QTP 84006 40 Lead Saw QFN (Quad Flat No-Lead) (6 x 6 x 1mm) NiPdAu-Ag, MSL3, 260°C Reflow, ASE-Shanghai.pdf

Document No.001-89581 Rev. *A
ECN # 4526545
Cypress Semiconductor
Package Qualification Report
QTP# 084006 VERSION*A
October, 2014
40-Lead Saw QFN (Quad Flat No-Lead)
(6 x 6 x 1mm)
NiPdAu-Ag, MSL3, 260°C Reflow,
ASE-Shanghai
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No.001-89581 Rev. *A
ECN # 4526545
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
Qualify 40QFN (6X6X1) Saw Type Pb-Free (NiPdAu-Ag) using EN4900G epoxy, and Sumitomo
084006
G700L Mold compound, at MSL3 and 260C Reflow at ASE-Shanghai
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
Feb 09
Document No.001-89581 Rev. *A
ECN # 4526545
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
LT40A
40- Quad Flat No-Lead (QFN)
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
Mold Compound Alpha Emission Rate :
G700L/Sumitomo
Oxygen Rating Index:
None
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
NiPdAu-Ag
Die Backside Preparation
Method/Metallization:
Die Separation Method:
Backgrind
Die Attach Supplier:
Hitachi
Die Attach Material:
EN4900G
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-48292
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au, 0.8mil
Thermal Resistance Theta JA °C/W:
21.2°C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
001-47908
Name/Location of Assembly (prime) facility:
ASE-Shanghai (AE)
MSL Level
3
Reflow Profile
260C
UL-94
N/A
Saw
ELECTRICAL TEST/FINISH DESCRIPTION
Test Location
CML-R
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No.001-89581 Rev. *A
ECN # 4526545
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Acoustic Microscopy
Test Condition
(Temp/Bias)
J-STD-020
Result
P/F
P
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C
Ball Shear
JESD22-B116, Cpk : 1.33, Ppk : 1.66
P
Bond Pull
MIL-STD-883 – Method 2011, 1.33, Ppk : 1.66
P
Constructional Analysis
Criteria: Meet external and internal characteristics of
P
Cypress package
MIL-STD-883, Method 2019
Per die size:
<3000 sq. mils = 1.2 kgf
30001-5000 sq. mils = 1.2 kgf
>5001 sq. mils = 1.2 kgf
Die Shear
P
Dye Penetration test
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V
JESD22-C101
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
2,200V
JEDEC EIA/JESD22-A114
P
Final Visual
JESD22-B101
P
Internal Visual
MIL-STD-883-2014
P
High Accelerated Saturation Test
(HAST)
JEDEC STD 22-A110: 130C, 85%RH, 3.63V
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs., 30°C/60%RH+ Reflow, 260°C+0, -5°C
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
JESD22-A102: 121°C, 100%RH, 15 Psig
Pressure Cooker
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C
Solderability, Steam Aged
J-STD-002, JESD22-B102
P
P
95% solder coverage minimum
Temperature Cycle
MIL-STD-883, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C
P
Thermal Shock
MIL-STD-883, Method 1011, Condition B, -55 C to
125C and JESD22-A106, Condition C, -55 C to 125C
P
X-Ray
MIL-STD-883 2012
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 8
Document No.001-89581 Rev. *A
ECN # 4526545
Reliability Test Data
QTP #:084006
Device
STRESS:
Fab Lot#
Assy Lot #
Assy Loc
Duration
Samp
Rej
ACOUSTIC, MSL3
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4824057
610842164
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4802661
610842161
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4802661
610842162
SHANGHAI-AE
COMP
15
0
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
10
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
COMP
10
0
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
10
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
COMP
10
0
4828759
1TP9060YOJXE SHANGHAI-AE
COMP
15
0
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
COMP
15
0
STRESS:
STRESS:
Failure Mechanism
BALL SHEAR
BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CYRF6936 (7B6936AC)
STRESS: DIE SHEAR
STRESS: DYE PENTRANT TEST
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4824057
610842164
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4802661
610842161
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4802661
610842162
SHANGHAI-AE
COMP
15
0
SHANGHAI-AE
COMP
9
0
COMP
8
0
STRESS:
ESD-CHARGE DEVICE MODEL, 500V
CYRF6936 (7B6936AC)
STRESS:
4824057
610842163
ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No.001-89581 Rev. *A
ECN # 4526545
Reliability Test Data
QTP #:084006
Device
STRESS:
Fab Lot#
Assy Lot #
Assy Loc
Duration
Samp
Rej
FINAL VISUAL
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
1446
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
128
1250
0
STRESS:
HI-ACCEL SATURATION TEST (130C, 85%RH, 3.63V), PRE COND192 HR 30C/60%RH, MSL3
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
128
77
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
128
78
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
128
79
0
CYRF6936 7B63936AC)
4802661
610842162
SHANGHAI-AE
128
80
0
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
5
0
CYRF6936 7B63936AC)
4824057
610842164
SHANGHAI-AE
COMP
5
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
COMP
5
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
COMP
5
0
CYRF6936 7B63936AC)
4802661
610842161
SHANGHAI-AE
COMP
5
0
CYRF6936 7B63936AC)
4802661
610842162
SHANGHAI-AE
COMP
5
0
STRESS:
Failure Mechanism
INTERNAL VISUAL
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND192 HR 30C/60%RH, MSL3
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
168
74
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
168
79
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
168
80
0
STRESS: PHYSICAL DIMENSIONS
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
30
0
CYRF6936 7B63936AC)
4824057
610842164
SHANGHAI-AE
COMP
30
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
COMP
30
0
STRESS: SOLDERABILITY TEST
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
3
0
CYRF6936 7B63936AC)
4824057
610842164
SHANGHAI-AE
COMP
3
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
COMP
3
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No.001-89581 Rev. *A
ECN # 4526545
Reliability Test Data
QTP #:084006
Device
STRESS:
Fab Lot#
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
500
80
0
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
1000
80
0
CYRF6936 7B63936AC)
4824057
610842164
SHANGHAI-AE
500
80
0
CYRF6936 7B63936AC)
4824057
610842164
SHANGHAI-AE
1000
80
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
500
80
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
1000
80
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
500
80
0
CYRF6936 7B63936AC)
4802661
610842160
SHANGHAI-AE
1000
80
0
CYRF6936 7B63936AC)
4802661
610842161
SHANGHAI-AE
500
80
0
CYRF6936 7B63936AC)
4802661
610842161
SHANGHAI-AE
1000
80
0
CYRF6936 7B63936AC)
4802661
610842162
SHANGHAI-AE
500
80
0
CYRF6936 7B63936AC)
4802661
610842162
SHANGHAI-AE
1000
80
0
STRESS: THERMAL SHOCK COND. B – 55C TO 125C
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
200
80
0
CYRF6936 (7B6936AC)
4824057
610842163
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4824057
610842164
SHANGHAI-AE
COMP
15
0
CYRF6936 7B63936AC)
4824057
610842165
SHANGHAI-AE
COMP
15
0
STRESS:
X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No.001-89581 Rev. *A
ECN # 4526545
Document History Page
Document Title:
QTP# 084006: 40-LEAD SAW QFN (QUAD FLAT NO-LEAD) (6 X 6 X 1MM), NIPDAU-AG,
MSL3, 260C REFLOW, ASE-SHANGHAI
001-89581
Document Number:
Rev. ECN
No.
**
4149137
*A
4526545
Orig. of
Change
JYF
JYF
Description of Change
Initial Spec Release.
Sunset review:
Updated QTP title page for template alignment.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
Similar pages
QTP 102610:48-LEAD QFN (7X7X1.0 MM) NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 100401:68-LEAD SAW QFN (QUAD FLAT NO-LEAD) - 8 X 8 X 1.0MM NIPDAU, MSL3, 260C REFLOW CML-RA
QTP# 082902:32-LEAD SAW QFN (QUAD FLAT NO-LEAD) (5 X 5 X 0.93MM), NIPDAU, MSL3 260C REFLOW, CML-RA
QTP 9380 32-Lead Saw QFN (Quad Flat No-Lead) (5 x 5 x 1mm) NiPdAu,MSL3, 260°C Reflow CML-RA .pdf
QTP 112107:48QFN 7X7X1MM (LT48A, LT48C AND LT48D), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 133308 Qfn68l (8x8x1.0mm) Nipdau, Cupd Wire Msl3, 260°c Reflow Cml-ra.pdf
QTP 111816:56 QFN (8X8X0.9 MILS), 56/68 QFN (8X8X1.0 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 112302.pdf
092002:32-LEAD - SAW QFN (QUAD FLAT NO-LEAD) (5 X 5 X 0.6MM) NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 114407:68-LEAD SAW QFN (QUAD FLAT NO-LEAD), (8 X 8 X 1.0MM), NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 112104:32 QFN (5X5X0.6 MILS) / 36 QFN (5X5X0.6 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 153701:New Package Qualification of the BKK 24 FBGA, with CuPd, KMC-3580LVA, CRM-1577DB, SAC 305, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4.pdf
QTP 112108:24 QFN (4X4X0.6MM), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 093901:CY8CLEDAC01 PPSOC FAMILY 0.35UM LOGIC 1P4M, UMC FAB8 QUALIFICATION REPORT
QTP 83909 32QFN (5X5X0.6) NiPdAu-Ag, MSL3, 260C Reflow Amkor-Phil (Phil-M).pdf
QTP# 150414:48 VFBGA (6X8X1.0MM) SAC 105 SOLDER BALL FINISH, CUPD WIRE, MSL3, 260C REFLOW, CML-RA
QTP 154002:New Package Qualification of the CML 16LD 300-mil SOIC, with CuPd, KEG3000DA, QMI 509, NiPdAu, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4.pdf
QTP 101208:48-LEAD SSOP, KEG3000 M/C, NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 112603:16 QFN (3X3X0.6MM), NIPDAU-AG, MSL3 260C REFLOW ASEK- TAIWAN
QTP#153304:124 vFBGA Package (9x9x1.0mm) SAC-105, CuPd MSL3, 260C Reflow ASEK-Taiwan (G)
QTP 151502:New Package Qualification Of The UTL 16LD 300-MIL SOIC, WITH CUPD, G605, 8200T, PURE SN, AT MSL3, 260C, WITH 1M NVSRAM, S8 Technology from CMI FAB4.pdf
QTP 133309 FN68L (8x8x1.0mm) Pure Sn CuPd Wire MSL3 260C Reflow ASE-G.pdf