CYPRESS CYONSLENS2000-C

CYONS2110
OvationONS™ II
Wired/Wireless Laser Navigation System-on-Chip
Features
■
Description
Programmable blocks
❐ Highly integrated mouse-on-a-chip with programmable
PSoC® microcontroller unit (MCU)
❐ 32 KB flash memory
❐ 2 KB static RAM (SRAM)
❐ Internal 24, 12, or 6 MHz main oscillator (IMO)
❐ Internal 32 kHz low-speed oscillator (ILO)
❐ 16-bit data report enables simultaneous high-speed and
high-resolution tracking
®
❐ CapSense sensing of up to 26 capacitive elements
■
Tracking performance
❐ Continuously variable resolution 400 to 3200 counts per inch
(CPI), independent of speed
❐ High speed with high accuracy tracking
❐ Speed up to 75 inches per second (in/s)
❐ Acceleration up to 30 g
■
Peripheral interface
❐ Integrated full-speed USB for wired applications
❐ SPI interface to radio for wireless applications
2
❐ Fast or standard mode I C
■
28 general purpose input/output (GPIO) pins
❐ Port 0 – 8 bits
❐ Port 1 – 8 bits with high current capability, regulated output
voltage, and 5 V input tolerance
❐ Port 2 – 8 bits
❐ Port 3 – 4 bits
■
Power
❐ Internal power system enables operation from 5 V USB,
battery, or external 2.7 V to 3.6 V supply
❐ Battery input voltage of 0.8 V to 3.6 V allows operation from
single or dual series cells
❐ Automatic switch to USB power when plugged into USB port
❐ Automatic switch battery power when removed from USB
❐ Self adjusting power saving modes
■
On-chip laser
❐ Vertical cavity surface emitting laser (VCSEL) integrated
within the sensor package
❐ No calibration or alignment needed
❐ Electrostatic discharge (ESD) immunity: 2000 V
human body mode (HBMl)
❐ Wavelength: 840 - 870 nm
❐ IEC 60825-1 Class 1 safety: built-in eye-safe fault tolerant
laser drive circuitry
■
Snap-on lens
❐ Molded optic: Self-aligning snap on molded lens
❐ 6 mm distance between the PCB and tracking surface
Cypress Semiconductor Corporation
Document Number: 001-44048 Rev. *G
•
The CYONS2110 is a member of Cypress Semiconductor’s
second generation laser navigation System-on-Chip (SoC)
family of products. Powered by the high-speed and
high-precision OptiCheck™ technology, along with the
world-leading PSoC technology, this family integrates the
sensor, USB, boost regulator, CapSense, and MCU functions
into one chip. Bundled with the VCSEL into one package, the
combination forms the market’s first true mouse-on-a-chip
solution.
The CYONS2110 is the version that is designed for
high-performance applications. Enabled by the Cypress
0.13-micron mixed signal process technology, the device
integrates the OptiCheck sensor, full-speed USB, boost power
regulator, and CapSense capability into a single silicon chip that
allows seamless communication between sensor and
MCU/full-speed USB. The sensor provides the best translation
of hand motion into true gaming motion on the PC.
This highly integrated solution is programmable. It provides
mouse suppliers the ease-of-use to design a single PCB system
and customize their product. With the VCSEL integrated in the
same package, designers do not need to calibrate the laser
power during the manufacturing process. This greatly increases
production throughput and reduces manufacturing costs.
The innovative technology of OvationONS™ II provides
high-precision, high-speed motion tracking, and low power
consumption. Designers can select from a family of integration
options, ranging from low-power to high-performance, to target
different types of wired and wireless design applications.
The CYONS2110 solutions have a small form factor. Along with
the lens, each package forms a complete and compact laser
tracking system. This datasheet describes the detailed
technology capabilities of the CYONS2110.
Figure 1. CYONS2110/CYONSLENS2000 (2-Piece System)
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 3, 2011
[+] Feedback
CYONS2110
Contents
OvationONS II Family Performance Table...................... 3
OvationONS II Family Applications ................................ 3
OvationONS II Family Functional Description ............... 3
Pin Description ................................................................. 5
Microcontroller System.................................................... 7
Features ...................................................................... 7
PSoC Functional Overview.............................................. 8
The PSoC Core ........................................................... 8
The CapSense Analog System ................................... 8
The Analog Multiplexer System................................... 8
Additional System Resources ..................................... 9
Getting Started.................................................................. 9
Application Notes ........................................................ 9
Development Kits ........................................................ 9
Training ....................................................................... 9
CYPros Consultants .................................................... 9
Solutions Library.......................................................... 9
Technical Support ....................................................... 9
Development Tools .......................................................... 9
PSoC Designer Software Subsystems........................ 9
Designing with PSoC Designer ..................................... 10
Select User Modules ................................................. 10
Configure User Modules............................................ 10
Organize and Connect .............................................. 10
Generate, Verify, and Debug..................................... 10
Power Supply Connections ........................................... 11
Overview ................................................................... 11
Understanding DVDD................................................ 11
AVDD, VREGA, and VREGD .................................... 11
Using USB Power...................................................... 11
Using Battery Power.................................................. 11
Using External Power................................................ 11
Filtering and Grounding............................................. 11
Wired Mouse Application Example............................... 12
Wireless Mouse Application Example .......................... 13
Electrical Specifications ................................................ 14
Absolute Maximum Ratings....................................... 14
Operating Conditions................................................. 14
.................................................................................. 14
Power Consumption .................................................. 15
Power Specifications ................................................. 16
DC General Purpose I/O Specifications .................... 17
Document Number: 001-44048 Rev. *G
DC Analog Mux Bus Specifications...........................
DC Low Power Comparator Specifications ...............
DC POR and LVD Specifications ..............................
DC Programming Specifications ...............................
DC Characteristics - USB Interface...........................
AC Chip Level Specifications ....................................
AC General Purpose I/O Specifications ....................
AC External Clock Specifications ..............................
AC Analog Mux Bus Specifications ...........................
AC Programming Specifications................................
AC SPI Specifications ...............................................
AC Comparator Specifications ..................................
AC I2C Specifications................................................
AC USB Specifications..............................................
PCB Land Pads and Keepout Zones ........................
Orientation of Axes....................................................
PCB Mounting Height and Thickness........................
Thermal Impedances ................................................
Solder Reflow Peak Temperature .............................
Laser Safety Considerations .........................................
Laser Output Power ..................................................
Laser Output Power Test Procedure.........................
Registration Assistance.............................................
Development Tool Selection .........................................
Software ....................................................................
Mouse Design Kits ....................................................
Development Kits ......................................................
Evaluation Tools........................................................
Device Programmers.................................................
Third Party Tools .......................................................
Package Diagrams..........................................................
Ordering Information......................................................
Ordering Code Definition...........................................
Document Conventions .................................................
Acronyms Used .........................................................
Units of Measure .......................................................
Numeric Naming........................................................
Document History Page .................................................
Worldwide Sales and Design Support.......................
Products ....................................................................
PSoC Solutions .........................................................
18
18
18
19
19
20
20
21
21
21
22
25
25
26
27
28
28
29
29
30
30
30
30
31
31
31
31
31
32
32
33
34
34
35
35
35
35
36
36
36
36
Page 2 of 36
[+] Feedback
CYONS2110
OvationONS II Family Performance Table
Parameter
Variable resolution
CYONS2000
CYONS2001
400, 800, 1600 400, 800, 1600
CYONS2100
CYONS2101
CYONS2110
Unit
400–3200
400–3200
400–3200
CPI
Maximum speed
30
30
75
75
75
in/s
Maximum acceleration
20
20
30
30
30
g
Integrated MCU
Yes
Yes
Yes
Yes
Yes
CapSense
No
No
No
No
26 inputs
Flash
16
16
32
32
32
KB
SRAM
2
2
2
2
2
KB
4-wire SPI
up to 28
GPIOs
Full-speed USB
4-wire SPI
up to 28 GPIOs
0.8 to 3.6
0.8 to 3.6
V
Interfaces
Full-speed USB
4-wire SPI
Full-speed USB
4-wire SPI
up to 28 GPIOs
4-wire SPI
up to 28 GPIOs
up to 28 GPIO
Battery supply voltage
USB supply voltage
External supply voltage
NA
0.8 to 3.6
NA
4.25 to 5.25
NA
4.25 to 5.25
NA
4.25 to 5.25
V
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
V
1
1
1
1
1
Count
Zero motion
OvationONS II Family Applications
■
Wired and wireless laser mice
❐ Gaming, graphic design, desktop, and mobile mice
■
Optical trackballs
■
Battery powered devices
■
Motion sensing applications
OvationONS II Family Functional Description
The OvationONS II family is a two-piece laser navigation SoC kit
containing the integrated IC package and the molded lens.
The 2-kV ESD-rated IC package integrates the VCSEL and laser
sensor SoC. Depending on the product selected, the SoC
includes an MCU, flash, SRAM, two internal oscillators,
CapSense system, battery boost regulator, power regulator, and
full-speed USB.
The molded lens collimates the VCSEL beam and images the
light scattered from the tracking surface on to the sensor portion
of the laser detector. The lens has features for registration to the
package and easily snaps onto the PC board.
At the heart of the system is the OptiCheck laser navigation
engine. It supports all functions required for tracking, including
laser power control, resolution control, and self-adjusting power
reduction, which reduces power consumption when motion
stops. The laser output power is pre-calibrated to meet the eye
safety requirements of IEC 60825 Class 1.
The navigation engine is accessed and controlled by an
integrated PSoC-based MCU. The interface between the two
blocks is through a system bus and a collection of navigation
engine interrupts. Full details are available in the OvationONS II
Laser Navigation System-on-Chip TRM (Technical Reference
Manual) or in the PSoC Designer integrated development
environment (IDE) software.
Document Number: 001-44048 Rev. *G
In addition to controlling the navigation engine, the PSoC MCU
also serves as the main application processor. Based on
Cypress’s M8C architecture, the PSoC supports a rich
instruction set, multiple processor speeds, and flexible GPIOs.
Its internal main oscillator requires no external crystal. On-chip
Flash and RAM allow entire navigation systems to be
implemented with the single SoC.
The OvationONS II family supports a wide range of powering
options. Internal regulators minimize the need for external
circuitry. Depending on the product selected, the device can be
power from a USB 5-V supply, from a single battery, from dual
batteries, or from an external supply. The configuration and use
of the power blocks are controlled with the integrated PSoC.
Wired sensors include integrated full-speed USB. As with the
navigation engine and power system, the USB block is controlled
by the integrated PSoC.
All sensors support a 4-wire SPI interface. A typical use of the
SPI interface is to provide access to a radio for wireless
applications. An I2C interface is also included with all devices.
The CYONS2110 device also supports CapSense functions,
allowing additional features and differentiation in end products.
All features of the OvationONS II family are configured using
Cypress’s PSoC Designer™ software, allowing fast application
development and time to market.
The OvationONS II family block diagram is shown on Figure 2 on
page 4. It shows a true SoC solution that enables design cycle
reductions along with savings on manufacturing, PCB area, and
component inventory management. The packaged solution
delivers a fully integrated system that demonstrates tracking
performance with efficient power consumption.
Page 3 of 36
[+] Feedback
CYONS2110
Figure 2. Block Diagram
Ovation II
Power
System
OptiCheckTM
Navigation
System
Resolution
Control
DSP
Boost Regulator
Battery
Filter
Power Control
POWER BUS
f
VCSEL
Laser
Control
3.3V Regulator
Port 3
Port 2
Port 1
Port 0
1.8V
Analog
Regulator
PSoC
Core
Regulator
PSoC CORE
SYSTEM BUS
Global Analog Interconnect
SRAM
Supervisory ROM (SROM)
Interrupt
Controller
Flash
Nonvolatile Memory
Sleep and
Watchdog
CPU Core (M8C)
32 kHz Internal Low Speed
Oscillator (ILO)
6/12/24 MHz Internal Main Oscillator (IMO)
Multiple Clock Sources
SYSTEM BUS
Full
Speed
USB
Internal
Voltage
References
System
Resets
POR
and
LVD
SPI
Master/
Slave
Three 16-Bit
Programmable
Timers
Digital
Clocks
I2C
Slave
ADC
CapSense
System
SYSTEM RESOURCES
NOTE: Shaded blocks indicate optional functions - Refer to OvationONSTM II Family Performance Table for details
Document Number: 001-44048 Rev. *G
Page 4 of 36
[+] Feedback
CYONS2110
Pin Description
This section describes, lists, and illustrates the CYONS2110 device pins and pinout configurations. The CYONS2110 is available in
a 42-pin quad flat no-leads (QFN) package.
Table 1. CYONS2110 Pin Description
Pin
Name
Digital
Analog
I
Description
1
XRES
Active high external reset with internal pull down
2
BOOST_GND
Power
Power
Boost regulator ground
3
BOOST_IND
Power
Power
Boost regulator inductor
4
VBATT
Power
Power
Boost regulator input
5
DVDD
Power
Power
Digital supply voltage and regulated output (see Power Supply
Connections on page 11)
6
VREGD
Power
Power
Digital VREG
7
AVDD
Power
Power
Analog supply voltage
8
VREGA
Power
Power
9
P2[7]
I/O
I
GPIO port 2 pin 7
10
P1[5]
IOHR
I
SPI MISO, I2C_SDA, GPIO port 1 pin 5
11
P1[3]
IOHR
I
SPI CLK, GPIO port 1 pin 3
12
P2[3]
I/O
I
GPIO port 2 pin 3
13
P2[5]
I/O
I
GPIO port 2 pin 5
14
P1[7]
IOHR
I
SPI SS, I2C_SCL, GPIO port 1 pin 7
15
P1[1]
IOHR
I
SPI MOSI, ISSP CLK[1], I2C_SCL, GPIO port 1 pin 1
16
P3[3]
IOHR
I
HCLK (OCD high speed clock output), GPIO port 3 pin 3
17
P1[0]
I/O
I
ISSP DATA[1], I2C_SDA, GPIO port 1 pin 0
18
P3[5]
I/O
I
CCLK (OCD CPU clock output), GPIO port 3 pin 5
19
P1[6]
IOHR
I
GPIO port 1 pin 6
20
P1[2]
IOHR
I
GPIO port 1 pin 2
21
P2[2]
I/O
I
GPIO port 2 pin 2
22
P3[7]
I/O
I
OCDOE (OCD mode direction pin), GPIO port 3 pin 7
23
P3[1]
I/O
I
OCDO (OCD odd data output), GPIO port 3 pin 1
Analog VREG
24
OCDE
OCD
OCD
25
AVSS
Power
Power
26
P2[1]
I/O
I
GPIO port 2 pin 1
27
P2[0]
I/O
I
GPIO port 2 pin 0
28
P1[4]
IOHR
I
EXT CLK, GPIO port 1 pin 4
29
P2[4]
I/O
I
GPIO port 2 pin 4
30
DVSS
Power
Power
31
P2[6]
I/O
I
GPIO port 2 pin 6
32
P0[0]
I/O
I
GPIO port 0 pin 0
33
P0[2]
I/O
I
GPIO port 0 pin 2
34
P0[4]
I/O
I
GPIO port 0 pin 4
35
P0[6]
I/O
I
GPIO port 0 pin 6
36
P0[1]
I/O
I
GPIO port 0 pin 1
Document Number: 001-44048 Rev. *G
OCDE (OCD even data output)
Analog ground
Digital ground
Page 5 of 36
[+] Feedback
CYONS2110
Table 1. CYONS2110 Pin Description (continued)
Digital
Analog
37
Pin
P0[3]
Name
I/O
I
GPIO port 0 pin 3
Description
38
P0[5]
I/O
I
GPIO port 0 pin 5
39
P0[7]
I/O
I
GPIO port 0 pin 7
40
D-
I/O
USB data
41
D+
I/O
USB data
42
VDD5V
Power
Power
5V power
CP
DVSS
Power
Power
Center pad (CP) must be connected to digital ground
Legend: I=Input; O=Output; H=5 mA High Output Drive, R=Regulated Output, OCD=On-Chip Debug
1
2
3
4
5
6
7
8
9
VDD5V
D+
DAI, P0[7]
AI, P0[5]
AI, P0[3]
AI, P0[1]
AI, P0[6]
38
37
36
35
34
CYONS2110
QFN
(Top View)
33
32
31
30
29
28
27
26
25
24
23
AI, P0[4]
AI, P0[2]
AI, P0[0]
AI, P2[6]
DVSS
AI, P2[4]
AI, EXT CLK, P1[4]
AI, P2[0]
AI, P2[1]
AVSS
OCDE
AI, OCDO, P3[1]
AI, SPI MISO, P1[5]
AI, SPI CLK, P1[3]
AI, P2[3]
AI, P2[5]
AI, SPI SS, P1[7]
AI, SPI MOSI, ISSP CLK, P1[1]
AI, HCLK, P3[3]
AI, ISSP DATA, P1[0]
AI, CCLK, P3[5]
AI, P1[6]
AI, P1[2]
AI, P2[2]
AI, OCDOE, P3[7]
10
11
12
13
14
15
16
17
18
19
20
21
22
XRES
BOOST_GND
BOOST_IND
BVATT
DVDD
VREGD
AVDD
VREGA
AI, P2[7]
42
41
40
39
Figure 3. Pin Diagram
Note
1. These are the in-system serial programming (ISSP) pins. Unlike other GPIOs, they are not high-impedance at power-on reset (POR). See the Technical Reference
Manual (TRM) at www.cypress.com or in the PSoC Designer development software for more details.
Document Number: 001-44048 Rev. *G
Page 6 of 36
[+] Feedback
CYONS2110
Microcontroller System
■
Features
■
■
■
■
■
Powerful Harvard-architecture processor
❐ M8C processor speed up to 24 MHz
❐ Low power at high speed
❐ Interrupt controller
❐ Operating temperature range: +5°C to +45°C
Flexible on-chip memory
❐ 32 KB flash program storage
50,000 erase and write cycles
❐ 2 KB SRAM data storage
❐ Partial flash updates
❐ Flexible protection modes
❐ In-system serial programming (ISSP)
Full-speed USB (12 Mbps)
❐ Eight unidirectional endpoints
❐ One bidirectional control endpoint
❐ USB 2.0 compliant
❐ Dedicated 512-byte buffer
❐ Internal 3.3-V output regulator
Low-power CapSense block
❐ Configurable capacitive sensing elements
❐ Supports combination of CapSense buttons, sliders,
touchpads, touchscreens, and proximity sensors
Complete development tools
❐ Free development tool (PSoC Designer)
❐ Full featured in-circuit emulator (ICE) and programmer
❐ Full-speed emulation
❐ Complex breakpoint structure
❐ 128 K trace memory
Document Number: 001-44048 Rev. *G
Precision programmable clocking
❐ Internal ±5.0% 6-, 12-, 24-MHz main oscillator
❐ Internal 32-kHz low speed oscillator
❐ Support for optional external 32-kHz crystal
❐ 0.25% accuracy for USB with no external crystal
Programmable pin configurations
❐ 25-mA sink current on all GPIOs
❐ Pull-up, high-Z, open drain, or strong drive modes on all
GPIOs
❐ Up to 28 analog inputs on GPIO
❐ Configurable inputs on all GPIOs
❐ Selectable, regulated digital I/O on port 1
• 3.3-, 2.5-, or 1.8-V output
❐ 3.0 V, 20 mA total port 1 source current
❐ 5-mA source current mode on ports 0 and 1
❐ Hot swap capable
■ Versatile analog mux
❐ Common internal analog bus
❐ Simultaneous connection of I/O combinations
❐ High power supply rejection ratio (PSRR) comparator
❐ Low dropout voltage regulator for the analog array
■ Additional system resources
❐ SPI master and SPI slave
• Clock speed up to 12 MHz
❐ Three 16-bit timers
❐ Watchdog and sleep timers
❐ Internal voltage reference
❐ Integrated supervisory circuit
❐ Analog-to-digital converter (ADC)
2
❐ I C slave
■
Page 7 of 36
[+] Feedback
CYONS2110
PSoC Functional Overview
Figure 4. Analog System Block Diagram
Cypress's programmable system-on-chip (PSoC) on-chip
controllers combine dynamic, configurable analog and digital
blocks and an 8-bit MCU on a single chip, replacing multiple
discrete components while delivering advanced flexibility and
functionality. A PSoC device includes configurable analog and
digital blocks, and programmable interconnect. This architecture
enables the creation of customized peripheral configurations, to
match the requirements of each individual application.
Additionally, a fast CPU, flash program memory, SRAM data
memory, and configurable I/O are included in a range of convenient pinouts.
Analog Global Bus
IDAC
Vr
Reference
Buffer
The architecture for this device family, as shown in Figure 2 on
page 4, contains: the core, the sensor, the CapSense analog
system, and the system resources (including a full-speed USB
port). A common, versatile bus enables connection between I/O
and the analog system. Each PSoC device includes a dedicated
CapSense block that provides sensing and scanning control
circuitry for capacitive sensing applications. GPIO is also
included. The GPIO provides access to the MCU and analog
mux.
Comparator
System resources provide additional capability, such as configurable USB and SPI master-slave communication interface,
three 16-bit programmable timers, and various system resets
supported by the M8C.
The analog system is composed of the CapSense PSoC block
and an internal 1.8 V analog reference, which together support
capacitive sensing of up to 26 inputs.
The CapSense Analog System
The analog system contains the capacitive sensing hardware.
Several hardware algorithms are supported. This hardware
performs capacitive sensing and scanning without requiring
external components. Capacitive sensing is configurable on
each GPIO pin. Scanning of enabled CapSense pins are
completed quickly and easily across multiple ports.
Document Number: 001-44048 Rev. *G
Mux
Mux
Refs
CapSenseCounters
The PSoC Core
The PSoC core is a powerful engine that supports a rich
instruction set. The PSoC core encompasses SRAM for data
storage, an interrupt controller, Sleep and Watchdog timers, an
IMO, and an ILO. The CPU core, called the M8C, is a powerful
processor with speeds up to 24 MHz. The M8C is a 4 MIPS, 8-bit
Harvard-architecture microprocessor.
Cinternal
CSCLK
IMO
CapSense
Clock Select
Oscillator
The Analog Multiplexer System
The analog mux bus connects to every GPIO pin. Pins are
connected to the bus individually or in any combination. The bus
also connects to the analog system for analysis with the
CapSense block comparator.
Switch control logic enables selected pins to precharge continuously under hardware control. This enables capacitive
measurement for applications such as touch sensing. Other
multiplexer applications include:
Complex capacitive sensing interfaces, such as sliders and
touchpads
■ Chip-wide mux that enables analog input from any I/O pin
■ Crosspoint connection between any I/O pin combinations
When designing capacitive sensing applications, refer to the
latest signal-to-noise signal level requirements application notes,
which are at http://www.cypress.com. In general, and unless
otherwise noted in the relevant application notes, the minimum
signal-to-noise ratio (SNR) for CapSense applications is 5:1.
■
Page 8 of 36
[+] Feedback
CYONS2110
Additional System Resources
System resources, some previously listed, provide additional
capability useful to complete systems. Additional resources
include low voltage detection (LVD) and power-on reset (POR).
Brief statements describing the merits of each system resource
follows.
■
■
■
■
The SPI master/slave module
❐ Provides communication over three or four wires.
❐ Runs at speeds of 46.9 kHz to 3 MHz (lower for a slower
system clock).
An I2C slave module
LVD interrupts can signal the application of falling voltage
levels, while the advanced POR circuit eliminates the need for
a system
supervisor.
An internal reference provides an absolute reference for capacitive sensing.
Getting Started
For in depth information, along with detailed programming
details, see the PSoC® Technical Reference Manual.
For up-to-date ordering, packaging, and electrical specification
information, see the latest PSoC device datasheets on the web.
Application Notes
Cypress application notes are an excellent introduction to the
wide variety of possible PSoC designs.
Development Kits
PSoC Development Kits are available online from and through a
growing number of regional and global distributors, which
include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and
Newark.
Training
Free PSoC technical training (on demand, webinars, and
workshops), which is available online via www.cypress.com,
covers a wide variety of topics and skill levels to assist you in
your designs.
CYPros Consultants
Certified PSoC Consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC Consultant go to the CYPros Consultants web site.
Solutions Library
Visit our growing library of solution focused designs. Here you
can find various application designs that include firmware and
hardware design files that enable you to complete your designs
quickly.
Technical Support
Technical support – including a searchable Knowledge Base
articles and technical forums – is also available online. If you
cannot find an answer to your question, call our Technical
Support hotline at 1-800-541-4736.
Document Number: 001-44048 Rev. *G
Development Tools
PSoC Designer™ is the revolutionary Integrated Design
Environment (IDE) that you can use to customize PSoC to meet
your specific application requirements. PSoC Designer software
accelerates system design and time-to-market. Develop your
applications using a library of precharacterized analog and digital
peripherals (called User Modules) in a drag-and-drop design
environment. Then, customize your design by leveraging the
dynamically generated application programming interface (API)
libraries of code. Finally, debug and test your designs with the
integrated debug environment including in-circuit emulation
(ICE) and standard software debug features. PSoC Designer
includes:
■
Application Editor GUI for device and User Module
configuration and dynamic reconfiguration
■
Extensive User Module catalog
■
Integrated source code editor (C and Assembly)
■
Free C compiler with no size restrictions or time limits
■
Built in debugger
■
Integrated Circuit Emulation (ICE)
Built-in Support for Communication Interfaces:
2
❐ Hardware and software I C slaves and masters
❐ Full-speed USB 2.0
❐ Up to 4 full-duplex UARTs, SPI master and slave, and Wireless
PSoC Designer supports the entire library of PSoC 1 devices and
runs on Windows XP, Windows Vista, and Windows 7.
■
PSoC Designer Software Subsystems
Design Entry
In the chip-level view you choose a base device to work with and
then select different onboard analog and digital components
called user modules that use the PSoC blocks. Examples of user
modules are ADCs, DACs, amplifiers, and filters. You configure
the user modules for your chosen application and connect them
to each other and to the proper pins. Then you generate your
project. This prepopulates your project with APIs and libraries
that you can use to program your application.
The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration
allows for changing configurations at run time. In essence, this
allows you to usemore than 100% of PSoC’s resources for a
given application.
Code Generation Tools
The code generation tools work seamlessly within the PSoC
Designer interface and have been tested with a full
range of debugging tools. You can develop your design in C,
assembly, or a combination of the two - the choice is yours.
Assemblers. The assemblers allow you to merge assembly
code seamlessly with C code. Link libraries automatically use
absolute addressing or are compiled in relative mode, and linked
with other software modules to get absolute addressing.
Page 9 of 36
[+] Feedback
CYONS2110
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices. The
optimizing C compilers provide all the features of C tailored to
the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
Select User Modules
Debugger
Each user module that you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a pulse
width modulator (PWM) User Module configures one or more
digital PSoC blocks, one for each 8 bits of resolution. The user
module parameters permit you to establish the pulse width and
duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by
selecting values from drop-down menus. All the user modules
are documented in datasheets that may be viewed directly in
PSoC Designer or on the Cypress website. These user module
datasheets explain the internal operation of the user module and
provide performance specifications. Each datasheet describes
the use of each user module parameter, and other information
you may need to successfully implement your design.
PSoC Designer has a debug environment that provides hardware
in-circuit emulation (ICE), allowing you to test the program in a
physical system while providing an internal view of the PSoC
device. Debugger commands allow a designer to read and
program and read and write data memory, read and write I/O
registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The
debugger also allows the designer to create a trace buffer of
registers and memory locations of interest.
Online Help System
The online help system displays online, context-sensitive help.
Designed for procedural and quick reference, each functional
subsystem has its own context-sensitive help. This system also
provides tutorials and links to FAQs and an Online Support
Forum to aid the designer.
In-Circuit Emulator
A low cost, high functionality In-Circuit Emulator (ICE) is
available for development support. This hardware has the
capability to program single devices.
The emulator consists of a base unit that connects to the PC
using a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full speed
(24 MHz) operation.
Designing with PSoC Designer
The development process for the PSoC® device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
The PSoC development process is summarized in four steps:
1. Select User Modules.
2. Configure user modules.
3. Organize and connect.
4. Generate, verify, and debug.
Document Number: 001-44048 Rev. *G
PSoC Designer provides a library of prebuilt, pretested hardware
peripheral components called “user modules.” User modules
make selecting and implementing peripheral devices, both
analog and digital, simple.
Configure User Modules
Organize and Connect
You build signal chains at the chip level by interconnecting user
modules to each other and the I/O pins. You perform the
selection, configuration, and routing so that you have complete
control over all on-chip resources.
Generate, Verify, and Debug
When you are ready to test the hardware configuration or move
on to developing code for the project, you perform the “Generate
Configuration Files” step. This causes PSoC Designer to
generate source code that automatically configures the device to
your specification and provides the software for the system. The
generated code provides APIs with high-level functions to control
and respond to hardware events at run time and interrupt service
routines that you can adapt as needed.
A complete code development environment allows you to
develop and customize your applications in either C, assembly
language, or both.
The last step in the development process takes place inside
PSoC Designer’s debugger (access by clicking the Connect
icon). PSoC Designer downloads the HEX image to the ICE
where it runs at full speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition
to traditional single-step, run-to-breakpoint and watch-variable
features, the debug interface provides a large trace buffer and
allows you to define complex breakpoint events that include
monitoring address and data bus values, memory locations and
external signals.
Page 10 of 36
[+] Feedback
CYONS2110
Power Supply Connections
Figure 5. Power Connections
CYONS2110
VDD5V 42
4.25 - 5.25 V
3 BOOST_IND
3.3V
Regulator
External 3.3V
Supply, 15
mA max
10 nH
22
uF
22
uF
DVDD
5
AVDD
7
USB IO
Regulator
Boost
Regulator
4
Battery
Filter
47 uH
Battery
0.8 - 3.6V
VBATT
22
uF
Global
Analog
Interconnect
Digital
GND
VREGD 6
VREGA 8
1.8V PSoC
Core
Regulator
1.8V Analog
Regulator
Digital
GND
Analog
GND
Analog
GND
1.8V Digital
Circuitry
3V Digital
Circuitry
30
3V Analog
Circuitry
AVSS 25
1.8V Analog
Circuitry
DVSS
Analog
GND
BOOST_GND 2
Digital
GND
Digital
GND
Digital
GND
Overview
Using Battery Power
The CYONS2110 incorporates a powerful and flexible powering
system. It can be powered from one of three sources: a 5V
supply (typically from the USB VBUS line), a battery, or an
external 3.3V supply. Additionally, the CYONS2110’s internal
regulators can supply current to external devices. This section
describes the capabilities and usage of the power system. Refer
to Figure 5 for a block diagram of the CYONS2110’s power
system.
For wireless applications, the device may be powered by the
boost regulator. In this configuration, BOOST_GND should be
connected to DVSS, BOOST_IND and VBATT pins should be
connected as shown in Figure 5, and VDD5V should be left
unconnected. Do not run the device without the appropriate
bypass capacitors, or excessive voltage may be generated
across the inductor.
Understanding DVDD
DVDD is a unique pin because it serves as either an input or an
output. When the device is powered from USB (using the 3.3-V
regulator) or battery (using the Boost Regulator), DVDD acts as
an output, providing a 3.3-V voltage that can be used to power
AVDD, VREGD, VREGA, and external parts. When the device is
powered from an external 3.3-V supply, DVDD acts as an input
only.
VBATT connects to an internal low-pass filter. The filter output
can be routed through the global analog interconnect to the
device’s ADC, enabling the battery voltage to be monitored.
For designs using two series batteries, an option is to drive
VREGA directly from the battery output. Doing so reduces the
conversion loss in the boost regulator. However, care must be
taken to ensure that the battery voltage does not fall below
1.71 V.
Using External Power
As with DVDD, these signals power the internal circuitry of the
device. Unlike DVDD, these are always inputs. They should be
connected as shown in Figure 5.
The CYONS2110 can also be powered from an external source.
In this case, BOOST_GND should be connected to DVSS,
VDD5V and BOOST_IND should be left unconnected, and the
external 3.3V source should connect to DVDD. VBATT can be
connected to DVSS or left unconnected.
Using USB Power
Filtering and Grounding
For most USB applications, the device is powered from the USB
VBUS signal. In this case, the 5-V VBUS signal should be
connected directly to the CYONS2110’s VDD5V pin. Pins VBATT
and BOOST_GND should be connected to DVSS, and
BOOST_IND should be left unconnected.
For all designs, it is important to provide proper grounding and
isolation between the analog and digital power supplies. The
analog and digital grounds should be isolated, except for a single
connection point that is placed as close as possible to the device.
On the supply side, an L-C filter should be placed between AVDD
and DVDD, as shown in Figure 5.
AVDD, VREGA, and VREGD
Document Number: 001-44048 Rev. *G
Page 11 of 36
[+] Feedback
S
DP
DM
GND
GND_SHIELD
AGND
0.1 uF
AVCC
AGND
0.1 uF
DVCC
Zero
C4
1M
1 nF
0.1 uF
VCC_5V
Sensor Decoupling Caps
1
2
3
4
5
10 uF
+
DVCC
10 nH
VCC Filter
22
22
+
10 uF
AGND
+
AVCC
DMINUS
DPLUS
10 uF
Z-WHEEL1
Z-WHEEL2
LF_SW
RT_SW
CTR_SW
27
26
21
12
29
13
31
9
32
36
33
37
34
38
35
39
1
22
18
16
24
23
P2_0
P2_1
P2_2
P2_3
P2_4
P2_5
P2_6
P2_7
P0_0
P0_1
P0_2
P0_3
P0_4
P0_5
P0_6
P0_7
AGND
DD+
ISSP DATA, P1_0
SPI_MOSI, ISSP CLK, P1_1
P1_2
SPI_CLK, P1_3
EXT_CLK, P1_4
SPI MISO, P1_5
P1_6
SPI SS, P1_7
BATT_MON
BOOST_IND
BOOST_GND
CYONS2110
XRES
OCDOE, P3_7
CCLK, P3_5
HCLK, P3_3
OCDE
OCDO, P3_1
U2
43
1
2
3
4
5
CP
W
G
R
B
SHLD
7
AVDD
AVSS
25
Vbus
D+/SDATA
D-/SCLK
GND
8
VREGA
VCC_5V
DVCC
DVCC
5
DVDD
AVCC
42
VDD5V
VCC_5V
6
VREGD
DVSS
30
Document Number: 001-44048 Rev. *G
1206
USB Interface
40
41
17
15
20
11
28
10
19
14
4
3
2
1
2
2
2
3
Z-WHEEL2
COM
GND1
GND2
ENCODER
QB
QA
Z WHEEL
SW PUSHBUTTON
1
SW PUSHBUTTON
Z-WHEEL1
DMINUS
DPLUS
2
SW PUSHBUTTON
1
4
5
1
CTR_SW
RT_SW
LF_SW
Mouse Button Switches
CYONS2110
Wired Mouse Application Example
Figure 6 shows an implementation of a wired mouse. For complete details, refer to the CY4631 - OvationONS™ II Laser Gaming
Mouse Reference Design Kit.
Figure 6. Wired Mouse
Page 12 of 36
[+] Feedback
27
26
21
12
29
13
31
9
Z-WHEEL1
Z-WHEEL2
RADIO_IRQ
32
36
33
37
34
38
35
39
LF_SW
RT_SW
CTR_SW
FWD_SW
BWD_SW
1
22
18
16
24
23
P2_0
P2_1
P2_2
P2_3
P2_4
P2_5
P2_6
P2_7
P0_0
P0_1
P0_2
P0_3
P0_4
P0_5
P0_6
P0_7
EN1
GND1
GND2
COM
ENCODER
QB
QA
DD+
ISSP DATA, P1_0
SPI MOSI, ISSP CLK, P1_1
P1_2
SPI CLK, P1_3
EXT CLK, P1_4
SPI MISO, P1_5
P1_6
SPI SS, P1_7
VBATT
BOOST_IND
BOOST_GND
40
41
17
15
20
11
28
10
19
14
4
3
2
4
5
1
SW PUSHBUTTON
SW PUSHBUTTON
SW PUSHBUTTON
SW PUSHBUTTON
DVCC
3
2
SW5
SW4
SW3
SW2
CYONS2110
XRES
OCDOE, P3_7
CCLK, P3_5
HCLK, P3_3
OCDE
OCDO, P3_1
U1
7
AVDD
AVCC
Z-WHEEL2
Z-WHEEL1
BWD_SW
FWD_SW
CTR_SW
8
VREGA
SW PUSHBUTTON
nSS
MISO
SCK
MOSI
C7
.1uF
C12
22uF
VBAT
RADIO_IRQ
nSS
SCK
MOSI
MISO
RST
U2
0.047 uFd
C13
C8
1 uFd
1 1%
R2
C19
0.47 uFd
DVCC
47
R3
Single point connection
between analog and
digital ground
L5
47 uH
D1
OPTIONAL
SWITCHES
DVCC
2
4
5
9
14
15
17
18
37
26
24
25
27
28
34
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
L/D
IRQ
SS
SCK
MOSI
MISO
RST
10 uFd
C9
DVCC
19
20
21
22
23
31
32
36
39
29
1
30
13
11
10
1.8 nH
L3
22 nH
L2
C2
22uF
DVCC
Y1
12 MHz Crystal
15 pFd
C1
10nH
2.0 pFd
C4
C5
.1uF
L1
VCC Filter
E-PAD must be soldered to ground.
RESV
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
XOUT
XTAL
PACTL
RFn
RFp
RFbias
0.47 uFd
C17
0.047 uFd
C10
0.047 uFd
C11
0.047 uFd
C14
0.047 uFd
C16
0.047 uFd
C15
CYRF6936
8
6
38
VBAT2
VBAT1
VBAT0
SW1
33
VIO
RT_SW
5
DVDD
AVSS
25
1
2
40
VREG
GND1
12
6
DVSS
30
3
7
16
E-PAD
41
VREGD
VDD5V
42
35
VDD
VCC1
VCC2
VCC3
Document Number: 001-44048 Rev. *G
C3
22uF
1.5 pFd
C20
C6
.1uF
AVCC
ANT1
WIGGLE 63
1
2
LF_SW
CYONS2110
Wireless Mouse Application Example
Figure 7 shows an implementation of a wireless mouse.
Figure 7. Wireless Mouse
Page 13 of 36
[+] Feedback
CYONS2110
Electrical Specifications
This section presents the DC and AC electrical specifications of the CYONS2110 device. For the most up-to-date electrical specifications, confirm that you have the most recent datasheet by visiting http://www.cypress.com.
Absolute Maximum Ratings
Min
Typ
Max
Unit
Storage temperature[2]
Parameter
–40
25
65
°C
Case temperature
Conditions
Operating temperature
–15
–
55
°C
Case temperature
Lead solder temperature
–
–
260
°C
10 seconds
Supply voltage, DVDD, AVDD, VREGA,
and VREGD relative to DVSS)
–
–
3.6
V
Supply voltage, VDD5V relative to DVSS
–
–
5.5
V
Supply voltage, VBATT relative to DVSS
–
–
3.6
V
ESD
I/O voltage relative to DVSS
–
–
2.0
kV
All pins, HBM MIL 883 method 3015
–0.5
–
DVDD + 0.5
V
GPIO ports 0, 2, and 3
I/O voltage relative to DVSS
–
–
5.5
V
Latch-up current
–
–
100
mA
–25
–
+50
mA
Min
Typ
Max
Unit
5
–
45
°C
Maximum current into any GPIO pin
GPIO port 1
In accordance with JESD78 standard.
Operating Conditions
Parameter
Operating temperature
–
4.35
2.70
1.71
0.80
Power supply rise time
100
–
–
µs
–
–
25
mV pp
Supply noise – AVDD (sinusoidal)
Supply noise – VDD, DVDD (sinusoidal)
Ambient air temperature
V
Power supply voltage
VDD5V
DVDD, AVDD, VREGD
VREGA
VBATT
5.25
3.60
3.60
3.60
Conditions
DVDD, AVDD, VREGD, VREGA
10 kHz to 50 MHz
–
–
100
mV pp
Distance from PCB to tracking surface
5.80
6
6.20
mm
See Figure 17
10 kHz to 50 MHz
PCB thickness
1.54
–
1.79
mm
See Figure 17
Note
2. High storage temperature reduces flash data retention time specified in Table 7 on page 19. Recommended storage temperature is 25 ± 25°C. Extended duration
above 65°C can degrade reliability.
Document Number: 001-44048 Rev. *G
Page 14 of 36
[+] Feedback
CYONS2110
Power Consumption
Introduction
As described in Overview on page 11, the CYONS2110 has a
highly advanced power system, which can be used to develop
very low power applications. This section describes and
specifies the power consumption performance of the device.
Enabling Low-Power Modes
In some cases, designers may wish to develop “always-on”
applications, with no power-saving modes, and consequently no
wakeup latency in performance. In other applications,
conserving power is crucial and power saving modes are a firm
requirement. The CYONS2110 allows low power modes to be
enabled or disabled in firmware, either through register writes or
through the application programming interface in Cypress’s
PSoC Designer development software. The remainder of this
section applies to applications requiring power saving modes.
with four sets of sleep mode settings, allowing four levels of
sleep. By controlling the parameters of these four sleep modes,
the designer can tailor the solution to make appropriate tradeoffs
between power consumption and wakeup latency.
The transition between sleep modes is under the control of the
CYONS2110’s digital signal processor (DSP) – no firmware
needs to be written to manage the transition between modes.
Each of the four available sleep modes is defined by three
parameters. These parameters are defined as registers that can
be controlled by firmware, either through direct register writes or
by using the NAV User Module in PSoC Designer.
■
Sleep time: This is the amount of time that the device is in its
low power inactive state.
■
Motion threshold: This is the amount of motion that is required
to bring the device out of sleep.
■
Sleep mode time: This is the amount of time that the device
stays in a particular sleep mode before transitioning to the next
lowest sleep mode. Longer sleep times saves power but have
higher wakeup latency.
Operating Modes
From a power consumption standpoint, consider these three
operating modes.
■
Tracking mode: In this mode, the device is actively tracking on
a surface. It is the highest power mode of the device. The
current consumption has a slight dependence on speed and
surface. The current, however, is independent of resolution.
■
Inactive mode: In this mode, the device is in its lowest power
state. In inactive mode, the device cannot sense motion, but a
timer is running. The timer can generate an interrupt that can
wake the rest of the device and start tracking motion.
■
Sleep mode: In sleep mode, the device self-transitions between
tracking mode and inactive mode. The typical use of sleep
modes is when the device is at rest, but might still be moved.
In sleep mode, the CYONS2110 stays in inactive mode for a
fixed time, then wakes up and checks for motion. If motion is
detected, the device fully wakes up and begins tracking. If no
motion is detected, the device can go back to sleep mode.
Power Management Through Sleep Mode Control
Figure 8 shows the flowchart for a particular sleep mode,
showing how the three parameters affect behavior.
Calculating Power for Sleep Mode
The power consumption in sleep mode can be found by using a
duty cycle calculation. The sleep mode current is determined by
the tracking mode current, the inactive current, the time required
to check for motion (typically 2.9 ms), and the time between
check-for-motion events. The expected current consumption is
given by the formula
I TRACK × 2.9 + I INACT × T SLEEP
I SLEEP = ----------------------------------------------------------------------------------2.9 + T SLEEP
where ISLEEP is the sleep current, ITRACK is the tracking current,
IINACT is the inactive current, and TSLEEP is the time (in ms) in
the low power state. As an example, if the tracking current is
8.5 mA, the inactive current is 7.5 µA and the sleep time is
100 ms, then the expected sleep current is 0.25 mA.
Power management for the CYONS2110 consists of setting the
parameters that define the sleep modes. The device is equipped
Figure 8. Sleep Mode Flowchart.
Enter from
higher sleep
mode
Go to sleep for N ms
Wake up, check for motion
Motion > threshold T?
Y
Go to active
tracking mode
N
Time in mode > M sec?
Y
Go to deeper
sleep mode
N
Document Number: 001-44048 Rev. *G
Page 15 of 36
[+] Feedback
CYONS2110
Power Specifications
With USB powering, the 5-V USB supply is connected to VDD5V,
and DVDD, AVDD, VREGD, and VREGA are driven by the
internal 5-V USB regulator. The boost regulator is turned off.
Tracking current in this case is specified by ITRACK_USB. Sleep
current must include the current consumption of the regulator
itself, and is specified by the sum of ISLEEP and IREG5V. For
designs using the CYONS2110, low power operation is often
only needed to support USB Suspend. Reference code for this
is available in the CY4631 - OvationONS™ II Laser Gaming
Mouse Reference Design Kit.
There are three ways to power the CYONS2110 – external
powering, battery powering, and USB powering. Table 4
provides the current consumption values for each mode.
With external powering, a 3-V supply is connected to DVDD,
AVDD, VREGD, and VREGA, and the internal regulators are
turned off. In this case, the current consumption during tracking
is ITRACK_EXT, and the consumption during sleep is ISLEEP.
With battery powering, the device is powered by the internal
boost regulator. The 5-V USB regulator is turned off. Total
tracking current must include the current consumed by the
regulator itself, and is given by the sum of ITRACK and IREGBOOST.
Sleep current is likewise given by the sum of ISLEEP and
IREGBOOST. In both cases, the current drawn from the battery
must be adjusted by the voltage conversion ratio and the boost
regulator efficiency ηTRACK and ηINACT.
Sleep current is achieved by activating “Navigation Sleep
Modes” in Cypress’s PSoC Designer development environment.
Doing so enables the sleep mode progressions described
earlier. If sleep modes are not activated, the device current stays
at tracking levels, even when the device is not sensing motion.
ISB is the current in the lowest-power mode of the device. In this
mode, the CPU is halted and operation can only be restarted with
an external reset at the XRES pin.
Table 2. Power Specifications
Min
Typ
Max
Units
ITRACK_EXT
Symbol
Tracking current into DVDD, 3.0 V, 25 °C, 5 inch/second, 24 MHz IMO, 6 MHz
AVDD, VREGD, VREGA
CPU clock, white surface, nominal tracking height
Description
Conditions
–
9
12.5
mA
ITRACK_USB
Tracking current into VDD5V 5.25 V, 25 °C, 5 inch/second, 24 MHz IMO, 6 MHz
CPU clock, white surface, nominal tracking height,
DVDD, AVDD, VREGD, and VREGA powered by
internal regulator
–
12.5
16
mA
IINACT
Inactive current into DVDD,
AVDD, VREGD, VREGA
3.0 V, 25 °C, CPU in sleep state
–
7
14
µA
ISLEEP
Sleep current into DVDD,
AVDD, VREGD, VREGA
3.0 V, 25 °C
IREG5V
5 V-to-3 V regulator current
consumption
VDD5V = 5.25 V, regulator active
–
250
–
µA
IREGBOOST
Boost regulator current
consumption
3.0 V at VBATT, 25 °C
–
20
–
µA
ηTRACK
Boost converter efficiency,
tracking mode
1.2 V VBATT input, 47 µH inductor, 10 mA load,
400 kHz switching frequency
–
90
–
%
ηINACT
Boost converter efficiency,
inactive mode
1.2 V VBATT input, 47 µH inductor
–
70
–
%
–
3.3
V
+10
%
See Calculating Power for Sleep
Mode on page 15 for equation
VBOOST_SET Boost converter nominal
output
Programmed using PSoC Designer user module
calibration feature
2.7
VBOOST[3]
Boost converter accuracy
Offset from set point
–10
ISB
Shutdown current into DVDD, 3.0 V, 25 °C, 5 V supply not present
AVDD, VREGD, VREGA, all
blocks off
–
4
11
µA
ISB_USB
Shutdown current, all blocks 5.25 V, 25C, DVDD, AVDD, VREGA, VREGD
off, into VDD5V
powered by internal 5 V-to-3 V regulator in standby
–
80
–
µA
–
16.5
–
µA
ISB_DUALUSB Shutdown current, all blocks 25 °C, dual mode trip circuit active, 5V supply
present
off, into DVDD, AVDD,
VREGD, VREGA
Note
3. Boost output specification requires use of calibrated user module in PSoC Designer version 5.0 Service Pack 6 or later.
Document Number: 001-44048 Rev. *G
Page 16 of 36
[+] Feedback
CYONS2110
DC General Purpose I/O Specifications
GPIOs are arranged into four ports. Ports 0, 1, and 2 have eight GPIO pins and Port 3 has four GPIO pins. Port 1 has an optional low
drop out (LDO) regulator that adjusts the port’s output voltage to 1.8, 2.5, or 3.0 volts. Additionally, each GPIO pin can be independently
set to one of four drive modes: strong drive, open drain, pull-up, or Hi-Z analog.
Rise and fall times are specified for 10% and 90% voltage values.
The following tables list guaranteed maximum and minimum specifications for the voltage range of 2.7 V to 3.6 V at the DVDD pin,
and over the temperature range 5 °C ≤ TA ≤ 45 °C. Typical parameters apply to 3.3 V at 25 °C and are for design guidance only.
Table 3. 2.7V to 3.6V DC GPIO Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
RPU
Pull-up resistor
Pin configured for pull-up mode.
4.0
5.6
8.0
kΩ
VOH1
High output voltage
Port 2 or 3 Pins
IOH < 10 μA, maximum of 10 mA
source current in all I/Os.
DVDD - 0.2
–
–
V
VOH2
High output voltage
Port 2 or 3 Pins
IOH = 1 mA, maximum of 20 mA source DVDD - 0.9
current in all I/Os.
–
–
V
VOH3
High output voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
IOH < 10 μA, maximum of 10 mA
source current in all I/Os.
DVDD - 0.2
–
–
V
VOH4
High output voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
IOH = 5 mA, maximum of 20 mA source DVDD - 0.9
current in all I/Os.
–
–
V
VOH5
High output voltage
Port 1 Pins with LDO Regulator
Enabled for 3V Out
IOH < 10 μA, DVDD > 3.1V, maximum
of 4 I/Os all sourcing 5 mA.
2.85
3.00
3.30
V
VOH6
High output voltage
Port 1 Pins with LDO Regulator
Enabled for 3V Out
IOH = 5 mA, DVDD > 3.1V, maximum
of 20 mA source current in all I/Os.
2.20
–
–
V
VOH7
Highoutput voltage
IOH < 10 μA, DVDD > 2.7V, maximum
Port 1 Pins with LDO Enabled for 2.5V of 20 mA source current in all I/Os.
Out
2.35
2.50
2.75
V
VOH8
High output voltage
IOH = 2 mA, DVDD > 2.7V, maximum
Port 1 Pins with LDO Enabled for 2.5V of 20 mA source current in all I/Os.
Out
1.90
–
–
V
VOH9
IOH < 10 μA, DVDD > 2.7V, maximum
High output voltage
Port 1 Pins with LDO Enabled for 1.8V of 20 mA source current in all I/Os.
Out
1.60
1.80
2.10
V
VOH10
High output voltage
IOH = 1 mA, DVDD > 2.7V, maximum
Port 1 Pins with LDO Enabled for 1.8V of 20 mA source current in all I/Os.
Out
1.20
–
–
V
VOL
Low output voltage
–
–
0.75
V
VIL
Input low voltage
–
–
0.80
VIH
Input high voltage
2.00
–
VH
Input hysteresis voltage
IIL
Input leakage (absolute value)
Gross tested to 1 μA.
CPIN
Pin capacitance
Temp = 25 °C.
Document Number: 001-44048 Rev. *G
IOL = 25 mA, DVDD > 3.3V, maximum
of 60 mA sink current on even port pins
(for example, P0[2] and P1[4]) and 60
mA sink current on odd port pins (for
example, P0[3] and P1[5]).
V
V
–
80
–
mV
–
0.5
1.0
µA
0.5
1.7
8.0
pF
Page 17 of 36
[+] Feedback
CYONS2110
DC Analog Mux Bus Specifications
The analog mux bus can connect signals from GPIOs to and from internal analog blocks and other GPIOs. Table 4 lists guaranteed
maximum and minimum specifications for the entire voltage and temperature ranges.
Table 4. DC Analog Mux Bus Specifications
Min
Typ
Max
Unit
RSW
Parameter
Switch resistance to common analog bus
Description
Pin voltage < 1.8 V
Conditions
–
–
800
Ω
RGND
Resistance of initialization switch to DVSS
Pin voltage < 1.8 V
–
–
800
Ω
DC Low Power Comparator Specifications
The device includes two general-purpose comparators, using internal or external signals from the analog mux bus. Table 5 lists
guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 5. DC Comparator Specifications
Parameter
Description
Conditions
Min
Typ
Max
Unit
0.0
–
1.8
V
VLPC
Low power comparator (LPC)
common mode
ILPC
LPC supply current
–
10
40
μA
VOSLPC
LPC voltage offset
–
2.5
30
mV
Maximum voltage limited to DVDD.
DC POR and LVD Specifications
The device features two mechanisms for dealing with low power supply voltages. Both POR and LVD events occur when DVDD falls
below a threshold. A POR completely resets the device. An LVD generates an interrupt to the MCU, allowing the application developer
to better manage power supply drops.
The POR threshold is defined by bits 7 (HPOR) and 5:4 (PORLEV) and of the VLT_CR register at address E3h in register bank 1.
The LVD threshold is defined by bits 2:0 (VM) of the same register. Refer to the technical reference manual for more details.
Table 6 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 6. DC POR and LVD Specifications
Parameter
Description
VPOR0
VPOR1
VPOR2
VPOR3
DVDD value for POR trip
PORLEV[1:0] = 00b, HPOR = 0
PORLEV[1:0] = 00b, HPOR = 1
PORLEV[1:0] = 01b, HPOR = 1
PORLEV[1:0] = 10b, HPOR = 1
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
DVDD value for LVD trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
Conditions
DVDD must be greater than or equal to
1.71V during startup, reset from the XRES
pin, or reset from watchdog.
Min
Typ
Max
Unit
1.61
–
1.66
2.36
2.60
2.82
1.71
2.40
2.65
2.95
V
V
V
V
2.40[4]
2.64[5]
2.85[6]
2.95
3.06
1.84
1.75[7]
2.45
2.71
2.92
3.02
3.13
1.90
1.80
2.51
2.78
2.99
3.09
3.20
1.96
1.84
V
V
V
V
V
V
V
Notes
4. Always greater than 50 mV above VPOR1 voltage for falling supply.
5. Always greater than 50 mV above VPOR2 voltage for falling supply.
6. Always greater than 50 mV above VPOR3 voltage for falling supply.
7. Always greater than 50 mV above VPOR0 voltage for falling supply.
Document Number: 001-44048 Rev. *G
Page 18 of 36
[+] Feedback
CYONS2110
DC Programming Specifications
Table 7 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
The CYONS2110 must be properly powered for flash programming, with DVDD, AVDD, VREGD, and VREGA all held within the
specified range. A suitable option for in-circuit programming USB designs is to apply 5 V to the VDD5V pin, and use the internal
regulator to drive DVDD, AVDD, VREGD, and VREGA. This enables direct connection to Cypress’s CY3210-Miniprog. For in-circuit
programming of battery or externally-powered designs, the designer must include provisions for supplying DVDD, AVDD, VREGD,
and VREGA externally.
Table 7. DC Programming Specifications
Parameter
Description
Conditions
VIW applied to DVDD, AVDD,
VREGD, and VREGA
Min
Typ
Max
Unit
2.7
–
3.6
V
VIW
Supply voltage for flash write operations
IDDP
Supply current during programming or verify
–
5
25
mA
VILP
Input low voltage during programming or verify See DC General Purpose I/O
Specifications on page 17.
–
–
VIL
V
VIHP
Input high voltage during programming or
verify
VIH
–
–
V
IILP
Input current when applying VILP to ISSP CLK Driving internal pull-down
and ISSP DATA pins during programming or resistor.
verify
–
–
0.2
mA
IIHP
Input current when applying VIHP to ISSP CLK Driving internal pull-down
and ISSP DATA pins during programming or resistor.
verify
–
–
1.5
mA
VOLP
Output low voltage during programming or
verify
–
–
DVSS + 0.75
V
VOHP
Output high voltage during programming or
verify
DC General Purpose I/O Specifications on page 17.For DVDD
> 3V use the value with IOH = 5
mA.
VOH
–
DVDD
V
FlashENPB
Flash write endurance
Erase/write cycles by block.
50,000
–
–
Cycles
FlashDR
Flash data retention
Following maximum flash write
cycles at ambient temp of 45°C.
5
10
–
Years
See DC General Purpose I/O
Specifications on page 17.
DC Characteristics - USB Interface
The device includes an integrated full-speed USB block. Table 8 lists guaranteed maximum and minimum specifications for the entire
voltage and temperature ranges.
Table 8. DC USB Characteristics
Symbol
Description
Conditions
Min
Typ
Max
Units
Rusbi
USB D+ pull-up resistance
With idle bus
0.900
–
1.575
kΩ
Rusba
USB D+ pull-up resistance
While receiving traffic
1.425
–
3.090
kΩ
Vohusb
Static output high
2.8
–
3.6
V
Volusb
Static output low
–
–
0.3
V
Vdi
Differential input sensitivity
0.2
–
–
V
Vcm
Differential input common mode range
0.8
–
2.5
V
Vse
Single-ended receiver threshold
0.8
–
2.0
V
Cin
Transceiver capacitance
–
50
pF
–10
–
10
uA
3
5
7
kΩ
21.78
22
22.22
Ω
Iio
High-Z state data line leakage
Rps2
PS/2 pull-up resistance
Rext
External USB series resistor
Document Number: 001-44048 Rev. *G
On D+ or D- line
In series with each USB pin
Page 19 of 36
[+] Feedback
CYONS2110
AC Chip Level Specifications
The device has two internal oscillators. The IMO controls the clock speeds for the CPU. An programmable frequency divider allows
the CPU to run at lower speeds than the IMO. The ILO is a typically active in sleep modes, clocking sleep, and watchdog timers. Other
internal timers can be clocked by either the CPU clock or the ILO.
Table 9 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 9. AC Specifications
Min
Typ
Max
Unit
FIMO24
Parameter
IMO frequency for 24 MHz setting
Description
22.8
24
25.2
MHz
FIMO12
IMO frequency for 12 MHz setting
11.4
12
12.6
MHz
FIMO6
IMO frequency for 6 MHz setting
5.7
6.0
6.3
MHz
setting[8]
DCIMO
IMO output duty cycle at 6 and 12 MHz
40
50
60
%
FCPU
CPU frequency[9]
FIMO / 256
–
FIMO
MHz
F32K1
ILO frequency[10]
19
32
50
kHz
TRAMP
Supply ramp time
20
–
–
μs
TXRST
External reset pulse width at power-up
1
–
–
ms
TXRST2
External reset pulse width after power-up
10
–
–
μs
–
–
30
ms
TMOT
Motion delay from reset to valid tracking
data[11]
AC General Purpose I/O Specifications
GPIOs are arranged into ports. Ports 0, 1, and 2 have eight GPIO pins and Port 3 has four GPIO pins. Port 1 has an optional LDO
regulator that adjusts the port’s output voltage to 1.8, 2.5, or 3.0 volts. Additionally, each GPIO pin can be independently set to one
of four drive modes: strong drive, open drain, pull-up, or high-Z analog.
Rise and fall times are specified for 10% and 90% voltage values.
Specifications are for the entire operating temperature range.
Table 10. AC GPIO Specs
Parameter
Description
Conditions
Min
Typ
Max
Units
FGPIO
GPIO operating frequency
Strong drive
0
–
12
MHz
TRISE_01
Rise time, ports 0 -1
Strong drive, CLOAD = 50 pF, DVDD = 3.0 - 3.6
–
–
50
ns
TRISE_01_L
Rise time, ports 0 -1, low supply
Strong drive, CLOAD = 50 pF, DVDD = 2.7 - 3.0
–
–
70
ns
TRISE_LDO_3
Rise time, port 1, 3V LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 3.1V
–
–
50
ns
TRISE_LDO_2.5
Rise time, port 1, 2.5 LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 2.7V
–
–
70
ns
TRISE_LDO_1.8
Rise time, port 1, 1.8 LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 2.7V
–
–
100
ns
TRISE_23
Rise time, ports 2 - 3
Strong drive, CLOAD = 50 pF, DVDD = 2.7 - 3.6
–
–
80
ns
TFALL
Fall time, all ports
Strong drive, CLOAD = 50 pF, DVDD = 3.0 - 3.6
–
–
50
ns
TFALL_L
Fall time, all ports, low supply
Strong drive, CLOAD = 50 pF, DVDD = 2.7 - 3.0
–
–
70
ns
TFALL_LDO_3
Fall time, port 1, 3V LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 3.1V
–
–
50
ns
TFALL_LDO_2.5
Fall time, port 1, 2.5 LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 2.7V
–
–
70
ns
TFALL_LDO_1.8
Fall time, port 1, 1.8 LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 2.7V
–
–
80
ns
Notes
8. IMO can be output from chip by routing to GPIO. Maximum GPIO output frequency is 12 MHz, so duty cycle at 24 MHz is not defined. See Technical Reference Manual
at www.cypress.com or in Cypress's PSoC Designer software for details on routing IMO to GPIO pin.
9. Available frequency divisors are 1, 2, 4, 8, 16, 32, 128, and 256.
10. 32 kHz oscillator can be locked to external crystal. See technical reference manual available at www.cypress.com or in Cypress’ PSoC Designer software.
11. Value provided represents maximum startup time for typical application. Applications requiring additional startup code, processing, or delay may increase TMOT.
Document Number: 001-44048 Rev. *G
Page 20 of 36
[+] Feedback
CYONS2110
AC External Clock Specifications
The IMO can be replaced with an external clock at the EXT CLK / P[1]4 pin. Refer to the technical reference manual for more details.
Table 11 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 11. AC External Clock Specifications
Min
Typ
Max
Unit
FOSCEXT
Parameter
Frequency
Description
0.750
–
25.2
MHz
–
High period
20.6
–
5300
ns
–
Low period
20.6
–
–
ns
–
Required time to run from IMO before switching to external clock
150
–
–
μs
AC Analog Mux Bus Specifications
The analog mux bus can connect signals from GPIOs to and from internal analog blocks and other GPIOs. Table 12 lists guaranteed
maximum and minimum specifications for the entire voltage and temperature ranges.
Table 12. AC Analog Mux Bus Specifications
Parameter
FSW
Description
Switch rate
Conditions
Pin voltage < 1.8 V
Min
Typ
Max
Unit
–
–
6.3
MHz
AC Programming Specifications
Table 13 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 13. AC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
1
–
20
ns
Fall time of ISSP CLK
1
–
20
ns
Data setup time to falling edge of ISSP
CLK
40
–
–
ns
THSCLK
Data hold time from falling edge of ISSP
CLK
40
–
–
ns
FSCLK
Frequency of ISSP CLK
0
–
8
MHz
TERASEB
Flash erase time (Block)
–
–
18
ms
TWRITE
Flash block write time
–
–
25
ms
TDSCLK2
Data out delay from falling edge of ISSP 3.0 ≤ DVDD ≤ 3.6
CLK
–
–
85
ns
TRSCLK
Rise time of ISSP CLK
TFSCLK
TSSCLK
Document Number: 001-44048 Rev. *G
Conditions
Page 21 of 36
[+] Feedback
CYONS2110
AC SPI Specifications
Table 14 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 14. AC SPI Master Specifications
Parameter
Description
[12]
Min
Typ
Max
Unit
fSCLK
SPI CLK frequency
–
–
FIMO/2
MHz
tSETUP
SPI MISO to SPI CLK setup time
60
–
–
ns
tHOLD
SPI CLK to SPI MISO hold time
40
–
–
ns
tOUT_SU
SPI MOSI to SPI CLK setup time
40
–
–
ns
tOUT_H
SPI CLK to SPI MOSI hold time
40
–
–
ns
Min
Typ
Max
Unit
–
–
12
MHz
Table 15. AC SPI Slave Specifications
Parameter
Description
fSCLK
SPI CLK frequency[12]
tLOW
Minimum SPI CLK low width[13]
41.67
–
–
ns
tHIGH
Minimum SPI CLK high width[13]
41.67
–
–
ns
tSETUP
SPI MOSI to SPI CLK setup time
25
–
–
ns
tHOLD
SPI CLK to SPI MOSI hold time
25
–
–
ns
tOUT_H
SPI CLK to SPI MISO hold time
35
–
–
ns
tSS_MISO
SPI SS to SPI MISO valid
–
–
100
ns
tSCLK_MISO
SPI CLK to SPI MISO valid
–
–
140
ns
tSS_HIGH
Minimum SPI SS high width
–
–
35
ns
tSS_CLK
Time from SPI SS low to first SPI CLK
–
–
20
ns
tCLK_SS
Time from last SPI CLK to SPI SS high
–
–
25
ns
Notes
12. Clock frequency is half of clock input to SPI block.
13. Value corresponds to 50% duty cycle at 12 MHz.
Document Number: 001-44048 Rev. *G
Page 22 of 36
[+] Feedback
CYONS2110
Figure 9. SPI Master Timing Diagram, Modes 0 and 2
Figure 10. SPI Master Timing Diagram, Modes 1 and 3
Document Number: 001-44048 Rev. *G
Page 23 of 36
[+] Feedback
CYONS2110
Figure 11. SPI Slave Timing Diagram, Modes 0 and 2
Figure 12. SPI Slave Timing Diagram, Modes 1 and 3
Document Number: 001-44048 Rev. *G
Page 24 of 36
[+] Feedback
CYONS2110
AC Comparator Specifications
The device includes two general purpose comparators, using internal or external signals from the analog mux bus. Table 16 lists
guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 16. AC Low Power Comparator Specifications
Symbol
TLPC
Description
Conditions
Comparator response time, 50 mV
overdrive
50 mV overdrive does not include
offset voltage.
Min
Typ
Max
Units
–
–
100
ns
AC I2C Specifications
The device includes an I2C slave block with an input filter that suppresses spikes and glitches on the clock and data lines. The block
can be configured for standard or fast mode. Table 17 lists guaranteed maximum and minimum specifications for the entire voltage
and temperature ranges.
Table 17. AC Characteristics of the I2C SDA and SCL Pins
Symbol
Standard Mode
Description
FSCLI2C
I2C_SCL clock frequency
Fast Mode
Units
Min
Max
Min
Max
0
100
0
400
kHz
THDSTAI2C
Hold time for START and Repeated START condition
4.0
–
0.6
–
μs
TLOWI2C
LOW period of the I2C_SCL clock
4.7
–
1.3
–
μs
THIGHI2C
HIGH period of I2C_SCL clock
4.0
–
0.6
–
μs
TSUSTAI2C
Setup time for a START and Repeated START condition
4.7
–
0.6
–
μs
THDDATI2C
Data hold time
0
–
0
–
μs
TSUDATI2C
Data setup time
250
–
100[14]
–
ns
TSUSTOI2C Setup time for STOP condition
4.0
–
0.6
–
μs
TBUFI2C
Bus free time between a STOP and START condition
4.7
–
1.3
–
μs
TSPI2C
Pulse width of spikes that are suppressed by the input filter
–
–
0
50
ns
Figure 13. Timing for Fast/Standard Mode on the I2C Bus
I2C_SDA
TSUDATI2C
THDSTAI2C
TSPI2C
THDDATI2CTSUSTAI2C
TBUFI2C
I2C_SCL
THIGHI2C TLOWI2C
S
START Condition
TSUSTOI2C
Sr
Repeated START Condition
P
S
STOP Condition
Note
14. A Fast-Mode I2C-bus device can be used in a Standard Mode I2C-bus system, but the requirement tSUDATI2C ≥ 250 ns must then be met. This automatically is the
case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit
to the SDA line trmax + tSUDATI2C = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 001-44048 Rev. *G
Page 25 of 36
[+] Feedback
CYONS2110
AC USB Specifications
The device includes an integrated full-speed USB block. Table 18 lists guaranteed maximum and minimum specifications for the entire
voltage and temperature ranges.
Table 18. AC Characteristics – USB Data Timing Specifications
Min
Typ
Max
Units
Tdrate
Symbol
Full-speed data rate
Description
Average bit rate
Conditions
12–0.25%
12
12 + 0.25
MHz
Tdjr1
Receiver data jitter tolerance
To next transition
–18.5
0
18.5
ns
Tdjr2
Receiver data jitter tolerance
To pair transition
–9
–
9
ns
Tudj1
Driver differential jitter
To next transition
–3.5
–
3.5
ns
Tudj2
Driver differential jitter
To pair transition
–4.0
–
4.0
ns
Tfdeop
Source jitter for differential transition
To SE0 transition
–2
–
5
ns
Tfeopt
Source SE0 interval of EOP
160
–
175
ns
Tfeopr
Receiver SE0 interval of EOP
82
–
–
ns
Tfst
Width of SE0 interval during differential
transition
–
–
14
ns
Min
Typ
Max
Units
4
–
20
ns
Table 19. AC Characteristics – USB Driver
Symbol
Tr
Description
Conditions
Transition rise time
50 pF
Tf
Transition fall time
50 pF
4
–
20
ns
TR
Rise/fall time matching
0.8V - 2.5V
90
–
111
%
Vcrs
Output signal crossover voltage
1.3
–
2.0
V
Document Number: 001-44048 Rev. *G
Page 26 of 36
[+] Feedback
CYONS2110
PCB Land Pads and Keepout Zones
Figure 14 and Figure 15 show the recommended land pad architecture and keepout zones. The pads on the 42-pin device are a
subset of the JEDEC MO-220 52-pin QFN standard. For detailed layout instructions, see application note AN48995, Mechanical
Design Considerations for the OvationONSTM II Laser Navigation System-on-Chip.
Figure 14. Land Pad Architecture and Spacing
Figure 15. PCB Keep Out Zones
Document Number: 001-44048 Rev. *G
Page 27 of 36
[+] Feedback
CYONS2110
Orientation of Axes
Figure 16 describes the relationship between the package and the x/y axes when using the API provided by Cypress’s PSoC Designer
software. Note that there is a 90-degree rotation between the orientation below and the orientation described in the register section
of the Technical Reference Manual. If PSoC Designer is not used, the application firmware should read and invert the Y count register
for X data, and read the X count register for Y data.
Figure 16. Sensor Orientation
PCB Mounting Height and Thickness
Figure 17 shows the recommended thickness and mounting height of the PCB above the tracking surface.
Figure 17. PCB Height and Thickness
Document Number: 001-44048 Rev. *G
Page 28 of 36
[+] Feedback
CYONS2110
Thermal Impedances
Table 20. Thermal Impedances per Package
Package
Typical θJA[15]
42 PQFN[16]
24 °C/W
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 21. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature[17]
Maximum Peak Temperature
42 PQFN
240°C
260°C
Notes
15. TJ = TA + Power x θJA.
16. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
17. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications. For a recommended soldering profile, refer to Application Note 49035, Manufacturing Considerations for the OvationONSTM Laser Navigation System-on-Chip.
Document Number: 001-44048 Rev. *G
Page 29 of 36
[+] Feedback
CYONS2110
Laser Safety Considerations
The CYONS2110 laser navigation SoC and the CYONSLENS2000
lens are designed and tested to enable manufacturers to achieve
eye safety certification with minimal effort. This section provides
guidelines for complying with the Class 1 emission requirements of
IEC/EN 60825-1.
Laser Output Power Test Procedure
When installed and operated in accordance with all requirements in
this datasheet, the kit consisting of the CYONS2110 Laser
Navigation SoC and CYONSLENS2000 satisfies CDRH 21 CFR
1040 per Laser Notice #50 and IEC/EN 60825-1 Class 1.
Registration Assistance
Laser Output Power
The CYONS2110 sensor package contains an integrated
VCSEL and drive circuitry. Before shipping, Cypress adjusts the
laser output power to eye-safe levels, taking into account
specified variations in supply voltage, temperature, lens
transmission, and VCSEL polarization, and factors such as
VCSEL aging and test equipment accuracy. The output remains
within eye-safe limits under reasonably foreseeable
single-faults, as required by the IEC standard.
From the perspective of a manufacturer, laser emission remains
within the Class 1 limit, as defined in IEC 60825-1, Edition 2,
2007, provided the following requirements are met.
■
The supply voltage applied to pins DVDD and AVDD of the SoC
must be in the range of 2.7 to 3.6V.
■
The operating temperature must be between 5 and 45 °C.
■
The laser output power must not be increased by any means,
including but not limited to firmware, hardware, or mechanical
modifications to the sensor or lens.
■
The mechanical housing must be designed such that the
CYONSLENS2000 cannot be removed by the user.
■
The device firmware must initialize the VCSEL driver as
described in the “VCSEL Driver” chapter of the OvationONS II
technical reference manual or by using the NAV or LaserNAV
User Modules in Cypress’s PSoC Designer software.
To verify the laser output level, follow the steps shown in the
“VCSEL Power Calibration and Verification” section of the
technical reference manual.
The mouse or end-product supplier is responsible for certifying
the end-use product with respect to the drive voltage, manuals
and labels, and operating temperature specifications.
Additionally, for products sold in the US, a CDRH report must be
filed for each model produced, and test and inspection of the
product’s characteristics as they relate to laser safety and the
CDRH requirements must be performed.
When filing a report with the CDRH, the supplier can refer to the
product report filed by Cypress for the CYONS2xxx family of
products. The Cypress report is based on the previously-noted
limits for voltage and temperature, and describes how the sensor
design includes consideration of drive circuit failures, laser
output variation with temperature, drive circuit variation with
temperature and voltage, polarization sensitivity of molded
optics, and measurement uncertainties.
Cypress can provide assistance to customers who wish to obtain
registration. Supporting documentation, including a verification
test procedure to demonstrate end-product compliance with IEC
and CDRH requirements is available. For further information,
contact a Cypress representative.
The manufacturer must ensure these conditions are always met
and demonstrate end-product compliance to the appropriate
regulatory standards.
Document Number: 001-44048 Rev. *G
Page 30 of 36
[+] Feedback
CYONS2110
Development Tool Selection
This section presents the development tools available for all
current PSoC device families including the CYONS2110.
Software
PSoC Designer
At the core of the PSoC development software suite is PSoC
Designer, used to generate PSoC firmware applications. PSoC
Designer
is
available
free
of
charge
at
http://www.cypress.com/psocdesigner and includes a free C
compiler with version Service Pack 4.5 or later.
Evaluation Tools
You can purchase the evaluation tools from the Cypress Online
Store.
CY3210-MiniProg1
The CY3210-MiniProg1 kit enables a user to program PSoC
devices using the MiniProg1 programming unit. The MiniProg is
a small, compact prototyping programmer that connects to the
PC via a provided USB 2.0 cable. The kit includes:
■
MiniProg programming unit
PSoC Programmer
■
MiniEval socket programming and evaluation board
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate
directly from PSoC Designer. PSoC Programmer software is
compatible with both PSoC ICE-Cube In-Circuit Emulator and
PSoC MiniProg. PSoC programmer is available free of charge at
http://www.cypress.com/psocprogrammer.
■
28-pin CY8C29466-24PXI PDIP PSoC device sample
■
28-pin CY8C27443-24PXI PDIP PSoC device sample
■
PSoC Designer software CD
■
Getting Started guide
■
USB 2.0 cable
Mouse Design Kits
CY3210-PSoCEval1
Two kits featuring the OvationONS II family of products are
available. The reference design kit provides a complete
hardware, firmware, and software solution, ready for production.
The demonstration kit provides tested hardware and firmware
that demonstrate the capabilities of the OvationONS II device.
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit
includes:
■
CY4631 Wired Mouse Reference Design Kit
■
Evaluation board with LCD module
■
Wireless Mouse Demonstration Kit
■
MiniProg programming unit
Development Kits
■
28-pin CY8C29466-24PXI PDIP PSoC device sample (2)
You can purchase the development kits from the Cypress Online
Store.
■
PSoC Designer software CD
■
Getting Started guide
■
USB 2.0 cable
CY3215-DK Basic Development Kit
The CY3215-DK kit enables prototyping and development with
PSoC Designer. This kit supports in-circuit emulation and the
software interface enables users to run, halt, and single step the
processor and view the content of specific memory locations.
Advanced emulation features are also supported through PSoC
Designer. The kit includes:
CY3214-PSoCEvalUSB
■
PSoC Designer software CD
■
ICE-Cube In-Circuit Emulator
The CY3214-PSoCEvalUSB evaluation kit features a development board for the CY8C24794-24LFXI PSoC device. Special
features of the board include both USB and capacitive sensing
development and debugging support. This evaluation board also
includes an LCD module, potentiometer, LEDs, an enunciator
and plenty of bread boarding space to meet all of your evaluation
needs. The kit includes:
■
ICE Flex-Pod for CY8C29x66 family
■
PSoCEvalUSB board
■
Cat-5 adapter
■
LCD module
■
Mini-Eval programming board
■
MIniProg programming unit
■
110 ~ 240 V power supply, Euro-Plug adapter
■
Mini USB cable
■
iMAGEcraft C compiler (registration required)
■
PSoC Designer and example projects CD
■
ISSP cable
■
Getting Started guide
■
USB 2.0 cable and Blue Cat-5 cable
■
Wire pack
■
Two CY8C29466-24PXI 28-PDIP chip samples
Document Number: 001-44048 Rev. *G
Page 31 of 36
[+] Feedback
CYONS2110
Device Programmers
CY3207ISSP In-System Serial Programmer (ISSP)
You can purchase the device programmers from the Cypress
Online Store.
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
CY3216 Modular Programmer
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
Note CY3207ISSP needs special software and is not compatible
with PSoC Programmer.
The kit includes:
■
CY3207 programmer unit
■
Modular programmer base
■
PSoC ISSP software CD
■
Three programming module cards
■
110 ~ 240 V power supply, Euro-Plug adapter
■
MiniProg programming unit
■
USB 2.0 cable
■
PSoC Designer software CD
Third Party Tools
■
Getting Started guide
■
USB 2.0 cable
Several tools have been specially designed by third-party
vendors to accompany PSoC devices during development and
production. Specific details for each of these tools are found at
http://www.cypress.com.
Document Number: 001-44048 Rev. *G
Page 32 of 36
[+] Feedback
CYONS2110
Package Diagrams
Figure 18. QFN Package
SIDE VIEW
TOP VIEW
0.05 MAX
8.300 SQ
1.40 MAX
BOTTOM VIEW
0.50-0.60
[2X]
SEE DETAIL - B
SEE DETAIL - A
~
~
2
Pin 1
0.20 MAX
+0.05
0.42-0.00 X 45° [4X]
0.50-0.60
(PIN1 ID)
SEATING PLANE
+0.025
[2X] Ø0.64 -0.025 THRU
DETAIL - A
SCALE: 2/1
NOTES:
1. ALL DIMENSIONS ARE IN MM , [ MIN/MAX]
2. REFRENCE JEDEC # MO-220
3. PKG WEIGHT: 0.2 grams
+0.025
Ø0.64 -0.025 THRU
DETAIL - B
4. APERTURE MOLD CAVITY I .D.
NON-SOLDERABLE PADS
001-44934 *C
SCALE: 2/1
Document Number: 001-44048 Rev. *G
Page 33 of 36
[+] Feedback
CYONS2110
Figure 19. Lens
001-44677 *B
Ordering Information
The CYONS2110 and CYONSLENS2000 are sold separately. When placing orders, order both part numbers
Part Number
Package
CYONS2110-LBXC
42 Pin PQFN
CYONSLENS2000-C
Lens - 4 mm height
Application
High Performance wired and wireless
Molded optic
Ordering Code Definition
CY ONS XXXX - XXX C
Temperature range:
Commercial
42- pin PQFN package
Wired laser navigation system-on-chip
Optical navigation sensor
Company ID : CY = Cypress
Document Number: 001-44048 Rev. *G
Page 34 of 36
[+] Feedback
CYONS2110
Document Conventions
Numeric Naming
Hexadecimal numbers are represented with all letters in
uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (for example, ‘01010100b’ or
‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or ‘0x’ are
decimal.
Acronyms Used
Table 22 lists the acronyms used in this document.
Units of Measure
The units of measure in Table 23 lists the abbreviations used to
measure the devices.
Table 22. Acronyms
Acronym
Description
Acronym
Description
AC
Alternating Current
LDO
Low Drop Out (regulator)
ADC
Analog to Digital Converter
LED
Light Emitting Diode
API
Application Programming Interface
LPC
Low Power Comparator
CDRH
Center for Devices and Radiological Health
LSb
Least-significant Bit
CPI
Counts per Inch
LVD
Low Voltage Detect
CPU
Central Processing Unit
M8C
Cypress’ 8-bit CPU Core
DAC
Digital to Analog Converter
MCU
Microcontroller Unit
DC
Direct Current
MIPS
Million Instructions per Second
DSP
Digital Signal Processor
MSb
Most-significant Bit
ESD
Electrostatic Discharge
MUX
Multiplexer
GND
Ground
PC, PCB
Printed Circuit, Printed Circuit Board
GPIO
General Purpose I/O
PDIP
Plastic Dual In-Line Package
HEX
Hexadecimal
PGA
Programmable Gain Amplifier
Hi-Z
High Impedance
POR
Power On Reset
I2C
Inter-Integrated Circuit (bus)
PQFN
Plastic Quad Flat No-Leads (package)
ICE
In-circuit Emulator
PSoC
Programmable System-on-Chip
IDAC
DAC-Controlled Current Source
PSRR
Power Supply Rejection Ratio
IDE
Integrated Development Environment
PWM
Pulse Width Modulator
IEC
International Electrotechnical Commission
QFN
Quad Flat No-Leads (package)
ILO
Internal Low Speed Oscillator
SoC
System on Chip
IMO
Internal Main Oscillator
SPI
Serial Peripheral Interface (bus)
I/O
Input/Output
SRAM
Static Random Access Memory
JEDEC
Joint Electron Devices Engineering Council
USB
Universal Serial Bus
LCD
Liquid Crystal Display
VCSEL
Vertical Cavity Surface Emitting Laser
Table 23. Units of Measure
Symbol
Unit of Measure
Symbol
Unit of Measure
°C
degree Celsius
μV
microvolts
g
acceleration of gravity
mA
milliampere
KB
1024 bytes
ms
millisecond
in/s
inches per second
mV
millivolt
kHz
kilohertz
nH
nanohenry
kΩ
kilohm
nm
nanometer
kV
kilovolt
ns
nanosecond
MHz
megahertz
Ω
ohm
μA
microampere
pF
picofarad
μF
microfarad
pp
peak-to-peak
μH
microhenry
V
volt
μs
microsecond
W
watt
Document Number: 001-44048 Rev. *G
Page 35 of 36
[+] Feedback
CYONS2110
Document History Page
Document Title: CYONS2110 OvationONS™ II Wired / Wireless Laser Navigation System-on-Chip
Document Number: 001-44048
Revision
ECN
Orig. of
Change
Submission
Date
**
2261927
FJZ
See ECN
*A
2580125
FJZ
10/07/08
Extensive Updates
*B
2769396
FJZ/AESA
25/09/09
Updated Getting Started and Development Tools sectionsUpdated thermal
impedance, wireless kit info, Flash specs, storage temperature, I2C footnote,
external mode powering, reference schematic, power specifications, pin table,
and c compiler information.
*C
2889331
FJZ
03/09/10
Added Table of Contents. Updated package diagram and sales links.
*D
2903558
FJZ
04/20/10
Update LVD, USB, SPI Master and SPI Slave specs, numerous minor updates
for improved clarity and consistency
*E
2936335
MMCY
05/24/2010
Updated content to match the new template and style guide.
No technical updates.
*F
3092209
FJZ
11/22/2010
Corrected error in Pin Description.
Removed invalid reference to application note in Registration Assistance.
*G
3126503
FJZ
01/03/2011
Updated Figure 19. Changed posting to external web
Description of Change
CYONS2110 New Data Sheet.
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
Automotive
Clocks & Buffers
Interface
Lighting & Power Control
PSoC Solutions
cypress.com/go/automotive
psoc.cypress.com/solutions
cypress.com/go/clocks
PSoC 1 | PSoC 3 | PSoC 5
cypress.com/go/interface
cypress.com/go/powerpsoc
cypress.com/go/plc
Memory
Optical & Image Sensing
PSoC
Touch Sensing
USB Controllers
Wireless/RF
cypress.com/go/memory
cypress.com/go/image
cypress.com/go/psoc
cypress.com/go/touch
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2008-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-44048 Rev. *G
Revised January 3, 2011
Page 36 of 36
OvationONS™, OptiCheck™, and PSoC Designer™ are trademarks and PSoC and CapSense are registered trademarks of Cypress Semiconductor Corp. All other trademarks or registered trademarks
referenced herein are property of the respective corporations.
[+] Feedback