PAP7501V PAP7501V USB2.0 PC Camera Controller General Description The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0 standard.Internal controller can be power-up loaded from external EEPROM. This allows customization of VID, PID, product string, sensor parameters…etc. Features .USB Features z z z Key Specification USB 2.0 and 1.1 compliance(high speed and full speed transceiver). USB video class 1.1 compliance. USB audio class 1.0 compliance. .Micro Controller Features Supply Voltage 5.0V ± 10% Resolution Up to 640 (H) x 480 (V) Frame Rate Up to 30fps System Clock 12MHz z Built-in 8 bit micro controller with 40K-byte of mask Power consumption ROM and 24K-byte SRAM. z Firmware supports AE, AWB, and USB protocol. z Programmable codes uploaded from serial EEPROM/Flash. <100mA .Sensor Controller Features. z Support up to VGA CMOS image sensors. z Support 8 bit raw image data or YUV2 input from CMOS sensor. z On chip color processor engine. z Built-in MJPEG encoder. z Support 2 wires serial interface for sensor control. . Audio Controller Features z Audio interface: -Built in 10 bit mono audio ADC for audio recording through microphone. z -Sampling rate @16/48kHZ, resolution 16 bits format. z Recording, mute and volume control. . Miscellaneous Features z Power consumption: < 100mA z USB 5V power in, on-chip 3.3V regulator for IO PAD and PHY, on-chip 1.8V regulator for core logic. Ordering Information Order number Package Type Package Size(mm) PAP7501V 48-pin QFN 5.53 x 5.53 All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 1 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 1. Pin Assignment Pin# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Name GND33A_PLL_I VDD5MA VDD28A_MIC VCOM MIC_P MIC_N VDD33A_PGA VSSA VDD33A_ADC VSSQ RSTN SEN_CSB KEY GPIO4 VDD18K VDD33Q SEN_CLK SEN_SCL SEN_SDA I_VSYNC I_HSYNC EPR_CSB EPR_SO EPR_SI EPR_SCK I_PXD7 I_PXD6 I_PXD5 I_PXD4 I_PXD3 I_PXD2 I_PXD1 I_PXD0 I_PXCLK VDD5MD VDDAYS VDD5MV VSSQ VDD33A_HSRT_O VDD18K OSC_IN OSC_OUT VDD33A_HSRT_I GND33A_HSRT_I RRET DM DP VDD33A_PLL_I Type GND PWR BYPASS BYPASS IN IN BYPASS GND BYPASS GND IN OUT IN I/O BYPASS BYPASS OUT OUT I/O IN IN IN IN OUT OUT IN IN IN IN IN IN IN IN IN PWR BYPASS PWR GND BYPASS BYPASS IN OUT BYPASS GND IN I/O I/O BYPASS Description Ground for PLL 5V Power for analog circuit Analog power for Audio MIC, 2.8V Microphone common mode voltage reference Microphone positive input Microphone negative input Analog power for Audio PGA, 3.3V Microphone GND Analog power for Audio ADC, 3.3V Digital ground Chip power up reset (Internal pull-up 100Kohm) Chip select of EEPROM Snapshot control signal (Active Low, internal pull-up 100Kohm) General purpose I/O Logic power for digit circuit, 1.8V Logic power for digit circuit, 3.3V Clock output for sensor I2C clock I2C data Vertical synchronization signal Horizontal synchronization signal Chip Select of EEPROM Data out of EEPROM Data input of EEPROM Serial clock of EEPROM Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor pixel clock input 5V power for digit circuit Logic power for digit circuit, 2.5V 5V power for PHY circuit Digital ground Analog power for TX/RX Logic power for digit circuit, 1.8V Crystal input Crystal output Analog power for TX/RX Ground for USB TX/RX Reference supply current for PHY DM for USB PHY DP for USB PHY Analog power for PLL All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 2 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 2.Block Diagram Sensor MIC Image prcessing Audio PGA/ADC 8051 EEPROM Boot Loader FUSB200 USB2.0 PHY DMA INT PLL Key Crystal The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0 standard. It integrates micro-controller, color processor engine, MJPEG encoder, and 24K-byte programmable SRAM. All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 3 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 3. Specifications Absolute Maximum Ratings Exceeding the Absolute Maximum Ratings shown below invalidates all AC and DC electrical specifications and may result in permanent device damage. Symbol Parameter Min Max Unit TSTG Ambient storage temperature -25 125 °C VDD DC supply voltage -0.5 5.5 V VIN DC input voltage 0.5 3.8 V VOUT DC output voltage -0.5 3.8 V ESD ESD Rating, Human Body model 2 kV Notes Recommend Operating Condition Symbol Min Typ. Max Unit Temperature Operation Range Stable Image -10 - 70 °C 0 - 50 °C VDD Power supply voltage 4.5 5.0 5.5 V FCLK System clock frequency - 12.0 - MHz TA Parameter Notes DC Electrical Characteristics (Typical values at 25°C, VDD =5.0V, FCLK=12.0MHz) Symbol Parameter Min. Typ. Max. Unit - 70 - mA Notes Type: PWR IDD IPWDN Operating Current Power Down current @30 frame/sec 500u Type: IN & I/O, Reset VIH Input voltage HIGH VIL Input voltage LOW 1.9 - V - 1.3 V - - V Type: OUT & I/O VOH Output voltage HIGH VOL Output voltage LOW 0.9 x VDD33Q - - 0.1 x VDD33Q V All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 4 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4. Packing Information 4.1 Product Ordering Information Product Number : PAP7501 V QFN 6*6 48L with lead-free process Part Number 4.2 Material List Items Process Material 1 Leadframe Material Copper 2 Die Attach Conductive Epoxy 3 Wire Bonding 4N Φ1.0 mil Gold Wire 4 Cover Epoxy Molding Compound 5 Marking Laser or Ink 6 Lead Finish Pd/Ni/Au plating 4.3 Package Outline Dimension Saw Type(A type): All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 5 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera Punch Type(U type): 4.4 Pin Assignment All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 6 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4.5 Recommended Layout PCB All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 7 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4.6 Packing Information Anti-static PP band Tray (11 pcs) Static Shielding Bag PART NO. : LOT NO. : QTY : QA : ELECTROSTATIC SENSITIVE DEVICES CAUTION LABEL Label PACKING BOX One packing box capacity One packing box Remark 4900 units ( 490 units x 10 Trays) Tray durable temperature = 150℃ Note: 1. When the units is out of dry packing, should be operation at : Temperature = ↓30℃ , Humidity = ↓60% RH 2. If units is out of dry packing over 168 hrs, before go through infrared reflow process must be bake with 125℃ ±5℃ @24hrs, to remove the moisture. All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 8 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4.7 Recommended Condition For Infrared Reflow Carefully observe the mounting conditions, recommended temperature profile when Mounting infrared reflows is show in the figure below. Recommend Reflow Profile Melting area 250 Temp. 200 150 Pre-heat 100 50 0 0 20 40 60 80 100 120 Time 140 160 180 200 220 ( Sec ) Recommend Pb-free solder paste vender & type : 1. Almit LFM-48W TM-HP 2. Senju M705-GRN360-K Programming rate 1.5~2.5 oC/sec Pre-heat 170~200oC 90 +/- 30 sec Melting area >220oC 30~50sec with peak temperature 230~245oC All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 9 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4.8 Handling precaution for the prevention of ESD Explained below are procedures that must be taken in fabrication to prevent the electrostatic destruction of semiconductor devices. The following basic rules must be obeyed. 1. Equalize potentials of terminals when transporting or storing. 2. Equalize the potentials of the electric device, work table, and operator's body that may come in contact with the IC's. 3. Prepare an environment that does not generate static electricity. One method is keeping relative humidity in the work room to about 50%. Operator 1. The operator should wear wrist straps. (Must maintain electric contact with bare skin) 2. Wear cotton or antistatic-treated materials clothes and gloves. 3. When a conductive mat will be used, must be ware conductive shoes. 4. Do not touch the IC's leads. Touch the body of IC's when holding. Equipment and tools 1. Any electrical equipments and tools located on the work table surface must be isolated from The work table surface, and ground the equipments and tools that are to be used. 2. Work table surface must be use conductive material or conductive mat. (Should be ground through a 1MΩ resistor) Transporting, storing and packing 1. Use conductive IC's tray, and conductive or shielding bag to store IC's. Soldering operation 1. Use a soldering iron with a grounding wire. 2. When perform manual soldering operation, the operator should wear wrist straps. 3. Do not use the desoldering pump when removing the IC's from the PCB board. Use a solder-wick or equivalent. All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 10 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera I_VSYNC VDDAY VDDAY VDDD C5 D2 D4 PAS6311LT PX9 SDA PX8 SCL PX0 PX1 A3 B3 B2 B1 C1 C2 I_PXD4 I_PXD3 I_PXD2 I_PXD1 I_PXD0 VDDA VSYNC I_PXCLK I_HSYNC E3 VDDQ D3 VDDQ PXCLK VSSA I_PXD5 VDDQ HSYNC VSSD PX7 A1 C4 0.1u B5 VDDA 1u VDD33A_PLL_I VDD33A_HSRT_O VDD33A_HSRT_I C4 E5 SEN_SDA E4 SEN_SCL VDDAY S C7 A2 C8 CON1 R2 4.7nF/250V VDD18K 0.1u 8 9 HC3 HC4 USB_SHADING C12 C31 1u 7 6 HC2 HC1 C10 C11 10pF USB_SHADING 10pF R3 1M Y 1 12MHz Note: xx_N_M=> No Mount VDD18K VDD33A_HSRT_O VSSQ VDD5MV 38 37 OSC_IN 41 39 OSC_OUT 40 GND33A_HSRT_O VDD33A_HSRT_I 12k 42 R4 43 D+ D- USB_5V 20pF_N.M. 46 SEN_CLK VDD28A_MIC VDD33A_PLL_I + 22u D+ D- + 22u C15 47 C14 48 20pF_N.M. 44 5 4 3 2 1 I_PXCLK C13 4.7u C9 MINI USB 5P 10M VDD33Q VDDAY S VDD33A_HSRT_O C5 1u R1 100k VDDA SEN_CSB VDD33A_HSRT_I C2 + B4 C3 0.1u D5 1u 0.1u GND2 NC + +5V A4 I_PXD6 U1 C1 C30 PX2 I_PXD7 VDD33A_PLL_I VDDAY RESET RESET PX3 D1 VDDQ VDDA CSB PX4 E1 PX5 RESET SY SCLK PX6 SEN_CLKE2 A5 5. Reference Application Circuit 5.1 PAP7501 with PAS6311 CS VCC SO HOLD WP SCK GND SI VDD33Q EPR_HOLD EPR_SCK EPR_SI 8 7 6 5 C25 25F512A 20pF_N.M. R17 VSSQ XSCI VDD18K XSCO 45 RREF VDD5MV 36 VDDAY S 35 VDD5MD 34 I_PXCLK 33 I_PXD0 32 I_PXD1 31 I_PXD2 30 I_PXD3 29 I_PXD4 28 I_PXD5 27 I_PXD6 26 I_PXD7 25 EPR_SCK EPR_SI 1 2 3 4 24 EPR_CSB 100k EPR_SO WP GND KEY R13 EPR_SCK SEN_CSB VDD33Q U3 VDD33Q I_PXD7 RSTN EPR_SI 12 EPR_SO SEN_CSB 23 300k 11 EPR_SO R12 RSTN EPR_CSB VDD33Q 1uF I_HSYNC 100k C24 I_PXD6 I_VSYNC EPR_HOLD R11 VDD33Q I_PXD5 VSSQ 22 100k VDD33A_ADC 17 R10 10 SEN_CLK WP VSSQ 21 2.2k I_PXD4 20 9 I_PXD3 VSSA EPR_CSB VDD33A_ADC VDD33A_PGA I_HSYNC 8 I_VSYNC VSSA R9 I_PXD2 PAP7501_48P 16 - C33 0.47uF_N.M. 0.47uF_N.M. MICROPHONE MIC_N SEN_SDA 7 SEN_SCL 6 VDD33A_PGA I_PXD1 SEN_CLK MIC_N + C32 MIC_P VDD33Q 2.2u I_PXD0 15 C23 VCOM 19 5 18 4 MIC_P I_PXCLK SEN_SCL VCOM VDD5MD VDD28A_MIC 14 2.2u VDDAY S VDD5MA 13 C22 GND33A_PLL_I SEN_SDA 3 10k 10k X1 VDD33A_ADC 1u 2 VDD28A_MIC KEY 2.2k C21 VDD5MA R7 R8 VDD18K R6 GPIO_4 + VCOM VDD33A_PGA 1u VDD33A_HSRT_O 5.1k 22u 1 C20 VDD33A_HSRT_I R5 C19 VDD33Q 0.01u VDD18K + C18 GND33A_HSRT_I VDD28A_MIC VCOM DM U2 VDD33A_PLL_I 0.1u 10u GPIO_4 C16 C17 DP VSSV 1 1K D1_Green SEN_CSB LED-0603 L1 1 3.3u 2 VDD5MD L2 1 3.3u 2 VDD5MA L4 1 3.3u 2 2 USB_5V VDD5MV U4 KEY C6 1u R14 R15 10k 10k L3 3.3uH C28 VDD5MD C27 VDD5MA VSSA C35 0.1u GPIO_4 C34 VDD33Q VDD33Q VDD5MV 1uF_N.M. 10u VDD33Q 1uF_N.M. + 1uF_N.M. C26 C29 1u R16 100k All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 11 V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 6. Update History Version V1.0 V1.1 Update Creation, Preliminary 1st version Update circuit and Package information, Add C30~C35, R17, D1, Change R5 to 5.1k ohm, R6 and R9 Change to 2.2k ohm All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] Date 01/17/2008 05/06/2008 12 V1.1 May. 2008