Document No.001-70190 Rev. *C ECN # 4450627 Cypress Semiconductor Package Qualification Report QTP# 111812 VERSION*C July, 2014 32 QFN (5X5X1.0 mm) / 40 QFN (6X6X1.0 mm) NiPdAu, MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-70190 Rev. *C ECN # 4450627 PACKAGE QUALIFICATION HISTORY QTP Number 111812 Description of Qualification Purpose Qualification of 32QFN 5X5X1 (LT32B) with 3.5X3.5 Epad size and 40QFN 6X6X1 (LT40A) with 3.5X3.5 Epad size packages at ASEKH (G) using G631 mold compound and EN-4900 epoxy Date Jun 2011 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 8 Document No.001-70190 Rev. *C ECN # 4450627 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT32B / LT40A Package Outline, Type, or Name: 32 Quad Flat No-Lead / 40 Quad Flat No-Lead Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN-4900 Bond Diagram Designation 001-30999 / 001-44328 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 22°C/W , 21.2°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 8 Document No.001-70190 Rev. *C ECN # 4450627 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc = 5.5V, 125 C JESD22-A108 Dynamic Operating Condition, Vcc = 5.5V, 150 C JESD22-A108 JEDEC STD 22-A110, 130 C, 85%RH, 3.63V/5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A103, 150 C, no bias Result P/F P P P P P P P Ball Shear (2200V) JEDEC EIA/JESD22-A114 (500V) JESD22-C101 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow JESD22-B116, Cpk : 1.33, Ppk : 1.66 Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: • <3000 sq. mils = 1.2 kgf • 30001-5000 sq. mils = 1.2 kgf • >5001 sq. mils = 1.2 kgf P P P P P P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C Solderability, Steam Aged J-STD-002, JESD22-B102 P P P 95% solder coverage minimum X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 8 P Document No.001-70190 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 111812 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN COMP 15 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN COMP 15 0 CYRF6936B (7B6936B) 4022631 611114118 G-TAIWAN COMP 15 0 4022630 611117174 G-TAIWAN COMP 10 0 4022630 611117174 G-TAIWAN COMP 10 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CYRF6936B (7B6936B) STRESS: BOND PULL CYRF6936B (7B6936B) STRESS: CONSTRUCTIONAL ANALYIS CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN COMP 5 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN COMP 5 0 CYRF6936B (7B6936B) 4022631 611114118 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN COMP 15 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN COMP 15 0 CYRF6936B (7B6936B) 4022631 611114118 G-TAIWAN COMP 15 0 4022630 611117174 G-TAIWAN COMP 15 0 G-TAIWAN COMP 9 0 COMP 8 0 STRESS: DIE SHEAR CYRF6936B (7B6936B) STRESS: ESD-CHARGE DEVICE MODEL, (500V) CYRF6936B (7B6936B) 4022630 611117174 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3 CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN 128 77 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 128 78 0 STRESS: HIGH TEMP STORAGE, 150C CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 500 80 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 500 80 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 8 Document No.001-70190 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 111812 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN COMP 5 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN COMP 5 0 CYRF6936B (7B6936B) 4022631 611114118 G-TAIWAN COMP 5 0 Failure Mechanism STRESS: INTERNAL VISUAL STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 5.5V, Vcc Core CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 96 1495 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 5.5V, Vcc Core CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 80 116 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 500 116 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN 168 77 0 CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN 288 77 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 168 80 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 288 80 0 4022630 611117174 G-TAIWAN COMP 15 0 CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN COMP 3 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN COMP 3 0 CYRF6936B (7B6936B) 4022631 611114118 G-TAIWAN COMP 3 0 STRESS: PHYSICAL DIMENSION CYRF6936B (7B6936B) STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN 500 77 0 CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN 1000 77 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 500 80 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 1000 80 0 CYRF6936B (7B6936B) 4022631 611114118 G-TAIWAN 500 80 0 CYRF6936B (7B6936B) 4022631 611114118 G-TAIWAN 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-70190 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 111812 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN 200 77 0 CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN 1000 77 0 CYRF6936B (7B6936B) 4022630 611117174 G-TAIWAN COMP 15 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN COMP 15 0 Failure Mechanism STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-70190 Rev. *C ECN # 4450627 Document History Page Document Title: QTP 111812: 32 QFN (5X5X1.0 MILS) / 40 QFN (6X6X1.0 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN Document Number: 001-70190 Rev. ECN No. ** 3283659 *A 3657926 Orig. of Change NSR NSR *B 4055318 JYF *C 4450627 JYF Description of Change Initial spec release Sunset Review. Remove the reference Cypress specs on the reliability test conditions and replace with the industry standards. Remove version 1.0 in the QTP# in title page. Sunset Review: Deleted revisions of ref. Jedec/Military standards in Reliability Tests Performed table. Revision changes from time to time. Sunset Review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8