MAXIM MAX1170CBH

19-1132; Rev 0; 10/96
KIT
ATION
EVALU
LE
B
A
IL
A
AV
12-Bit, 10Msps, TTL-Output ADC
_____________________________Features
♦ Monolithic, 12-Bit, 10Msps Converter
♦ On-Chip Track/Hold
♦ ±2.0V Analog Input Range
♦ High Input Impedance
♦ 66dB SNR at 1MHz Input
♦ Low Power: 1.1W
♦ 5pF Input Capacitance
♦ TTL-Compatible Outputs
________________Ordering Information
_________________________Applications
PART
TEMP. RANGE
MAX1170CDJ
0°C to +70°C
32 Ceramic SB
PIN-PACKAGE
MAX1170CBH
0°C to +70°C
44 CERQUAD
Radar Receivers
Professional Video
Instrumentation
___________________Pin Configurations
Imaging
Digital Communications
TOP VIEW
ANALOG GAIN
COMPRESSION
PROCESSOR
TRACK/
HOLD
AMPLIFIERS
ASYNCHRONOUS
8-BIT SAR
8
34
35
36
37
38
39
40
41
42
31
4
30
29
5
6
28
MAX1170
N.C.
VFB
VSB
VRT1
VRT2
VIN
VRT3
VST
VFT
N.C.
VCC
22
21
23
20
24
11
19
25
10
18
26
9
17
27
8
16
7
15
DIGITAL
ERROR
OUTPUT
CORRECTION,
DECODING
12
AND
OUTPUT TLL
DRIVERS
3
14
4
32
13
4-BIT FLASH CONVERTER
33
2
12
VIN
INPUT
BUFFER
1
N.C.
D12
DGND
DVCC
N.C.
CLK
N.C.
VEE
N.C.
AGND
N.C.
________________Functional Diagram
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
N.C.
43
44
D1
D0
N.C.
DGND
DVCC
VEE
N.C.
AGND
N.C.
VCC
N.C.
Digital Spectrum Analyzers
CERQUAD
Pin Configurations continued at end of data sheet.
________________________________________________________________ Maxim Integrated Products
For the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800
1
MAX1170
_________________General Description
The MAX1170 analog-to-digital converter (ADC) is a
12-bit monolithic ADC capable of sample rates greater
than 10Msps. An on-board input buffer and track/hold
function ensure excellent dynamic performance without
the need for external components. A 5pF input capacitance minimizes development problems.
Logic inputs and outputs are TTL compatible. An overrange output signal is provided to indicate overflow
conditions. Output data format is straight binary. Power
dissipation is a very low 1.1W with power-supply voltages of +5.0V and -5.2V. The MAX1170 also provides a
wide input voltage range of ±2.0V.
The MAX1170 is available in a 32-lead ceramic sidebrazed package and a 44-lead surface-mount CERQUAD
package.
MAX1170
12-Bit, 10Msps, TTL-Output ADC
ABSOLUTE MAXIMUM RATINGS
VCC .......................................................................................+6V
VEE .........................................................................................-6V
Analog Input ........................................................VFB ≤ VIN ≤ VFT
VFB, VFT ................................................................. -3.0V, +3.0V
Reference Ladder Current ..................................................12mA
CLK IN ...................................................................................VCC
Digital Outputs.......................................................0mA to -30mA
Operating Temperature Range...............................0°C to +70°C
Junction Temperature (Tj)................................................+175°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +5.0V, VEE = -5.2V, DVCC = +5.0V, VIN = ±2.0V, VSB = -2.0V, VST = +2.0V, fCLK = 10MHz, 50% clock duty cycle,
TA = TMIN to TMAX, unless otherwise noted.)
PARAMETER
CONDITIONS
TEST
LEVEL
Resolution
MIN
TYP
MAX
12
UNITS
Bits
DC ACCURACY (TA = +25°C)
Integral Nonlinearity
± full scale
IV
±2.0
LSB
Differential Nonlinearity
250kHz sample rate
IV
±0.8
LSB
I
Guaranteed
VI
±2.0
I
30
No Missing Codes
ANALOG INPUT
Input Voltage Range
Input Bias Current
TA = +25°C
Input Resistance
VIN = 0V, TA = +25°C
I
100
V
60
300
µA
kΩ
V
5
pF
V
120
MHz
Positive Full-Scale Error
V
±5.0
LSB
Negative Full-Scale Error
V
±5.0
LSB
Input Capacitance
Input Bandwidth
3dB small signal
REFERENCE INPUT
Reference Ladder Resistance
VI
Reference Ladder Tempco
V
500
800
Ω
0.8
Ω/°C
TIMING CHARACTERISTICS
Maximum Conversion Rate
VI
Overvoltage Recovery Time
V
Pipeline Delay (Latency)
10
MHz
20
VI
ns
1
Clock
Cycle
18
ns
Output Delay
TA = +25°C
V
14
Aperture Delay Time
TA = +25°C
V
1
ns
Aperture Jitter Time
TA = +25°C
V
5
ps-RMS
2
_______________________________________________________________________________________
12-Bit, 10Msps, TTL-Output ADC
(VCC = +5.0V, VEE = -5.2V, DVCC = +5.0V, VIN = ±2.0V, VSB = -2.0V, VST = +2.0V, fCLK = 10MHz, 50% clock duty cycle,
TA = TMIN to TMAX, unless otherwise noted.)
PARAMETER
CONDITIONS
TEST
LEVEL
MIN
TYP
MAX
UNITS
DYNAMIC PERFORMANCE
Effective Number of Bits
fIN = 500kHz
10.2
fIN = 1MHz
10.0
fIN = 3.58MHz
9.5
fIN = 500kHz
Signal-to-Noise Ratio
(without Harmonics)
fIN = 1MHz
fIN = 3.58MHz
fIN = 500kHz
Harmonic Distortion
fIN = 1MHz
fIN = 3.58MHz
fIN = 500kHz
Signal-to-Noise and Distortion
fIN = 1MHz
fIN = 3.58MHz
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
TA = TMIN to TMAX
I
64
67
IV
58
61
I
64
66
IV
58
60
I
62
64
IV
58
60
I
63
66
IV
59
62
I
63
65
IV
59
61
I
59
61
IV
57
59
I
60
63
IV
55
58
I
60
62
IV
55
57
I
57
59
IV
54
Bits
dB
dB
dB
56
Spurious-Free Dynamic Range
fIN = 1MHz, TA = +25°C
V
74
dBc
Differential Phase
fIN = 3.58MHz and 4.35MHz,
TA = +25°C
V
0.2
Degrees
Differential Gain
fIN = 3.58MHz and 4.35MHz,
TA = +25°C
V
0.7
%
DIGITAL INPUTS
Logic "1" Voltage
V
Logic "0" Voltage
V
Maximum Input Current Low
TA = +25°C
Maximum Input Current High
TA = +25°C
I
2.4
4.0
V
0.8
V
0
5
20
µA
5
20
µA
I
0
Pulse Width Low (CLK)
IV
30
Pulse Width High (CLK)
IV
30
2.4
ns
300
ns
DIGITAL OUTPUTS
Logic "1" Voltage
TA = +25°C
I
Logic "0" Voltage
TA = +25°C
I
V
0.6
V
_______________________________________________________________________________________
3
MAX1170
ELECTRICAL CHARACTERISTICS (continued)
MAX1170
12-Bit, 10Msps, TTL-Output ADC
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +5.0V, VEE = -5.2V, DVCC = +5.0V, VIN = ±2.0V, VSB = -2.0V, VST = +2.0V, fCLK = 10MHz, 50% clock duty cycle,
TA = TMIN to TMAX, unless otherwise noted.)
TEST
LEVEL
MIN
TYP
MAX
VCC
IV
4.75
5.0
5.25
DVCC
IV
4.75
5.0
5.25
-VEE
IV
-4.95
-5.2
-5.45
PARAMETER
CONDITIONS
UNITS
POWER-SUPPLY REQUIREMENTS
Voltages
ICC, TA = +25°C
Currents
DICC, TA = TMIN to TMAX
-IEE, TA = +25°C
Power Dissipation
Power-Supply Rejection
5V ±0.25V, -5.2V ±0.25V
I
135
150
IV
40
55
I
45
70
VI
1.1
1.3
V
1.0
V
mA
W
LSB
Note 1: Typical thermal impedances (unsoldered, in free air):
32 Ceramic SB: θjA = 50°C/W
44 CERQUAD: θjA = 78°C/W, θjA at 1m/s airflow = 58°C/W, θjC = 3.3°C/W
Use forced-air cooling or heatsinking to maintain Tj ≤ 150°C.
TEST LEVEL CODES
All electrical characteristics are subject to the
following conditions:
All parameters having min/max specifications
are guaranteed. The Test Level column indicates the specific device testing actually performed during production and Quality
Assurance inspection. Any blank section in the
data column indicates that the specification is
not tested at the specified condition.
Unless otherwise noted, all tests are pulsed;
therefore, Tj = TC = TA.
4
TEST LEVEL
TEST PROCEDURE
I
100% production tested at the specified temperature.
II
100% production tested at TA = +25°C, and sample tested at the
specified temperatures.
III
QA sample tested only at the specified temperatures.
IV
Parameter is guaranteed (but not tested) by design and characterization data.
V
Parameter is a typical value for information purposes only.
VI
100% production tested at TA = +25°C. Parameter is guaranteed
over specified temperature range.
_______________________________________________________________________________________
12-Bit, 10Msps, TTL-Output ADC
MAX1170
__________________________________________Typical Operating Characteristics
(fS = 10Msps, fIN = 1MHz, TA = +25°C, unless otherwise noted.)
TOTAL HARMONIC DISTORTION
vs. INPUT FREQUENCY
60
50
50
40
40
30
30
20
1
INPUT FREQUENCY (MHz)
10
1
INPUT FREQUENCY (MHz)
50
40
1
SPECTRAL RESPONSE
50
40
100
MAX1170 TOC-05
75
70
SNR, THD, SINAD (dB)
AMPLITUDE (dB)
60
10
SAMPLE RATE (Msps)
SNR, THD, SINAD vs. TEMPERATURE
-30
SINAD (dB)
SINAD
10
0
MAX1170 TOC-04
70
60
20
0.1
SIGNAL-TO-NOISE AND DISTORTION
vs. INPUT FREQUENCY
80
SNR, THD
30
20
0.1
70
-60
-90
MAX1170 TOC-06
THD (dB)
SNR (dB)
SNR, THD, SINAD (dB)
70
60
80
MAX1170 TOC-02
70
SNR, THD, SINAD vs. SAMPLE RATE
80
MAX1170 TOC-01
80
MAX1170 TOC-03
SIGNAL-TO-NOISE RATIO
vs. INPUT FREQUENCY
SNR
65
THD
60
SINAD
55
30
-120
20
0.1
1
INPUT FREQUENCY (MHz)
10
50
0
1
2
3
FREQUENCY (MHz)
4
5
-25
0
50
25
TEMPERATURE (°C)
75
_______________________________________________________________________________________
5
MAX1170
12-Bit, 10Msps, TTL-Output ADC
_________________________________________________________________________Pin Description
PIN
NAME
6
Ceramic SB
CERQUAD
1, 15
14, 41
DGND
2–13
43, 44, 1–10
D0–D11
14
13
D12
16, 32
15, 40
DVCC
FUNCTION
Digital Ground
TTL Outputs (D0 = LSB)
TTL Output Overrange Bit
Digital +5.0V Supply (TTL Outputs)
17
17
CLK
TTL Clock Input
18, 31
19, 39
VEE
-5.2V Supply
19, 30
21, 37
AGND
20, 29
23, 35
VCC
+5.0V Supply
21
25
VFT
Force for Top of Reference Ladder
22
26
VST
Sense for Top of Reference Ladder
23
27
VRT3
24
28
VIN
25
29
VRT2
Voltage Reference Tap 2
26
30
VRT1
Voltage Reference Tap 1
27
31
VSB
Sense for Bottom of Reference Ladder
28
32
VFB
Force for Bottom of Reference Ladder
—
11, 12, 16, 18,
20, 22, 24, 33,
34, 36, 38, 42
N.C.
No Connection
Analog Ground
Voltage Reference Tap 3
Analog Input, ±2.0V typical
_______________________________________________________________________________________
12-Bit, 10Msps, TTL-Output ADC
MAX1170
N+1
N
N+2
tPWH
tPWL
CLK
tD
OUTPUT
DATA
N-2
DATA VALID
N
N-1
DATA VALID
N+1
Figure 1a. Timing Diagram
CLK
tD
OUTPUT
DATA
DATA VALID
Figure 1b. Single-Event Clock
Table 1. Timing Parameters
PARAMETER
MIN
DESCRIPTION
tD
CLK to Data Valid Prop Delay
tPWH
CLK High Pulse Width
30
tPWL
CLK Low Pulse Width
30
_______________Detailed Description
The MAX1170 requires few external components to
achieve the stated operation and performance. Figure
2 shows the typical interface requirements when using
the MAX1170 in normal circuit operation. The following
section provides a description of the pin functions and
outlines critical performance criteria for achieving the
optimal device performance.
TYP
MAX
UNITS
14
18
ns
300
ns
ns
Power Supplies and Grounding
The MAX1170 requires -5.2V and +5V analog supply
voltages. The +5V supply is common to analog VCC
and digital DVCC. A ferrite bead in series with each
supply line reduces the transient noise injected into the
analog VCC. These beads should be connected as
close to the device as possible. The connection
between the beads and the MAX1170 should not be
shared with any other device. Bypass each power-supply pin as close to the device as possible. Use 0.1µF
for VEE and VCC, and 0.01µF for DVCC (chip capacitors
are preferred).
_______________________________________________________________________________________
7
R1
100Ω
17 CLK
+
VIN
+2.5V
VOUT 6
GND
TRIM
4
D11 13
21 VFT
+
IC1
(REF-03)
4
D12 14 (OVERRANGE)
COARSE
ADC
1µF
5
D10 12
D9 11
22 VST
10k
C2
0.01µF
30k
D8 10
ANALOG
PRESCALER
2R
23 VRT3
C3
0.01µF
2R
25 VRT2
C4
0.01µF
D4 6
18
31
19
AGND
30
20
29
D0 2
16
DGND
DGND
C7
0.01µF
R
28 VFB
DVCC
C16
1µF
D5 7
D1 3
SUCCESSIVE
INTERPOLATION
STAGE N
DVCC
-2.5V
D6 8
D2 4
2R
C6
0.01µF
6
D7 9
D3 5
27 VSB
30k
VCC
C17
0.01µF
7
C18
0.01µF
4
VCC
8
+5V
C5
0.01µF
-5.2V
AGND
10k
2R
VEE
IC2
OP-07
SUCCESSIVE
INTERPOLATION
STAGE 1
26 VRT1
AGND
1
2
VEE
3
32
1
C8 C10
0.1µF 0.1µF
C12
0.01µF
C9 C11
0.1µF 0.1µF
C13
0.01µF
15
NOTES:
1) D1 = SCHOTTKY OR HOT CARRIER DIODE
D1
FB
FB
C15 C14
10µF 10µF
FB
2) FB = FERRITE BEAD, FAIR RIGHT P/N 2743001111, TO BE MOUNTED AS
CLOSELY AS POSSIBLE. THE FERRITE BEAD TO ADC CONNECTION SHOULD
NOT BE SHARED WITH ANY OTHER DEVICE.
3) C1–C3 = CHIP CAPACITOR (RECOMMENDED) MOUNTED AS CLOSELY TO
THE DEVICE’S PIN AS POSSIBLE
4) USE OF A SEPARATE SUPPLY FOR VCC AND DVCC IS NOT RECOMMENDED
5) R1 PROVIDES CURRENT LIMITING TO 45mA
-5.2V
(ANALOG)
+5V
(ANALOG)
Figure 2. Typical Interface Circuit
8
(MSB)
R
C1
0.01µF
DECODING NETWORK
2
+5V
C19
1.0µF
MAX1170
24 VIN
VIN
(±2V)
DIGITAL OUTPUTS
CLK
(TTL)
DGND
MAX1170
12-Bit, 10Msps, TTL-Output ADC
_______________________________________________________________________________________
(LSB)
12-Bit, 10Msps, TTL-Output ADC
Voltage Reference
The MAX1170 requires the use of two voltage references: VFT and VFB. VFT is the force for the top of the
voltage reference ladder (+2.5V typical), VFB (-2.5V
typical) is the force for the bottom of the voltage reference ladder. Both voltages are applied across an internal reference ladder resistance of 800Ω. The +2.5V
voltage source for reference VFT must be current limited to 20mA maximum if a different driving circuit is
used in place of the recommended reference circuit
shown in Figures 2 and 3.
In addition, there are five reference ladder taps (VST,
VRT1, VRT2, VRT3, and VSB). VST is the sense for the
top of the reference ladder (+2.0V), VRT2 is the midpoint of the ladder (0.0V typical), and VSB is the sense
for the bottom of the reference ladder (-2.0V). VRT1 and
VRT3 are quarter-point ladder taps (+1.0V and -1.0V
typical, respectively). The voltages seen at V ST and
VSB are the true full-scale input voltages of the device
when VFT and VFB are driven to the recommended voltages (+2.5V and -2.5V typical, respectively). VST and
VSB can be used to monitor the actual full-scale input
voltage of the device. VRT1, VRT2, and VRT3 should not
be driven to the expected ideal values, as is commonly
done with standard flash converters. A decoupling
capacitor of 0.01µF connected to AGND from each tap
is recommended to minimize high-frequency noise
injection.
The analog input range will scale proportionally with
respect to the reference voltage if a different input
MAX1170
VCC
ANALOG PRESCALER
AGND and DGND are the two grounds available on the
MAX1170. These two internal grounds are isolated on
the device. The use of ground planes is recommended
to achieve optimum device performance. DGND is
needed for the DVCC return path (40mA typical) and for
the return path for all digital output logic interfaces.
AGND and DGND should be separated from each
other and connected together only at the device
through a ferrite bead.
A Schottky or hot carrier diode connected between
AGND and VEE is required. The use of separate power
supplies between VCC and DVCC is not recommended
due to potential power-supply sequencing latchup conditions. Use of the recommended interface circuit shown
in Figure 2 will provide optimum device performance for
the MAX1170.
VIN
VFT
VEE
Figure 3. Analog Equivalent Input Circuit
range is required. The maximum scaling factor for
device operation is ±20% of the recommended reference voltages of VFT and VFB. However, because the
MAX1170 is laser trimmed to optimize performance
with ±2.5V references, its accuracy will degrade if
operated beyond a ±2% range.
An example of a recommended reference driver circuit
is shown in Figure 2. IC1 is REF-03, the +2.5V reference with a tolerance of 0.6% or ±0.015V. The 10kΩ
potentiometer supports an adjustable range of 150mV.
IC2 is recommended to be an OP-07 or equivalent
device. R2 and R3 must be matched to within 0.1%
with good TC tracking to maintain a 0.3LSB matching
between VFT and VFB. If 0.1% matching is not met, then
potentiometer R4 can be used to adjust the VFB voltage
to the desired level. Adjust R1 and R4 such that VST
and VSB are exactly +2.0V and -2.0V, respectively.
The following errors are defined:
+FS error = top of ladder offset voltage
= ∆(+FS - VST)
-FS error = bottom of ladder offset voltage
= ∆(-FS - VSB)
Where the +FS (full scale) input voltage is defined as
the output 1LSB above the transition of 1–10 and 1–11,
and the -FS input voltage is defined as the output 1LSB
below the transition of 0–00 and 0–01.
_______________________________________________________________________________________
9
MAX1170
12-Bit, 10Msps, TTL-Output ADC
N
CLK IN
N+1
2.4V
tRISE
6ns
6ns
typ
3.5V
DATA OUT
(ACTUAL)
INVALID
DATA
2.4V
INVALID
DATA
(N - 2)
(N - 1)
(N)
0.8V
0.5V
tPD1
14ns typ
DATA OUT
(EQUIVALENT)
(N - 2)
INVALID
DATA
INVALID
DATA
(N - 1)
(N - 1)
Figure 4. Digital Output Characteristics
Analog Input
VIN is the analog input. The full-scale input range will be
80% of the reference voltage or ±2V with VFB = -2.5V
and VFT = +2.5V.
The drive requirements for the analog inputs are minimal
compared to those of conventional flash converters, due
to the MAX1170’s extremely low 5pF input capacitance
and high 300kΩ input impedance. For example, for an
input signal of ±2Vp-p with an input frequency of
10MHz, the peak output current required for the driving
circuit is only 628µA.
Clock Input
The MAX1170 is driven from a single-ended TTL input
(CLK). For optimal noise performance, the clock input
slew rate should be a minimum of 6ns. Because of this,
the use of fast logic is recommended. The clock input
duty cycle should be 50% where possible, but performance will not be degraded if kept within the range of
40% to 60%. However, in any case, the clock pulse
width (tPWH) must be kept at 300ns maximum to ensure
proper operation of the internal track/hold amplifier
(Figure 1a). The analog input signal is latched on the
rising edge of the CLK.
The clock input must be driven from fast TTL logic (VIH ≤
4.5V, tRISE < 6ns). In the event the clock is driven from a
high current source, use a 100Ω resistor (R1, Figure 2)
in series to current limit to approximately 45mA.
Digital Outputs
The format of the output data (D0-D11) is straight binary (Table 2). The outputs are latched on the rising edge
of CLK with a typical propagation delay of 14ns. There
is a one clock cycle latency between CLK and the valid
output data (Figure 1a).
The digital outputs’ rise times and fall times are not
symmetrical. The rise time’s typical propagation delay
is 14ns, and the typical fall time is 6ns (Figure 4). The
nonsymmetrical rise and fall times create approximately
8ns of invalid data.
Table 2. Output Data Information
ANALOG
INPUT
OVERRANGE
D10
OUTPUT CODE
D9–D0
> +2.0V + 1/2LSB
1
1 1 1 111 1111
+2.0V - 1LSB
0.0V
-2.0V + 1LSB
< -2.0V
0
0
0
0
11
ØØ
00
00
1 111
ØØØØ
0000
0000
(Ø indicates the flickering bit between logic 0 and 1).
10
______________________________________________________________________________________
111Ø
ØØØØ
000Ø
0000
12-Bit, 10Msps, TTL-Output ADC
Evaluation Board
The MAX1170 evaluation kit (EV kit) is available to aid
designers in demonstrating the full performance of the
MAX1172 (or of the MAX1170/MAX1171). This board
includes a reference circuit, clock driver circuit, output
data latches, and on-board reconstruction of the digital
data. A separate EV kit manual describing the operation of this board is available. Contact the factory for
price and availability.
____Pin Configurations (continued)
TOP VIEW
DGND 1
32 DVCC
D0 2
31 VEE
D1 3
30 AGND
D2 4
MAX1170
D3 5
29 VCC
28 VFB
D4 6
27 VSB
D5 7
26 VRT1
D6 8
25 VRT2
D7 9
24 VIN
D8 10
23 VRT3
D9 11
22 VST
D10 12
21 VFT
D11 13
20 VCC
D12 14
19 AGND
DGND 15
18 VEE
DVCC 16
17 CLK
Ceramic SB
______________________________________________________________________________________
11
MAX1170
Overrange Output
The overrange output (D12) is an indication that the analog input signal has exceeded the full-scale input voltage by 1LSB. When this condition occurs, the outputs
will switch to logic 1s. All other data outputs are unaffected by this operation. This feature makes it possible
to include the MAX1170 in higher resolution systems.
MAX1170
12-Bit, 10Msps, TTL-Output ADC
__________________________________________________________Package Information
DIM
A
B
C
D
E
F
G
H
I
J
32
1
G
INCHES
MAX
MIN
0.099
0.081
0.020
0.016
0.105
0.095
0.050 typ
–
–
0.040
0.225
0.175
1.620
1.580
0.605
0.585
0.012
0.009
0.620
0.600
MILLIMETERS
MIN
MAX
2.06
2.51
0.41
0.51
2.41
2.67
–
1.27
1.02
–
4.45
5.72
40.13
41.15
14.86
15.37
0.23
0.30
15.24
15.75
H
32-PIN
SIDEBRAZED
PACKAGE
A
E
F
I
J
C
B
D
DIM
C
A
D
B
A
B
C
D
E
F
G
H
INCHES
MAX
MIN
0.000
0.546 typ
0.694
0.679
0.040
0.038
0.000
0.016 typ
0.000
0.008 typ
0.051
0.027
0.000
0.006 typ
0.140
0.115
MILLIMETERS
MIN
MAX
14.00 typ
–
17.40
17.80
0.98
1.02
0.40 typ
–
0.20 typ
–
0.70
1.30
0.15 typ
–
2.96
3.58
A
B
44-PIN
CERQUAD
H
0-5°
G
E
F
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 __________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600
© 1996 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.