Document No.001-66965 Rev. *B ECN # 4674343 Cypress Semiconductor Package Qualification Report QTP# 104807 VERSION*B March, 2015 48-Lead QFN (6X6X0.6mm) 24-Lead QFN (4X4X0.6mm) 32-Lead QFN (5X5X0.6mm) NiPdAu-Ag, MSL3, 260°°C Reflow K1-Amkor (L) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro (RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-66965 Rev. *B ECN # 4674343 PACKAGE QUALIFICATION HISTORY QTP Number DESCRIPTION OF QUALIFICATION PURPOSE Date Comp. 104807 Qualification of QFN48 6X6X0.6 (LQ48A) package using 4.6X4.6 E-pad Size, G700 Mold Compound, CRM 1085A D/A Epoxy and NiPdAu-Ag Leadfinish at MSL3 260C assembled at Amkor Korea (L) Jan 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-66965 Rev. *B ECN # 4674343 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ48A Package Outline, Type, or Name: 48L QFN (6X6X0.6mm) Mold Compound Name/Manufacturer: G700 / Sumitomo Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: 54 (typical) / 28 (Min. value) Lead Frame Material: RU-PPF Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Die Separation Method: Backgrind Sawing Die Attach Supplier: Sumitomo Die Attach Material: CRM 1085A Die Attach Method: Epoxy Bond Diagram Designation 001-65175 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: N/A Package Cross Section Yes/No: Yes Assembly Process Flow: 49-10999 Name/Location of Assembly (prime) facility: K1-Amkor MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-66965 Rev. *B ECN # 4674343 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Temperature Cycle Pressure Cooker Test High Temperature Operating Life Early Failure Rate (EFR) High Temperature Operating Life Latent Failure Rate (LFR) Electrostatic Discharge Human Body Model (ESD HBM) Electrostatic Discharge Charge Device Model (ESD CDM) High Accelerated Saturation Test (HAST) High Temp Storage Acoustics Microscopy Ball Shear Bond Pull Test Condition (Temp/Bias) MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-A102, 121°C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) Dynamic Operating Condition, 125°C, 3.8V, 96 Hours JESD22-A108 Dynamic Operating Condition, 150°C, 3.8V, 500 Hours JESD22-A108 2200V JEDEC EIA/JESD22-A114 500V JESD22-C101 JEDEC STD 22-A110, 130°C, 4.0V, 85% RH Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-A103:150°C No bias J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-B116 Result P/F P P P P P P P P P P Final Visual MIL-STD-883 – Method 2011 Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: • <3000 sq. mils = 1.2 kgf • 30001-5000 sq. mils = 1.2 kgf • >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Criteria: No Package Crack JESD22-B101 Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 J-STD-002, JESD22-B102 95% solder coverage minimum MIL-STD-883, Method 1011, Condition B, -55°C to 125°C and JESD22-A106, Condition C, -55°C to 125°C MIL-STD-883 2012 P Constructional Analysis Die Shear Dye Penetration Solderability Thermal Shock X-ray Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P P P P P P P Document No.001-66965 Rev. *B ECN # 4674343 Reliability Test Data QTP #: Device 104807 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA COMP 15 0 CY8CTMA301E (8C20313DC) 4005516 611055902 L-KOREA COMP 15 0 CY8CTMA301E (8C20313DC) 4005516 611055903 L-KOREA COMP 15 0 CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA COMP 10 0 CY8CTMA301E (8C20313DC) 4005516 611055902 L-KOREA COMP 10 0 CY8CTMA301E (8C20313DC) 4005516 611055903 L-KOREA COMP 10 0 CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA COMP 10 0 CY8CTMA301E (8C20313DC) 4005516 611055902 L-KOREA COMP 10 0 CY8CTMA301E (8C20313DC) 4005516 611055903 L-KOREA COMP 10 0 4005516 611055901 L-KOREA COMP 5 0 CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA COMP 15 0 CY8CTMA301E (8C20313DC) 4005516 611055902 L-KOREA COMP 15 0 CY8CTMA301E (8C20313DC) 4005516 611055903 L-KOREA COMP 15 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BOND PULL STRESS: BALL SHEAR STRESS: CONSTRUCTIONAL ANALYSIS CY8CTMA301E (8C20313DC) STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA COMP 15 0 CY8CTMA301E (8C20313DC) 4005516 611055902 L-KOREA COMP 15 0 CY8CTMA301E (8C20313DC) 4005516 611055903 L-KOREA COMP 15 0 L-KOREA COMP 9 0 COMP 8 0 STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CTMA301E (8C20313DC) 4005516 611055901 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-66965 Rev. *B ECN # 4674343 Reliability Test Data QTP #: Device Fab Lot # 104807 Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 3.8V, Vcc Max CYWUSB6934 (7B6934AC) 4318747 610336918 L-KOREA 80 269 0 CYWUSB6934 (7B6934AC) 4318747 610336918 L-KOREA 500 266 0 7C136GT 2127990 610346637 G-TAIWAN 80 120 0 7C136GT 2127990 610346637 G-TAIWAN 500 120 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 3.8V, Vcc Max CYWUSB6934 (7B6934AC) 4318747 610336918 L-KOREA 96 1025 0 7C136GT 2127990 610346637 G-TAIWAN 48 999 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 4.0V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 611055901 L-KOREA 128 80 0 CY8CTMA300EES (8C20322DC) 4945318 611008184 L-KOREA 500 80 0 CY8CTMA300EES (8C20322DC) 4945318 611008184 L-KOREA 1000 80 0 611055901 L-KOREA COMP 5 0 CY8CTMA301E (8C20313DC) 4005516 STRESS: HIGH TEMP STORAGE STRESS: INTERNAL VISUAL CY8CTMA301E (8C20313DC) 4005516 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA 168 80 0 STRESS: PHYSICAL DIMENSION CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA COMP 5 0 CY8CTMA301E (8C20313DC) 4005516 611055902 L-KOREA COMP 5 0 CY8CTMA301E (8C20313DC) 4005516 611055903 L-KOREA COMP 5 0 CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA COMP 3 0 CY8CTMA301E (8C20313DC) 4005516 611055902 L-KOREA COMP 3 0 CY8CTMA301E (8C20313DC) 4005516 611055903 L-KOREA COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA 500 80 0 CY8CTMA301E (8C20313DC) 4005516 611055902 L-KOREA 500 80 0 CY8CTMA301E (8C20313DC) 4005516 611055903 L-KOREA 500 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-66965 Rev. *B ECN # 4674343 Reliability Test Data QTP #: Device 104807 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA 200 80 0 CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA 1000 80 0 CY8CTMA301E (8C20313DC) 4005516 611055901 L-KOREA COMP 15 0 CY8CTMA301E (8C20313DC) 4005516 611055902 L-KOREA COMP 15 0 CY8CTMA301E (8C20313DC) 4005516 611055903 L-KOREA COMP 15 0 Failure Mechanism STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-66965 Rev. *B ECN # 4674343 Document History Page Document Title: QTP 104807: 48-LEAD QFN (6X6X0.6MM),24-Lead QFN (4X4X0.6mm),32-Lead QFN (5X5X0.6mm) NIPDAU-AG, MSL3, 260C REFLOW K1-AMKOR (L) QUALIFICATION REPORT 001-66965 Document Number: Rev. ECN No. ** 3156203 *A 4274569 *B 4674343 Orig. of Change NRG JYF JYF Description of Change Initial spec release No Change Sunset review: Updated QTP title page and Reliability Tests Performed table (TCT, PCT, ESD-CDM/HBM, HAST, HTS, Acoustic, Ball Shear, Bond Pull, CA, Die Shear, FVI, IVI, Physical Dimension, Solderability Test, Thermal Shock) for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8