Order this document by MC145407/D SEMICONDUCTOR TECHNICAL DATA Advance Information EIA–232–E and CCITT V.28 The MC145407 is a silicon–gate CMOS IC that combines three drivers and three receivers to fulfill the electrical specifications of EIA–232–E and CCITT V.28 while operating from a single + 5 V power supply. A voltage doubler and inverter convert the + 5 V to ± 10 V. This is accomplished through an on–board 20 kHz oscillator and four inexpensive external electrolytic capacitors. The three drivers and three receivers of the MC145407 are virtually identical to those of the MC145406. Therefore, for applications requiring more than three drivers and/or three receivers, an MC145406 can be powered from an MC145407, since the MC145407 charge pumps have been designed to guarantee ± 5 V at the output of up to six drivers. Thus, the MC145407 provides a high–performance, low–power, stand–alone solution or, with the MC145406, a + 5 V only, high–performance two–chip solution. Drivers • ± 7.5 V Output Swing • 300 Ω Power–Off Impedance • Output Current Limiting • TTL and CMOS Compatible Inputs • Slew Rate Range Limited from 4 V/µs to 30 V/µs Receivers • + 25 V Input Range • 3 to 7 kΩ Input Impedance • 0.8 V Hysteresis for Enhanced Noise Immunity Charge Pumps • + 5 V to ± 10 V Dual Charge Pump Architecture • Supply Outputs Capable of Driving Three On–Chip Drivers and Three Drivers on the MC145406 Simultaneously • Requires Four Inexpensive Electrolytic Capacitors • On–Chip 20 kHz Oscillator P SUFFIX PLASTIC DIP CASE 738 20 1 DW SUFFIX SOG PACKAGE CASE 751D 20 1 ORDERING INFORMATION MC145407P MC145407DW Plastic DIP SOG Package PIN ASSIGNMENT C2+ GND C2– VSS Rx1 Tx1 Rx2 Tx2 Rx3 Tx3 1 20 C1+ 2 19 3 18 4 17 5 R R 10 VDD DO1 14 DO2 D 13 DI2 8 9 C1– D 15 DI1 6 7 16 VCC R 12 DO3 D 11 DI3 D = DRIVER R = RECEIVER This document contains information on a new product. Specifications and information herein are subject to change without notice. REV 1 10/95 Motorola, Inc. 1995 MOTOROLA MC145407 1 FUNCTION DIAGRAM CHARGE PUMPS OSC GND VCC C3 VOLTAGE DOUBLER VOLTAGE INVERTER C1 C2 + C4 + VDD + + C1 – C1 + C2 + RECEIVER C2 – DRIVER VDD VDD VDD VCC * 15 kΩ Rx + VSS * Proctection circuit VCC 300 Ω DO – 5.4 k MC145407 2 VSS LEVEL SHIFT Tx + DI – 1.4 V 1.0 V 1.8 V VSS MOTOROLA MAXIMUM RATINGS (Voltage polarities referenced to GND) Rating DC Supply Voltages Input Voltage Range Symbol Value Unit VCC – 0.5 to + 6.0 V VIR Rx1 – Rx3 Inputs DI1 – DI3 Inputs V VSS – 15 to VDD + 15 – 0.5 to (VCC + 0.5) DC Current per Pin I ± 100 mA Power Dissipation PD 1 W Operating Temperature Range TA – 40 to + 85 °C Tstg – 85 to + 150 °C Storage Temperature Range This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation, it is recommended that the voltages at the DI and DO pins be constrained to the range GND ≤ VDI ≤ VCC and GND ≤ VDO ≤ V CC. Also, the voltage at the Rx pin should be constrained to (VSS – 15 V) ≤ VRx1 – Rx3 ≤ (VDD + 15 V), and Tx should be constrained to VSS ≤ VTx1 – Tx3 ≤ VDD. Unused inputs must always be tied to appropriate logic voltage level (e.g., GND or VCC for DI, and GND for Rx). DC ELECTRICAL CHARACTERISTICS (All polarities referenced to GND = 0 V; C1, C2, C3, C4 = 10 µF; TA = – 40 to + 85°C) Symbol Min Typ Max Unit DC Supply Voltage VCC 4.5 5 5.5 V Quiescent Supply Current (Outputs unloaded, inputs low) ICC — 1.2 3.0 mA Iload = 0 mA Iload = 5 mA Iload = 10 mA VDD 8.5 7.5 6 10 9.5 9 11 — — V Iload = 0 mA Iload = 5 mA Iload = 10 mA VSS – 8.5 – 7.5 –6 – 10 – 9.2 – 8.6 –11 — — Parameter Output Voltage RECEIVER ELECTRICAL SPECIFICATIONS (Voltage polarities referenced to GND = 0 V; VCC = + 5 V ± 10%; C1, C2, C3, C4 = 10 µF; TA = – 40 to + 85°C) Characteristic Symbol Min Typ Max Unit Input Turn–on Threshold VDO1 – DO3 = VOL Rx1 – Rx3 Von 1.35 1.8 2.35 V Input Turn–off Threshold VDO1 – DO3 = VOH Rx1 – Rx3 Voff 0.75 1.0 1.25 V Input Threshold Hysteresis (Von – Voff) Rx1 – Rx3 Vhys 0.6 0.8 — V Input Resistance Rx1 – Rx3 Rin 3.0 5.4 7.0 kΩ High–Level Output Voltage VRx1 – Rx3 = – 3 V to – 25 V IOH = – 20 µA IOH = – 1 mA DO1 – DO3 VOH Low–Level Output Voltage VRx1 – Rx3 = + 3 V to + 25 V IOL = + 20 µA IOL = + 1.6 mA DO1 – DO3 MOTOROLA V VCC – 0.1 VCC – 0.7 — 4.3 — — VOL V — — 0.01 0.5 0.1 0.7 MC145407 3 DRIVER ELECTRICAL SPECIFICATIONS (Voltage polarities referenced to GND = 0 V: VCC = +5 V ± 10%; C1, C2, C3, C4 = 10 µF; TA = –40 to +85°C) Characteristic Digital Input Voltage Logic 0 Logic 1 DI1 – DI3 Input Current GND ≤ VDI1 – DI3 ≤ VCC DI1 – DI3 Symbol Min Typ Max Unit VIL VIH — 2.0 — — 0.8 — Iin — — ± 1.0 µA V Output High Voltage VDI1 – DI3 = Logic 0, RL = 3.0 kΩ Tx1 – Tx3 Tx1 – Tx6* VOH 6 5 7.5 6.5 — — V Output Low Voltage VDI1 – DI3 = Logic 1, RL = 3.0 kΩ Tx1 – Tx3 Tx1 – Tx6* VOL –6 –5 – 7.5 – 6.5 — — V Tx1 – Tx3 Zoff 300 — — Ω Tx1 – Tx3 Tx1 – Tx3 shorted to GND** Tx1 – Tx3 shorted to ± 15 V*** ISC — — — — ± 60 ± 100 Off Source Impedance (Figure 1) Output Short–Circuit Current VCC = + 5.5 V mA * Specifications for an MC145407 powering an MC145406 with three additional drivers/receivers. ** Specification is for one Tx output pin to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation limits could be exceeded. *** This condition could exceed package limitations. SWITCHING CHARACTERISTICS (VCC = + 5 V ± 10%; C1, C2, C3, C4 = 10 µF; TA = – 40 to + 85°C; See Figures 2 and 3) Symbol Characteristic Min Typ Max Unit Drivers Propagation Delay Time Low–to–High RL = 3 kΩ, CL = 50 pF or 2500 pF Tx1 – Tx3 High–to–Low RL = 3 kΩ, CL = 50 pF or 2500 pF Output Slew Rate Minimum Load: RL = 7 kΩ, CL = 0 pF µs tPLH — 0.5 1 — 0.5 1 — 9.0 ± 30 4.0 — — tPLH — — 1 tPHL — — 1 tPHL Tx1 – Tx3 SR Maximum Load: RL = 3 kΩ, CL = 2500 pF V/µs Receivers (CL = 50 pF) Propagation Delay Time Low–to–High µs DO1 – DO3 High–to–Low Output Rise Time DO1 – DO3 tr — 250 400 ns Output Fall Time DO1 – DO3 tf — 40 100 ns MC145407 4 MOTOROLA PIN DESCRIPTIONS 17 19 VDD VCC 15 DI1 13 DI2 VCC Digital Power Supply (Pin 19) 6 Tx1 Tx2 8 Vin = ± 2 V The digital supply pin, which is connected to the logic power supply. This pin should have a 0.33 µF capacitor to ground. GND Ground (Pin 2) 11 DI3 10 Tx3 Ground return pin is typically connected to the signal ground pin of the EIA–232–E connector (Pin 7) as well as to the logic power supply ground. VSS GND 4 2 Vin Rout = I VDD Positive Power Supply (Pin 17) This is the positive output of the on–chip voltage doubler and the positive power supply input of the driver/receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump. Figure 1. Power–Off Source Resistance VSS Negative Power Supply (Pin 4) DRIVERS 3V DI1 – DI3 50% 0V tf tr 90% Tx1 – Tx3 10% VOH C2+, C2–, C1–, C1+ Voltage Doubler and Inverter (Pins 1, 3, 18, 20) VOL These are the connections to the internal voltage doubler and inverter, which generate the VDD and VSS voltages. tPLH tPHL This is the negative output of the on–chip voltage doubler/ inverter and the negative power supply input of the driver/receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump. Rx1, Rx2, Rx3 Receive Data Input (Pins 5, 7, 9) RECEIVERS +3V Rx1 – Rx3 50% 0V tPHL tPLH VOH 90% 50% 10% DO1 – DO3 tf VOL tr These are the EIA–232–E receive signal inputs. A voltage between + 3 and + 25 V is decoded as a space and causes the corresponding DO pin to swing to ground (0 V). A voltage between – 3 and – 25 V is decoded as a mark, and causes the DO pin to swing up to VCC. DO1, DO2, DO3 Data Output (Pins 16, 14, 12) These are the receiver digital output pins, which swing from VCC to GND. Each output pin is capable of driving one LSTTL input load. Figure 2. Switching Characteristics DI1, DI2, DI3 Data Input (Pins 15, 13, 11) These are the high impedance digital input pins to the drivers. Input voltage levels on these pins must be between VCC and GND. DRIVERS 3V Tx1 – Tx3 –3V tSLH SLEW RATE (SR) = 3V –3V tSHL – 3 V – (3 V) 3 V – ( – 3 V) OR tSLH tSHL Figure 3. Slew Rate Characterization MOTOROLA Tx1, Tx2, Tx3 Transmit Data Output (Pins 6, 8, 10) These are the EIA–232–E transmit signal output pins, which swing toward VDD and VSS. A logic 1 at a DI input causes the corresponding Tx output to swing toward VSS. A logic 0 causes the output to swing toward VDD. The actual levels and slew rate achieved will depend on the output loading (RL ø CL). MC145407 5 APPLICATIONS INFORMATION ESD CONSIDERATIONS ESD protection on IC devices that have their pins accessible to the outside world is essential. High static voltages applied to the pins when someone touches them either directly or indirectly can cause damage to gate oxides and transistor junctions by coupling a portion of the energy from the I/O pin to the power supply busses of the IC. This coupling will usually occur through the internal ESD protection diodes. The key to protecting the IC is to shunt as much of the energy to ground as possible before it enters the IC. Figure 7 shows a technique which will clamp the ESD voltage at approximately + 15 V using the MMBZ15VDLT1. Any residual voltage which appears on the supply pins is shunted to ground through the 0.1 µF capacitors. using 10 µF charge pump caps to illustrate its capability in driving a companion MC145406 or MC145403. If there is no requirement to support a second interface device and/or the charge pump is not being used to power any other components, the MC145407 is capable of complying with EIA–232–E and V.28 with smaller value charge pump caps. Table 1 summarizes driver performance with both 2.2 µF and 1.0 µF charge pump caps. Table 1. Typical Performance 2.2 µF 1.0 µF Tx VOH @ 25°C 7.3 7.2 Tx VOH @ 85°C 7.2 7.1 Tx VOL @ 25°C – 6.5 – 6.4 Parameter Tx VOL @ 85°C OPERATION WITH SMALLER VALUE CHARGE PUMP CAPS The MC145407 is characterized in the electrical tables – 6.1 – 6.0 Tx Slew Rate @ 25°C 8.0 V/µs 8.0 V/µs Tx Slew Rate @ 85°C 7.0 V/µs 7.0 V/µs +5V 0.1 µF 20 DTMF INPUT CDSI RTLA RDSI 20 kΩ TIP 16 18 CFB 10 0.1 µF VSS BYPASS Xout CD 8 1.0 µF 19 VCC C1 – 1 13 Tx1 DI2 ExI LB Rx1 0.1 µF 19 VAG 4 CDT 0.1 µF CCDT MODE VSS 12 CDA 8 2 MC145407 14 Tx2 2 Rx2 DI3 10 kΩ FB 6 5 10 kΩ SQT 1.0 µF C1 + C2 + 15 DI1 16 DO1 3 11 TxD 5 RxD MC145442 OR RxA1 MC145443 17 + C2 – VDD 3 3.579 MHz 0.1 µF 1.0 µF 10 kΩ RING VDD Xin 9 DSI 600:600 * 0.1 µF VDD BYPASS 6 VDD 17 TxA 15 RxA2 0.1 µF RTx 10 µF 600 + 10 kΩ 1 TLA 0.1 µF 8 7 EIA–232–E DB–25 CONNECTOR 3 7 9 Rx3 13 7 CCDA 0.1 µF 1.0 µF VSS 4 GND 2 * Line protection circuit Figure 4. 5 V, 300 Baud Modem with EIA–232–E Interface MC145407 6 MOTOROLA +5V 1 V DD 2 Rx1 3 Tx1 4 Rx2 5 6 7 8 VCC 16 15 DO1 14 DI1 13 DO2 MC145406 12 Tx2 DI2 11 Rx3 DO3 10 Tx3 DI3 9 VSS GND 1 C1+ C2+ 2 10 µF 10 µF 20 10 µF 19 GND VCC 18 3 C2– C1– 4 V 17 VDD SS 5 16 Rx1 MC145407 DO1 6 Tx1 DI1 15 7 14 Rx2 DO2 8 Tx2 13 DI2 9 12 Rx3 DO3 11 10 Tx3 DI3 10 µF Figure 5. MC145406/MC145407 5 V Only Solution for up to Six EIA–232–E Drivers and Receivers +5 V + 10 V C2 C2+ GND C2– VSS C4 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 C1+ 0.1 µF VCC C1– VDD 0.1 µF Figure 6. Two Supply Configuration (MC145407 Generates VSS Only) +5 V MMBZ15VDLT × 6 C2 C2+ GND C2– VSS C4 Rx1 Tx1 TO CONNECTOR Rx2 Tx2 Rx3 Tx3 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 C1+ C1 VCC 0.1 µF C1– VDD DO1 C3 0.1 µF DI1 DO2 DI2 DO3 DI3 Figure 7. ESD Protection Scheme MOTOROLA MC145407 7 PACKAGE DIMENSIONS P SUFFIX PLASTIC DIP CASE 738–03 -A20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B C -T- L K SEATING PLANE M E G N F J 20 PL 0.25 (0.010) D 20 PL 0.25 (0.010) M T A M M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 15° 0° 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0° 15° 1.01 0.51 DW SUFFIX SOG PACKAGE CASE 751D–04 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– 20 11 –B– 10X P 0.010 (0.25) 1 M B M 10 20X D 0.010 (0.25) M T A B S J S F R C –T– 18X G SEATING PLANE K X 45 _ DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 M Motorola reserves the right to make changes without further notice to any products herein. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: [email protected] – TOUCHTONE (602) 244–6609 INTERNET: http://Design–NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MC145407 8 ◊ *MC145407/D* MC145407/D MOTOROLA