Order this document by MC145705/D SEMICONDUCTOR TECHNICAL DATA Product Preview # !! " # P SUFFIX PLASTIC DIP CASE 738 EIA–232–E and CCITT V.28 20 The MC145705/06/07 are a series of silicon–gate CMOS transceiver ICs that fulfill the electrical specifications of EIA–232–E and CCITT V.28 while operating from a single + 5 V power supply. These transceiver series are high performance and low power consumption devices that are equipped with standby and output enable function. A voltage doubler and inverter convert the + 5 V to ± 10 V. This is accomplished through an on–board 20 kHz oscillator and four inexpensive external electrolytic capacitors. The MC145705 is composed of two drivers and three receivers, the MC145706 has three drivers and two receivers, and the MC145707 has three drivers and three receivers. These drivers and receivers are virtually identical to those of the MC145407. 1 DW SUFFIX SOG PACKAGE CASE 751D 20 1 P SUFFIX PLASTIC DIP CASE 724 24 1 Available Driver/Receiver Combinations Device Drivers Receivers No. of Pins MC145705 2 3 20 MC145706 3 2 20 MC145707 3 3 24 DW SUFFIX SOG PACKAGE CASE 751E 24 Drivers: • ± 7.5 Output Swing • 300 Ω Power–Off Impedance • Output Current Limiting • TTL and CMOS Compatible Inputs • Three–State Outputs During Standby Mode • Hold Output OFF (MARK) State by TxEN Pin Receivers: • ± 25 V Input Range • 3 to 7 kΩ Input Impedance • 0.8 V Hysteresis for Enhanced Noise Immunity • Three–State Outputs During Standby Mode Charge Pumps: • + 5 to ± 10 V Dual Charge Pump Architecture • Supply Outputs Capable of Driving Three Drivers on the MC145403/06 Simultaneously • Requires Four Inexpensive Electrolytic Capacitors • On–Chip 20 kHz Oscillators 1 ORDERING INFORMATION MC145705P MC145706P MC145707P Plastic DIP Plastic DIP Plastic DIP MC145705DW MC145706DW MC145707DW SOG Package SOG Package SOG Package This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice. REV 1 8/95 Motorola, Inc. 1995 MOTOROLA MC145705•MC145706•MC145707 1 PIN ASSIGNMENTS MC145705 2 DRIVERS/3 RECEIVERS MC145706 3 DRIVERS/2 RECEIVERS C2+ 1 20 C1+ C2+ 1 20 C1+ GND 2 19 VCC GND 2 19 VCC C2– 3 18 C1– C2– 3 18 C1– VSS 4 17 VDD VSS 4 17 VDD STB 5 16 TxEN STB 5 16 TxEN Rx1 6 15 DO1 Tx1 6 15 DI1 7 14 DO2 Rx1 7 14 8 13 DI1 Tx2 8 13 DI2 9 12 DO3 Rx2 9 12 DO2 10 11 DI2 Tx3 10 11 DI3 Rx2 Tx1 Rx3 Tx2 DO1 MC145707 3 DRIVERS/3 RECEIVERS C2+ 1 24 C1+ GND 2 23 VCC C2– 3 22 C1– VSS 4 21 VDD STB 5 NC 6 19 7 18 8 17 9 16 DO2 10 15 DI2 11 14 DO3 12 13 Rx1 Tx1 Rx2 Tx2 Rx3 Tx3 20 TxEN NC DO1 DI1 DI3 NC = NO CONNECTION MC145705•MC145706•MC145707 2 MOTOROLA FUNCTION DIAGRAM CHARGE PUMPS OSC VCC C3 GND + VOLTAGE DOUBLER VOLTAGE INVERTER C1 C2 VDD + C1– C1+ + C2+ + C4 VSS C2– RECEIVER VDD VDD * VCC STB 15 kΩ + – DO 5.4 kΩ VSS 1.0 V 1.8 V * Protection Circuit DRIVER VDD STB TxEN VCC VCC 300 Ω LEVEL SHIFT Tx + – DI 1.4 V VSS MOTOROLA MC145705•MC145706•MC145707 3 MAXIMUM RATINGS (Voltage Polarities Referenced to GND) Rating Symbol Value Unit VCC – 0.5 to + 6.0 V VIR VSS – 15 to VDD + 15 0.5 to VCC + 15 V DC Current per Pin I ± 100 mA Power Dissipation PD 1 W Operating Temperature Range TA – 40 to + 85 °C Tstg – 85 to + 150 °C DC Supply Voltage Input Voltage Rx1 – Rx3 Inputs DI1 – DI3 Inputs Storage Temperature Range This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, it is recommended that the voltage at the DI and DO pins be constrained to the range GND ≤ VDI ≤ VDD and GND ≤ VDO ≤ V CC. Also, the voltage at the Rx pin should be constrained to (VSS – 15 V) ≤ V Rx1 – Rx3 ≤ (VDD + 15 V), and Tx should be constrained to VSS ≤ VTx1 – Tx3 ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., GND or VCC for DI, and GND for Rx). RECOMMENDED OPERATING LIMITS Parameter Power Supply Operating Temperature Range Symbol Min Typ Max Unit VCC 4.5 5 5.5 V TA – 40 — 85 °C DC ELECTRICAL CHARACTERISTICS (Voltage polarities referenced to GND = 0 V; C1 – C4 = 10 µF; TA = – 40 to + 85°C) Parameter DC Power Supply Quiescent Supply Current (Output Unloaded, Input Low) Control Signal Input Current Charge Pumps Output Voltage (C1, C2, C3, C4 = 10 µF) Output Voltage (VDD) Output Voltage (VSS) Min Typ Max Unit VCC 4.5 5 5.5 V ICC — 1.7 3.5 mA ICC(STB) — < 10 20 µA Logic Low Logic High VIL VIH — VCC – 0.5 — — 0.5 — V Logic Low (TxEN) Logic High (STB) IIL IIH — — — — – 10 10 µA 8.5 7.5 6.0 10.0 9.5 9.0 11 — — – 8.5 – 7.5 – 6.0 – 10.0 – 9.2 – 8.6 – 11 — — Quiescent Supply Current (Standby Mode) (Output Unloaded, Input Open) Control Signal Input Voltage (STB, TxEN) Symbol VDD Iload = 0 mA Iload = 5 mA Iload = 10 mA Iload = 0 mA Iload = 5 mA Iload = 10 mA VSS V RECEIVER ELECTRICAL SPECIFICATIONS (Voltage polarities referenced to GND = 0 V; VCC = + 5 V ± 10%; C1 – C4 = 10 µF; TA = – 40 to + 85°C) Parameter Symbol Min Typ Max Unit Input Turn–On Threshold (VDO1 – DO3 = VOL) Rx1 – Rx3 Von 1.35 1.8 2.35 V Input Turn–Off Threshold (VDO1 – DO3 = VOH) Rx1 – Rx3 Voff 0.75 1 1.25 V Input Threshold Hysteresis (Von = Voff) Rx1 – Rx3 Vhys 0.6 0.8 — V Rin 3 5.4 7 kΩ Input Resistance High–Level Output Voltage (DO1 – DO3) VRx1 – Rx3 = – 3 to – 25 V Iout = – 20 µA Iout = – 1 mA VOH VCC – 0.1 VCC – 0.7 — 4.3 — — V Low–Level Output Voltage (DO1 – DO3) VRx1 – Rx3 = + 3 to + 25 V Iout = + 20 µA Iout = + 1.6 mA VOL — — 0.01 0.5 0.1 0.7 V MC145705•MC145706•MC145707 4 MOTOROLA DRIVER ELECTRICAL SPECIFICATIONS (Voltage polarities referenced to GND = 0 V; VCC = + 5 V ± 10%; C1 – C4 = 10 µF; TA = – 40 to + 85°C) Parameter Digital Input Voltage Logic Low Logic High DI1 – DI3 Input Current VDI = GND VDI = VCC DI1 – DI3 Symbol Min Typ Max VIL VIH — 2 — — 0.8 — IIL IIH — — 7 — — ± 1.0 Unit V µA Output High Voltage (VDI1 – DI3 = Logic Low, RL = 3 kΩ) Tx1 – Tx3 Tx1 – Tx6* VOH 6 5 7.5 6.5 — — V Output Low Voltage (VDI1 – DI3 = Logic High, RL = 3 kΩ) Tx1 – Tx3 Tx1 – Tx6* VOL –6 –5 – 7.5 – 6.5 — — V Tx1 – Tx3 Zoff 300 — — Ω — — — — ± 60 ± 100 Off Source Impedance Output Short Circuit Current (VCC = 5.5 V) Tx1 – Tx3 Shorted to GND** Tx1 – Tx3 Shorted to ± 15 V*** ISC mA * Specifications for a MC14570X powering a MC145406 or MC145403 with three additional drivers/receivers. ** Specification is for one Tx output to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation limits could be exceeded. *** This condition could exceed package limitations. SWITCHING CHARACTERISTICS (VCC = + 5 V, ± 10%; C1 – C4 = 10 µF; TA = – 40 to + 85°C) Symbol Parameter Min Typ Max Unit Drivers Propagation Delay Time Low–to–High (RL = 3 kΩ, CL = 50 pF or 2500 pF) Tx1 – Tx3 µs tPLH High–to–Low (RL = 3 kΩ, CL = 50 pF or 2500 pF) — 0.5 1 — 0.5 1 — ±6 ± 30 tPHL Output Slew Rate Minimum Load (RL = 7 kΩ, CL = 0 pF) Tx1 – Tx3 SR V/µs — ±5 — Output Disable Time tDAZ — 4 10 µs Output Enable Time tDZA — 25 50 ms — — 1 tPHL — — 1 Maximum Load (RL = 3 kΩ, CL = 2500 pF) Receivers Propagation Delay Time Low–to–High DO1 – DO3 µs tPLH High–to–Low Output Rise Time DO1 – DO3 tr — 250 400 ns Output Fall Time DO1 – DO3 tf — 40 100 ns Output Disable Time tRAZ — 4 10 µs Output Enable Time tRZA — 25 50 ms TRUTH TABLE Drivers Receivers DI TxEN STB Tx Rx STB DO X X H Z* X H Z* X L L L H L L H H L L L L H L H L H * VSS ≤ VTx ≤ VDD MOTOROLA * GND ≤ VDO ≤ VCC X = Don’t Care X = Don’t Care MC145705•MC145706•MC145707 5 state. In this condition, supply current ICC is below 10 µA (Typ) and can be operated with low current consumption. PIN DESCRIPTIONS VCC Digital Power Supply This digital supply pin is connected to the logic power supply. This pin should have a 0.33 µF capacitor to ground. GND Ground Ground return pin is typically connected to the signal ground pin of the EIA–232–D connector (Pin 7) as well as to the logic power supply ground. VDD Positive Power Supply This is the positive output of the on–chip voltage doubler and the positive power supply input of the driver/receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump. VSS Negative Power Supply This is the negative output of the on–chip voltage doubler/ inverter and the negative power supply input of the driver/ receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump. C2+, C2–, C1+, C1– Voltage Doubler and Inverter These are the connections to the internal voltage doubler and inverter, which generate the VDD and VSS voltages. Rx1, Rx2 (Rx3) Receive Data Input These are the EIA–232–E receive signal inputs. A voltage between + 3 and + 25 V is decoded as a space, and causes the corresponding DO pin to swing to ground (0 V). A voltage between – 3 and – 25 V is decoded as a mark, and causes the DO pin to swing up to VCC. DO1, DO2 (DO3) Data Output These are the receiver digital output pins, which swing from VCC to GND. Each output pin is capable of driving one LSTTL input load. Output level of these pins is high impedance while in standby mode. DI1, DI2 (DI3) Data Input TxEN Output Enable These are the high impedance digital input pins to the drivers. Input voltage levels on these pins must be between VCC and GND. The level of these input pins are TTL/CMOS compatible. This is the driver output enable pin. When this pin is in logic low level, the condition of the driver outputs (Tx1 – Tx3) are in keep OFF (mark) state. Tx1, Tx2 (Tx3) Transmit Data Output STB Standby The device enters the standby mode while this pin is connected to the logic high level. During the standby mode, driver and receiver output pins become high impedance These are the EIA–232–E transmit signal output pins, which swing toward VDD and VSS. A logic 1 at a DI input causes the corresponding Tx output to swing toward VSS. The actual levels and slew rate achieved will depend on the output loading (RL/CL). The minimum output impedance is 300 Ω when turned off. SWITCHING CHARACTERISTICS DRIVER +3V DI1 – DI3 (INPUT) DRIVER +5V + 1.5 V STB (INPUT) 50% 0V 0V tf Tx1 – Tx3 (OUTPUT) tr VOH 90% 10% tPHL VOL –5V DO1 – DO3 (OUTPUT) +3V RECEIVER 0V STB (INPUT) VOH HIGH Z tPLH RECEIVER +5V +5V Tx1 – Rx3 (OUTPUT) tDAZ Rx1 – Rx3 (INPUT) + 1.5 V –5V VOL tDZA +5V 50% tPHL 90% tPLH 10% tf + 1.5 V 0V VOH VOL 90% DO1 – DO3 (OUTPUT) 90% VOH HIGH Z tr 10% tRAZ MC145705•MC145706•MC145707 6 + 1.5 V 10% VOL tRZA MOTOROLA ESD PROTECTION occur through the internal ESD protection diodes which are designed to do just that. The key to protecting the IC is to shunt as much of the energy to ground as possible before it enters the IC. The figure below shows a technique which will clamp the ESD voltage at approximately ± 15 V using the MMBZ15VDLT1. Any residual voltage which appears on the supply pins is shunted to ground through the capacitors C1 and C2. ESD protection on IC devices that have their pins accessible to the outside world is essential. High static voltages applied to the pins when someone touches them either directly or indirectly can cause damage to gate oxides and transistor junctions by coupling a portion of the energy from the I/O pin to the power supply buses of the IC. This coupling will usually MMBZ15VDLT1 C2+ GND C2– VSS STB NC MOTOROLA C1+ 1 24 2 23 3 22 4 21 VDD 20 TxEN 5 VCC C1– 0.1 µF NC 6 19 Rx1 7 18 DO1 Tx1 8 17 DI1 Rx2 9 16 DO2 Tx2 10 15 DI2 Rx3 11 14 DO3 Tx3 12 13 DI3 MC145705•MC145706•MC145707 7 PACKAGE DIMENSIONS P SUFFIX PLASTIC DIP CASE 738–03 -A20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B C -T- L DIM A B C D E F G J K L M N K SEATING PLANE M E G N F J 20 PL 0.25 (0.010) D 20 PL 0.25 (0.010) T A M M T B M M INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0° 15° 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0° 15° 0.51 1.01 DW SUFFIX SOG PACKAGE CASE 751D–04 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– 20 11 –B– 10X P 0.010 (0.25) 1 M B M 10 20X D 0.010 (0.25) M T A B S J S F R C –T– 18X G K MC145705•MC145706•MC145707 8 SEATING PLANE X 45 _ DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 M MOTOROLA P SUFFIX PLASTIC DIP CASE 724–03 –A– 24 13 1 12 NOTES: 1. CHAMFERED CONTOUR OPTIONAL. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. –B– L C –T– NOTE 1 K SEATING PLANE N E G M J F D DIM A B C D E F G J K L M N 24 PL 0.25 (0.010) 24 PL 0.25 (0.010) M T A M T B M M INCHES MIN MAX 1.230 1.265 0.250 0.270 0.145 0.175 0.015 0.020 0.050 BSC 0.040 0.060 0.100 BSC 0.007 0.012 0.110 0.140 0.300 BSC 0_ 15_ 0.020 0.040 MILLIMETERS MIN MAX 31.25 32.13 6.35 6.85 3.69 4.44 0.38 0.51 1.27 BSC 1.02 1.52 2.54 BSC 0.18 0.30 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 DW SUFFIX SOG PACKAGE CASE 751E–04 –A– 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 13 –B– 12X P 0.010 (0.25) 1 M B M 12 24X D J 0.010 (0.25) M T A S B S F R C –T– SEATING PLANE MOTOROLA M 22X G K X 45 _ DIM A B C D F G J K M P R MILLIMETERS MIN MAX 15.25 15.54 7.40 7.60 2.35 2.65 0.35 0.49 0.41 0.90 1.27 BSC 0.23 0.32 0.13 0.29 0_ 8_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.601 0.612 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0_ 8_ 0.395 0.415 0.010 0.029 MC145705•MC145706•MC145707 9 This page intentionally left blank. MC145705•MC145706•MC145707 10 MOTOROLA This page intentionally left blank. MOTOROLA MC145705•MC145706•MC145707 11 Motorola reserves the right to make changes without further notice to any products herein. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: [email protected] – TOUCHTONE (602) 244–6609 INTERNET: http://Design–NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MC145705•MC145706•MC145707 12 *MC145705/D* MC145705/D MOTOROLA