Order this document by MC145583/D SEMICONDUCTOR TECHNICAL DATA Product Preview # !! " DW SUFFIX SOG PACKAGE CASE 751F 28 1 # EIA–232–E and CCITT V.28 The MC145583 is a CMOS transceiver composed of three drivers and five receivers that fulfills the electrical specifications of EIA–232–E, EIA–562, and CCITT V.28 while operating from a single + 3.3 or + 5.0 V power supply. This transceiver is a high–performance, low–power consumption device that is equipped with a standby function. A voltage tripler and inverter converts the + 3.3 V to ± 8.8 V, or a voltage doubler and inverter converts the + 5.0 V to ± 8.8 V. This is accomplished through an on–chip 40 kHz oscillator and five inexpensive external capacitors. Drivers: • ± 5 V Minimum Output Swing at 3.3 or 5.0 V Power Supply • 300 Ω Power–Off Impedance • Output Current Limiting • Three–State Outputs During Standby Mode Receivers: • ± 25 V Input Range • 3 to 7 kΩ Input Impedance • 0.8 V Hysteresis for Enhanced Noise Immunity • Three–State Outputs During Standby Mode Ring Monitor Circuit: • Invert the Input Level on Rx1 to Logic Output Level on RIMON at Standby Mode VF SUFFIX SSOP CASE 940J 28 1 ORDERING INFORMATION MC145583DW MC145583VF SOG Package SSOP PIN ASSIGNMENT C5+ 1 28 C2+ GND 2 27 VCC C5– 3 26 C2– RIMON 4 25 C1+ VSS 5 24 C1– STB 6 23 VDD Rx1 7 22 DO1 Rx2 8 21 DO2 Rx3 9 20 DO3 Tx1 10 19 DI1 Rx4 11 18 DO4 Tx2 12 17 DI2 Rx5 13 16 DO5 Tx3 14 15 DI3 RING MONITOR CIRCUIT (INVERTING) This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice. REV 3 1/96 Motorola, Inc. 1996 MOTOROLA MC145583 1 FUNCTION DIAGRAM CHARGE PUMPS OSC VCC C3 GND VOLTAGE TRIPLER + C2 C1 VDD VOLTAGE INVERTER C5 C5+ C1– C2– C1+ + C4 + VSS C5– C2+ + ** RECEIVER VDD * VCC STB 15 kΩ + – DO 5.4 kΩ 1.0 V TURN OFF * Protection Circuit. ** Capacitors C1 and C2 are replaced by a 1 µF capacitor at VCC = 5.0 V supply. 1.8 V TURN ON DRIVER VDD STB VCC 300 Ω LEVEL SHIFTER Tx + – DI 1.4 V VSS MC145583 2 MOTOROLA MAXIMUM RATINGS (Voltage polarities referenced to GND) Rating Symbol Value Unit VCC – 0.5 to + 6.0 V VIR VSS – 15 to VDD + 15 – 0.5 to VCC + 0.5 V DC Current per Pin I ± 100 mA Power Dissipation PD 1 W Operating Temperature Range TA – 40 to + 85 °C Tstg – 85 to + 150 °C DC Supply Voltage Input Voltage Rx1 – Rx5 Inputs DI1 – DI3 Inputs Storage Temperature Range This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, it is recommended that the voltage at the DI and DO pins be constrained to the range GND ≤ VDI ≤ VCC and GND ≤ VDO ≤ VCC. Also, the voltage at the Rx pin should be constrained to (VSS – 15 V) ≤ VRx1 – Rx5 ≤ (VDD + 15 V), and Tx should be constrained to VSS ≤ VTx1 – Tx3 ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., GND or VCC for DI, and GND for Rx). RECOMMENDED OPERATING LIMITS Parameter Power Supply Operating Temperature Range Symbol Min Typ Max Unit VCC VCC* 3.0 4.5 3.3 5.0 3.6 5.5 V TA – 40 — 85 °C * Capacitors C1 and C2 are replaced by a 1 µF capacitor at VCC = 5 V. DC ELECTRICAL CHARACTERISTICS (Voltage polarities referenced to GND = 0 V; C1 – C5 = 1 µF; TA = 25°C) Symbol Min Typ Max Unit DC Power Supply VCC 3.0 3.3 3.6 V Quiescent Supply Current (Output Unloaded, Input Low) ICC — 2.8 6.0 mA ICC(STB) — <5 10 µA Control Signal Input Voltage (STB) VIL VIH — VCC – 0.5 — — 0.5 — V Control Signal Input Current (STB) IIL IIH — — — — 10 10 µA 8.5 7.5 8.8 7.9 — — — — – 8.8 – 7.8 – 8.5 – 7.0 Symbol Min Typ Max Unit Parameter Quiescent Supply Current (Standby Mode; STB = 1, Output Unloaded) Charge Pumps Output Voltage (VCC = 3 V; C1, C2, C3, C4, C5 = 1 µF) Output Voltage (VDD) Iload = 0 mA Iload = 6 mA Output Voltage (VSS) Iload = 0 mA Iload = 6 mA VDD V VSS RECEIVER ELECTRICAL SPECIFICATIONS (Voltage polarities referenced to GND = 0 V; VCC = + 3.3 V ± 10%; C1 – C5 = 1 µF; TA = 25°C) Parameter Input Turn–On Threshold (VDO1 – DO5 = VOL; Rx1 – Rx5) 3.3 V 5.0 V Von 1.35 2.00 1.8 2.5 2.35 3.10 V Input Turn–Off Threshold (VDO1 – DO5 = VOH; Rx1 – Rx5) 3.3 V 5.0 V Voff 0.75 1.20 1.0 1.5 1.25 1.80 V Rin 3 5.4 7 kΩ Input Resistance High–Level Output Voltage (DO1 – DO5) VRx1 – Rx5 = – 3 to – 25 V Iout = – 20 µA Iout = – 1 mA VOH VCC – 0.1 VCC – 0.6 — 2.7 — — V Low–Level Output Voltage (DO1 – DO5) VRx1 – Rx5 = + 3 to + 25 V Iout = + 20 µA Iout = + 1.6 mA VOL — — 0.01 0.5 0.1 0.7 V VTH — 1.1 — V Ring Monitor Circuit (Input Threshold) High–Level Output Voltage (RIMON) Iout = – 20 µA Iout = – 1 mA VOH VCC – 0.1 VCC – 0.6 — 2.7 — — V Low–Level Output Voltage (RIMON) Iout = + 20 µA Iout = + 1.6 mA VOL — — 0.01 0.5 0.1 0.7 V MOTOROLA MC145583 3 DRIVER ELECTRICAL SPECIFICATIONS (Voltage polarities referenced to GND = 0 V; VCC = + 3.3 V or + 5.0 V ± 10%; C1 – C5 = 1 µF; TA = 25°C) Parameter Digital Input Voltage Logic Low Logic High Symbol Min Typ Max VIL VIH — 1.8 — — 0.7 — IIL IIH VOH — — 7 — — ± 1.0 5.0 8.5 7.0 8.8 — — — — – 7.0 – 8.8 – 5.0 – 8.5 — — ± 5% 300 — — DI1 – DI3 V µA Digital Input Current DI1 – DI3 VDI = GND VDI = VCC Output High Voltage Load on All Tx1 – Tx3, RL = 3 kΩ; CP = 2500 pF, VDI1 – DI3 = Logic Low No Load Output Low Voltage Load on All Tx1 – Tx3, RL = 3 kΩ; CP = 2500 pF, VDI1 – DI3 = Logic High No Load VOL Ripple (Refer to VDD – VSS Value) *** VRF Zoff Off Source Impedance Unit Tx1 – Tx3 Output Short Circuit Current (VCC = 3.3 V or 5.5 V) Tx1 – Tx3 Shorted to GND* Tx1 – Tx3 Shorted to ± 15 V** V V ISC Ω mA — — — — ± 60 ± 100 * Specification is for one Tx output to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation limits could be exceeded. ** This condition could exceed package limitations. *** Ripple VRF would not exceed ± 5% of (VDD – VSS). SWITCHING CHARACTERISTICS (VCC = + 3.3 V or + 5 V, ± 10%; C1 – C5 = 1 µF; TA = 25°C) Symbol Parameter Min Typ Max Unit Drivers Propagation Delay Time Low–to–High (RL = 3 kΩ, CL = 50 pF or 2500 pF) Tx1 – Tx3 µs tDPLH — 0.5 1 — 0.5 1 SR ±4 — ± 30 Output Disable Time* tDAZ — 4 10 µs Output Enable Time* tDZA — 25 50 ms tRPLH — — 1 High–to–Low (RL = 3 kΩ, CL = 50 pF or 2500 pF) Output Slew Rate (Source R = 300 Ω) Loading: RL = 3 – 7 kΩ; CL = 2500 pF tDPHL Tx1 – Tx3 V/µs Receivers Propagation Delay Time Low–to–High µs DO1 – DO5 tRPHL — — 1 Output Rise Time High–to–Low DO1 – DO5 tr — 120 200 ns Output Fall Time DO1 – DO5 tf — 40 100 ns Output Disable Time* tRAZ — 4 10 µs Output Enable Time* tRZA — 25 50 ms * Including the charge pump setup time. TRUTH TABLES Drivers Receivers DI STB Tx Rx STB DO X H Z* X H Z* H L L H L L L L L L * VSS ≤ VTx ≤ VDD MC145583 4 H X = Don’t Care * GND ≤ VDO ≤ VCC H X = Don’t Care MOTOROLA driver and receiver output pins become high–impedance state. In this condition, supply current ICC is below 5 µA (typ). PIN DESCRIPTIONS VCC Digital Power Supply (Pin 27) This digital supply pin is connected to the logic power supply. This pin should have a not less than 0.33 µF capacitor GND. GND Ground (Pin 2) Ground return pin is typically connected to the signal ground pin of the EIA–232–E connector (Pin 7) as well as to the logic power supply ground. VDD Positive Power Supply (Pin 23) This is the positive output of the on–chip voltage tripler and the positive power supply input of the driver/receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump. VSS Negative Power Supply (Pin 5) This is the negative output of the on–chip voltage tripler/inverter and the negative power supply input of the driver/ receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump. RIMON Ring Monitor Circuit (Pin 4) The Ring Monitor Circuit will convert the input level on Rx1 pin at standby mode and output on the RIMON pin. STB Standby Mode (Pin 6) The device enters the standby mode while this pin is connected to the logic high level. During the standby mode, C5+, C5–, C2+, C2–, C1+, C1– Voltage Tripler and Inverter (Pins 1, 3, 28, 26, 25, 24) These are the connections to the internal voltage tripler and inverter, which generate the VDD and VSS voltages. Rx1, Rx2, Rx3, Rx4, Rx5 Receive Data Inputs (Pins 7, 8, 9, 11, 13) These are the EIA–232–E receive signal inputs. A voltage between + 3 and + 25 V is decoded as a space, and causes the corresponding DO pin to swing to GND (0 V). A voltage between – 3 and – 25 V is decoded as a mark, and causes the DO pin to swing up to VCC. DO1, DO2, DO3, DO4, DO5 Data Outputs (Pins 22, 21, 20, 18, 16) These are the receiver digital output pins, which swing from VCC to GND. Output level of these pins is high impedance while in standby mode. DI1, DI2, DI3 Data Inputs (Pins 19, 17, 15) These are the high impedance digital input pins to the drivers. Input voltage levels on these pins must be between VCC and GND. Tx1, Tx2, Tx3 Transmit Data Output (Pins 10, 12, 14) These are the EIA–232–E transmit signal output pins, which swing toward VDD and VSS. A logic 1 at a DI input causes the corresponding Tx output to swing toward VSS. The actual levels and slew rate achieved will depend on the output loading (RL /CL ). The minimum output impedance is 300 Ω when turned off. SWITCHING CHARACTERISTICS DRIVER DRIVER DI1 – DI3 (INPUT) + 3.3 V +3V STB (INPUT) 50% + 1.5 V + 1.5 V 0V 0V tf Tx1 – Tx3 (OUTPUT) tr VOH 90% 10% tDPHL VOL Rx1 – Rx5 (INPUT) HIGH Z –5V tDAZ tDPLH RECEIVER +5V Tx1 – Tx3 (OUTPUT) +5V –5V V OL tDZA RECEIVER +3V + 3.3 V + 1.5 V STB (INPUT) 50% + 1.5 V 0V 0V DO1 – DO5 (OUTPUT) tRPHL 90% tRPLH 10% tf MOTOROLA VOH VOH 90% DO1 – DO5 (OUTPUT) 10% VOL tr HIGH Z tRAZ 90% 10% VOH VOL tRZA MC145583 5 ESD PROTECTION ESD protection on IC devices that have their pins accessible to the outside world is essential. High static voltages applied to the pins when someone touches them either directly or indirectly can cause damage to gate oxides and transistor junctions by coupling a portion of the energy from the I/O pin to the power supply buses of the IC. This coupling MMBZ15VDLT1 x 8 will usually occur through the internal ESD protection diodes which are designed to do just that. The key to protecting the IC is to shunt as much of the energy to ground as possible before it enters the IC. Figure 1 shows a technique which will clamp the ESD voltage at approximately ± 15 V using the MMBZ15VDLT1. Any residual voltage which appears on the supply pins is shunted to ground through the capacitors C1 and C2. C5+ C2+ GND VCC C5– C2– RIMON C1+ VSS C1– STB VDD Rx1 DO1 Rx2 DO2 Rx3 DO3 Tx1 DI1 Rx4 DO4 Tx2 DI2 Rx5 DO5 Tx3 DI3 0.1 µF 0.1 µF C1 C2 Figure 1. ESD Protection Scheme MC145583 6 MOTOROLA PACKAGE DIMENSIONS DW SUFFIX SOG PACKAGE CASE 751F–04 -A28 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 15 14X -B1 P 0.010 (0.25) M B M 14 28X D 0.010 (0.25) M T A S B M S R X 45° C -T26X DIM A B C D F G J K M P R -T- G SEATING PLANE K F J MILLIMETERS MIN MAX 17.80 18.05 7.60 7.40 2.65 2.35 0.49 0.35 0.90 0.41 1.27 BSC 0.32 0.23 0.29 0.13 8° 0° 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.701 0.711 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0° 8° 0.395 0.415 0.010 0.029 VF SUFFIX SSOP CASE 940J–01 28 15 B –R– 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROSTRUSION. MOLD PROTRUSION IS 0.15 (0.006) MAX PER SIDE. 14 A –P– DIM A B C D E F G H J K L M L 0.25 (0.010) M T R S –T– J K MILLIMETERS MIN MAX 10.10 10.20 5.20 5.30 ––– 2.00 0.20 0.40 1.75 1.85 0.45 0.75 0.65 BSC 0.00 0.15 0.10 0.20 0.325 BSC 7.50 7.90 1_ 7_ INCHES MIN MAX 0.398 0.402 0.205 0.209 ––– 0.079 0.008 0.016 0.069 0.073 0.018 0.030 0.0256 BSC 0.000 0.006 0.004 0.008 0.0128 BSC 0.295 0.311 1_ 7_ D G 0.12 (0.005) M T P S 0.10 (0.004) T C E –T– H SEATING PLANE F MOTOROLA M MC145583 7 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: [email protected] – TOUCHTONE (602) 244–6609 INTERNET: http://Design–NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MC145583 8 ◊ *MC145583/D* MC145583/D MOTOROLA