TI ADS5474IPFPG4

ADS5474
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SLAS525 – JULY 2007
14-Bit, 400-MSPS Analog-to-Digital Converter
•
FEATURES
•
•
•
•
•
•
•
•
•
•
•
400-MSPS Sample Rate
14-Bit Resolution, 11.2-Bits ENOB
1.4-GHz Input Bandwidth
SFDR = 80 dBc at 230 MHz and 400 MSPS
SNR = 69.8 dBFS at 230 MHz and 400 MSPS
2.2 VPP Differential Input Voltage
LVDS-Compatible Outputs
Total Power Dissipation: 2.5 W
Power Down Mode: 50mW
Offset Binary Output Format
Output Data Transitions on the Rising and
Falling Edges of a Half-Rate Output Clock
•
•
•
On-Chip Analog Buffer, Track-and-Hold, and
Reference Circuit
TQFP-80 PowerPAD™ Package
(14 mm × 14 mm footprint)
Industrial Temperature Range:
–40°C to +85°C
Pin-Similar/Compatible with 12-, 13-, and
14-Bit Family:
ADS5463 and ADS5440/ADS5444
APPLICATIONS
•
•
•
•
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Test and Measurement Instrumentation
Software-Defined Radio
Data Acquisition
Power Amplifier Linearization
Communication Instrumentation
Radar
DESCRIPTION
The ADS5474 is a 14-bit, 400-MSPS analog-to-digital converter (ADC) that operates from both a 5-V supply and
3.3-V supply while providing LVDS-compatible digital outputs. This ADC is one of a family of 12-, 13-, and 14-bit
ADCs that operate from 210 MSPS to 500 MSPS. The ADS5474 input buffer isolates the internal switching of
the onboard track and hold (T&H) from disturbing the signal source while providing a high-impedance input. An
internal reference generator is also provided to simplify the system design.
Designed with a 1.4-GHz input bandwidth for the conversion of wide-bandwidth signals that exceed 400 MHz of
input frequency at 400 MSPS, the ADS5474 has outstanding low noise performance and spurious-free dynamic
range over a large input frequency range.
The ADS5474 is available in an TQFP-80 PowerPAD package. The device is built on Texas Instruments
complementary bipolar process (BiCom3) and is specified over the full industrial temperature range (–40°C to
+85°C).
VIN
VIN
A1
TH1
+
TH2
S
+
TH3
A2
ADC1
VREF
S
A3
ADC3
–
–
DAC1
ADC2
DAC2
Reference
5
5
6
Digital Error Correction
CLK
CLK
Timing
OVR
OVR
DRY
DRY
D[13:0]
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
ADS5474
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SLAS525 – JULY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
PACKAGE-LEAD
ADS5474
HTQFP-80 (2)
PowerPAD
(1)
(2)
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
PFP
–40°C to +85°C
ADS5474I
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
ADS5474IPFP
Tray, 96
ADS5474IPFPR
Tape and Reel, 1000
For the most current product and ordering information see the Package Option Addendum located at the end of this document, or see
the TI web site at www.ti.com.
Thermal pad size: 9.5 mm × 9.5 mm (minimum), 10 mm × 10 mm (maximum).
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range, unless otherwise noted.
Supply voltage
ADS5474
UNIT
AVDD5 to GND
6
V
AVDD3 to GND
5
V
5
V
Analog input to GND
DVDD3 to GND
–0.3 to (AVDD5 + 0.3)
V
Clock input to GND
–0.3 to (AVDD5 + 0.3)
V
±2.5
V
CLK to CLK
Digital data output to GND
–0.3 to (DVDD3 + 0.3)
V
–40 to +85
°C
+150
°C
Operating temperature range
Maximum junction temperature
Storage temperature range
ESD, human-body model (HBM)
(1)
–65 to +150
°C
2
kV
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime are available upon
request.
THERMAL CHARACTERISTICS (1)
PARAMETER
RθJA
(2)
RθJP (3)
(1)
(2)
(3)
2
TEST CONDITIONS
TYP
Soldered thermal pad, no airflow
23.7
Soldered thermal pad, 150-LFM airflow
17.8
Soldered thermal pad, 250-LFM airflow
16.4
Bottom of package (thermal pad)
2.99
Using 36 thermal vias (6 × 6 array). See PowerPAD Package in the Application Information section.
RθJA is the thermal resistance from the junction to ambient.
RθJP is the thermal resistance from the junction to the thermal pad.
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UNIT
°C/W
°C/W
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RECOMMENDED OPERATING CONDITIONS
ADS5474
MIN
TYP
MAX
UNIT
SUPPLIES
AVDD5
Analog supply voltage
4.75
5
5.25
V
AVDD3
Analog supply voltage
3.1
3.3
3.6
V
DVDD3
Output driver supply voltage
3
3.3
3.6
V
ANALOG INPUT
VCM
Differential input range
2.2
VPP
Input common mode
3.1
V
10
pF
DIGITAL OUTPUT (DRY, DATA, OVR)
Maximum differential output load
CLOCK INPUT (CLK)
CLK input sample rate (sine wave)
20
400
Clock amplitude, differential sine wave (see Figure 42)
0.5
5
Clock duty cycle (see Figure 46)
TA
40
Operating free-air temperature
50
–40
MSPS
VPP
60
%
+85
°C
ELECTRICAL CHARACTERISTICS
Typical values at TA = +25°C: minimum and maximum values over full temperature range TMIN = –40°C to TMAX = +85°C,
sampling rate = 400 MSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, –1 dBFS differential input,
and 3-VPP differential clock, unless otherwise noted.
ADS5474
PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP
MAX
UNIT
14
Bits
2.2
VPP
ANALOG INPUTS
Differential input range
Analog input common-mode voltage
Self-biased; see VCM specification below
3.1
V
Input resistance (dc)
Each input to VCM
500
Ω
Input capacitance
Each input to GND
1.8
pF
1.44
GHz
100
dB
2.4
V
Analog input bandwidth (–3dB)
CMRR
Common-mode rejection ratio
Common-mode signal < 50 MHz
(see Figure 27)
INTERNAL REFERENCE VOLTAGE
VREF
VCM
Reference voltage
Analog input common-mode voltage
reference output
With internal VREF. Provided as an output
via the VCM pin for dc-coupled
applications. If an external VREF is used,
the VCM pin tracks as illustrated in
Figure 39
2.9
VCM temperature coefficient
3.1
3.3
–0.8
V
mV/°C
DYNAMIC ACCURACY
No missing codes
Assured
DNL
Differential linearity error
fIN = 70 MHz
INL
Integral linearity error
fIN = 70 MHz
Offset error
–0.99
±0.7
–3
±1
–11
Offset temperature coefficient
1.5
LSB
3
LSB
11
0.02
Gain error
–5
Gain temperature coefficient
5
–0.02
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mV
mV/°C
%FS
%FS/°C
3
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SLAS525 – JULY 2007
ELECTRICAL CHARACTERISTICS (continued)
Typical values at TA = +25°C: minimum and maximum values over full temperature range TMIN = –40°C to TMAX = +85°C,
sampling rate = 400 MSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, –1 dBFS differential input,
and 3-VPP differential clock, unless otherwise noted.
ADS5474
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
338
372
mA
185
201
mA
75
83
2.5
2.797
POWER SUPPLY
IAVDD5
5-V analog supply current
IAVDD3
3.3-V analog supply current
IDVDD3
3.3-V digital supply current
(includes LVDS)
VIN = full-scale, fIN = 70 MHz,
fS = 400 MSPS
Total power dissipation
Power-up time
From turn-on of AVDD5
Wake-up time
From PDWN pin switched from HIGH
(PDWN active) to LOW (ADC awake)
(see Figure 28)
Power-down power dissipation
PDWN pin = logic HIGH
PSRR
Power-supply rejection ratio,
AVDD5 supply
PSRR
Power-supply rejection ratio,
AVDD3 supply
PSRR
Power-supply rejection ratio,
DVDD3 supply
W
50
μs
5
μs
50
75
Without 0.1-μF board supply capacitors,
with < 1-MHz supply noise (see Figure 49)
mA
90
110
350
mW
dB
dB
dB
DYNAMIC AC CHARACTERISTICS
fIN = 30 MHz
fIN = 70 MHz
70.3
68.3
fIN = 130 MHz
fIN = 230 MHz
SNR
Signal-to-noise ratio
70.1
68
69.1
fIN = 451 MHz
68.4
fIN = 651 MHz
67.5
fIN = 751 MHz
66.6
fIN = 999 MHz
64.7
fIN = 70 MHz
fIN = 230 MHz
HD2
4
Second-harmonic
86
80
71
80
fIN = 351 MHz
76
fIN = 451 MHz
71
fIN = 651 MHz
60
fIN = 751 MHz
55
fIN = 999 MHz
46
fIN = 30 MHz
89
fIN = 70 MHz
87
fIN = 130 MHz
90
fIN = 230 MHz
84
fIN = 351 MHz
76
fIN = 451 MHz
71
fIN = 651 MHz
74
fIN = 751 MHz
70
fIN = 999 MHz
55
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dBFS
88
74
fIN = 130 MHz
Spurious-free dynamic range
69.8
fIN = 351 MHz
fIN = 30 MHz
SFDR
70.2
dBc
dBc
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ELECTRICAL CHARACTERISTICS (continued)
Typical values at TA = +25°C: minimum and maximum values over full temperature range TMIN = –40°C to TMAX = +85°C,
sampling rate = 400 MSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, –1 dBFS differential input,
and 3-VPP differential clock, unless otherwise noted.
ADS5474
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DYNAMIC AC CHARACTERISTICS (continued)
HD3
Third-harmonic
Worst harmonic/spur
(other than HD2 and HD3)
THD
Total harmonic distortion
fIN = 30 MHz
93
fIN = 70 MHz
86
fIN = 130 MHz
80
fIN = 230 MHz
80
fIN = 351 MHz
85
fIN = 451 MHz
71
fIN = 651 MHz
60
fIN = 751 MHz
55
fIN = 999 MHz
46
fIN = 30 MHz
95
fIN = 70 MHz
93
fIN = 130 MHz
85
fIN = 230 MHz
85
fIN = 351 MHz
87
fIN = 451 MHz
87
fIN = 651 MHz
90
fIN = 751 MHz
87
fIN = 999 MHz
80
fIN = 30 MHz
86
fIN = 70 MHz
83
fIN = 130 MHz
78
fIN = 230 MHz
77
fIN = 351 MHz
75
fIN = 451 MHz
68
fIN = 651 MHz
60
fIN = 751 MHz
55
fIN = 999 MHz
45
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dBc
dBc
dBc
5
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ELECTRICAL CHARACTERISTICS (continued)
Typical values at TA = +25°C: minimum and maximum values over full temperature range TMIN = –40°C to TMAX = +85°C,
sampling rate = 400 MSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, –1 dBFS differential input,
and 3-VPP differential clock, unless otherwise noted.
ADS5474
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DYNAMIC AC CHARACTERISTICS (continued)
fIN = 30 MHz
fIN = 70 MHz
69.2
67
fIN = 130 MHz
fIN = 230 MHz
SINAD
Signal-to-noise and distortion
Two-tone SFDR
ENOB
Effective number of bits
RMS idle-channel noise
68.9
68.5
65.5
68.2
fIN = 351 MHz
67.3
fIN = 451 MHz
64.8
fIN = 651 MHz
58.5
fIN = 751 MHz
54
fIN = 999 MHz
45.4
fIN1 = 69 MHz, fIN2 = 70 MHz,
each tone at –7 dBFS
93
fIN1 = 69 MHz, fIN2 = 70 MHz,
each tone at –16 dBFS
95
fIN1 = 297.5 MHz, fIN2 = 302.5 MHz,
each tone at –7 dBFS
85
fIN1 = 297.5 MHz, fIN2 = 302.5 MHz,
each tone at –16 dBFS
83
dBc
dBFS
fIN = 70 MHz
10.8
11.2
fIN = 230 MHz
10.6
10.9
Inputs tied to common-mode
Bits
1.8
LSB
LVDS DIGITAL OUTPUTS
6
VOD
Differential output voltage (±)
VOC
Common-mode output voltage
247
1.125
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350
454
1.375
mV
V
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TIMING INFORMATION
Sample
N–1
N+4
N+2
ta
N
N+1
N+3
tCLKH
N+5
tCLKL
CLK
CLK
Latency = 3.5 Clock Cycles
tDRY
DRY
DRY
(1)
tDATA
D[13:0], OVR
N
N–1
N+1
D[13:0], OVR
(1)
Polarity of DRY is undetermined. For further information, see the Digital Outputs section.
Figure 1. Timing Diagram
TIMING CHARACTERISTICS (1)
Typical values at TA = +25°C: minimum and maximum values over full temperature range TMIN = –40°C to TMAX = +85°C,
sampling rate = 400 MSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, and 3-VPP differential
clock, unless otherwise noted.
PARAMETER
ta
TEST CONDITIONS
MIN
Aperture delay
Aperture jitter, rms
TYP
MAX
200
Internal jitter of the ADC
Latency
UNIT
ps
103
fs
3.5
cycles
tCLK
Clock period
tCLKH
Clock pulse duration, high
1
tCLKL
Clock pulse duration, low
1
tDRY
CLK to DRY delay (2)
Zero crossing, 10-pF parasitic loading to GND on each
output pin
1000
1400
1800
ps
tDATA
CLK to DATA/OVR delay (2)
Zero crossing, 10-pF parasitic loading to GND on each
output pin
800
1400
2000
ps
tSKEW
DATA to DRY skew
tDATA – tDRY, 10-pF parasitic loading to GND on each output
pin
–500
0
500
ps
tRISE
DRY/DATA/OVR rise time
10-pF parasitic loading to GND on each output pin
500
ps
tFALL
DRY/DATA/OVR fall time
10-pF parasitic loading to GND on each output pin
500
ps
(1)
(2)
2.5
50
ns
ns
ns
Timing parameters are assured by design or characterization, but not production tested.
DRY, DATA, and OVR are updated on the falling edge of CLK. The latency must be added to tDATA to determine the overall propagation
delay.
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PIN CONFIGURATION
D6
D6
D7
D7
GND
DVDD3
D8
D8
D9
D9
D10
D10
D11
D11
D12
D12
D13
D13
DRY
DRY
PFP PACKAGE
(TOP VIEW)
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
DVDD3
1
60
D5
GND
2
59
D5
AVDD5
3
58
D4
NC
4
57
D4
NC
5
56
D3
VREF
6
55
D3
GND
7
54
D2
AVDD5
8
53
D2
GND
9
52
GND
CLK
10
51
DVDD3
CLK
11
50
D1
GND
12
49
D1
AVDD5
13
48
D0
AVDD5
14
47
D0
GND
15
46
NC
AIN
16
45
NC
AIN
17
44
NC
GND
18
43
NC
AVDD5
19
42
OVR
GND
20
41
OVR
ADS5474
8
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GND
AVDD3
GND
AVDD3
GND
AVDD3
GND
PDWN
GND
GND
AVDD5
VCM
GND
AVDD5
GND
AVDD5
GND
AVDD5
GND
AVDD5
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
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PIN CONFIGURATION (continued)
Table 1. TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
DESCRIPTION
AIN
16
Differential input signal (positive)
AIN
17
Differential input signal (negative)
AVDD5
3, 8, 13, 14, 19, 21,
23, 25, 27, 31
AVDD3
35, 37, 39
Analog power supply (3.3 V) (Suggestion for ≤ 250 MSPS: leave option to connect to 5 V for
ADS5440/ADS5444 13-bit compatibility)
1, 51, 66
Digital and output driver power supply (3.3 V)
DVDD3
Analog power supply (5 V)
GND
2, 7, 9, 12, 15, 18,
20, 22, 24, 26, 28,
30, 32, 34, 36, 38,
40, 52, 65
CLK
10
Differential input clock (positive). Conversion is initiated on rising edge.
CLK
11
Differential input clock (negative)
D0, D0
48, 47
Ground
LVDS digital output pair, least significant bit (LSB)
D1–D12,
D1–D10
49, 50, 53–64,
67–76
D13, D13
78, 77
LVDS digital output pair, most significant bit (MSB)
DRY, DRY
80, 79
Data ready LVDS output pair
NC
OVR, OVR
4, 5, 43–46
42, 41
LVDS digital output pairs
No connect (pins 4 and 5 should be left floating; pins 43 to 46 are possible future bit additions for this
pinout and therefore can be connected to a digital bus or left floating)
Overrange indicator LVDS output. A logic high signals an analog input in excess of the full-scale
range.
VCM
29
Common-mode voltage output (3.1 V nominal). Commonly used in DC-coupled applications to set
the input signal to the correct common-mode voltage.
(This pin is not used on the ADS5440, ADS5444, and ADS5463)
PDWN
33
Power-down (active high). Device is in sleep mode when PDWN pin is logic HIGH. ADC converter is
awake when PDWN is logic LOW (grounded).
(This pin is not used on the ADS5440, ADS5444, and ADS5463)
VREF
6
Reference voltage input/output (2.4 V nominal)
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TYPICAL CHARACTERISTICS
At TA = +25°C, sampling rate = 400 MSPS, 50% clock duty cycle, 3-VPP differential sinusoidal clock, analog input amplitude =
–1 dBFS, AVDD5 = 5 V, AVDD3 = 3.3 V, and DVDD3 = 3.3 V, unless otherwise noted.
SPECTRAL PERFORMANCE
FFT FOR 30 MHz INPUT SIGNAL
SPECTRAL PERFORMANCE
FFT FOR 70 MHz INPUT SIGNAL
0
0
SFDR = 88.4 dBc
SNR = 70.3 dBFS
SINAD = 70.2 dBFS
THD = 86 dBc
-20
-20
-40
Amplitude - dB
-40
Amplitude - dB
SFDR = 86.6 dBc
SNR = 70.1 dBFS
SINAD = 69.9 dBFS
THD = 82.9 dBc
-60
-60
-80
-80
-100
-100
-120
-120
0
20
40
60
80
100
120
140
160
180
0
200
20
40
60
Frequency - MHz
120
140
160
Figure 3.
SPECTRAL PERFORMANCE
FFT FOR 130 MHz INPUT SIGNAL
SPECTRAL PERFORMANCE
FFT FOR 230 MHz INPUT SIGNAL
180
200
180
200
0
SFDR = 78.5 dBc
SNR = 70.1 dBFS
SINAD = 69.5 dBFS
THD = 77.4 dBc
-20
SFDR = 79.7 dBc
SNR = 69.8 dBFS
SINAD = 69.2 dBFS
THD = 76.9 dBc
-20
-40
Amplitude - dB
-40
Amplitude - dB
100
Figure 2.
0
-60
-60
-80
-80
-100
-100
-120
-120
0
20
40
60
80
100
120 140
160
180
200
0
Frequency - MHz
20
40
60
80
100
120 140
Frequency - MHz
Figure 4.
10
80
Frequency - MHz
Figure 5.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, sampling rate = 400 MSPS, 50% clock duty cycle, 3-VPP differential sinusoidal clock, analog input amplitude =
–1 dBFS, AVDD5 = 5 V, AVDD3 = 3.3 V, and DVDD3 = 3.3 V, unless otherwise noted.
SPECTRAL PERFORMANCE
FFT FOR 351 MHz INPUT SIGNAL
SPECTRAL PERFORMANCE
FFT FOR 451 MHz INPUT SIGNAL
0
0
SFDR = 75.5 dBc
SNR = 69.2 dBFS
SINAD = 68.3 dBFS
THD = 74.7 dBc
-20
-20
-40
Amplitude - dB
-40
Amplitude - dB
SFDR = 71.4 dBc
SNR = 68.4 dBFS
SINAD = 65.8 dBFS
THD = 68.3 dBc
-60
-60
-80
-80
-100
-100
-120
-120
0
20
40
60
80
100
120 140
160
180
200
0
20
40
60
Frequency - MHz
100
120 140
160
Figure 6.
Figure 7.
SPECTRAL PERFORMANCE
FFT FOR 751 MHz INPUT SIGNAL
SPECTRAL PERFORMANCE
FFT FOR 999 MHz INPUT SIGNAL
0
180
200
0
SFDR = 54.5 dBc
SNR = 66.6 dBFS
SINAD = 55.1 dBFS
THD = 54.4 dBc
-20
SFDR = 46 dBc
SNR = 64.7 dBFS
SINAD = 46.4 dBFS
THD = 45.5 dBc
-20
-40
Amplitude - dB
-40
Amplitude - dB
80
Frequency - MHz
-60
-60
-80
-80
-100
-100
-120
-120
0
20
40
60
80
100
120 140
160
180
200
0
Frequency - MHz
20
40
60
80
100
120 140
160
180
200
Frequency - MHz
Figure 8.
Figure 9.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, sampling rate = 400 MSPS, 50% clock duty cycle, 3-VPP differential sinusoidal clock, analog input amplitude =
–1 dBFS, AVDD5 = 5 V, AVDD3 = 3.3 V, and DVDD3 = 3.3 V, unless otherwise noted.
TWO-TONE INTERMODULATION DISTORTION
(FFT for 69 MHz and 70 MHz at –7 dBFS)
TWO-TONE INTERMODULATION DISTORTION
(FFT for 297.5 MHz and 302.5 MHz at –7 dBFS)
0
0
fIN1 = 69 MHz, -7 dBFS
fIN2 = 70 MHz, -7 dBFS
IMD3 = 97.3 dBFS
SFDR = 93.4 dBFS
-20
-20
-40
Amplitude - dB
-40
Amplitude - dB
fIN1 = 297.5 MHz, -7 dBFS
fIN2 = 302.5 MHz, -7 dBFS
IMD3 = 85.1 dBFS
SFDR = 85 dBFS
-60
-60
-80
-80
-100
-100
-120
-120
0
20
40
60
80
100
120
140
160
180
200
0
20
40
60
Frequency - MHz
120
140
160
180
200
Frequency - MHz
Figure 11.
TWO-TONE INTERMODULATION DISTORTION
(FFT for 69 MHz and 70 MHz at –16 dBFS)
TWO-TONE INTERMODULATION DISTORTION
(FFT for 297.5 MHz and 302.5 MHz at –16 dBFS)
0
fIN1 = 69 MHz, -16 dBFS
fIN2 = 70 MHz, -16 dBFS
IMD3 = 98 dBFS
SFDR = 95.7 dFBS
-20
fIN1 = 297.5 MHz, -16 dBFS
fIN2 = 302.5 MHz, -16 dBFS
IMD3 = 94.4 dBFS
SFDR = 83.1 dFBS
-20
-40
Amplitude - dB
-40
Amplitude - dB
100
Figure 10.
0
-60
-60
-80
-80
-100
-100
-120
-120
0
20
40
60
80
100
120
140
160
180
200
0
Frequency - MHz
20
40
60
80
100
120
Frequency - MHz
Figure 12.
12
80
Figure 13.
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160
180
200
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, sampling rate = 400 MSPS, 50% clock duty cycle, 3-VPP differential sinusoidal clock, analog input amplitude =
–1 dBFS, AVDD5 = 5 V, AVDD3 = 3.3 V, and DVDD3 = 3.3 V, unless otherwise noted.
NORMALIZED GAIN RESPONSE
vs
INPUT FREQUENCY
DIFFERENTIAL NONLINEARITY
3
0.5
fS = 400 MSPS
fIN = 70 MHz
0.4
0
0.3
-3
-6
0.1
DNL - LSB
Normalized Gain - dB
0.2
-9
0
-0.1
-12
-0.2
-15
-0.3
-18
-0.4
fS = 400 MSPS
AIN = ±0.38 VPP
-21
10 M
-0.5
100 M
1G
5G
0
2048
Frequency - Hz
4096
6144
8192 10240 12288 14336 16384
Code
Figure 14.
Figure 15.
INTEGRAL NONLINEARITY
NOISE HISTOGRAM WITH INPUTS SHORTED
25
2.0
fS = 400 MSPS
fIN = 70 MHz
fS = 400 MSPS
fIN = VCM
1.5
20
1.0
Percentage - %
0
-0.5
15
10
-1.0
5
-1.5
0
-2.0
0
2048
4096
6144
8192 10240 12288 14336 16384
Code
8205
8206
8207
8208
8209
8210
8211
8212
8213
8214
8215
8216
8217
8218
8219
8220
8221
8222
8223
8224
8225
8226
8227
INL - LSB
0.5
Output Code
Figure 16.
Figure 17.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, sampling rate = 400 MSPS, 50% clock duty cycle, 3-VPP differential sinusoidal clock, analog input amplitude =
–1 dBFS, AVDD5 = 5 V, AVDD3 = 3.3 V, and DVDD3 = 3.3 V, unless otherwise noted.
AC PERFORMANCE
vs
INPUT AMPLITUDE (70 MHz Input Signal)
AC PERFORMANCE
vs
INPUT AMPLITUDE (230 MHz Input Signal)
120
120
SFDR (dBFS)
SFDR (dBFS)
100
100
SNR (dBFS)
SNR (dBFS)
80
AC Performance - dB
AC Performance - dB
80
60
40
SFDR (dBc)
20
0
60
40
SFDR (dBc)
20
0
SNR (dBc)
SNR (dBc)
-20
-40
-100 -90
-20
fS = 400 MSPS
fIN = 70 MHz
-80
-70
-60
-50
-40
-30
-20
-10
fS = 400 MSPS
fIN = 230 MHz
-40
-100 -90
0
-80
-70
Input Amplitude - dBFS
-40
-30
-20
Figure 19.
TWO-TONE PERFORMANCE
vs
INPUT AMPLITUDE (f1 = 297.5 MHz and f2 = 302.5 MHz)
SFDR
vs
AVDD5 OVER TEMPERATURE
0
90
88
SFDR - Spurious-Free Dynamic Range - dBc
90
80
2f1 - f2 (dBc)
70
60
50
40
30
20
Worst Spur (dBc)
fS = 400 MSPS
fIN = 230 MHz
86
84
+40°C
+65°C
+25°C
82
80
78
0°C
76
+85°C
-40°C
+100°C
74
72
10
0
-100 -90
-10
Input Amplitude - dBFS
2f2 - f1 (dBc)
Performance - dB
-50
Figure 18.
100
70
-80
-70
-60
-50
-40
-30
-20
-10
0
4.7
4.8
4.9
5.0
5.1
AVDD5 - Supply Voltage - V
AIN - dBFS
Figure 20.
14
-60
Figure 21.
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5.3
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, sampling rate = 400 MSPS, 50% clock duty cycle, 3-VPP differential sinusoidal clock, analog input amplitude =
–1 dBFS, AVDD5 = 5 V, AVDD3 = 3.3 V, and DVDD3 = 3.3 V, unless otherwise noted.
SNR
vs
AVDD5 OVER TEMPERATURE
SFDR
vs
AVDD3 OVER TEMPERATURE
90
71.0
fS = 400 MSPS
fIN = 230 MHz
SFDR - Spurious-Free Dynamic Range - dBc
70.5
SNR - Signal-to-Noise Ratio - dBFS
fS = 400 MSPS
fIN = 230 MHz
88
+25°C
+65°C
+40°C
70.0
69.5
-40°C
0°C
+85°C
+100°C
69.0
68.5
86
84
+40°C
+25°C
+65°C
82
80
78
+85°C
0°C
76
+100°C
-40°C
74
72
68.0
70
4.7
4.8
4.9
5.0
5.1
5.2
3.0
5.3
3.1
AVDD5 - Supply Voltage - V
3.4
3.3
3.5
3.6
AVDD3 - Supply Voltage - V
Figure 22.
Figure 23.
SNR
vs
AVDD3 OVER TEMPERATURE
SFDR
vs
DVDD3 OVER TEMPERATURE
71.0
90
fS = 400 MSPS
fIN = 230 MHz
SFDR - Spurious-Free Dynamic Range - dBc
+65°C
+40°C
+25°C
70.0
69.5
0°C
fS = 400 MSPS
fIN = 230 MHz
88
70.5
SNR - Signal-to-Noise Ratio - dBFS
3.2
+85°C
-40°C
+100°C
69.0
68.5
86
84
+25°C
82
+65°C
+40°C
80
78
76
+85°C
-40°C
0°C
+100°C
74
72
70
68.0
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.0
AVDD3 - Supply Voltage - V
3.1
3.2
3.3
3.4
3.5
3.6
DVDD3 - Supply Voltage - V
Figure 24.
Figure 25.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, sampling rate = 400 MSPS, 50% clock duty cycle, 3-VPP differential sinusoidal clock, analog input amplitude =
–1 dBFS, AVDD5 = 5 V, AVDD3 = 3.3 V, and DVDD3 = 3.3 V, unless otherwise noted.
SNR
vs
DVDD3 OVER TEMPERATURE
CMRR
vs
COMMON-MODE INPUT FREQUENCY
71.0
0
fS = 400 MSPS
fIN = 230 MHz
CMRR - Common-Mode Rejection Ratio - dB
-10
SNR - Signal-to-Noise Ratio - dBFS
70.5
+40°C
+25°C
0°C
+65°C
70.0
69.5
+85°C
-40°C
+100°C
69.0
68.5
-20
-30
-40
-50
-60
-70
-80
-90
400 MSPS
-100
-110
300 MSPS
-120
68.0
3.0
3.1
3.2
3.3
3.4
-130
100 k
3.6
3.5
1M
10 M
DVDD3 - Supply Voltage - V
Frequency - Hz
Figure 26.
Figure 27.
ADC WAKEUP TIME
75
Wake from PDWN
70
65
60
55
SNR - dBFS
50
45
Wake from 5 V Supply
40
35
30
25
20
15
10
5
0
0
10
20
30
40
50
60
70
Time - ms
Figure 28.
16
100 M
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90
100
1G
10 G
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, sampling rate = 400 MSPS, 50% clock duty cycle, 3-VPP differential sinusoidal clock, analog input amplitude =
–1 dBFS, AVDD5 = 5 V, AVDD3 = 3.3 V, and DVDD3 = 3.3 V, unless otherwise noted.
SNR vs INPUT FREQUENCY AND SAMPLING FREQUENCY
400
68
70
69
fS - Sampling Frequency - MHz
350
300
70
250
68
69
200
67
70
150
68
100
69
70
69
66
67
68
40
10
100
200
300
400
500
600
fIN - Input Frequency - MHz
54
56
58
60
62
64
66
68
70
SNR - dBFS
Figure 29.
SFDR vs INPUT FREQUENCY AND SAMPLING FREQUENCY
400
80
85
350
77
65
73
80
70
fS - Sampling Frequency - MHz
77
300
80
85
250
65
73
77
85
70
200
77
80
85
150
73
100
80
85
85
65
70
77
60
40
10
100
200
300
400
500
600
fIN - Input Frequency - MHz
50
55
60
65
70
75
80
85
90
SFDR - dBc
Figure 30.
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APPLICATIONS INFORMATION
Theory of Operation
The ADS5474 is a 14-bit, 400-MSPS, monolithic pipeline ADC. Its bipolar analog core operates from 5-V and
3.3-V supplies, while the output uses a 3.3-V supply to provide LVDS-compatible outputs. The conversion
process is initiated by the rising edge of the external input clock. At that instant, the differential input signal is
captured by the input track-and-hold (T&H), and the input sample is converted sequentially by a series of lower
resolution stages, with the outputs combined in a digital correction logic block. Both the rising and the falling
clock edges are used to propagate the sample through the pipeline every half clock cycle. This process results
in a data latency of 3.5 clock cycles, after which the output data are available as a 14-bit parallel word, coded in
offset binary format.
Input Configuration
The analog input for the ADS5474 consists of an analog pseudo-differential buffer followed by a bipolar
transistor T&H. The analog buffer isolates the source driving the input of the ADC from any internal switching
and presents a high impedance that is easy to drive at high input frequencies, compared to an ADC without a
buffered input. The input common-mode is set internally through a 500-Ω resistor connected from 3.1 V to each
of the inputs. This configuration results in a differential input impedance of 1 kΩ.
AVDD5
Buffer
AIN
1.6 pF
500 W
GND
VCM
AVDD5
GND
500 W
1.6 pF
AIN
Buffer
GND
ADS5474
Figure 31. Analog Input Circuit
For a full-scale differential input, each of the differential lines of the input signal (pins 16 and 17) swings
symmetrically between (3.1 V + 0.55 V) and (3.1 V – 0.55 V). This range means that each input has a maximum
signal swing of 1.1 VPP for a total differential input signal swing of 2.2 VPP. Operation below 2.2 VPP is allowable,
with the characteristics of performance versus input amplitude demonstrated in Figure 18 and Figure 19. For
instance, for performance at 1.1 VPP rather than 2.2 VPP, refer to the SNR and SFDR at –6 dBFS (0 dBFS =
2.2 VPP). The maximum swing is determined by the internal reference voltage generator, eliminating the need for
any external circuitry for this purpose.
18
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Applications Information (continued)
The ADS5474 performs optimally when the analog inputs are driven differentially. The circuit in Figure 32 shows
one possible configuration using an RF transformer with termination either on the primary or on the secondary of
the transformer. In addition, the evaluation module is configured with two back-to-back transformers, also
demonstrating good performance. If voltage gain is required, a step-up transformer can be used.
R0
50 W
Z0
50 W
AIN
R
200 W
AC Signal
Source
ADS5474
AIN
Mini-Circuits
JTX-4-10T
Figure 32. Converting a Single-Ended Input to a Differential Signal Using an RF Transformer
In addition to the transformer configurations, Texas Instruments offers a wide selection of single-ended
operational amplifiers that can be selected depending on the application. An RF gain-block amplifier, such as
Texas Instruments' THS9001, can also be used for high-input-frequency applications. For large voltage gains at
intermediate-frequencies in the 50 MHz to 400 MHz range, the configuration shown in Figure 33 can be used.
The component values can be tuned for different intermediate frequencies. The example shown in Figure 33 is
located on the evaluation module and is tuned for an IF of 170 MHz. More information regarding this
configuration can be found in the ADS5474 EVM User Guide (SLAU194) and the THS9001 50-MHz to 350-MHz
Cascadeable Amplifier data sheet (SLOS426), both available for download at www.ti.com.
1000 pF
1000 pF
THS9001
VIN
AIN
50 W
18 mH
39 pF
ADS5474
50 W
0.1 mF
THS9001
VIN
1000 pF
AIN
1000 pF
Figure 33. Using the THS9001 IF Amplifier With the ADS5474
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Applications Information (continued)
For applications requiring dc-coupling with the signal source, a differential input/differential output amplifier such
as the THS4509 (shown in Figure 34) provides good harmonic performance and low noise over a wide range of
frequencies.
VIN
100 W
From
50 W
Source
78.9 W
348 W
+5V
49.9 W
0.22 mF
100 W
AIN
THS4509
49.9 W
ADS5474
18 pF
AIN
VCM
CM
49.9 W
0.22 mF
78.9 W
49.9 W
0.22 mF
0.1 mF
0.1 mF
348 W
Figure 34. Using the THS4509 or THS4520 With the ADS5474
In this configuration, the THS4509 amplifier circuit provides 10 dB of gain, converts the single-ended input to
differential, and sets the proper input common-mode voltage to the ADS5474 by utilizing the VCM output pin of
the ADC. The 50-Ω resistors and 18-pF capacitor between the THS4509 outputs and ADS5474 inputs (along
with the input capacitance of the ADC) limit the bandwidth of the signal to about 70 MHz (–3 dB). Input
termination is accomplished via the 78.9-Ω resistor and 0.22-μF capacitor to ground, in conjunction with the
input impedance of the amplifier circuit. A 0.22-μF capacitor and 49.9-Ω resistor are inserted to ground across
the 78.9-Ω resistor and 0.22-μF capacitor on the alternate input to balance the circuit. Gain is a function of the
source impedance, termination, and 348-Ω feedback resistor. See the THS4509 data sheet for further
component values to set proper 50-Ω termination for other common gains. Because the ADS5474
recommended input common-mode voltage is 3.1 V, the THS4509 operates from a single power-supply input
with VS+ = 5 V and VS– = 0 V (ground). This configuration has the potential to slightly exceed the recommended
output voltage from the THS4509 of 3.6V due to the ADC input common-mode of 3.1V and the +0.55V full-scale
signal. This will not harm the THS4509 but may result in a degradation in the harmonic performance of the
THS4509. An amplifier with a wider recommended output voltage range is the THS4520, which is optimized for
low noise and low distortion in the range of frequencies up to ~20MHz. Applications that are not sensitive to
harmonic distortion could consider either device at higher frequencies.
20
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Applications Information (continued)
External Voltage Reference
For systems that require the analog signal gain to be adjusted or calibrated, this can be performed by using an
external reference. The dependency on the signal amplitude to the value of the external reference voltage is
characterizaed typically by Figure 35 (VREF = 2.4 V is normalized to 0 dB as this is the internal reference
voltage). As can be seen in the linear fit, this equates to approximately –0.3 dB of signal adjustment per 100 mV
of reference adjustment. The range of allowable variation depends on the analog input amplitude that is applied
to the inputs and the desired spectral performance, as can be seen in the performance versus external
reference graphs in Figure 36 and Figure 37. As the applied analog signal amplitude is reduced, more variation
in the reference voltage is allowed in the positive direction (which equates to a reduction in signal amplitude),
whereas an adjustment in reference voltage below the nominal 2.4 V (which equates to an increase in signal
amplitude) is not recommended below approximately 2.35 V. The power consumption versus reference voltage
and operating temperature should also be considered, especially at high ambient temperatures, because the
lifetime of the device is affected by internal junction temperature, see Figure 50.
For dc-coupled applications that use the VCM pin of the ADS5474 as the common mode of the signal in the
analog signal gain path prior to the ADC inputs, the information in Figure 39 is useful to consider versus the
allowable common-mode range of the device that is receiving the VCM voltage, such as an operational amplifier.
Because it is pin-compatible, it is important to note that the ADS5463 does not have a VCM pin and primarily
uses the VREF pin to provide the common-mode voltage in dc-coupled applications. The ADS5463 (VCM = 2.4
V) and ADS5474 (VCM = 3.1V) do not have the same common-mode voltage. To create a board layout that may
accomodate both devices in dc-coupled applications, route VCM and VREF both to a common point that can be
selected via a switch, jumper, or a 0 Ω resistor.
fS = 400 MSPS
fIN = 70 MHz
AIN = < -1 dBFS
Normalized Gain Adjustment - dB
0.5
0
Best Fit:
y = -3.14x + 7.5063
-0.5
-1.0
-1.5
-2.0
-2.5
90
AIN = -5 dBFS
SFDR - Spurious-Free Dynamic Range - dBc
1.0
AIN = -6 dBFS
80
AIN = -4 dBFS
70
AIN = -3 dBFS
60
AIN = -2 dBFS
AIN = -1 dBFS
50
fS = 400 MSPS
fIN = 70 MHz
-3.0
2.2
40
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
2.05 2.15 2.25 2.35 2.45 2.55 2.65 2.75 2.85 2.95 3.05 3.15
External VREF Applied - V
External VREF Applied - V
Figure 35. Signal Gain Adjustment versus External
Reference (VREF)
Figure 36. SFDR versus External VREF and AIN
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Applications Information (continued)
75
3.4
fS = 400 MSPS
fIN = 70 MHz
AIN = -6 dBFS
70
3.2
65
3.0
Power - W
SNR - Signal-to-Noise Ratio - V
fS = 400 MSPS
fIN = 70 MHz
60
AIN = -4 dBFS
AIN = -3 dBFS
55
2.8
2.6
AIN = -2 dBFS
50
2.4
AIN = -5 dBFS
AIN = -1 dBFS
45
2.2
40
2.0
2.05 2.15 2.25 2.35 2.45 2.55 2.65 2.75 2.85 2.95 3.05 3.15
2.05 2.15 2.25 2.35 2.45 2.55 2.65 2.75 2.85 2.95 3.05 3.15
External VREF Applied - V
External VREF Applied - V
Figure 37. SNR versus External VREF and AIN
Figure 38. Total Power Consumption versus External
VREF
3.8
fS = 400 MSPS
fIN = 70 MHz
3.7
VCM Pin Output Voltage - V
3.6
3.5
3.4
3.3
3.2
3.1
3.0
2.9
2.8
2.05 2.15 2.25 2.35 2.45 2.55 2.65 2.75 2.85 2.95 3.05 3.15
External VREF Applied - V
Figure 39. VCM Pin Output versus External VREF
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Applications Information (continued)
Clock Inputs
The ADS5474 clock input can be driven with either a differential clock signal or a single-ended clock input, as
shown in Figure 40. The characterization of the ADS5474 is typically performed with a 3-VPP differential clock,
but the ADC performs well with a differential clock amplitude down to ~0.5 VPP, as shown in Figure 42. The
clock amplitude becomes more of a factor in performance as the analog input frequency increases. In
low-input-frequency applications, where jitter may not be a big concern, the use of a single-ended clock (as
shown in Figure 41) could save cost and board space without much performance tradeoff. When clocked with
this configuration, it is best to connect CLK to ground with a 0.01-μF capacitor, while CLK is ac-coupled with a
0.01-μF capacitor to the clock source, as shown in Figure 41.
AVDD5
CLK
1 kW
GND
Parasitic
~200 fF
Clock
Buffer
~2.4 V
AVDD5
GND
1 kW
Parasitic
~200 fF
CLK
GND
ADS5474
Figure 40. Clock Input Circuit
90
fS = 400 MSPS
fIN = 230 MHz
85
SFDR (dBc)
Square Wave or
Sine Wave
AC Performance - dB
CLK
0.01 mF
ADS5474
CLK
0.01 mF
80
75
70
SNR (dBFS)
65
60
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Clock Amplitude - VPP
Figure 41. Single-Ended Clock
Figure 42. AC Performance versus Clock Level
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For jitter-sensitive applications, the use of a differential clock has some advantages at the system level. The
differential clock allows for common-mode noise rejection at the printed circuit board (PCB) level. With a
differential clock, the signal-to-noise ratio of the ADC is better for jitter-sensitive, high-frequency applications
because the board level clock jitter is superior.
Larger clock amplitude levels are recommended for high analog input frequencies or slow clock frequencies. In
the case of a sinusoidal clock, larger amplitudes result in higher clock slew rates and reduces the impact of
clock noise on jitter. At high analog input frequencies, the sampling process is sensitive to jitter. And at slow
clock frequencies, a small amplitude sinusoidal clock has a lower slew rate and can create jitter-related SNR
degradation. Figure 43 demonstrates a recommended method for converting a single-ended clock source into a
differential clock; it is similar to the configuration found on the evaluation board and was used for much of the
characterization. See also Clocking High Speed Data Converters (SLYT075) for more details.
0.1 mF
Clock
Source
CLK
ADS5474
CLK
Figure 43. Differential Clock
The common-mode voltage of the clock inputs is set internally to 2.4 V using internal 1-kΩ resistors. It is
recommended to use ac coupling, but if this scheme is not possible, the ADS5474 features good tolerance to
clock common-mode variation (as shown in Figure 44 and Figure 45). Additionally, the internal ADC core uses
both edges of the clock for the conversion process. Ideally, a 50% duty-cycle clock signal should be provided.
Performance degradation as a result of duty cycle can be seen in Figure 46.
75
90
230 MHz
70 MHz
10 MHz
SNR - Signal-to-Noise Ratio - dBFS
SFDR - Spurious-Free Dynamic Range - dBc
10 MHz
85
80
75
351 MHz
70
65
60
70
65
230 MHz
60
55
55
fS = 400 MSPS
VCLK = 3 VPP
fS = 400 MSPS
VCLK = 3 VPP
50
50
0
24
70 MHz
351 MHz
1
2
3
4
5
0
1
2
3
4
Clock Common Mode - V
Clock Common Mode - V
Figure 44. SFDR versus Clock Common Mode
Figure 45. SNR versus Clock Common Mode
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90
SFDR - Spurious-Free Dynamic Range - dBc
fIN = 10 MHz
fIN = 70 MHz
85
80
75
fIN = 230 MHz
70
fIN = 300 MHz
65
60
55
fS = 400 MSPS
Clock Input = 3 VPP
50
20
30
40
50
60
70
80
Clock Duty Cycle - %
Figure 46. SFDR vs Clock Duty Cycle
The ADS5474 is capable of achieving 69.2 dBFS SNR at 350 MHz of analog input frequency. In order to
achieve the SNR at 350 MHz the clock source rms jitter must be at least 144 fsec in order for the total rms jitter
to be 177 fsec. A summary of maximum recommended rms clock jitter as a function of analog input frequency is
provided in Table 2. The equations used to create the table are also presented.
Table 2. Recommended RMS Clock Jitter
INPUT FREQUENCY
(MHz)
MEASURED SNR
(dBc)
TOTAL JITTER
(fsec rms)
MAXIMUM CLOCK JITTER
(fsec rms)
30
69.3
1818
1816
70
69.1
798
791
130
69.1
429
417
230
68.8
251
229
350
68.2
177
144
450
67.4
151
110
750
65.6
111
42
1000
63.7
104
14
Equation 1 and Equation 2 are used to estimate the required clock source jitter.
SNR (dBc) = -20 ´ LOG10 (2 ´ p ´ fIN ´ jTOTAL)
2
(1)
2 1/2
jTOTAL = (jADC + jCLOCK )
(2)
where:
jTOTAL = the rms summation of the clock and ADC aperture jitter;
jADC = the ADC internal aperture jitter which is located in the data sheet;
jCLOCK = the rms jitter of the clock at the clock input pins to the ADC; and
fIN = the analog input frequency.
Notice that the SNR is a strong function of the analog input frequency, not the clock frequency. The slope of the
clock source edges can have a mild impact on SNR as well and is not taken into account for these estimates.
For this reason, maximizing clock source amplitudes at the ADC clock inputs is recommended, though not
required (faster slope is desireable for jitter-related SNR). For more information on clocking high-speed ADCs,
see Application Note SLWA034, Implementing a CDC7005 Low Jitter Clock Solution For High-Speed, High-IF
Submit Documentation Feedback
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ADS5474
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SLAS525 – JULY 2007
ADC Devices, on the Texas Instruments web site. Recommended clock distribution chips (CDCs) are the TI
CDC7005 and CDCM7005. Depending on the jitter requirements, a band pass filter (BPF) is sometimes required
between the CDC and the ADC. If the insertion loss of the BPF causes the clock amplitude to be too low for the
ADC, or the clock source amplitude is too low to begin with, an inexpensive amplifier can be placed between the
CDC and the BPF.
Figure 47 represents a scenario where an LVCMOS single-ended clock output is used from a TI CDCM7005
with the clock signal path optimized for maximum amplitude and minimum jitter. This type of conditioning might
generally be well-suited for use with greater than 150 MHz of input frequency. The jitter of this setup is difficult to
estimate and requires a careful phase noise analysis of the clock path. The BPF (and possibly a low-cost
amplifier because of insertion loss in the BPF) can improve the jitter between the CDC and ADC when the jitter
provided by the CDC is still not adequate. The total jitter at the CDCM7005 output depends largely on the phase
noise of the VCXO selected, as well as the CDCM7005, and typically has 50–100 fs of rms jitter. If it is
determined that the jitter from the CDCM7005 with a VCXO is sufficient without further conditioning, it is possible
to clock the ADS5474 directly from the CDCM7005 using differential LVPECL outputs, as illustrated in Figure 48
(see the CDCM7005 data sheet for the exact schematic). This scenario may be more suitable for less than 150
MHz of input frequency where jitter is not as critical. A careful analysis of the required jitter is recommended
before determining the proper approach.
Low-Jitter Clock Distribution
AMP and/or BPF are Optional
Board Master
Reference Clock
(high or low jitter)
10 MHz
CLKIN
LVCMOS
REF
AMP
BPF
XFMR
CLKIN
400 MHz
ADC
800 MHz (to transmit DAC)
100 MHz (to DSP)
ADS5474
¼
Low-Jitter Oscillator
800 MHz
LVPECL
or
LVCMOS
200 MHz (to FPGA)
To Other
VCXO
CDC
(Clock Distribution Chip)
CDCM7005
This is an example block diagram.
Consult the CDCM7005 data sheet for proper schematic and specifications regarding allowable input and output
frequency and amplitude ranges.
Figure 47. Optimum Jitter Clock Circuit
26
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Low-Jitter Clock Distribution
Board Master
Reference Clock
(high or low jitter)
10 MHz
400 MHz
CLKIN
LVPECL
REF
CLKIN
ADC
800 MHz (to transmit DAC)
100 MHz (to DSP)
Low-Jitter Oscillator
800 MHz
ADS5474
¼
LVPECL
or
LVCMOS
200 MHz (to FPGA)
To Other
VCXO
CDC
(Clock Distribution Chip)
CDCM7005
This is an example block diagram.
Consult the CDCM7005 data sheet for proper schematic and specifications regarding allowable input and output
frequency and amplitude ranges.
Figure 48. Acceptable Jitter Clock Circuit
Digital Outputs
The ADC provides 14 LVDS-compatible, offset binary data outputs (D13 to D0; D13 is the MSB and D0 is the
LSB), a data-ready signal (DRY), and an over-range indicator (OVR). It is recommended to use the DRY signal
to capture the output data of the ADS5474. DRY is source-synchronous to the DATA/OVR outputs and operates
at the same frequency, creating a half-rate DDR interface that updates data on both the rising and falling edges
of DRY. It is recommended that the capacitive loading on the digital outputs be minimized. Higher capacitance
shortens the data-valid timing window. The values given for timing (see Figure 1) were obtained with a
measured 10-pF parasitic board capacitance to ground on each LVDS line (or 5-pF differential parasitic
capacitance). When setting the time relationship between DRY and DATA at the receiving device, it is generally
recommended that setup time be maximized, but this partially depends on the setup and hold times of the
device receiving the digital data (like an FPGA or Field Programmable Field Array). Since DRY and DATA are
coincident, it will likely be necessary to delay either DRY or DATA such that setup time is maximized.
Referencing Figure 1, the polarity of DRY with respect to the sample N data output transition is undetermined
because of the unknown startup logic level of the clock divider that generates the DRY signal (DRY is a
frequency divide-by-two of CLK). Either the rising or the falling edge of DRY will be coincident with sample N
and the polarity of DRY could invert when power is cycled off/on or when the power-down pin is cycled. Data
capture from the transition and not the polarity of DRY is recommended, but not required. If the synchronization
of multiple ADS5474 devices is required, it might be necessary to use a form of the CLKIN signal rather than
DRY to capture the data.
The DRY frequency is identical on the ADS5474 to the ADS5463 (where DRY equals 1/2 CLK frequency), but
different than it is on the pin-similar ADS5444/ADS5440 (where DRY equals the CLK frequency). The LVDS
outputs all require an external 100-Ω load between each output pair in order to meet the expected LVDS voltage
levels. For long trace lengths, it may be necessary to place a 100-Ω load on each digital output as close to the
ADS5474 as possible and another 100-Ω differential load at the end of the LVDS transmission line to provide
matched impedance and avoid signal reflections. The effective load in this case reduces the LVDS voltage
levels by half.
The OVR output equals a logic high when the 14-bit output word attempts to exceed either all 0s or all 1s. This
flag is provided as an indicator that the analog input signal exceeded the full-scale input limit of approximately
2.2 VPP (± gain error). The OVR indicator is provided for systems that use gain control to keep the analog input
signal within acceptable limits.
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ADS5474
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Power Supplies
The ADS5474 uses three power supplies. For the analog portion of the design, a 5-V and 3.3-V supply (AVDD5
and AVDD3) are used, while the digital portion uses a 3.3-V supply (DVDD3). All the ground pins are marked as
GND, although analog and digital grounds are not tied together inside the package. The use of low-noise power
supplies with adequate decoupling is recommended. Linear supplies are preferred to switched supplies;
switched supplies tend to generate more noise components that can be coupled to the ADS5474. However, the
PSRR value and plot shown in Figure 49 were obtained without bulk supply decoupling capacitors. When bulk
(0.1 μF) decoupling capacitors are used, the board-level PSRR is much higher than the stated value for the
ADC. The user may be able to supply power to the device with a less-than-ideal supply and still achieve very
good performance. It is not possible to make a single recommendation for every type of supply and level of
decoupling for all systems. If the noise characteristics of the available supplies are understood, a study of the
PSRR data for the ADS5474 may provide the user with enough information to select noisy supplies if the
performance is still acceptable within the frequency range of interest. The power consumption of the ADS5474
does not change substantially over clock rate or input frequency as a result of the architecture and process. The
total maximum ensured power supersedes the summation of the maximum individual supply currents.
0
fS = 400 MSPS
PSRR - Power-Supply Rejection Ratio - dB
-10
-20
-30
-40
AVDD5
-50
-60
-70
-80
AVDD3
-90
-100
-110
DVDD3
-120
100 k
1M
10 M
100 M
1G
Frequency - Hz
Figure 49. PSRR versus Supply Injected Frequency
28
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Operational Lifetime
It is important for applications that anticipate running continously for long periods of time near the
maximum-rated ambient temperature of +85°C to consider the data shown in Figure 50. Referring to the
Thermal Characteristics table, the worst-case operating condition with no airflow has a thermal rise of 23.7°C/W.
At approximately 2.5 W of normal power dissipation, at a maximum ambient of +85°C with no airflow, the
junction temperature of the ADS5474 reaches approximately +85°C + 23.7°C/W × 2.5 W = +144°C. Being even
more conservative and accounting for the maximum possible power dissipation that is ensured (2.755 W), the
junction temperature becomes nearly +150°C. As Figure 50 shows, this performance limits the expected lifetime
of the ADS5474. Operation at +85°C continously may require airflow or an additional heatsink in order to
decrease the internal junction temperature and increase the expected lifetime (because of electromigration
failures). An airflow of 250 LFM (linear feet per minute) reduces the thermal resistance to 16.4°C/W and,
therefore, the maximum junction temperature to +130°C, assuming a worst-case of 2.755 W and +85°C ambient.
The ADS5474 performance over temperature is quite good and can be seen starting in Figure 21. Though the
typical plots show good performance at +100°C, the device is only rated from –40°C to +85°C. For continuous
operation at temperatures near or above the maximum, the expected primary negative effect is a shorter device
lifetime because of the electromigration failures at high junction temperatures. The maximum recommended
continuous junction temperature is +150°C.
Estimated Life - Years
1000
100
10
1
80
90
100
110
120
130
140
150
160
170
180
Continuous Junction Temperature - °C
Figure 50. Operating Life Derating Chart, Electromigration Fail Mode
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ADS5474
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SLAS525 – JULY 2007
Layout Information
The evaluation board represents a good model of how to lay out the printed circuit board (PCB) to obtain the
maximum performance from the ADS5474. Follow general design rules, such as the use of multilayer boards, a
single ground plane for ADC ground connections, and local decoupling ceramic chip capacitors. The analog
input traces should be isolated from any external source of interference or noise, including the digital outputs as
well as the clock traces. The clock signal traces should also be isolated from other signals, especially in
applications such as high IF sampling where low jitter is required. Besides performance-oriented rules, care
must be taken when considering the heat dissipation of the device. The thermal heatsink included on the bottom
of the package should be soldered to the board as described in the PowerPad Package section. See the
ADS5474 EVM User Guide (SLAU194) on the TI web site for the evaluation board schematic.
PowerPAD Package
The PowerPAD package is a thermally-enhanced, standard-size IC package designed to eliminate the use of
bulky heatsinks and slugs traditionally used in thermal packages. This package can be easily mounted using
standard PCB assembly techniques, and can be removed and replaced using standard repair procedures.
The PowerPAD package is designed so that the leadframe die pad (or thermal pad) is exposed on the bottom of
the IC. This pad design provides an extremely low thermal resistance path between the die and the exterior of
the package. The thermal pad on the bottom of the IC can then be soldered directly to the PCB, using the PCB
as a heatsink.
Assembly Process
1. Prepare the PCB top-side etch pattern including etch for the leads as well as the thermal pad as
illustrated in the Mechanical Data section (at the end of this data sheet).
2. Place a 6-by-6 array of thermal vias in the thermal pad area. These holes should be 13 mils (0.013 in or
0.3302 mm) in diameter. The small size prevents wicking of the solder through the holes.
3. It is recommended to place a small number of 25 mil (0.025 in or 0.635 mm) diameter holes under the
package, but outside the thermal pad area, to provide an additional heat path.
4. Connect all holes (both those inside and outside the thermal pad area) to an internal copper plane (such
as a ground plane).
5. Do not use the typical web or spoke via-connection pattern when connecting the thermal vias to the
ground plane. The spoke pattern increases the thermal resistance to the ground plane.
6. The top-side solder mask should leave exposed the terminals of the package and the thermal pad area.
7. Cover the entire bottom side of the PowerPAD vias to prevent solder wicking.
8. Apply solder paste to the exposed thermal pad area and all of the package terminals.
For more detailed information regarding the PowerPAD package and its thermal properties, see either the
PowerPAD Made Easy application brief (SLMA004) or the PowerPAD Thermally Enhanced Package application
report (SLMA002), both available for download at www.ti.com.
30
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SLAS525 – JULY 2007
DEFINITION OF SPECIFICATIONS
Analog Bandwidth
The analog input frequency at which the power of the
fundamental is reduced by 3 dB with respect to the
low-frequency value.
The injected frequency level is translated into dBFS,
the spur in the output FFT is measured in dBFS, and
the difference is the PSRR in dB. The measurement
calibrates out the benefit of the board supply
decoupling capacitors.
Aperture Uncertainty (Jitter)
The sample-to-sample variation in aperture delay.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the power of the fundamental (PS)
to the noise floor power (PN), excluding the power at
dc and in the first five harmonics.
P
SNR + 10log 10 S
PN
Clock Pulse Duration/Duty Cycle
The duty cycle of a clock signal is the ratio of the
time the clock signal remains at a logic high (clock
pulse duration) to the period of the clock signal,
expressed as a percentage.
SNR is either given in units of dBc (dB to carrier)
when the absolute power of the fundamental is used
as the reference, or dBFS (dB to full-scale) when the
power of the fundamental is extrapolated to the
converter full-scale range.
Differential Nonlinearity (DNL)
An ideal ADC exhibits code transitions at analog
input values spaced exactly 1 LSB apart. DNL is the
deviation of any single step from this ideal value,
measured in units of LSB.
Signal-to-Noise and Distortion (SINAD)
SINAD is the ratio of the power of the fundamental
(PS) to the power of all the other spectral
components including noise (PN) and distortion (PD),
but excluding dc.
PS
SINAD + 10log 10
PN ) PD
Aperture Delay
The delay in time between the rising edge of the
input sampling clock and the actual time at which the
sampling occurs.
Common-Mode Rejection Ratio (CMRR)
CMRR measures the ability to reject signals that are
presented to both analog inputs simultaneously. The
injected common-mode frequency level is translated
into dBFS, the spur in the output FFT is measured in
dBFS, and the difference is the CMRR in dB.
Effective Number of Bits (ENOB)
ENOB is a measure in units of bits of converter
performance as compared to the theoretical limit
based on quantization noise:
ENOB = (SINAD – 1.76)/6.02
Gain Error
Gain error is the deviation of the ADC actual input
full-scale range from its ideal value, given as a
percentage of the ideal input full-scale range.
Integral Nonlinearity (INL)
INL is the deviation of the ADC transfer function from
a best-fit line determined by a least-squares curve fit
of that transfer function. The INL at each analog
input value is the difference between the actual
transfer function and this best-fit line, measured in
units of LSB.
Offset Error
Offset error is the deviation of output code from
mid-code when both inputs are tied to
common-mode.
Power-Supply Rejection Ratio (PSRR)
PSRR is a measure of the ability to reject
frequencies present on the power supply.
(4)
(5)
SINAD is either given in units of dBc (dB to carrier)
when the absolute power of the fundamental is used
as the reference, or dBFS (dB to full-scale) when the
power of the fundamental is extrapolated to the
converter full-scale range.
Temperature Drift
Temperature drift (with respect to gain error and
offset error) specifies the change from the value at
the nominal temperature to the value at TMIN or TMAX.
It is computed as the maximum variation the
parameters over the whole temperature range
divided by TMIN – TMAX.
Total Harmonic Distortion (THD)
THD is the ratio of the power of the fundamental (PS)
to the power of the first five harmonics (PD).
P
THD + 10log 10 S
PD
(6)
THD is typically given in units of dBc (dB to carrier).
Two-Tone Intermodulation Distortion (IMD3)
IMD3 is the ratio of the power of the fundamental (at
frequencies f1, f2) to the power of the worst spectral
component at either frequency 2f1 – f2 or 2f2 – f1).
IMD3 is given in units of either dBc (dB to carrier)
when the absolute power of the fundamental is used
as the reference, or dBFS (dB to full-scale) when the
power of the fundamental is extrapolated to the
converter full-scale range.
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ADS5474IPFP
ACTIVE
HTQFP
PFP
80
96
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
ADS5474IPFPG4
ACTIVE
HTQFP
PFP
80
96
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
ADS5474IPFPR
ACTIVE
HTQFP
PFP
80
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
ADS5474IPFPRG4
ACTIVE
HTQFP
PFP
80
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
ADS5474IPFPR
Package Pins
PFP
80
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
SITE 60
330
24
15.0
15.0
1.5
20
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
24
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
ADS5474IPFPR
PFP
80
SITE 60
0.0
0.0
0.0
Pack Materials-Page 2
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