Document No.001-89581 Rev. *A ECN # 4526545 Cypress Semiconductor Package Qualification Report QTP# 084006 VERSION*A October, 2014 40-Lead Saw QFN (Quad Flat No-Lead) (6 x 6 x 1mm) NiPdAu-Ag, MSL3, 260°C Reflow, ASE-Shanghai FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-89581 Rev. *A ECN # 4526545 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date Qualify 40QFN (6X6X1) Saw Type Pb-Free (NiPdAu-Ag) using EN4900G epoxy, and Sumitomo 084006 G700L Mold compound, at MSL3 and 260C Reflow at ASE-Shanghai Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 8 Feb 09 Document No.001-89581 Rev. *A ECN # 4526545 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: LT40A 40- Quad Flat No-Lead (QFN) Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate : G700L/Sumitomo Oxygen Rating Index: None Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Die Separation Method: Backgrind Die Attach Supplier: Hitachi Die Attach Material: EN4900G Die Attach Method: Epoxy Bond Diagram Designation: 001-48292 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.8mil Thermal Resistance Theta JA °C/W: 21.2°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-47908 Name/Location of Assembly (prime) facility: ASE-Shanghai (AE) MSL Level 3 Reflow Profile 260C UL-94 N/A Saw ELECTRICAL TEST/FINISH DESCRIPTION Test Location CML-R Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 8 Document No.001-89581 Rev. *A ECN # 4526545 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Acoustic Microscopy Test Condition (Temp/Bias) J-STD-020 Result P/F P Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C Ball Shear JESD22-B116, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, 1.33, Ppk : 1.66 P Constructional Analysis Criteria: Meet external and internal characteristics of P Cypress package MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Die Shear P Dye Penetration test Test to determine the existence and extent of cracks, Criteria: No Package Crack P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V JEDEC EIA/JESD22-A114 P Final Visual JESD22-B101 P Internal Visual MIL-STD-883-2014 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130C, 85%RH, 3.63V Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30°C/60%RH+ Reflow, 260°C+0, -5°C P Physical Dimension MIL-STD-1835, JESD22-B100 P JESD22-A102: 121°C, 100%RH, 15 Psig Pressure Cooker Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C Solderability, Steam Aged J-STD-002, JESD22-B102 P P 95% solder coverage minimum Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C P X-Ray MIL-STD-883 2012 P Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 8 Document No.001-89581 Rev. *A ECN # 4526545 Reliability Test Data QTP #:084006 Device STRESS: Fab Lot# Assy Lot # Assy Loc Duration Samp Rej ACOUSTIC, MSL3 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4824057 610842164 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4802661 610842161 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4802661 610842162 SHANGHAI-AE COMP 15 0 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 10 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE COMP 10 0 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 10 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE COMP 10 0 4828759 1TP9060YOJXE SHANGHAI-AE COMP 15 0 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE COMP 15 0 STRESS: STRESS: Failure Mechanism BALL SHEAR BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CYRF6936 (7B6936AC) STRESS: DIE SHEAR STRESS: DYE PENTRANT TEST CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4824057 610842164 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4802661 610842161 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4802661 610842162 SHANGHAI-AE COMP 15 0 SHANGHAI-AE COMP 9 0 COMP 8 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CYRF6936 (7B6936AC) STRESS: 4824057 610842163 ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 8 Document No.001-89581 Rev. *A ECN # 4526545 Reliability Test Data QTP #:084006 Device STRESS: Fab Lot# Assy Lot # Assy Loc Duration Samp Rej FINAL VISUAL CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 1446 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE 128 1250 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.63V), PRE COND192 HR 30C/60%RH, MSL3 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE 128 77 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE 128 78 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE 128 79 0 CYRF6936 7B63936AC) 4802661 610842162 SHANGHAI-AE 128 80 0 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 5 0 CYRF6936 7B63936AC) 4824057 610842164 SHANGHAI-AE COMP 5 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE COMP 5 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE COMP 5 0 CYRF6936 7B63936AC) 4802661 610842161 SHANGHAI-AE COMP 5 0 CYRF6936 7B63936AC) 4802661 610842162 SHANGHAI-AE COMP 5 0 STRESS: Failure Mechanism INTERNAL VISUAL STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND192 HR 30C/60%RH, MSL3 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE 168 74 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE 168 79 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE 168 80 0 STRESS: PHYSICAL DIMENSIONS CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 30 0 CYRF6936 7B63936AC) 4824057 610842164 SHANGHAI-AE COMP 30 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE COMP 30 0 STRESS: SOLDERABILITY TEST CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 3 0 CYRF6936 7B63936AC) 4824057 610842164 SHANGHAI-AE COMP 3 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE COMP 3 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-89581 Rev. *A ECN # 4526545 Reliability Test Data QTP #:084006 Device STRESS: Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE 500 80 0 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE 1000 80 0 CYRF6936 7B63936AC) 4824057 610842164 SHANGHAI-AE 500 80 0 CYRF6936 7B63936AC) 4824057 610842164 SHANGHAI-AE 1000 80 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE 500 80 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE 1000 80 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE 500 80 0 CYRF6936 7B63936AC) 4802661 610842160 SHANGHAI-AE 1000 80 0 CYRF6936 7B63936AC) 4802661 610842161 SHANGHAI-AE 500 80 0 CYRF6936 7B63936AC) 4802661 610842161 SHANGHAI-AE 1000 80 0 CYRF6936 7B63936AC) 4802661 610842162 SHANGHAI-AE 500 80 0 CYRF6936 7B63936AC) 4802661 610842162 SHANGHAI-AE 1000 80 0 STRESS: THERMAL SHOCK COND. B – 55C TO 125C CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE 200 80 0 CYRF6936 (7B6936AC) 4824057 610842163 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4824057 610842164 SHANGHAI-AE COMP 15 0 CYRF6936 7B63936AC) 4824057 610842165 SHANGHAI-AE COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-89581 Rev. *A ECN # 4526545 Document History Page Document Title: QTP# 084006: 40-LEAD SAW QFN (QUAD FLAT NO-LEAD) (6 X 6 X 1MM), NIPDAU-AG, MSL3, 260C REFLOW, ASE-SHANGHAI 001-89581 Document Number: Rev. ECN No. ** 4149137 *A 4526545 Orig. of Change JYF JYF Description of Change Initial Spec Release. Sunset review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8