
A7
18
27
A8
19
26
A11
11
512K x8
A13
A12
A9
NC
20
25
A10
21
24
NC
NC
22
23
NC
44-Pin TSOP-II
(See mechanical drawing on Page 18)
PIN DESCRIPTIONS
Pin Name
I/O
Description
A18-A0
Input
Address: The 19 address inputs select one of 524,288 bytes in the nvSRAM array
DQ7-DQ0
I/O
Data: Bi-directional 8-bit data bus for accessing the nvSRAM
E
Input
Chip Enable: The active low E input selects the device
W
Input
Write Enable: The active low W enables data on the DQ pins to be written to the address
location latched by the falling edge of E
G
Input
Output Enable: The active low G input enables the data output buffers during read cycles.
De-asserting G high caused the DQ pins to tri-state.
VCC
Power Supply
Power: 3.0V, +20%, -10%
HSB
I/O
Hardware Store Busy: When low this output indicates a Store is in progress (also low during
power up while busy). When pulled low external to the chip, it will initiate a nonvolatile
STORE operation. A weak pull up resistor keeps this pin high if not connected. (Connection
Optional).
VCAP
Power Supply
Autostore Capacitor: Supplies power to the nvSRAM during a power loss to store data from
SRAM to nonvolatile storage elements.
VSS
Power Supply
Ground
NC
No Connect
This pin is not connected to the die. (Do not connect in design; reserved for future use)
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Preliminary
STK14EC8
ABSOLUTE MAXIMUM RATINGSa
Voltage on Input Relative to Ground . . . . . . . . . . . . . –0.5V to 4.1V
Voltage on Input Relative to VSS . . . . . . . . . .–0.5V to (VCC + 0.5V)
Voltage on DQ0-7 or HSB . . . . . . . . . . . . . . . .–0.5V to (VCC + 0.5V)
Temperature under Bias. . . . . . . . . . . . . . . . . . . . . .–55°C to 125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .–55°C to 140°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .–65°C to 150°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W
DC Output Current (1 output at a time, 1s duration) . . . . . . . 15mA
Note a: Stresses greater than those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Package Thermal Characteristics - See Website at http://www.simtek.com
DC CHARACTERISTICS
(VCC = 2.7V-3.6V)
COMMERCIAL
SYMBOL
MIN
ICC1
ICC2
ICC3
ICC4
ISB
INDUSTRIAL
PARAMETER
MAX
MIN
UNITS
NOTES
tAVAV = 15ns
tAVAV = 25ns
tAVAV = 45ns
Dependent on output loading and cycle
rate. Values obtained without output
loads.
MAX
Average VCC Current
70
65
50
75
70
52
mA
mA
mA
3
3
mA
All Inputs Don’t Care, VCC = max
Average current for duration of STORE
cycle (tSTORE)
Average VCC Current during STORE
13
13
mA
W ≥ (V CC – 0.2V)
All Other Inputs Cycling at CMOS Levels
Dependent on output loading and cycle
rate. Values obtained without output
loads.
Average VCAP Current during
AutoStore™ Cycle
3
3
mA
All Inputs Don’t Care
Average current for duration of STORE
cycle (tSTORE)
VCC Standby Current
(Standby, Stable CMOS Levels)
2
2
mA
Average VCC Current at tAVAV = 200ns
3V, 25°C, Typical
E ≥ (VCC -0.2V)
All Others VIN≤ 0.2V or ≥ (VCC-0.2V)
Standby current level after nonvolatile
cycle complete
IILK
Input Leakage Current
±1
±1
μA
VCC = max
VIN = VSS to VCC
IOLK
Off-State Output Leakage Current
±1
±1
μA
VCC = max
VIN = VSS to VCC, E or G ≥ VIH
VIH
Input Logic “1” Voltage
2.0
VCC + 0.3
2.0
VCC + 0.3
V
All Inputs
VIL
Input Logic “0” Voltage
VSS –0.5
0.8
VSS –0.5
0.8
V
All Inputs
VOH
Output Logic “1” Voltage
VOL
Output Logic “0” Voltage
2.4
2.4
TA
Operating Temperature
0
70
V
IOUT = – 2mA
0.4
V
IOUT = 4mA
–40
85
°C
0.4
VCC
Operating Voltage
2.7
3.6
2.7
3.6
V
3.3V nominal
VCAP
Storage Capacitance
37
57
37
57
μF
Between VCAP pin and VSS, 5V rated.
NVC
Nonvolatile STORE operations
200
200
K
DATAR
Data Retention
20
20
Years
Note: The HSB pin has IOUT = -10 uA for VOH of 2.4 V. This parameter is characterized but not tested.
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@ 55 deg C
Preliminary
STK14EC8
AC TEST CONDITIONS
Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 3V
Input Rise and Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 5ns
Input and Output Timing Reference Levels . . . . . . . . . . . . . . . 1.5V
Output Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Figure 1 and 2
CAPACITANCEb
SYMBOL
PARAMETER
(TA = 25°C, f = 1.0MHz)
MAX
UNITS
CONDITIONS
CIN
Input Capacitance
7
pF
ΔV = 0 to 3V
COUT
Output Capacitance
7
pF
ΔV = 0 to 3V
Note b: These parameters are guaranteed but not tested.
3.0V
577 Ohms
OUTPUT
30 pF
INCLUDING
SCOPE AND
FIXTURE
789 Ohms
Figure 1: AC Output Loading
3.0V
577 Ohms
OUTPUT
789 Ohms
5 pF
INCLUDING
SCOPE AND
FIXTURE
Figure 2: AC Output Loading for Tristate Specs (tHZ, tLZ, tWLQZ, tWHQZ, tGLQX, tGHQZ)
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Preliminary
STK14EC8
SRAM READ CYCLES #1 & #2
SYMBOLS
NO.
STK14EC8-15
STK14EC8-25
STK14EC8-45
MIN
MIN
MIN
PARAMETER
#1
#2
1
Alt.
tELQV
2
tAVAVc
tAVAV
3
tAVQVd
tAVQVd
tGLQV
4
tAXQXd
5
6
c
tAXQX
d
tELQX
7
tEHQZ
8
tGLQX
9
e
tGHQZ
e
MAX
15
Chip Enable Access Time
tRC
Read Cycle Time
tAA
Address Access Time
15
25
45
ns
tOE
Output Enable to Data Valid
10
12
20
ns
tOH
Output Hold after Address Change
3
3
3
ns
tLZ
Chip Enable to Output Active
3
3
3
ns
tHZ
Chip Disable to Output Inactive
tOLZ
Output Enable to Output Active
15
tOHZ
Output Disable to Output Inactive
10
tELICCH
tPA
Chip Enable to Power Active
11
tEHICCLb
tPS
Chip Disable to Power Standby
25
45
25
45
7
0
10
0
7
0
10
0
25
SRAM READ CYCLE #1: Address Controlledc,d,f
2
tAVAV
ADDRESS
3
tAVQV
5
tAXQX
DQ (DATA OUT)
DATA VALID
SRAM READ CYCLE #2: E Controlledc,f
2
tAVAV
ADDRESS
1
tELQV
6
11
tEHICCL
tELQX
7
tEHQZ
G
9
tGHQZ
4
8
tGLQX
tGLQV
DQ (DATA OUT)
DATA VALID
10
tELICCH
ACTIVE
ICC
STANDBY
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Simtek Confidential
ns
ns
15
ns
45
ns
0
15
ns
ns
15
0
W must be high during SRAM READ cycles.
Device is continuously selected with E and G both low
Measured ± 200mV from steady state output voltage.
HSB must remain high during READ and WRITE cycles.
E
MAX
tACS
b
Note c:
Note d:
Note e:
Note f:
UNITS
MAX
ns
Preliminary
STK14EC8
SRAM WRITE CYCLES #1 & #2
SYMBOLS
NO.
STK14EC8-15
STK14EC8-25
STK14EC8-45
MIN
MIN
MIN
PARAMETER
UNITS
#1
#2
Alt.
MAX
MAX
MAX
12
tAVAV
tAVAV
tWC
Write Cycle Time
15
25
45
ns
13
tWLWH
tWLEH
tWP
Write Pulse Width
10
20
30
ns
14
tELWH
tELEH
tCW
Chip Enable to End of Write
15
20
30
ns
15
tDVWH
tDVEH
tDW
Data Set-up to End of Write
5
10
15
ns
16
tWHDX
tEHDX
tDH
Data Hold after End of Write
0
0
0
ns
17
tAVWH
tAVEH
tAW
Address Set-up to End of Write
10
20
30
ns
18
tAVWL
tAVEL
tAS
Address Set-up to Start of Write
0
0
0
ns
19
tWHAX
tEHAX
tWR
Address Hold after End of Write
0
0
0
ns
20
t WLQZ e, g
tWZ
Write Enable to Output Disable
21
tWHQX
tOW
Output Active after End of Write
7
3
10
3
3
Note g: If W is low when E goes low, the outputs remain in the high-impedance state.
Note h: E or W must be ≥ VIH during address transitions.
SRAM WRITE CYCLE #1: W Controlledg,h
12
tAVAV
ADDRESS
19
tWHAX
14
tELWH
E
17
tAVWH
18
tAVWL
13
tWLWH
W
15
tDVWH
DATA IN
16
tWHDX
DATA VALID
20
tWLQZ
DATA OUT
21
tWHQX
HIGH IMPEDANCE
PREVIOUS DATA
SRAM WRITE CYCLE #2: E Controlledg,h
12
tAVAV
ADDRESS
18
tAVEL
14
tELEH
19
tEHAX
E
17
tAVEH
13
tWLEH
W
15
tDVEH
DATA IN
DATA OUT
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16
tEHDX
DATA VALID
HIGH IMPEDANCE
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Simtek Confidential
15
ns
ns
Preliminary
STK14EC8
AutoStore™/POWER-UP RECALL
SYMBOLS
STK14EC8
NO.
PARAMETER
Standard
Alternate
MIN
NOTES
20
ms
i
15
ms
j
2.65
V
Power-up RECALL Duration
22
tHRECALL
23
tSTORE
24
VSWITCH
Low Voltage Trigger Level
25
VCCRISE
VCC Rise Time
Note i:
Note j:
UNITS
MAX
tHLHZ
STORE Cycle Duration
μs
150
tHRECALL starts from the time VCC rises above VSWITCH
If an SRAM WRITE has not taken place since the last nonvolatile cycle, no STORE will take place
AutoStore™/POWER-UP RECALL
STORE occurs only if a
SRAM write has
happened.
No STORE occurs
without at least one
SRAM write.
VCC
24
VSWITCH
25
tVCCRISE
AutoStoreTM
23
tSTORE
23
tSTORE
POWER-UP RECALL
22
tHRECALL
22
tHRECALL
Read & Write Inhibited
POWER-UP
RECALL
BROWN OUT
TM
AutoStore
POWER-UP
RECALL
POWER DOWN
TM
AutoStore
Note: Read and Write cycles will be ignored during STORE, RECALL and while VCC is below VSWITCH
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Preliminary
STK14EC8
SOFTWARE-CONTROLLED STORE/RECALL CYCLEk,l
Symbols
STK14EC8-15
NO.
STK14CA8-25
STK14CA8-45
PARAMETER
UNITS NOTES
E Cont
G Cont
Alternate
26
tAVAV
tAVAV
tRC
STORE/RECALL Initiation Cycle Time
15
25
45
ns
27
tAVEL
tAVGL
tAS
Address Set-up Time
0
0
0
ns
28
tELEH
tGLGH
tCW
Clock Pulse Width
12
20
30
ns
29
tEHAX
tGHAX
Address Hold Time
1
1
1
ns
30
tRECALL
tRECALL
RECALL Duration
MIN
MAX
MIN
100
MAX
MIN
MAX
100
100
k,l
μs
Note k: The software sequence is clocked with E controlled READs or G controlled READs
Note l: The six consecutive addresses must be read in the order listed in the Mode Selection Table. W must be high during all six consecutive cycles.
SOFTWARE STORE/RECALL CYCLE: E CONTROLLEDl
ADDRESS
E
26
tAVAV
26
tAVAV
ADDRESS #1
ADDRESS #6
27
tAVEL
28
tELEH
29
tEHAX
G
23
tSTORE
/t
30
RECALL
HIGH IMPEDENCE
DQ (DATA)
DATA VALID
DATA VALID
SOFTWARE STORE/RECALL CYCLE: G CONTROLLEDl
ADDRESS
26
tAVAV
26
tAVAV
ADDRESS #1
ADDRESS #6
E
27
tAVGL
28
tGLGH
G
23
tSTORE
29
/
30
tRECALL
tGHAX
DQ (DATA)
DATA VALID
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DATA VALID
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HIGH IMPEDENCE
Preliminary
STK14EC8
HARDWARE STORE CYCLE
SYMBOLS
STK14EC8
PARAMETER
Standard
Alternate
31
1
tDELAY
tHLQZ
32
2
tHLHX
MIN
MAX
Hardware STORE to SRAM Disabled
1
70
Hardware STORE Pulse Width
15
UNITS
NOTES
μs
m
ns
Note m: On a hardware STORE initiation, SRAM operation continues to be enabled for time tDELAY to allow read/write cycles to complete
HARDWARE STORE CYCLE
32
t HLHX
HSB (IN)
23
t STORE
HSB (OUT)
31
tDELAY
DQ (DATA OUT)
SRAM Enabled
SRAM Enabled
Soft Sequence Commands
NO.
SYMBOLS
PARAMETER
STK14EC8
Standard
33
MIN
tSS
UNITS
NOTES
μs
n,o
MAX
Soft Sequence Processing Time
70
Note n: This is the amount of time that it takes to take action on a soft sequence command. Vcc power must remain high to effectively register
command.
Note o: Commands like Store and Recall lock out I/O until operation is complete which further increases this time. See specific command.
33
tSS
33
tSS
Soft Sequence Command
ADDRESS
ADDRESS #1
Soft Sequence Command
ADDRESS #6
ADDRESS #1
Vcc
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ADDRESS #6
Preliminary
STK14EC8
MODE SELECTION
E
W
G
A15-A0
Mode
I/O
Power
H
X
X
X
Not Selected
Output High Z
Standby
L
H
L
X
Read SRAM
Output Data
Active
L
L
X
X
Write SRAM
Input Data
Active
L
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x8B45
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
AutoStore Disable
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Active
L
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x8B46
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
AutoStore Enable
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Active
L
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x8FC0
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile Store
Output Data
Output Data
Output Data
Output Data
Output Data
Output High Z
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x4C63
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile Recall
Output Data
Output Data
Output Data
Output Data
Output Data
Output High Z
L
L
L
L
H
H
H
H
L
Active
Notes
q,r,s
q,r,s
q,r,s
ICC2
Active
q,r,s
Note q: The six consecutive addresses must be in the order listed. W must be high during all six consecutive cycles to enable a nonvolatile
cycle.
Note r: While there are 19 addresses on the STK14EC8, only the lower 16 are used to control software modes
Note s: I/O state depends on the state of G. The I/O table shown assumes G low
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Preliminary
STK14EC8
nvSRAM OPERATION
nvSRAM
SRAM WRITE
The STK14EC8 nvSRAM is made up of two functional components paired in the same physical cell.
These are the SRAM memory cell and a nonvolatile
QuantumTrap cell. The SRAM memory cell operates
like a standard fast static RAM. Data in the SRAM
can be transferred to the nonvolatile cell (the
STORE operation), or from the nonvolatile cell to
SRAM (the RECALL operation). This unique architecture allows all cells to be stored and recalled in
parallel. During the STORE and RECALL operations
SRAM READ and WRITE operations are inhibited.
The STK14EC8 supports unlimited read and writes
like a typical SRAM. In addition, it provides unlimited
RECALL operations from the nonvolatile cells and
up to 200K STORE operations.
A WRITE cycle is performed whenever E and W are
low and HSB is high. The address inputs must be
stable prior to entering the WRITE cycle and must
remain stable until either E or W goes high at the
end of the cycle. The data on the common I/O pins
DQ0-7 will be written into memory if it is valid tDVWH
before the end of a W controlled WRITE or tDVEH
before the end of an E controlled WRITE.
SRAM READ
The STK14EC8 stores data to nvSRAM using one
of three storage operations. These three operations
are Hardware Store (activated by HSB), Software
Store (activated by an address sequence), and
AutoStore (on power down).
The STK14EC8 performs a READ cycle whenever
E and G are low while W and HSB are high. The
address specified on pins A0-18 determine which of
the 524,288 data bytes will be accessed. When the
READ is initiated by an address transition, the outputs will be valid after a delay of tAVQV (READ cycle
#1). If the READ is initiated by E and G, the outputs
will be valid at tELQV or at tGLQV, whichever is later
(READ cycle #2). The data outputs will repeatedly
respond to address changes within the tAVQV
access time without the need for transitions on any
control input pins, and will remain valid until another
address change or until E or G is brought high, or W
and HSB is brought low.
vCC
vCC
W
Figure 3: AutoStore Mode
Document Control #ML0060 Rev 1.0
April, 2007
vCAP
10K Ohm
0.1µF
vCAP
It is recommended that G be kept high during the
entire WRITE cycle to avoid data bus contention on
common I/O lines. If G is left low, internal circuitry
will turn off the output buffers tWLQZ after W goes
low.
AutoStore OPERATION
AutoStore operation is a unique feature of Simtek
QuanumTrap technology that is enabled by default
on the STK14EC8.
During normal operation, the device will draw current from VCC to charge a capacitor connected to
the VCAP pin. This stored charge will be used by the
chip to perform a single STORE operation. If the
voltage on the VCC pin drops below VSWITCH, the
part will automatically disconnect the VCAP pin from
VCC. A STORE operation will be initiated with power
provided by the VCAP capacitor.
Figure 3 shows the proper connection of the storage
capacitor (VCAP) for automatic store operation.
Refer to the DC CHARACTERISTICS table for the
size of VCAP. The voltage on the VCAP pin is driven
to 5V by a charge pump internal to the chip. A pull
up should be placed on W to hold it inactive during
power up. This pull-up is only effective if the W signal is tri-state during power up. Many MPU’s will tristate their controls on power up. This should be verified when using the pullup. When the nvSRAM
comes out on power-on-recall, the MPU must be
active or the W held inactive until the MPU comes
out of reset.
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Preliminary
STK14EC8
To reduce unneeded nonvolatile stores, AutoStore
and Hardware Store operations will be ignored
unless at least one WRITE operation has taken
place since the most recent STORE or RECALL
cycle. Software initiated STORE cycles are performed regardless of whether a WRITE operation
has taken place. The HSB signal can be monitored
by the system to detect an AutoStore cycle is in
progress.
HARDWARE STORE (HSB) OPERATION
The STK14EC8 provides the HSB pin for controlling
and acknowledging the STORE operations. The
HSB pin can be used to request a hardware STORE
cycle. When the HSB pin is driven low, the
STK14EC8 will conditionally initiate a STORE operation after tDELAY. An actual STORE cycle will only
begin if a WRITE to the SRAM took place since the
last STORE or RECALL cycle. The HSB pin also
acts as an open drain driver that is internally driven
low to indicate a busy condition while the STORE
(initiated by any means) is in progress. This pin
should be externally pulled up if it is used to drive
other inputs.
SRAM READ and WRITE operations that are in
progress when HSB is driven low by any means are
given time to complete before the STORE operation
is initiated. After HSB goes low, the STK14CA8 will
continue to allow SRAM operations for tDELAY. During tDELAY, multiple SRAM READ operations may
take place. If a WRITE is in progress when HSB is
pulled low, it will be allowed a time, tDELAY, to complete. However, any SRAM WRITE cycles requested
after HSB goes low will be inhibited until HSB
returns high.
If HSB is not used, it should be left unconnected.
HARDWARE RECALL (POWER-UP)
During power up or after any low-power condition
(VCC<VSWITCH), an internal RECALL request will be
latched. When VCC once again exceeds the sense
voltage of VSWITCH, a RECALL cycle will automatically be initiated and will take tHRECALL to complete.
SOFTWARE STORE
Data can be transferred from the SRAM to the nonvolatile memory by a software address sequence.
The STK14EC8 software STORE cycle is initiated
by executing sequential E controlled or G controlled
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April, 2007
READ cycles from six specific address locations in
exact order. During the STORE cycle, previous data
is erased and then the new data is programmed into
the nonvolatile elements. Once a STORE cycle is
initiated, further memory inputs and outputs are disabled until the cycle is completed.
To initiate the software STORE cycle, the following
READ sequence must be performed:
1 Read Address
0x4E38
Valid READ
2 Read Address
0xB1C7 Valid READ
3 Read Address
0x83E0
4 Read Address
0x7C1F Valid READ
Valid READ
5 Read Address
0x703F
6 Read Address
0x8FC0 Initiate STORE Cycle
Valid READ
Once the sixth address in the sequence has been
entered, the STORE cycle will commence and the
chip will be disabled. It is important that READ
cycles and not WRITE cycles be used in the
sequence and that G is active. After the tSTORE cycle
time has been fulfilled, the SRAM will again be activated for READ and WRITE operation.
SOFTWARE RECALL
Data can be transferred from the nonvolatile memory to the SRAM by a software address sequence. A
software RECALL cycle is initiated with a sequence
of READ operations in a manner similar to the software STORE initiation. To initiate the RECALL cycle,
the following sequence of E controlled or G controlled READ operations must be performed:
1 Read Address
0x4E38
Valid READ
2 Read Address
0xB1C7 Valid READ
3 Read Address
0x83E0
4 Read Address
0x7C1F Valid READ
5 Read Address
0x703F
Valid READ
6 Read Address
0x4C63
Initiate RECALL Cycle
Valid READ
Internally, RECALL is a two-step procedure. First,
the SRAM data is cleared, and second, the nonvolatile information is transferred into the SRAM cells.
After the tRECALL cycle time, the SRAM will once
again be ready for READ or WRITE operations. The
RECALL operation in no way alters the data in the
nonvolatile storage elements. Care must be taken
so the controlling falling edge is glitch and ring free
so as not to double clock the read address.
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Simtek Confidential
Preliminary
STK14EC8
DATA PROTECTION
LOW AVERAGE ACTIVE POWER
The STK14EC8 protects data from corruption during
low-voltage conditions by inhibiting all externally initiated STORE and WRITE operations. The low-voltage condition is detected when VCC<VSWITCH.
CMOS technology provides the STK14EC8 with the
benefit of power supply current that scales with
cycle time. Less current will be drawn as the memory cycle time becomes longer than 50 ns. Figure 4
shows the relationship between ICC and READ/
WRITE cycle time. Worst-case current consumption
is shown for commercial temperature range,
VCC=3.6V, and chip enable at maximum frequency.
Only standby current is drawn when the chip is disabled. The overall average current drawn by the
STK14EC8 depends on the following items:
If the STK14CA8 is in a WRITE mode (both E and
W low) at power-up, after a RECALL, or after a
STORE, the WRITE will be inhibited until a negative
transition on E or W is detected. This protects
against inadvertent writes during power up or brown
out conditions.
NOISE CONSIDERATIONS
The STK14EC8 is a high-speed memory and so
must have a high-frequency bypass capacitor of
approximately 0.1 µF connected between VCC and
VSS, using leads and traces that are a short as possible. As with all high-speed CMOS ICs, careful
routing of power, ground, and signals will reduce circuit noise.
1
The duty cycle of chip enable
2
The overall cycle rate for operations
3
The ratio of READs to WRITEs
4
The operating temperature
5
The VCC Level
6
I/O Loading
Figure 4 - Current vs Cycle Time
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Simtek Confidential
STK14EC8
Preliminary
PREVENTING AUTOSTORE
The AutoStore function can be disabled by initiating
an AutoStore Disable sequence. A sequence of
READ operations is performed in a manner similar
to the software STORE initiation. To initiate the
AutoStore Disable sequence, the following
sequence of E controlled or G controlled READ
operations must be performed:
1 Read Address
0x4E38
Valid READ
2 Read Address
0xB1C7 Valid READ
3 Read Address
0x83E0
4 Read Address
0x7C1F Valid READ
Valid READ
5 Read Address
0x703F
Valid READ
6 Read Address
0x8B45
AutoStore Disable
This is a product in development that has fixed target specifications that are subject to change pending characterization results.
Simtek Confidential & Proprietary
The AutoStore can be re-enabled by initiating an
AutoStore Enable sequence. A sequence of READ
operations is performed in a manner similar to the
software RECALL initiation. To initiate the AutoStore
Enable sequence, the following sequence of E controlled or G controlled READ operations must be
performed:
1 Read Address
0x4E38
Valid READ
2 Read Address
0xB1C7 Valid READ
3 Read Address
0x83E0
4 Read Address
0x7C1F Valid READ
Valid READ
5 Read Address
0x703F
Valid READ
6 Read Address
0x4B46
AutoStore Enable
If the AutoStore function is disabled or re-enabled, a
manual STORE operation (Hardware or Software)
needs to be issued to save the AutoStore state
through subsequent power down cycles. The part
comes from the factory with AutoStore enabled, but
best design practice is to set the enable or disable
state during each power-up sequence and not
depend on this factory default condition. Simtek recommends users configure the part completely for
the specific application.
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Document Control #ML0060 Rev 1.0
April, 2007
Preliminary
STK14EC8
ORDERING INFORMATION
STK14EC8-T F 45 I TR
Packing Option
Blank = Tube
TR = Tape and Reel
Temperature Range
Blank = Commercial (0 to +70 C)
I = Industrial (-40 to +85 C)
Access Time
15 = 15 ns
25 = 25 ns
45 = 45 ns
Lead Finish
F = 100% Sn (Matte Tin) RoHS Compliant
Package
T = Plastic 44-pin 400 mil TSOP-II (32 mil pitch)
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April, 2007
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Simtek Confidential
Preliminary
STK14EC8
Ordering Codes
STK14EC8-TF15
STK14EC8-TF25
STK14EC8-TF45
STK14EC8-TF15TR
STK14EC8-TF25TR
STK14EC8-TF45TR
STK14EC8-TF15I
STK14EC8-TF25I
STK14EC8-TF45I
STK14EC8-TF15ITR
STK14EC8-TF25ITR
STK14EC8-TF45ITR
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
3V 512Kx8 AutoStore nvSRAM
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April, 2007
TSOP44-400
TSOP44-400
TSOP44-400
TSOP44-400
TSOP44-400
TSOP44-400
TSOP44-400
TSOP44-400
TSOP44-400
TSOP44-400
TSOP44-400
TSOP44-400
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Simtek Confidential
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
Preliminary
STK14EC8
PACKAGE DIAGRAMS
44 Pin TSOPII
22
1
0.404
0.396
(
10.262
10.058
0.470
0.455
)
(
11.938
11.735
)
44
23
0.0404
0.0396
10.262
(10.058
)
0°
5°
0.0235
0.0160
0.0315
(0.800)
0.047
0.039
0.016
0.012
BSC
0.597
( 0.406
)
0.400
(0.300
)
Base
Plane
(1.194
0.991 )
Seating
Plane
0.729
0.721
18.517
( 18.313
)
0.150
0.050
DIM = INCHES
DIM = mm
MIN
MAX
MIN
( MAX
)
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Simtek Confidential
( 0.0059
0.0020)
0.004 (0.10)
Preliminary
STK14EC8
Document Revision History
Rev
Date
Change
1.0
April 2007
Moved to Preliminary from Advance Information
- made clear that nominal supply is 3.3V, not 3.0V (range 2.7V to 3.6V)
- modified language on pin description of HSB and NC.
- changed ISB from 1mA to 2mA.
- changed Icc3 from 8mA to 13mA
- clarified description language of Figure 3
- clarifed description language of Software Recall
- clarified description language of Preventing Autostore
- corrected typo on Industrial temp range: -45 to -40
SIMTEK STK14EC8 Datasheet, April 2007
Copyright 2007, Simtek Corporation. All rights reserved.
This datasheet may only be printed for the expressed use of Simtek Customers. No part of the datasheet may be reproduced in any other
form or means without the express written permission from Simtek Corporation. The information contained in this publication is believed to be
accurate, but changes may be made without notice. Simtek does not assume responsibility for, or grant or imply any warranty, including MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE regarding this information, the product or its use, Simtek products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express
written agreement with Simtek. Furthermore, Simtek does not authorize its products for use as critical components in life-support systems
where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Simtek products in lifesupport systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Simtek against all
charges. Nothing herein constitutes a license, grant or transfer of any rights to any Simtek patent, copyright, trademark, or other proprietary
right.
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Simtek Confidential