STK15C88
256 Kbit (32K x 8) PowerStore nvSRAM
Features
Functional Description
■
25 ns and 45 ns access times
■
Pin compatible with industry standard SRAMs
■
Automatic nonvolatile STORE on power loss
■
Nonvolatile STORE under Software control
■
Automatic RECALL to SRAM on power up
■
Unlimited Read/Write endurance
■
Unlimited RECALL cycles
■
1,000,000 STORE cycles
The Cypress STK15C88 is a 256Kb fast static RAM with a
nonvolatile element in each memory cell. The embedded
nonvolatile elements incorporate QuantumTrap™ technology
producing the world’s most reliable nonvolatile memory. The
SRAM provides unlimited read and write cycles, while
independent, nonvolatile data resides in the highly reliable
QuantumTrap cell. Data transfers from the SRAM to the
nonvolatile elements (the STORE operation) takes place
automatically at power down. On power up, data is restored to
the SRAM (the RECALL operation) from the nonvolatile
memory. Both the STORE and RECALL operations are also
available under software control.
■
100 year data retention
■
Single 5V+10% power supply
■
Commercial and Industrial Temperatures
■
28-pin (300 mil and 330 mil) SOIC packages
■
RoHS compliance
PowerStore nvSRAM products depend on the intrinsic system
capacitance to maintain system power long enough for an
automatic store on power loss. If the power ramp from 5 volts
to 3.6 volts is faster than 10 ms, consider our 14C88 or 16C88
for more reliable operation.
Logic Block Diagram
Cypress Semiconductor Corporation
Document Number: 001-50593 Rev. **
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 29, 2009
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STK15C88
Pin Configurations
Figure 1. Pin Diagram - 28-Pin SOIC
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Table 1. Pin Definitions - 28-Pin SOIC
Pin Name
Alt
IO Type
A0–A14
Input
DQ0-DQ7
Input or
Output
Description
Address Inputs. Used to select one of the 32,768 bytes of the nvSRAM.
Bidirectional Data IO lines. Used as input or output lines depending on operation.
WE
W
Input
Write Enable Input, Active LOW. When the chip is enabled and WE is LOW, data on the
IO pins is written to the specific address location.
CE
E
Input
Chip Enable Input, Active LOW. When LOW, selects the chip. When HIGH, deselects the
chip.
OE
G
Input
Output Enable, Active LOW. The active LOW OE input enables the data output buffers
during read cycles. Deasserting OE HIGH causes the IO pins to tri-state.
VSS
VCC
Ground
Ground for the Device. The device is connected to ground of the system.
Power Supply Power Supply Inputs to the Device.
Document Number: 001-50593 Rev. **
Page 2 of 15
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STK15C88
Device Operation
Software STORE
The STK15C88 is a versatile memory chip that provides several
modes of operation. The STK15C88 can operate as a standard
32K x 8 SRAM. It has a 32K x 8 nonvolatile element shadow to
which the SRAM information can be copied, or from which the
SRAM can be updated in nonvolatile mode.
Data is transferred from the SRAM to the nonvolatile memory by
a software address sequence. The STK15C88 software STORE
cycle is initiated by executing sequential CE controlled READ
cycles from six specific address locations in exact order. During
the STORE cycle, an erase of the previous nonvolatile data is
first performed, followed by a program of the nonvolatile
elements. When a STORE cycle is initiated, input and output are
disabled until the cycle is completed.
SRAM Read
The STK15C88 performs a READ cycle whenever CE and OE
are LOW while WE is HIGH. The address specified on pins A0–14
determines the 32,768 data bytes accessed. When the READ is
initiated by an address transition, the outputs are valid after a
delay of tAA (READ cycle 1). If the READ is initiated by CE or OE,
the outputs are valid at tACE or at tDOE, whichever is later (READ
cycle 2). The data outputs repeatedly respond to address
changes within the tAA access time without the need for transitions on any control input pins, and remains valid until another
address change or until CE or OE is brought HIGH.
SRAM Write
A WRITE cycle is performed whenever CE and WE are LOW.
The address inputs must be stable prior to entering the WRITE
cycle and must remain stable until either CE or WE goes HIGH
at the end of the cycle. The data on the common IO pins DQ0–7
are written into the memory if it has valid tSD, before the end of
a WE controlled WRITE or before the end of an CE controlled
WRITE. Keep OE HIGH during the entire WRITE cycle to avoid
data bus contention on common IO lines. If OE is left LOW,
internal circuitry turns off the output buffers tHZWE after WE goes
LOW.
Because a sequence of READs from specific addresses is used
for STORE initiation, it is important that no other READ or WRITE
accesses intervene in the sequence. If they intervene, the
sequence is aborted and no STORE or RECALL takes place.
To initiate the software STORE cycle, the following READ
sequence is performed:
1. Read address 0x0E38, Valid READ
2. Read address 0x31C7, Valid READ
3. Read address 0x03E0, Valid READ
4. Read address 0x3C1F, Valid READ
5. Read address 0x303F, Valid READ
6. Read address 0x0FC0, Initiate STORE cycle
The software sequence is clocked with CE controlled READs.
When the sixth address in the sequence is entered, the STORE
cycle commences and the chip is disabled. It is important that
READ cycles and not WRITE cycles are used in the sequence.
It is not necessary that OE is LOW for a valid sequence. After the
tSTORE cycle time is fulfilled, the SRAM is again activated for
READ and WRITE operation.
AutoStore Operation
Software RECALL
The STK15C88 uses the intrinsic system capacitance to perform
an automatic STORE on power down. As long as the system
power supply takes at least tSTORE to decay from VSWITCH down
to 3.6V, the STK15C88 will safely and automatically store the
SRAM data in nonvolatile elements on power down.
Data is transferred from the nonvolatile memory to the SRAM by
a software address sequence. A software RECALL cycle is
initiated with a sequence of READ operations in a manner similar
to the software STORE initiation. To initiate the RECALL cycle,
the following sequence of CE controlled READ operations is
performed:
1. Read address 0x0E38, Valid READ
2. Read address 0x31C7, Valid READ
3. Read address 0x03E0, Valid READ
4. Read address 0x3C1F, Valid READ
5. Read address 0x303F, Valid READ
6. Read address 0x0C63, Initiate RECALL cycle
In order to prevent unneeded STORE operations, automatic
STOREs will be ignored unless at least one WRITE operation
has taken place since the most recent STORE or RECALL cycle.
Software initiated STORE cycles are performed regardless of
whether a WRITE operation has taken place.
Hardware RECALL (Power Up)
During power up or after any low power condition (VCC <
VRESET), an internal RECALL request is latched. When VCC
once again exceeds the sense voltage of VSWITCH, a RECALL
cycle is automatically initiated and takes tHRECALL to complete.
If the STK15C88 is in a WRITE state at the end of power up
RECALL, the SRAM data is corrupted. To help avoid this
situation, a 10 Kohm resistor is connected either between WE
and system VCC or between CE and system VCC.
Document Number: 001-50593 Rev. **
Internally, RECALL is a two step procedure. First, the SRAM data
is cleared, and then the nonvolatile information is transferred into
the SRAM cells. After the tRECALL cycle time, the SRAM is once
again ready for READ and WRITE operations. The RECALL
operation does not alter the data in the nonvolatile elements. The
nonvolatile data can be recalled an unlimited number of times.
Page 3 of 15
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STK15C88
Hardware Protect
Figure 3. Current Versus Cycle Time (READ)
The STK15C88 offers hardware protection against inadvertent
STORE operation and SRAM WRITEs during low voltage
conditions. When VCAP<VSWITCH, all externally initiated
STORE operations and SRAM WRITEs are inhibited.
Noise Considerations
The STK15C88 is a high speed memory. It must have a high
frequency bypass capacitor of approximately 0.1 µF
connected between VCC and VSS, using leads and traces that
are as short as possible. As with all high speed CMOS ICs,
careful routing of power, ground, and signals reduce circuit
noise.
Low Average Active Power
CMOS technology provides the STK15C88 the benefit of
drawing significantly less current when it is cycled at times
longer than 50 ns. Figure 2 and Figure 3 show the relationship
between ICC and READ or WRITE cycle time. Worst case
current consumption is shown for both CMOS and TTL input
levels (commercial temperature range, VCC = 5.5V, 100%
duty cycle on chip enable). Only standby current is drawn
when the chip is disabled. The overall average current drawn
by the STK15C88 depends on the following items:
1. The duty cycle of chip enable
2. The overall cycle rate for accesses
3. The ratio of READs to WRITEs
4. CMOS versus TTL input levels
5. The operating temperature
6. The VCC level
7. IO loading
Best Practices
nvSRAM products have been used effectively for over 15
years. While ease-of-use is one of the product’s main system
values, experience gained working with hundreds of applications has resulted in the following suggestions as best
practices:
■
The nonvolatile cells in an nvSRAM are programmed on the
test floor during final test and quality assurance. Incoming
inspection routines at customer or contract manufacturer’s
sites, sometimes, reprogram these values. Final NV patterns
are typically repeating patterns of AA, 55, 00, FF, A5, or 5A.
End product’s firmware should not assume a NV array is in
a set programmed state. Routines that check memory
content values to determine first time system configuration
and cold or warm boot status should always program a
unique NV pattern (for example, complex 4-byte pattern of
46 E6 49 53 hex or more random bytes) as part of the final
system manufacturing test to ensure these system routines
work consistently.
■
Power up boot firmware routines should rewrite the nvSRAM
into the desired state. While the nvSRAM is shipped in a
preset state, best practice is to again rewrite the nvSRAM
into the desired state as a safeguard against events that
might flip the bit inadvertently (program bugs and incoming
inspection routines).
Figure 2. Current Versus Cycle Time (WRITE)
Document Number: 001-50593 Rev. **
Page 4 of 15
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STK15C88
Table 2. Software STORE/RECALL Mode Selection
CE
L
WE
H
L
H
A13 – A0
0x0E38
0x31C7
0x03E0
0x3C1F
0x303F
0x0FC0
0x0E38
0x31C7
0x03E0
0x3C1F
0x303F
0x0C63
Mode
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile STORE
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile RECALL
IO
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Notes
[1, 2]
[1, 2]
Notes
1. The six consecutive addresses must be in the order listed. WE must be high during all six consecutive CE controlled cycles to enable a nonvolatile cycle.
2. While there are 15 addresses on the STK15C88, only the lower 14 are used to control software modes.
Document Number: 001-50593 Rev. **
Page 5 of 15
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STK15C88
Maximum Ratings
Voltage on DQ0-7 ...................................–0.5V to Vcc + 0.5V
Exceeding maximum ratings may shorten the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................. –65°C to +150°C
Temperature under bias .............................. –55°C to +125°C
Power Dissipation ......................................................... 1.0W
DC output Current (1 output at a time, 1s duration) .... 15 mA
Operating Range
Range
Supply Voltage on VCC Relative to GND.......... –0.5V to 7.0V
Commercial
Voltage on Input Relative to Vss ............–0.6V to VCC + 0.5V
Industrial
Ambient Temperature
VCC
0°C to +70°C
4.5V to 5.5V
-40°C to +85°C
4.5V to 5.5V
DC Electrical Characteristics
Over the operating range (VCC = 4.5V to 5.5V)
Parameter
ICC1
Description
Test Conditions
Min
Average VCC Current tRC = 25 ns
Commercial
tRC = 45 ns
Dependent on output loading and cycle rate. Values
Industrial
obtained without output loads.
IOUT = 0 mA.
Max
Unit
97
70
mA
mA
100
70
mA
mA
ICC2
Average VCC Current All Inputs Do Not Care, VCC = Max
during STORE
Average current for duration tSTORE
3
mA
ICC3
Average VCC Current WE > (VCC – 0.2V). All other inputs cycling.
at tRC= 200 ns, 5V, Dependent on output loading and cycle rate. Values obtained
without output loads.
25°C Typical
10
mA
ICC4
Average Current
during AutoStore
Cycle
2
mA
ISB1[3]
Average VCC Current tRC=25ns, CE > VIH
tRC=45ns, CE > VIH
(Standby, Cycling
TTL Input Levels)
Commercial
30
22
mA
Industrial
31
23
mA
1.5
mA
All Inputs Do Not Care, VCC = Max
Average current for duration tSTORE
ISB2[3]
VCC Standby Current CE > (VCC – 0.2V). All others VIN < 0.2V or > (VCC – 0.2V).
(Standby, Stable
CMOS Input Levels)
IIX
Input Leakage
Current
VCC = Max, VSS < VIN < VCC
-1
+1
μA
IOZ
Off State Output
Leakage Current
VCC = Max, VSS < VIN < VCC, CE or OE > VIH or WE < VIL
-5
+5
μA
VIH
Input HIGH Voltage
2.2
VCC +
0.5
V
VIL
Input LOW Voltage
VSS –
0.5
0.8
V
VOH
Output HIGH Voltage IOUT = –4 mA
VOL
Output LOW Voltage IOUT = 8 mA
2.4
V
0.4
V
Note
3. CE > VIH will not produce standby current levels until any nonvolatile cycle in progress has timed out.
Document Number: 001-50593 Rev. **
Page 6 of 15
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STK15C88
Data Retention and Endurance
Parameter
Description
DATAR
Data Retention
NVC
Nonvolatile STORE Operations
Min
Unit
100
Years
1,000
K
Capacitance
In the following table, the capacitance parameters are listed.[4]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 0 to 3.0 V
Max
Unit
5
pF
7
pF
Thermal Resistance
In the following table, the thermal resistance parameters are listed.[4]
Parameter
ΘJA
ΘJC
Test Conditions
28-SOIC
(300 mil)
28-SOIC
(330 mil)
Unit
Test conditions follow standard test methods and
procedures for measuring thermal impedance,
per EIA / JESD51.
TBD
TBD
°C/W
TBD
TBD
°C/W
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Figure 4. AC Test Loads
R1 480Ω
5.0V
Output
30 pF
R2
255Ω
AC Test Conditions
Input Pulse Levels .................................................. 0 V to 3 V
Input Rise and Fall Times (10% - 90%)........................ <5 ns
Input and Output Timing Reference Levels ................... 1.5 V
Note
4. These parameters are guaranteed by design and are not tested.
Document Number: 001-50593 Rev. **
Page 7 of 15
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STK15C88
AC Switching Characteristics
SRAM Read Cycle
Parameter
Cypress
Alt
Parameter
tACE
tELQV
[5]
tAVAV, tELEH
tRC
tAA [6]
tAVQV
tDOE
tGLQV
tAXQX
tOHA [6]
tLZCE [7]
tELQX
tHZCE [7]
tEHQZ
[7]
tGLQX
tLZOE
tHZOE [7]
tGHQZ
tPU [4]
tELICCH
tEHICCL
tPD [4]
25 ns
Description
Chip Enable Access Time
Read Cycle Time
Address Access Time
Output Enable to Data Valid
Output Hold After Address Change
Chip Enable to Output Active
Chip Disable to Output Inactive
Output Enable to Output Active
Output Disable to Output Inactive
Chip Enable to Power Active
Chip Disable to Power Standby
Min
45 ns
Max
Min
25
Max
45
25
45
25
10
45
20
5
5
5
5
10
15
0
0
10
15
0
0
25
45
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Switching Waveforms
Figure 5. SRAM Read Cycle 1: Address Controlled [5, 7]
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Figure 6. SRAM Read Cycle 2: CE and OE Controlled [5]
W5&
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W3'
W/=&(
&(
W+=&(
2(
W+=2(
W'2(
W/=2(
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67$1'%<
Notes
5. WE must be HIGH during SRAM Read Cycles and LOW during SRAM WRITE cycles.
6. I/O state assumes CE and OE < VIL and WE > VIH; device is continuously selected.
7. Measured ±200 mV from steady state output voltage.
Document Number: 001-50593 Rev. **
Page 8 of 15
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STK15C88
Table 3. SRAM Write Cycle
Parameter
Cypress
Alt
Parameter
tWC
tAVAV
tWLWH, tWLEH
tPWE
tELWH, tELEH
tSCE
tSD
tDVWH, tDVEH
tWHDX, tEHDX
tHD
tAVWH, tAVEH
tAW
tSA
tAVWL, tAVEL
tWHAX, tEHAX
tHA
[7,8]
tWLQZ
tHZWE
tLZWE [7]
tWHQX
25 ns
Description
Min
Write Cycle Time
Write Pulse Width
Chip Enable To End of Write
Data Setup to End of Write
Data Hold After End of Write
Address Setup to End of Write
Address Setup to Start of Write
Address Hold After End of Write
Write Enable to Output Disable
Output Active After End of Write
45 ns
Max
25
20
20
10
0
20
0
0
Min
Max
45
30
30
15
0
30
0
0
10
5
15
5
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Switching Waveforms
Figure 7. SRAM Write Cycle 1: WE Controlled [8]
tWC
ADDRESS
tHA
tSCE
CE
tAW
tSA
tPWE
WE
tSD
tHD
DATA VALID
DATA IN
tHZWE
DATA OUT
tLZWE
HIGH IMPEDANCE
PREVIOUS DATA
Figure 8. SRAM Write Cycle 2: CE Controlled [8]
tWC
ADDRESS
CE
WE
tHA
tSCE
tSA
tAW
tPWE
tSD
DATA IN
DATA OUT
tHD
DATA VALID
HIGH IMPEDANCE
Notes
8. If WE is Low when CE goes Low, the outputs remain in the high impedance state.
9. CE or WE must be greater than VIH during address transitions.
Document Number: 001-50593 Rev. **
Page 9 of 15
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STK15C88
AutoStore or Power Up RECALL
Parameter
tHRECALL [10]
tSTORE [6]
VRESET
VSWITCH
Alt
tRESTORE
tHLHZ
Description
Power up RECALL Duration
STORE Cycle Duration
Low Voltage Reset Level
Low Voltage Trigger Level
STK15C88
Min
Max
550
10
3.6
4.0
4.5
Unit
μs
ms
V
V
Switching Waveforms
Figure 9. AutoStore/Power Up RECALL
9&&
9
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95(6(7
$XWR6WRUH
W6725(
32:(583 5(&$//
W+5(&$//
:(
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%52:1287
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%52:1287
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12 5(&$//
9&&','127*2
%(/2:95(6(7
12 5(&$//
9&&','127*2
%(/2:95(6(7
5(&$//:+(1
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Notes
10. tHRECALL starts from the time VCC rises above VSWITCH.
Document Number: 001-50593 Rev. **
Page 10 of 15
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STK15C88
Software Controlled STORE/RECALL Cycle
The software controlled STORE/RECALL cycle follows. [11, 12]
Parameter
tRC
tSA
[11]
tCW[11]
tHACE[7, 11]
Alt
25 ns
Description
Min
45 ns
Max
Min
Max
Unit
tAVAV
STORE/RECALL Initiation Cycle Time
25
45
ns
tAVEL
Address Setup Time
0
0
ns
tELEH
Clock Pulse Width
20
30
ns
tELAX
Address Hold Time
20
20
ns
RECALL Duration
tRECALL
20
20
μs
Switching Waveforms
Figure 10. CE Controlled Software STORE/RECALL Cycle [12]
tRC
ADDRESS # 1
ADDRESS
tSA
tRC
ADDRESS # 6
tSCE
CE
tHACE
OE
t STORE / t RECALL
DQ (DATA)
DATA VALID
DATA VALID
HIGH IMPEDANCE
Notes
11. The software sequence is clocked on the falling edge of CE without involving OE (double clocking will abort the sequence).
12. The six consecutive addresses must be read in the order listed in the Mode Selection table. WE must be HIGH during all six consecutive cycles.
Document Number: 001-50593 Rev. **
Page 11 of 15
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STK15C88
Part Numbering Nomenclature
STK15C88 - N F 45 I TR
Packaging Option:
TR = Tape and Reel
Blank = Tube
Temperature Range:
Blank - Commercial (0 to 70°C)
I - Industrial (-40 to 85°C)
Speed:
25 - 25 ns
45 - 45 ns
Lead Finish
F = 100% Sn (Matte Tin)
Package:
N = Plastic 28-pin 300 mil SOIC
S = Plastic 28-pin 330 mil SOIC
Ordering Information
Speed
(ns)
25
45
Ordering Code
Package Diagram
Operating
Range
Package Type
STK15C88-NF25TR
51-85026
28-Pin SOIC (300 mil)
STK15C88-NF25
51-85026
28-Pin SOIC (300 mil)
STK15C88-SF25TR
51-85058
28-Pin SOIC (330 mil)
STK15C88-SF25
51-85058
28-Pin SOIC (330 mil)
STK15C88-NF25ITR
51-85026
28-Pin SOIC (300 mil)
STK15C88-NF25I
51-85026
28-Pin SOIC (300 mil)
STK15C88-SF25ITR
51-85058
28-Pin SOIC (330 mil)
STK15C88-SF25I
51-85058
28-Pin SOIC (330 mil)
STK15C88-NF45TR
51-85026
28-Pin SOIC (300 mil)
STK15C88-NF45
51-85026
28-Pin SOIC (300 mil)
STK15C88-SF45TR
51-85058
28-Pin SOIC (330 mil)
STK15C88-SF45
51-85058
28-Pin SOIC (330 mil)
STK15C88-NF45ITR
51-85026
28-Pin SOIC (300 mil)
STK15C88-NF45I
51-85026
28-Pin SOIC (300 mil)
STK15C88-SF45ITR
51-85058
28-Pin SOIC (330 mil)
STK15C88-SF45I
51-85058
28-Pin SOIC (330 mil)
Commercial
Industrial
Commercial
Industrial
All parts are Pb-free. The above table contains Final information. Contact your local Cypress sales representative for availability of these parts
Document Number: 001-50593 Rev. **
Page 12 of 15
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STK15C88
Package Diagrams
Figure 11. 28-Pin (300 mil) SOIC (51-85026)
NOTE :
PIN 1 ID
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
14
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
1
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3. DIMENSIONS IN INCHES
0.291[7.39]
MIN.
MAX.
4. PACKAGE WEIGHT 0.85gms
0.300[7.62]
0.394[10.01]
*
0.419[10.64]
15
28
PART #
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
0.026[0.66]
0.032[0.81]
SEATING PLANE
0.697[17.70]
0.713[18.11]
0.092[2.33]
0.105[2.67]
0.004[0.10]
0.050[1.27]
0.013[0.33]
0.004[0.10]
0.019[0.48]
0.0118[0.30]
*
0.0091[0.23]
0.0125[3.17]
0.015[0.38]
0.050[1.27]
*
TYP.
51-85026-*D
51 85127 *A
Document Number: 001-50593 Rev. **
Page 13 of 15
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STK15C88
Package Diagrams (continued)
Figure 12. 28-Pin (330 mil) SOIC (51-85058)
51-85058-*A
Document Number: 001-50593 Rev. **
Page 14 of 15
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STK15C88
Document History Page
Document Title: STK15C88 256 Kbit (32K x 8) PowerStore nvSRAM
Document Number: 001-50593
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
2625096
GVCH/PYRS
12/19/08
Description of Change
New data sheet
Sales, Solutions and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at cypress.com/sales.
Products
PSoC
Clocks & Buffers
PSoC Solutions
psoc.cypress.com
clocks.cypress.com
General
Low Power/Low Voltage
psoc.cypress.com/solutions
psoc.cypress.com/low-power
Wireless
wireless.cypress.com
Precision Analog
Memories
memory.cypress.com
LCD Drive
psoc.cypress.com/lcd-drive
image.cypress.com
CAN 2.0b
psoc.cypress.com/can
USB
psoc.cypress.com/usb
Image Sensors
psoc.cypress.com/precision-analog
© Cypress Semiconductor Corporation, 2008-2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-50593 Rev. **
Revised January 29, 2009
Page 15 of 15
AutoStore and QuantumTrap are registered trademarks of Cypress Semiconductor Corporation. All products and company names mentioned in this document may be the trademarks of their respective
holders.
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