VISHAY TSMF1030

TSMF1000, TSMF1020, TSMF1030
Vishay Semiconductors
High Speed Infrared Emitting Diode, RoHS Compliant, 890 nm,
GaAlAs Double Hetero
FEATURES
TSMF1000
• Package type: surface mount
TSMF1020
• Package form: GW, RGW, yoke, axial
• Dimensions (L x W x H in mm): 2.5 x 2 x 2.7
• Peak wavelength: λp = 890 nm
• High radiant power
• Angle of half intensity: ϕ = ± 17°
TSMF1030
• Low forward voltage
• Suitable for high pulse current operation
• Versatile terminal configurations
16758-5
• Package matches with detector TEMD1000
• Floor life: 168 h, MSL 3, acc. J-STD-020
DESCRIPTION
• Lead (Pb)-free component in accordance
RoHS 2002/95/EC and WEEE 2002/96/EC
TSMF1000 series are infrared, 890 nm emitting diodes in
GaAlAs double hetero (DH) technology with high radiant
power and high speed, molded in clear, untinted plastic
packages (with lens) for surface mounting (SMD).
with
APPLICATIONS
• IrDA compatible data transmission
• Miniature light barrier
• Photointerrupters
• Optical switch
• Control and drive circuits
• Shaft encoders
PRODUCT SUMMARY
Ie (mW/sr)
ϕ (deg)
λP (nm)
tr (ns)
TSMF1000
5
± 17
890
30
TSMF1020
5
± 17
890
30
TSMF1030
5
± 17
890
30
COMPONENT
Note
Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
TSMF1000
Tape and reel
MOQ: 1000 pcs, 1000 pcs/reel
Reverse gullwing
TSMF1020
Tape and reel
MOQ: 1000 pcs, 1000 pcs/reel
Gullwing
TSMF1030
Tape and reel
MOQ: 1000 pcs, 1000 pcs/reel
Yoke
Note
MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VALUE
Reverse voltage
TEST CONDITION
VR
5
UNIT
V
Forward current
IF
100
mA
mA
Peak forward current
tp/T = 0.5, tp = 100 µs
IFM
200
Surge forward current
tp = 100 µs
IFSM
0.8
A
PV
180
mW
Power dissipation
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For technical questions, contact: [email protected]
Document Number: 81061
Rev. 1.7, 04-Sep-08
TSMF1000, TSMF1020, TSMF1030
High Speed Infrared Emitting Diode, RoHS Vishay Semiconductors
Compliant, 890 nm, GaAlAs Double Hetero
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITION
SYMBOL
Tj
100
°C
- 40 to + 85
°C
Storage temperature range
Tstg
- 40 to + 100
°C
t≤5s
Tsd
260
°C
Soldered on PCB, pad dimensions:
4 mm x 4 mm
RthJA
400
K/W
Soldering temperature
Thermal resistance junction/ambient
UNIT
Tamb
Junction temperature
Operating temperature range
VALUE
Note
Tamb = 25 °C, unless otherwise specified
200
120
160
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
140
120
100
RthJA = 400 K/W
80
60
40
100
80
60
RthJA = 400 K/W
40
20
20
0
0
0
10
21165
20
30
40
50
60
70 80
90 100
0
Tamb - Ambient Temperature (°C)
21166
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
10
20 30 40
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS
PARAMETER
TEST CONDITION
SYMBOL
TYP.
MAX.
IF = 20 mA
VF
1.3
1.5
IF = 1 A, tp = 100 µs
VF
2.4
Temperature coefficient of VF
IF = 1 mA
TKVF
- 1.8
Reverse current
VR = 5 V
IR
VR = 0 V, f = 1 MHz, E = 0
Cj
IF = 20 mA
Ie
IF = 100 mA, tp = 100 µs
Ie
Forward voltage
Junction capacitance
Radiant intensity
MIN.
5
25
V
V
mV/K
10
µA
13
mW/sr
160
2.5
UNIT
pF
mW/sr
IF = 100 mA, tp = 20 ms
φe
35
mW
IF = 20 mA
TKφe
- 0.6
%/K
ϕ
± 17
deg
Peak wavelength
IF = 20 mA
λp
890
nm
Spectral bandwidth
IF = 20 mA
Δλ
40
nm
Temperature coefficient of λp
IF = 20 mA
TKλp
0.2
nm/K
Rise time
IF = 20 mA
tr
30
ns
Fall time
IF = 20 mA
tf
30
ns
IDC = 70 mA, IAC = 30 mA pp
fc
12
MHz
d
1.2
mm
Radiant power
Temperature coefficient of φe
Angle of half intensity
Cut-off frequency
Virtual source diameter
Note
Tamb = 25 °C, unless otherwise specified
Document Number: 81061
Rev. 1.7, 04-Sep-08
For technical questions, contact: [email protected]
www.vishay.com
225
TSMF1000, TSMF1020, TSMF1030
Vishay Semiconductors High Speed Infrared Emitting Diode, RoHS
Compliant, 890 nm, GaAlAs Double Hetero
BASIC CHARACTERISTICS
Tamb = 25 °C, unless otherwise specified
10 000
1000
Tamb < 60 °C
0.01
Φe - Radiant Power (mW)
I F - Forward Current (mA)
tp/T = 0.005
1000
0.02
0.05
100
0.2
0.5
DC
0.1
10
1
0.01
0.1
1
10
1
1.6
103
1.2
IF = 20 mA
Ie rel; Φe rel
102
0.8
0.4
101
100
0
94 8880
1
2
3
0
- 10 0 10
4
VF - Forward Voltage (V)
94 7993
Fig. 4 - Forward Current vs. Forward Voltage
Φe rel - Relative Radiant Power
Ie - Radiant Intensity (mW/sr)
100
140
1.25
100
10
1
0.1
100
50
T amb - Ambient Temperature (°C)
Fig. 7 - Rel. Radiant Intensity/Power vs. Ambient Temperature
1000
101
102
103
1.0
0.75
0.5
0.25
0
800
104
IF - Forward Current (mA)
Fig. 5 - Radiant Intensity vs. Forward Current
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226
10 4
Fig. 6 - Radiant Power vs. Forward Current
104
16189
10 1
10 2
10 3
I F - Forward Current (mA)
94 8007
Fig. 3 - Pulse Forward Current vs. Pulse Duration
IF - Forward Current (mA)
10
0.1
10 0
100
t p - Pulse Length (ms)
95 9985
100
20082
1000
900
λ - Wavelength (nm)
Fig. 8 - Relative Radiant Power vs. Wavelength
For technical questions, contact: [email protected]
Document Number: 81061
Rev. 1.7, 04-Sep-08
TSMF1000, TSMF1020, TSMF1030
High Speed Infrared Emitting Diode, RoHS Vishay Semiconductors
Compliant, 890 nm, GaAlAs Double Hetero
REFLOW SOLDER PROFILE
0°
10°
20°
260
30°
1.0
0.9
50°
0.8
60°
70°
0.7
80°
220
Temperature (°C)
40°
ϕ - Angular Displacement
Srel - Relative Sensitivity
240
200
+ 5 °C/s
- 5 °C/s
180
160
140
120
60 s to 120 s
5s
100
80
60
0.6
0.4
0.2
0
0
20 40 60 80 100 120 140 160 180 200 220
17172
94 8248
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
Time (s)
Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile
PRECAUTIONS FOR USE
1. Over-current-proof
Customer must apply resistors for protection, otherwise
slight voltage shift will cause big current change (burn out will
happen).
2. Storage
2.1 Storage temperature and rel. humidity conditions are:
5 °C to 35 °C, R.H. 60 %.
2.2 Floor life must not exceed 168 h, acc. to JEDEC level 3,
J-STD-020.
Once the package is opened, the products should be
used within a week. Otherwise, they should be kept in a
damp proof box with desiccant.
Considering tape life, we suggest to use products within
one year from production date.
2.3 If opened more than one week in an atmosphere 5 °C to
35 °C, R.H. 60 %, devices should be treated at 60 °C
± 5 °C for 15 h.
2.4 If humidity indicator in the package shows pink color
(normal blue), then devices should be treated with the
same conditions as 2.3.
Document Number: 81061
Rev. 1.7, 04-Sep-08
For technical questions, contact: [email protected]
www.vishay.com
227
TSMF1000, TSMF1020, TSMF1030
Vishay Semiconductors High Speed Infrared Emitting Diode, RoHS
Compliant, 890 nm, GaAlAs Double Hetero
PACKAGE DIMENSIONS in millimeters: TSMF1000
16159
PACKAGE DIMENSIONS in millimeters: TSMF1020
3.8 ± 0.2
2.7 ± 0.2
0.75
0.15 ± 0.05
1.4
0.85
Ø 1.9 ± 0.2
0.3
0.4
C
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228
4.5 ± 0.1
0.5
2 ± 0.2
1.1
2.3 ± 0.1
A
For technical questions, contact: [email protected]
1 ± 0.1
2.5 ± 0.2
16160
Document Number: 81061
Rev. 1.7, 04-Sep-08
TSMF1000, TSMF1020, TSMF1030
High Speed Infrared Emitting Diode, RoHS Vishay Semiconductors
Compliant, 890 nm, GaAlAs Double Hetero
PACKAGE DIMENSIONS in millimeters: TSMF1030
16228
16 ±0.2
Unreel direction
X
2.
60.2
±0.5
REEL DIMENSIONS in millimeters
5
178 ±1
.5
±0
0.
5
Tape position
coming out from reel
13
±
X
13.2
±1.5
Label posted here
Leader and trailer tape:
Parts mounted
Direction of pulling out
Empty leader (400 mm, min.)
Drawing-No.: 9.800-5080.01-4
Issue: 3; 11.06.08
Empty trailer (200 mm, min.)
18033
Document Number: 81061
Rev. 1.7, 04-Sep-08
For technical questions, contact: [email protected]
www.vishay.com
229
TSMF1000, TSMF1020, TSMF1030
Vishay Semiconductors High Speed Infrared Emitting Diode, RoHS
Compliant, 890 nm, GaAlAs Double Hetero
TAPING DIMENSIONS in millimeters: TSMF1000
3.05 ± 0.1
Top tape
Anode
12 ± 0.3
1.75 ± 0.1
2 ± 0.05
Ø 1.55 ± 0.05
5.5 ± 0.05
0.3
4 ± 0.1
4 ± 0.1
Feed direction
Push pin through hole
Quantity per reel: 1000 pcs or 5000 pcs
18030
TAPING DIMENSIONS in millimeters: TSMF1020
3.05 ± 0.1
Feed direction
Top tape
12 ± 0.3
2 ± 0.05
1.75 ± 0.1
Ø 1.55 ± 0.05
5.5 ± 0.05
0.3
4 ± 0.1
4 ± 0.1
Anode
Push pin through hole
Quantity per reel: 1000 pcs or 5000 pcs
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230
For technical questions, contact: [email protected]
18031
Document Number: 81061
Rev. 1.7, 04-Sep-08
TSMF1000, TSMF1020, TSMF1030
High Speed Infrared Emitting Diode, RoHS Vishay Semiconductors
Compliant, 890 nm, GaAlAs Double Hetero
TAPING DIMENSIONS in millimeters: TSMF1030
3.05 ± 0.1
Feed direction
Top tape
4 ± 0.1
Anode
Push pin through hole
Document Number: 81061
Rev. 1.7, 04-Sep-08
12 ± 0.3
1.75 ± 0.1
2 ± 0.05
Ø 1.55 ± 0.05
5.5 ± 0.05
0.3
4 ± 0.1
18032
Quantity per reel: 1000 pcs or 5000 pcs
For technical questions, contact: [email protected]
www.vishay.com
231
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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