2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications SST12LP142.4 GHz Power Amplifier FEATURES: • • • • • • High Gain: – Typically 30 dB gain across 2.4~2.5 GHz over temperature 0°C to +80°C High linear output power: – >26.5 dBm P1dB – Meets 802.11g OFDM ACPR requirement up to 23 dBm – Added EVM ~4% up to 20 dBm for 54 Mbps 802.11g signal – Meets 802.11b ACPR requirement up to 24 dBm High power-added efficiency/Low operating current for both 802.11g/b applications – ~22% @ POUT = 22 dBm for 802.11g – ~26% @ POUT = 23.5 dBm for 802.11b Built-in Ultra-low IREF power-up/down control – IREF <4 mA Low idle current – ~60 mA ICQ High-speed power-up/down – Turn on/off time (10%~90%) <100 ns – Typical power-up/down delay with driver delay included <200 ns • High temperature stability – ~1 dB gain/power variation between 0°C to +80°C – ~1 dB detector variation over 0°C to +80°C • Low shut-down current (< 0.1 µA) • On-chip power detection • 25 dB dynamic range on-chip power detection • Simple input/output matching • Packages available – 16-contact VQFN (3mm x 3mm) – Non-Pb (lead-free) packages available APPLICATIONS: • • • • WLAN (IEEE 802.11g/b) Home RF Cordless phones 2.4 GHz ISM wireless equipment PRODUCT DESCRIPTION The SST12LP14 is a high-performance power amplifier IC based on the highly-reliable InGaP/GaAs HBT technology. The SST12LP14 can be easily configured for high-power, high-efficiency applications with superb power-added efficiency while operating over the 2.4~2.5 GHz frequency band. It typically provides 30 dB gain with 22% poweradded efficiency @ POUT = 22 dBm for 802.11g and 27% power-added efficiency @ POUT = 24 dBm for 802.11b. The SST12LP14 has excellent linearity, typically <4% added EVM up to 20 dBm output power which is essential for 54 Mbps 802.11g operation while meeting 802.11g spectrum mask at 23 dBm. The SST12LP14 also has wide-range (>25 dB), temperature-stable (~1 dB over 80°C), single-ended/differential power detectors which lower users’ cost on power control. ©2005 SST Communications Corp. S71279-00-000 1/05 1 The power amplifier IC also features easy board-level usage along with high-speed power-up/down control. Ultralow reference current (total IREF <4 mA) makes the SST12LP14 controllable by an on/off switching signal directly from the baseband chip. These features coupled with low operating current make the SST12LP14 ideal for the final stage power amplification in battery-powered 802.11g/b WLAN transmitter applications. The SST12LP14 is offered in 16-contact VQFN package. See Figure 1 for pin assignments and Table 1 for pin descriptions. The SST logo and SuperFlash are registered Trademarks of Silicon Storage Technology, Inc. These specifications are subject to change without notice. 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications FUNCTIONAL BLOCKS VCC1 NC NC NC FUNCTIONAL BLOCK DIAGRAM 16 15 14 13 NC 1 12 VCC2 RFIN 2 11 RFOUT RFIN 3 10 RFOUT NC 4 Bias Circuit 9 5 6 7 8 VCCb VREF1 VREF2 Det_ref ©2005 SST Communications Corp. Det 1279 B1.1 S71279-00-000 2 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications NC 1 RFIN 2 RFIN 3 NC 4 VCC1 NC NC NC PIN ASSIGNMENTS 16 15 14 13 12 VCC2 Top View (contacts facing down) RF and DC GND 0 5 6 7 8 11 RFOUT 10 RFOUT 9 Det VCCb VREF1 VREF2 Det_ref 1279 16-vqfn P1.1 FIGURE 1: PIN ASSIGNMENTS FOR 16-CONTACT VQFN PIN DESCRIPTIONS TABLE 1: PIN DESCRIPTION Symbol Pin No. Pin Name Type1 Function GND 0 Ground The center pad should be connected to RF ground with several low inductance, low resistance vias. NC 1 No Connection Unconnected pins. RFIN 2 I RF input, DC decoupled RFIN 3 I RF input, DC decoupled NC 4 No Connection VCCb 5 Power Supply VREF1 VREF2 Unconnected pins. PWR Supply voltage for bias circuit 6 PWR 1st stage idle current control 7 PWR 2nd stage idle current control Det_ref 8 O On-chip power detector reference Det 9 O On-chip power detector RFOUT 10 O RF output RFOUT 11 O RF output VCC2 12 Power Supply NC 13 No Connection Unconnected pins. NC 14 No Connection Unconnected pins. NC 15 No Connection Unconnected pins. VCC1 16 Power Supply PWR PWR Power supply, 2nd stage Power supply, 1st stage T1.0 1279 1. I=Input, O=Output ©2005 SST Communications Corp. 3 S71279-00-000 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications ELECTRICAL SPECIFICATIONS The AC and DC specifications for the power amplifier interface signals. Refer to Table 2 for the DC voltage and current specifications. Refer to Figures 2 through 12 for the RF performance. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Supply Voltage at pins 5, 12, and 16 (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +4.6V Reference voltage to pin 6 (VREF1) and pin 7 (VREF2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V DC supply current (ICC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC Surface Mount Solder Reflow Temperature: . . . . . . . . . . . . . . . . . . . . . . . . . “with-Pb” units1: 240°C for 3 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . “non-Pb” units: 260°C for 3 seconds 1. Certain “with-Pb” package types are capable of 260°C for 3 seconds; please consult the factory for the latest information. OPERATING RANGE Range Ambient Temp VCC Industrial -40°C to +85°C 3.3V TABLE 2: DC ELECTRICAL CHARACTERISTICS Parameter Min. Typ Max. Unit VCC Symbol Supply Voltage at pins 5, 12, 16 3.0 3.3 4.2 V ICC Supply Current 290 mA for 802.11g, 24 dBm for 802.11g, 25 dBm 340 mA ICQ Idle current for 802.11g to meet EVM @ 20.5 dBm IOFF Shut down current 0.1 µA VREG1 Reference Voltage for 1st Stage, with 120Ω resistor 2.7 2.9 3.1 V VREG2 Reference Voltage for 2nd Stage, with 360Ω resistor 2.7 2.9 3.1 V VREG1 Reference Voltage for 1st Stage, with 220Ω resistor 2.9 3.1 3.3 V VREG2 Reference Voltage for 2nd Stage, with 590Ω resistor 2.9 3.1 3.3 V 55 Test Conditions mA T2.0 1279 ©2005 SST Communications Corp. S71279-00-000 4 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications TABLE 3: AC ELECTRICAL CHARACTERISTICS FOR CONFIGURATION Symbol Parameter Min. FL-U Frequency range 2400 POUT Output power @ PIN = -7 dBm 11b signals 23 @ PIN = -10 dBm 11g signals 20 30 Typ Max. Unit 2485 MHz dBm dBm G Small signal gain 31 33 dB GVAR1 Gain variation over band (2400~2485 MHz) GVAR2 Gain ripple over channel (20 MHz) ±0.5 dB ACPR Meet 11b spectrum mask 23 dBm Meet 11g OFDM 54 MBPS spectrum mask 22 dBm 0.2 Added EVM @ 20 dBm output with 11g OFDM 54 MBPS signal 2f, 3f, 4f, 5f Harmonics at 22 dBm, without trapping capacitors dB 3 % -40 dBc T3.0 1279 ©2005 SST Communications Corp. S71279-00-000 5 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications TYPICAL PERFORMANCE CHARACTERISTICS TEST CONDITIONS: VCC = 3.3V, TA = 25°C FIGURE 2: S-PARAMETERS FIGURE 3: INPUT RETURN LOSS FIGURE 4: IN-BAND GAIN FLATNESS ©2005 SST Communications Corp. S71279-00-000 6 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications TYPICAL PERFORMANCE CHARACTERISTICS TEST CONDITIONS: F1 = 2.45 GHZ, F2 = 2.451 GHZ FIGURE 5: POUT VS PIN FIGURE 8: GAIN VS POUT FIGURE 6: IM3 VS POUT FIGURE 9: PAE FOR TWO TONE FIGURE 7: DETECTORS VS POUT ©2005 SST Communications Corp. S71279-00-000 7 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications TYPICAL PERFORMANCE CHARACTERISTICS TEST CONDITIONS: VCC = 3.3V, TA = 25°C, F = 2.45 GHZ, 54 MBPS 802.11G OFDM SIGNAL FIGURE 10: 802.11G SPECTRUM AT 22/23 DBM, DC CURRENT 210/240 MA FIGURE 11: 802.11G ADDED EVM FOR 54 MBPS 802.11G SIGNAL ©2005 SST Communications Corp. S71279-00-000 8 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications FIGURE 12: 802.11B SPECTRUM AT 24 DBM, DC CURRENT CONSUMPTION 280 MA 100pF 0.1 µF 0.1 µF 4.7 µF Vcc 12nH/06 03 16 100pF 50Ω/150mil 15 13 14 1 12 2 11 3 10 50 /140mil 100pF 50Ω RFOUT 50Ω RFin 2.0pF 2.4pF Bias circuit 4 9 5 6 7 8 0.1 µF 10pF R1 120Ω 10pF 10pF 10pF R2 360*Ω R1=120Ω, R2=360 and VREG1=VREG2=2.8~3.0V or R1=220Ω, R2=590 and VREG1=VREG2=2.9~3.3V 1279 Schematic.0.1 VREG1 VREG2 Det_ref Det FIGURE 13: TYPICAL SCHEMATIC FOR HIGH-POWER, HIGH-EFFICIENCY 802.11B/G APPLICATIONS ©2005 SST Communications Corp. S71279-00-000 9 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications PRODUCT ORDERING INFORMATION SST12LP SSTxxLP 14 xx - QVC - XXX E X Environmental Attribute E1 = non-Pb contact (lead) finish Package Modifier C = 16 contact Package Type QV = VQFN Product Family Identifier Product Type P = Power Amplifier Voltage L = 3.0-3.6V Frequency of Operation 2 = 2.4 GHz Product Line 1 = SST Communications 1. Environmental suffix “E” denotes non-Pb solder. SST non-Pb solder devices are “RoHS Compliant”. Valid combinations for SST12LP14 SST12LP14-QVC SST12LP14-QVCE SST12LP14 Evaluation Kits SST12LP14-QVC-K SST12LP14-QVCE-K Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales representative to confirm availability of valid combinations and to determine availability of new combinations. ©2005 SST Communications Corp. S71279-00-000 10 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications PACKAGING DIAGRAMS TOP VIEW SIDE VIEW BOTTOM VIEW See notes 2 and 3 0.2 Pin #1 Pin #1 1.7 3.00 ± 0.10 1.7 0.5 BSC 0.076 0.45 0.35 0.05 Max 3.00 ± 0.10 1.00 0.80 0.30 0.18 1mm 16-vqfn-3x3-QVC-0.0 Note: 1. Complies with JEDEC JEP95 MO-220I, variant VEED except external paddle nominal dimensions. 2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch. 3. The external paddle is electrically connected to the die back-side and possibly to certain VSS leads. This paddle can be soldered to the PC board; it is suggested to connect this paddle to the VSS of the unit. Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device. 4. Untoleranced dimensions are nominal target dimensions. 5. All linear dimensions are in millimeters (max/min). 16-CONTACT VERY-THIN QUAD FLAT NO-LEAD (VQFN) SST PACKAGE CODE: QVC TABLE 4: REVISION HISTORY Revision 00 Description • S71279: SST conversion of data sheet GP1214 ©2005 SST Communications Corp. Date Jan 2005 S71279-00-000 11 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications CONTACT INFORMATION Marketing SST Communications Corp. 2951 28th Street, Ste. 2040 Santa Monica, CA 90405 Tel: 310-581-1650 x27 Fax: 310-581-1663 Sales NORTH AMERICA ASIA PACIFIC NORTH Silicon Storage Technology, Inc. Les Crowder Technical Sales Support - Major Accounts 1922 Colina Salida Del Sol San Clemente, CA 92673-3652 USA Tel: 949-495-6437 Cell: 714-813-6636 Fax: 949-495-6364 E-mail: [email protected] SST Macao H. H. Chang Senior Director, Sales Room A, 8th Floor, Macao Financial Centre, No. 230-246, Rua Pequim, Macao Tel: (853) 706-022 Fax: (853) 706-023 E-mail: [email protected] EUROPE ASIA PACIFIC SOUTH Silicon Storage Technology Ltd. Ralph Thomson Applications Manager Mark House 9-11 Queens Road Hersham KT12 5LU UK Tel: +44 (0) 1869 321 431 Cell: +44 (0) 7787 508 919 E-mail: [email protected] SST Communications Co. Andy Chang Director of Sales 2F, No. 415, Tiding Blvd., Sec.2, Neihu, Taipei, Taiwan, R.O.C. Tel: 02-2656-2888 x220 Fax: 02-2656-2889 E-mail: [email protected] JAPAN KOREA SST Japan Yashushi Yoshinaga Sales Manager 6F Kose #2, 1-14-20 Shin-Yokohama, Kohoku-ku, Yokohama 222-0033 Kanagawa, Japan Tel: (81) 45-471-1851 Fax: (81) 45-471-3285 Email: [email protected] SST Korea Charlie Shin Country Manager Rm# 1101 DonGu Root Bldg, 16-2 Sunae-Dong, Bundang-Gu, Sungnam, Kyunggi-Do Korea, 463-020 Tel: (82) 31-715-9138 Fax: (82) 31-715-9137 Email: [email protected] Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036 www.SuperFlash.com or www.sst.com ©2005 SST Communications Corp. S71279-00-000 12 1/05