SST SST12LP14-QVC-K

2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
SST12LP142.4 GHz Power Amplifier
FEATURES:
•
•
•
•
•
•
High Gain:
– Typically 30 dB gain across 2.4~2.5 GHz over
temperature 0°C to +80°C
High linear output power:
– >26.5 dBm P1dB
– Meets 802.11g OFDM ACPR requirement up to
23 dBm
– Added EVM ~4% up to 20 dBm for
54 Mbps 802.11g signal
– Meets 802.11b ACPR requirement up to 24 dBm
High power-added efficiency/Low operating
current for both 802.11g/b applications
– ~22% @ POUT = 22 dBm for 802.11g
– ~26% @ POUT = 23.5 dBm for 802.11b
Built-in Ultra-low IREF power-up/down control
– IREF <4 mA
Low idle current
– ~60 mA ICQ
High-speed power-up/down
– Turn on/off time (10%~90%) <100 ns
– Typical power-up/down delay with driver delay
included <200 ns
• High temperature stability
– ~1 dB gain/power variation between 0°C to +80°C
– ~1 dB detector variation over 0°C to +80°C
• Low shut-down current (< 0.1 µA)
• On-chip power detection
• 25 dB dynamic range on-chip power detection
• Simple input/output matching
• Packages available
– 16-contact VQFN (3mm x 3mm)
– Non-Pb (lead-free) packages available
APPLICATIONS:
•
•
•
•
WLAN (IEEE 802.11g/b)
Home RF
Cordless phones
2.4 GHz ISM wireless equipment
PRODUCT DESCRIPTION
The SST12LP14 is a high-performance power amplifier IC
based on the highly-reliable InGaP/GaAs HBT technology.
The SST12LP14 can be easily configured for high-power,
high-efficiency applications with superb power-added efficiency while operating over the 2.4~2.5 GHz frequency
band. It typically provides 30 dB gain with 22% poweradded efficiency @ POUT = 22 dBm for 802.11g and 27%
power-added efficiency @ POUT = 24 dBm for 802.11b.
The SST12LP14 has excellent linearity, typically <4%
added EVM up to 20 dBm output power which is essential
for 54 Mbps 802.11g operation while meeting 802.11g
spectrum mask at 23 dBm. The SST12LP14 also has
wide-range (>25 dB), temperature-stable (~1 dB over
80°C), single-ended/differential power detectors which
lower users’ cost on power control.
©2005 SST Communications Corp.
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1
The power amplifier IC also features easy board-level
usage along with high-speed power-up/down control. Ultralow reference current (total IREF <4 mA) makes the
SST12LP14 controllable by an on/off switching signal
directly from the baseband chip. These features coupled
with low operating current make the SST12LP14 ideal for
the final stage power amplification in battery-powered
802.11g/b WLAN transmitter applications.
The SST12LP14 is offered in 16-contact VQFN package.
See Figure 1 for pin assignments and Table 1 for pin
descriptions.
The SST logo and SuperFlash are registered Trademarks of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.
2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
FUNCTIONAL BLOCKS
VCC1
NC
NC
NC
FUNCTIONAL BLOCK DIAGRAM
16
15
14
13
NC
1
12 VCC2
RFIN
2
11 RFOUT
RFIN
3
10 RFOUT
NC
4
Bias Circuit
9
5
6
7
8
VCCb
VREF1
VREF2
Det_ref
©2005 SST Communications Corp.
Det
1279 B1.1
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
NC
1
RFIN
2
RFIN
3
NC
4
VCC1
NC
NC
NC
PIN ASSIGNMENTS
16
15
14
13
12 VCC2
Top View
(contacts facing down)
RF and DC GND
0
5
6
7
8
11 RFOUT
10 RFOUT
9 Det
VCCb
VREF1
VREF2
Det_ref
1279 16-vqfn P1.1
FIGURE 1: PIN ASSIGNMENTS FOR 16-CONTACT VQFN
PIN DESCRIPTIONS
TABLE 1: PIN DESCRIPTION
Symbol
Pin No.
Pin Name
Type1
Function
GND
0
Ground
The center pad should be connected to RF ground with
several low inductance, low resistance vias.
NC
1
No Connection
Unconnected pins.
RFIN
2
I
RF input, DC decoupled
RFIN
3
I
RF input, DC decoupled
NC
4
No Connection
VCCb
5
Power Supply
VREF1
VREF2
Unconnected pins.
PWR
Supply voltage for bias circuit
6
PWR
1st stage idle current control
7
PWR
2nd stage idle current control
Det_ref
8
O
On-chip power detector reference
Det
9
O
On-chip power detector
RFOUT
10
O
RF output
RFOUT
11
O
RF output
VCC2
12
Power Supply
NC
13
No Connection
Unconnected pins.
NC
14
No Connection
Unconnected pins.
NC
15
No Connection
Unconnected pins.
VCC1
16
Power Supply
PWR
PWR
Power supply, 2nd stage
Power supply, 1st stage
T1.0 1279
1. I=Input, O=Output
©2005 SST Communications Corp.
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
ELECTRICAL SPECIFICATIONS
The AC and DC specifications for the power amplifier interface signals. Refer to Table 2 for the DC voltage and current specifications. Refer to Figures 2 through 12 for the RF performance.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Supply Voltage at pins 5, 12, and 16 (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +4.6V
Reference voltage to pin 6 (VREF1) and pin 7 (VREF2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V
DC supply current (ICC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA
Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC
Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC
Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC
Surface Mount Solder Reflow Temperature: . . . . . . . . . . . . . . . . . . . . . . . . . “with-Pb” units1: 240°C for 3 seconds
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . “non-Pb” units: 260°C for 3 seconds
1. Certain “with-Pb” package types are capable of 260°C for 3 seconds; please consult the factory for the latest information.
OPERATING RANGE
Range
Ambient Temp
VCC
Industrial
-40°C to +85°C
3.3V
TABLE 2: DC ELECTRICAL CHARACTERISTICS
Parameter
Min.
Typ
Max.
Unit
VCC
Symbol
Supply Voltage at pins 5, 12, 16
3.0
3.3
4.2
V
ICC
Supply Current
290
mA
for 802.11g, 24 dBm
for 802.11g, 25 dBm
340
mA
ICQ
Idle current for 802.11g to meet EVM @ 20.5 dBm
IOFF
Shut down current
0.1
µA
VREG1
Reference Voltage for 1st Stage, with 120Ω resistor
2.7
2.9
3.1
V
VREG2
Reference Voltage for 2nd Stage, with 360Ω resistor
2.7
2.9
3.1
V
VREG1
Reference Voltage for 1st Stage, with 220Ω resistor
2.9
3.1
3.3
V
VREG2
Reference Voltage for 2nd Stage, with 590Ω resistor
2.9
3.1
3.3
V
55
Test Conditions
mA
T2.0 1279
©2005 SST Communications Corp.
S71279-00-000
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
TABLE 3: AC ELECTRICAL CHARACTERISTICS FOR CONFIGURATION
Symbol
Parameter
Min.
FL-U
Frequency range
2400
POUT
Output power
@ PIN = -7 dBm 11b signals
23
@ PIN = -10 dBm 11g signals
20
30
Typ
Max.
Unit
2485
MHz
dBm
dBm
G
Small signal gain
31
33
dB
GVAR1
Gain variation over band (2400~2485 MHz)
GVAR2
Gain ripple over channel (20 MHz)
±0.5
dB
ACPR
Meet 11b spectrum mask
23
dBm
Meet 11g OFDM 54 MBPS spectrum mask
22
dBm
0.2
Added EVM
@ 20 dBm output with 11g OFDM 54 MBPS signal
2f, 3f, 4f, 5f
Harmonics at 22 dBm, without trapping capacitors
dB
3
%
-40
dBc
T3.0 1279
©2005 SST Communications Corp.
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
TYPICAL PERFORMANCE CHARACTERISTICS
TEST CONDITIONS: VCC = 3.3V, TA = 25°C
FIGURE 2: S-PARAMETERS
FIGURE 3: INPUT RETURN LOSS
FIGURE 4: IN-BAND GAIN FLATNESS
©2005 SST Communications Corp.
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
TYPICAL PERFORMANCE CHARACTERISTICS
TEST CONDITIONS: F1 = 2.45 GHZ, F2 = 2.451 GHZ
FIGURE 5: POUT VS PIN
FIGURE 8: GAIN VS POUT
FIGURE 6: IM3 VS POUT
FIGURE 9: PAE FOR TWO TONE
FIGURE 7: DETECTORS VS POUT
©2005 SST Communications Corp.
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
TYPICAL PERFORMANCE CHARACTERISTICS
TEST CONDITIONS: VCC = 3.3V, TA = 25°C, F = 2.45 GHZ, 54 MBPS 802.11G OFDM SIGNAL
FIGURE 10: 802.11G SPECTRUM AT 22/23 DBM, DC CURRENT 210/240 MA
FIGURE 11: 802.11G ADDED EVM FOR 54 MBPS 802.11G SIGNAL
©2005 SST Communications Corp.
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
FIGURE 12: 802.11B SPECTRUM AT 24 DBM, DC CURRENT CONSUMPTION 280 MA
100pF
0.1 µF
0.1 µF
4.7 µF
Vcc
12nH/06
03
16
100pF
50Ω/150mil
15
13
14
1
12
2
11
3
10
50 /140mil
100pF 50Ω RFOUT
50Ω RFin
2.0pF
2.4pF
Bias circuit
4
9
5
6
7
8
0.1 µF
10pF
R1 120Ω
10pF
10pF
10pF
R2 360*Ω
R1=120Ω, R2=360 and
VREG1=VREG2=2.8~3.0V
or
R1=220Ω, R2=590 and
VREG1=VREG2=2.9~3.3V
1279 Schematic.0.1
VREG1
VREG2
Det_ref
Det
FIGURE 13: TYPICAL SCHEMATIC FOR HIGH-POWER, HIGH-EFFICIENCY 802.11B/G APPLICATIONS
©2005 SST Communications Corp.
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
PRODUCT ORDERING INFORMATION
SST12LP
SSTxxLP
14
xx
- QVC
- XXX
E
X
Environmental Attribute
E1 = non-Pb contact (lead) finish
Package Modifier
C = 16 contact
Package Type
QV = VQFN
Product Family Identifier
Product Type
P = Power Amplifier
Voltage
L = 3.0-3.6V
Frequency of Operation
2 = 2.4 GHz
Product Line
1 = SST Communications
1. Environmental suffix “E” denotes non-Pb solder.
SST non-Pb solder devices are “RoHS Compliant”.
Valid combinations for SST12LP14
SST12LP14-QVC
SST12LP14-QVCE
SST12LP14 Evaluation Kits
SST12LP14-QVC-K
SST12LP14-QVCE-K
Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales
representative to confirm availability of valid combinations and to determine availability of new combinations.
©2005 SST Communications Corp.
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
PACKAGING DIAGRAMS
TOP VIEW
SIDE VIEW
BOTTOM VIEW
See notes
2 and 3
0.2
Pin #1
Pin #1
1.7
3.00 ± 0.10
1.7
0.5 BSC
0.076
0.45
0.35
0.05 Max
3.00 ± 0.10
1.00
0.80
0.30
0.18
1mm
16-vqfn-3x3-QVC-0.0
Note: 1. Complies with JEDEC JEP95 MO-220I, variant VEED except external paddle nominal dimensions.
2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.
3. The external paddle is electrically connected to the die back-side and possibly to certain VSS leads.
This paddle can be soldered to the PC board; it is suggested to connect this paddle to the VSS of the unit.
Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device.
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
16-CONTACT VERY-THIN QUAD FLAT NO-LEAD (VQFN)
SST PACKAGE CODE: QVC
TABLE 4: REVISION HISTORY
Revision
00
Description
•
S71279: SST conversion of data sheet GP1214
©2005 SST Communications Corp.
Date
Jan 2005
S71279-00-000
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2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
CONTACT INFORMATION
Marketing
SST Communications Corp.
2951 28th Street, Ste. 2040
Santa Monica, CA 90405
Tel: 310-581-1650 x27
Fax: 310-581-1663
Sales
NORTH AMERICA
ASIA PACIFIC NORTH
Silicon Storage Technology, Inc.
Les Crowder
Technical Sales Support - Major Accounts
1922 Colina Salida Del Sol
San Clemente, CA 92673-3652 USA
Tel: 949-495-6437
Cell: 714-813-6636
Fax: 949-495-6364
E-mail: [email protected]
SST Macao
H. H. Chang
Senior Director, Sales
Room A, 8th Floor,
Macao Financial Centre,
No. 230-246, Rua Pequim, Macao
Tel: (853) 706-022
Fax: (853) 706-023
E-mail: [email protected]
EUROPE
ASIA PACIFIC SOUTH
Silicon Storage Technology Ltd.
Ralph Thomson
Applications Manager
Mark House
9-11 Queens Road
Hersham KT12 5LU UK
Tel: +44 (0) 1869 321 431
Cell: +44 (0) 7787 508 919
E-mail: [email protected]
SST Communications Co.
Andy Chang
Director of Sales
2F, No. 415, Tiding Blvd., Sec.2,
Neihu, Taipei,
Taiwan, R.O.C.
Tel: 02-2656-2888 x220
Fax: 02-2656-2889
E-mail: [email protected]
JAPAN
KOREA
SST Japan
Yashushi Yoshinaga
Sales Manager
6F Kose #2, 1-14-20 Shin-Yokohama,
Kohoku-ku, Yokohama 222-0033
Kanagawa, Japan
Tel: (81) 45-471-1851
Fax: (81) 45-471-3285
Email: [email protected]
SST Korea
Charlie Shin
Country Manager
Rm# 1101 DonGu Root Bldg, 16-2 Sunae-Dong,
Bundang-Gu, Sungnam, Kyunggi-Do
Korea, 463-020
Tel: (82) 31-715-9138
Fax: (82) 31-715-9137
Email: [email protected]
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
www.SuperFlash.com or www.sst.com
©2005 SST Communications Corp.
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