MURD530 SWITCHMODEt Power Rectifier DPAK Surface Mount Package http://onsemi.com These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. ULTRAFAST RECTIFIER 5.0 AMPERES, 300 VOLTS Features • • • • Ultrafast 50 Nanosecond Recovery Time Low Forward Voltage Drop Low Leakage Pb−Free Package is Available 1 4 3 Mechanical Characteristics • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Available in 16 mm Tape and Reel, 2500 Units Per Reel, by Adding a “T4’’ Suffix to the Part Number MARKING DIAGRAM 4 1 2 DPAK CASE 369C 3 Y WW G MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 300 V Average Rectified Forward Current (Rated VR, TC = 165°C) IF(AV) 5.0 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 165°C) IFRM 10 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) IFSM 75 A TJ, Tstg −65 to +175 °C Operating Junction and Storage Temperature Range YWW U 530G = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device MURD530T4G Package Shipping† DPAK (Pb−Free) 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2008 November, 2008 − Rev. 1 1 Publication Order Number: MURD530/D MURD530 THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance − Junction−to−Case (Note 1) RqJC 3 °C/W Thermal Resistance − Junction−to−Ambient (Note 2) RqJA 92 °C/W RqJA 57 °C/W Thermal Resistance − Junction−to−Ambient (Note 3) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage Drop (Note 4) (iF = 3 A, TJ = 25°C) (iF = 3 A, TJ = 125°C) (iF = 5 A, TJ = 25°C) (iF = 5 A, TJ = 125°C) vF Maximum Instantaneous Reverse Current (Note 4) (TJ = 25°C, Rated dc Voltage) (TJ = 125°C, Rated dc Voltage) iR Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 A/ms, VR = 30 V, TJ = 25°C) trr 1. 2. 3. 4. 0.95 0.80 1.05 0.90 Volts mA 5.0 150 ns 50 Rating applies for one diode leg. Rating applies when for both diode legs when mounted on 130 mm2 pad size. Rating applies for both diode legs when mounted on 1 in pad size. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. 100 TJ = 175°C 85°C 125°C 1 25°C −40°C 0.1 0 0.5 1.0 1.5 85°C 25°C 1 −40°C 0.1 2.0 125°C 0 0.5 1.0 1.5 vF, INSTANTANEOUS VOLTAGE (V) vF, INSTANTANEOUS VOLTAGE (V) Figure 2. Typical Forward Voltage 125°C 10 85°C 1.0 25°C 0.1 0.01 −40°C 0.001 50 2.0 1000 175°C 100 0 0 175°C 10 Figure 1. Maximum Forward Voltage 1000 IR, REVERSE CURRENT (mA) IF, FORARD CURRENT (A) 10 IR, REVERSE CURRENT (A) IF, FORARD CURRENT (A) 100 100 150 200 vR, REVERSEE VOLTAGE (V) 250 125°C 10 85°C 1.0 0.1 25°C 0.01 −40°C 0.001 0 0 300 175°C 100 Figure 3. Maximum Reverse Voltage 50 100 150 200 250 vR, REVERSEE VOLTAGE (V) Figure 4. Typical Reverse Voltage http://onsemi.com 2 300 MURD530 5 15 10 dc SQUARE WAVE 5 80 90 dc SQUARE WAVE 0 100 110 120 130 140 150 160 170 180 80 90 100 110 120 130 140 150 160 170 18 TC, CASE TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 5. Typical Current Derating, Case Figure 6. Typical Current Derating, Ambient 8 1000 TJ = 25°C 7 6 5 C, CAPACITANCE (pF) PFO, AVERAGE POWER DISSIPATION (W) 0 Rated Voltage Applied RqJA = 57°C/W IF, AVERAGE FORWARD CURRENT (mA) IF, AVERAGE FORWARD CURRENT (mA) Rated Voltage Applied RqJA = 3°C/W SQUARE WAVE 4 dc 3 2 100 10 1 0 0 1 2 3 4 5 6 7 8 1 9 0 50 100 150 200 IO, AVERAGE FORWARD CURRENT (A) VR, REVERSE VOLTAGE (V) Figure 7. Forward Power Dissipation Figure 8. Typical Capacitance 250 10 R(t), (°C/W) D = 0.5 1 0.2 0.1 0.05 0.1 0.01 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 PULSE TIME (s) Figure 9. R(t) on an Infinite Heatsink Power (J1) 0.800 W Power (J2) 0.800 W http://onsemi.com 3 100 1000 MURD530 100 D = 0.5 0.2 0.1 R(t), (°C/W) 10 0.05 1 0.01 0.1 Single Pulse 0.01 0.001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 PULSE TIME (s) Figure 10. PCB Cu Area 650 mm2 PCB Cu thk 1 oz Power (J1) 0.800 W Power (J2) 0.800 W http://onsemi.com 4 1000 MURD530 PACKAGE DIMENSIONS DPAK CASE 369C ISSUE A −T− C B V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE E R 4 Z A S 1 2 DIM A B C D E F G H J K L R S U V Z 3 U K F J L H D G 2 PL 0.13 (0.005) M INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 −−− 0.035 0.050 0.155 −−− MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 −−− 0.89 1.27 3.93 −−− T SOLDERING FOOTPRINT* 6.20 0.244 3.0 0.118 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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