STM32TS60 Multitouch screen controller device using a digital resistive touchpanel with I²C, SPI, UART and USB interfaces Data brief Features FBGA ■ Patented digital resistive multitouchpanel technology powered by PmatrixTM firmware engine ■ Able to track up to 10 independent touches simultaneously ■ Finger, nail and any stylus touch capability ■ Up to 0.17 mm resolution ■ Touch actuation force information Applications ■ No calibration requirements ■ Gaming devices ■ Typical touchpanel scan rate of 125 Hz up to 250 Hz ■ Mobile handsets ■ Smart phones ■ Single- or dual-chip architecture able to support up to 10.1” screens ■ Portable media players ■ Single-chip controller able to support up to 129 rows/columns coming from the sensor matrix. ■ Personal navigation devices ■ Mobile internet devices ■ Embedded compensation resistors for reduced BOM and easy connection to the touchpanel ■ Netbooks ■ I2C, SPI, UART and USB communication interfaces ■ Very low power mode allowing “wakeup on touch/release” mode ■ Wakeup response time: 10 µs from Sleep mode and 100 µs from Standby mode Table 1. UFBGA144 (7 x 7 mm) STM32TS60 device summary Feature Description Touchpanel size 2.5" to 6” (single device) / 6" to 10.1” (dual device) / 10.4” to 15.4” (quad device) Columns, rows Up to 129 rows and columns with a maximum of 64 rows and 81 columns (see main configurations in Figure 2) Interface I²C, SPI, UART and USB Supply voltage range 2.4 to 3.6 V Max. temperature range Package December 2009 -40 °C to +85 °C UFBGA 144 (7 x 7 mm, 0.5 pitch) ECOPACK® package Doc ID 16925 Rev 1 For further information contact your local STMicroelectronics sales office. 1/18 www.st.com 1 Contents STM32TS60 Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.2 Main benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.3 Other benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Ballout and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Application diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2/18 Doc ID 16925 Rev 1 STM32TS60 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. STM32TS60 device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 STM32TS60 pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Single-device typical application passive component list . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Dual-device typical application passive component list . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Doc ID 16925 Rev 1 3/18 List of figures STM32TS60 List of figures Figure 1. Figure 2. Figure 3. 4/18 STM32TS60 device UFBGA144 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Single-device typical application schematic for 2.5” to 6” panels . . . . . . . . . . . . . . . . . . . . 13 Dual-device typical application schematic for 6” to 10.1” panels . . . . . . . . . . . . . . . . . . . . 14 Doc ID 16925 Rev 1 STM32TS60 Description 1 Description 1.1 Device overview The STM32TS60 product is a multitouch controller device based on Stantum's patented digital resistive multitouch technology. This technology employs the connectivity power of the universal serial bus (USB) with Cortex™-M3 processors and ARM architecture. Conventional resistive touch controllers are unable to detect more than one contact at a time. Thanks to the STM32TS60 device, it is possible to detect and track up to ten contacts over a touchpanel. The STM32TS60 delivers an exact image of what is happening on the touchpanel surface in the most reliable way with very fast response time and with high noise immunity performances. 1.2 Main benefits The STM32TS60 represents a breakthrough over competing technologies, bringing outstanding multitouch performance with the best power budget. The resistive technology does not require any panel scan during Standby. Consequently, the STM32TS60 device has very low standby power consumption. In addition, this device benefits from the industry-leading mW/MIPS power performance of the ARM Cortex-M3 core. 1.3 Other benefits ● Unique resistive true multitouch technology with up to 10 touches at a time ● Finger, nail and any stylus touch capability ● Fingers actuation force detection based on linear measurement of the touch area surface variation ● High responsiveness with low power consumption (at standby, near zero consumption) ● Homogeneous sensitivity on all points of the touchpanel area ● No calibration ● IP protected by solid patents based on proven resistive technology with very powerful EMI (electromagnetic insulation). ● Very low power Standby mode and zero power resistive panel ● Panel adapted from the proven high-volume resistive technology; able to reach high durability and 90 % transparency. Doc ID 16925 Rev 1 5/18 Ballout and pin description STM32TS60 2 Ballout and pin description Figure 1. STM32TS60 device UFBGA144 ballout ! #/, #/, #/, #/, #/, 6$$ ? 633 ? 7!+%50 30)?.33 #/, 2/7 #/, 2/7 #/, 2/7 #/, 2/7 " #/, #/, #/, #/, #/, /3#?/54 #/, )# 3#, 53" $- #/, 2/7 #/, 2/7 #/, 2/7 #/, 2/7 # #/, #/, #/, #/, 2/7 /3#?). #/, .#(' )# 3$! 53" $0 #/, 2/7 #/, 2/7 #/, 2/7 $ #/, #/, #/, #/, #/, 30)?3) 5!24?28 30)?3#+ )#?3#, 30)?3/ )#?3$! 5!24?48 #/, #/, 2/7 #/, 2/7 #/, 2/7 % 2/7 2/7 2/7 2/7 #/, 2/7 2/7 #/, #/, 30)?-)3/ #/, #/, 2/7 #/, 2/7 & 2/7 2/7 2/7 2/7 2/7 2/7 2/7 #/, #/, #/, #/, #/, ' 2/7 2/7 2/7 2/7 2/7 "// 4 53"? 05,,50 #/, #/, #/, #/, ( 2/7 2/7 2/7 2/7 2/7 #/,? *4#+ 37#,+ #/, *4-3 37$)/ #/, #/, #/, #/, #/, * 2/7 2/7 2/7 2/7 2/7 2/7 #/, *4234 #/, #/, #/, #/, #/, + 2/7 2/7 2/7 2/7 2/7 2/7 .234 #/, *4$/ #/, #/, #/, #/, , 2/7 2/7 2/7 2/7 2/7 2/7 2/7 #/, *4$) #/, #/, #/, #/, - 2/7 2/7 2/7 2/7 2/7 6$$ ? 633 ? #/, #/, #/, #/, #/, 30)?3#+ 30)?-/3) #/, #/, AI 6/18 Doc ID 16925 Rev 1 STM32TS60 Ballout and pin description Table 2. STM32TS60 pin definitions Pin no. Pin type(1) Pin level(2) A1 O COL55 Touchpanel column 55 A2 O COL61 Touchpanel column 61 A3 O COL63 Touchpanel column 63 A4 O COL52 Touchpanel column 52 A5 O COL23 Touchpanel column 23 A6 S VDD_1 Supply voltage pin 1 A7 S VSS_1 Ground pin 1 A8 I WAKEUP/SPI1_NSS A9 IO COL2/ROW50 Touchpanel column 2 Touchpanel row 50 A10 IO COL4/ROW52 Touchpanel column 4 Touchpanel row 52 A11 IO COL6/ROW54 Touchpanel column 6 Touchpanel row 54 A12 IO COL8/ROW56 Touchpanel column 8 Touchpanel row 56 B1 O COL64 Touchpanel column 64 B2 O COL49 Touchpanel column 49 B3 O COL54 Touchpanel column 54 B4 O COL53 Touchpanel column 53 B5 O COL25 Touchpanel column 25 B6 O OSC_OUT/COL78 B7 OD B8 PIn name Pin function Device wakeup capability. SPI1 slave select (active low) for host controller communication. Crystal/resonator oscillator output Touchpanel column 78 I2C2_SCL(3) I2C2 clock to Haptic system IO USBDM USB data for host controller communication B9 IO COL10/ROW58 Touchpanel column 10 Touchpanel row 58 B10 IO COL14/ROW62 Touchpanel column 14 Touchpanel row 62 B11 IO COL12/ROW60 Touchpanel column 12 Touchpanel row 60 B12 IO COL13/ROW61 Touchpanel column 13 Touchpanel row 61 C1 O COL62 Touchpanel column 62 C2 O COL56 Touchpanel column 56 FT Doc ID 16925 Rev 1 7/18 Ballout and pin description Table 2. STM32TS60 pin definitions (continued) Pin no. Pin type(1) C3 O COL57 Touchpanel column 57 C4 O COL59 Touchpanel column 59 C5 IO ROW13 Touchpanel row 13 C6 I OSC_IN/COL77 C7 IO Pin level(2) FT PIn name NCHG Pin function Crystal/resonator oscillator input Touchpanel column 77 Touchpanel change output (active low) (3) I2C2 data to Haptic system C8 OD I2C2_SDA C9 IO USBDP C10 IO COL16/ROW64 Touchpanel column 16 Touchpanel row 64 C11 IO COL11/ROW59 Touchpanel column 11 Touchpanel row 59 C12 IO COL9/ROW57 Touchpanel column 9 Touchpanel row 57 D1 O COL50 Touchpanel column 50 D2 O COL51 Touchpanel column 51 D3 O COL58 Touchpanel column 58 D4 O COL60 Touchpanel column 60 D5 IO COL71 Touchpanel column 71 D6 D7 8/18 STM32TS60 I/I I/OD SPI1_SI/UART_RX FT FT SPI1_SCK/I2C1_SCL USB data+ for host controller communication SPI1 slave in for host controller communication. UART data receive for host controller communication. SPI1 clock input for host controller communication. I2C1 clock input for host controller communication. SPI1 slave out for host controller communication. SPI1_SO/I2C1_SDA/UART_TX I2C1 data for host controller communication. UART data transmit to host controller. D8 O/OD/O D9 IO COL73 Touchpanel column 73 D10 IO COL7/ROW55 Touchpanel column 7 Touchpanel row 55 D11 IO COL1/ROW49 Touchpanel column 1 Touchpanel row 49 D12 IO COL5/ROW53 Touchpanel column 5 Touchpanel row 53 E1 IO ROW33 Doc ID 16925 Rev 1 Touchpanel row 33 STM32TS60 Ballout and pin description Table 2. STM32TS60 pin definitions (continued) Pin no. Pin type(1) Pin level(2) E2 IO ROW37 Touchpanel row 37 E3 IO ROW39 Touchpanel row 39 E4 IO ROW38 Touchpanel row 38 E5 IO COL74 Touchpanel column 74 E6 IO ROW1 Touchpanel row 1 E7 IO ROW2 Touchpanel row 2 E8 O COL17 Touchpanel column 17 E9 O COL76 Touchpanel column 76 E10 IO/O SPI2_MISO(4)/COL66 E11 IO COL3/ROW51 Touchpanel column 3 Touchpanel row 51 E12 IO COL15/ROW63 Touchpanel column 15 Touchpanel row 63 F1 IO ROW41 Touchpanel row 41 F2 IO ROW34 Touchpanel row 34 F3 IO ROW35 Touchpanel row 35 F4 IO ROW36 Touchpanel row 36 F5 IO ROW3 Touchpanel row 3 F6 IO ROW12 Touchpanel row 12 F7 IO ROW10 Touchpanel row 10 F8 O COL28 Touchpanel column 28 F9 O COL30 Touchpanel column 30 F10 IO COL72 Touchpanel column 72 F11 O COL27 Touchpanel column 27 F12 O COL29 Touchpanel column 29 G1 IO ROW44 Touchpanel row 44 G2 IO ROW45 Touchpanel row 45 G3 IO ROW43 Touchpanel row 43 G4 IO ROW42 Touchpanel row 42 G5 IO ROW4 Touchpanel row 4 G6 I BOOT0 G7 O USB_PULL-UP/COL75 PIn name Doc ID 16925 Rev 1 Pin function SPI2 master in/slave out from/to STMT controller device (extension interface). Touchpanel column 66. USB pull-up control Touchpanel column 75 9/18 Ballout and pin description Table 2. 10/18 STM32TS60 STM32TS60 pin definitions (continued) Pin no. Pin type(1) Pin level(2) G8 IO/O SPI2_SCK(4)/COL65 SPI2 clock output/input from/to STMT controller device (extension interface). Touchpanel column 65. G9 IO/O SPI2_MOSI(4)/COL67 SPI2 master out/slave in from/to STMT controller device (extension interface). Touchpanel column 67 G10 O COL31 Touchpanel column 31 G11 O COL21 Touchpanel column 21 G12 O COL32 Touchpanel column 32 H1 IO ROW48 Touchpanel row 48 H2 IO ROW46 Touchpanel row 46 H3 IO ROW47 Touchpanel row 47 H4 IO ROW40 Touchpanel row 40 H5 IO ROW5 Touchpanel row 5 H6 I/IO COL80/JTCK/SWCLK Touchpanel column 80 JTAG clock Serial wire clock H7 I/IO COL79/JTMS/SWDIO Touchpanel column 79 JTAG mode selection Serial wire data input/output H8 O COL19 Touchpanel column 19 H9 O COL20 Touchpanel column 20 H10 O COL24 Touchpanel column 24 H11 O COL22 Touchpanel column 22 H12 O COL26 Touchpanel column 26 J1 IO ROW20 Touchpanel row 20 J2 IO ROW21 Touchpanel row 21 J3 IO ROW19 Touchpanel row 19 J4 IO ROW18 Touchpanel row 18 J5 IO ROW6 Touchpanel row 6 J6 IO ROW11 Touchpanel row 11 J7 IO COL69/JTRST Touchpanel column 69 JTAG reset J8 O COL18 Touchpanel column 18 J9 O COL46 Touchpanel column 46 J10 O COL40 Touchpanel column 40 J11 O COL35 Touchpanel column 35 PIn name Doc ID 16925 Rev 1 Pin function STM32TS60 Ballout and pin description Table 2. STM32TS60 pin definitions (continued) Pin no. Pin type(1) Pin level(2) J12 O COL47 Touchpanel column 47 K1 IO ROW22 Touchpanel row 22 K2 IO ROW17 Touchpanel row 17 K3 IO ROW24 Touchpanel row 24 K4 IO ROW26 Touchpanel row 26 K5 IO ROW7 Touchpanel row 7 K6 IO ROW14 Touchpanel row 14 K7 IO NRST Reset (active low) K8 O/O COL68/JTDO Touchpanel column 68 JTAG data output K9 O COL41 Touchpanel column 41 K10 O COL42 Touchpanel column 42 K11 O COL44 Touchpanel column 44 K12 O COL48 Touchpanel column 48 L1 IO ROW23 Touchpanel row 23 L2 IO ROW28 Touchpanel row 28 L3 IO ROW29 Touchpanel row 29 L4 IO ROW31 Touchpanel row 31 L5 IO ROW9 Touchpanel row 9 L6 IO ROW16 Touchpanel row 16 L7 IO ROW15 Touchpanel row 15 L8 IO COL81/JTDI Touchpanel column 81 JTAG data input L9 O COL33 Touchpanel column 33 L10 O COL43 Touchpanel column 43 L11 O COL37 Touchpanel column 37 L12 O COL45 Touchpanel column 45 M1 IO ROW25 Touchpanel row 25 M2 IO ROW27 Touchpanel row 27 M3 IO ROW30 Touchpanel row 30 M4 IO ROW32 Touchpanel row 32 M5 IO ROW8 Touchpanel row 8 M6 S VDD_2 Supply voltage pin 2 M7 S VSS_2 Ground pin 2 M8 IO COL70 Touchpanel column 70 PIn name Doc ID 16925 Rev 1 Pin function 11/18 Ballout and pin description Table 2. STM32TS60 STM32TS60 pin definitions (continued) Pin no. Pin type(1) Pin level(2) M9 O COL34 Touchpanel column 34 M10 O COL38 Touchpanel column 38 M11 O COL39 Touchpanel column 39 M12 O COL36 Touchpanel column 36 PIn name Pin function 1. I = input pin, O = output push-pull, IO = input/output, OD = output open drain, S = supply pin 2. FT = 5 V tolerant 3. I2C2 interface is designed to drive an Haptic system 4. SPI2 is used to interconnect the STMT controller for multidevice systems. 12/18 Doc ID 16925 Rev 1 STM32TS60 Application diagrams Figure 2. Single-device typical application schematic for 2.5” to 6” panels HOST CONTROLLER SPI, I2C or UART USB VDD VDD R6 R4 R3 R5 R2 C2 NRST USB_DP USB_DM USB_PULLUP C3 C4 C5 VSS1 VSS2 COL C1 OSC_OUT VDD1 VDD2 ROW R1 SPI1_NSS OSC_IN X1 SPI1_SI/UART_RX SWCLK SPI1_SCK/I2C1_SCL DEV TOOLS NCHG C6 SWDIO SPI1_SO/I2C1_SDA/UART_TX 3 Application diagrams BOOT0 TOUCHPANEL 2.5” ~ 6” Table 3. Ref. C1,C2 X1 R1 Single-device typical application passive component list Typ. Value Comment 18 pF For USB interface only 16 MHz For USB interface only (1) For USB interface only Ref. Typ. value Comment C3,C4 100 nF Decoupling capacitors C5 1 µF Filtering capacitors C6 10 nF Reset filter R2 10 KΩ R5 1.5 KΩ For USB interface only R3,R4 4.7 KΩ For I2C interface only R6 10 KΩ Reset filter 1. Value depends on resonator or crystal RS resistance. Doc ID 16925 Rev 1 13/18 Application diagrams Figure 3. STM32TS60 Dual-device typical application schematic for 6” to 10.1” panels HOST CONTROLLER SPI, I2C or UART USB VDD VDD R6 R4 R3 R5 R2 NRST C6 SWDIO DEV TOOLS SWCLK C3 C4 C5 VSS1 COL VSS2 ROW SPI2_MISO C2 SPI2_SCK C1 VDD2 OSC_OUT SPI2_MOSI R1 VDD1 STM32TS60 “MASTER” OSC_IN X1 BOOT0 TOUCHPANEL 6” ~ 10.1” Sub-panel #2 VDD NRST COL ROW SPI2_MISOI SPI2_SCK DEV TOOLS SPI2_MOSI Sub-panel #1 VDD1 VDD2 C3’ STM32TS60 “SLAVE” VSS1 VSS2 BOOT0 14/18 Doc ID 16925 Rev 1 C4’ C5’ STM32TS60 Application diagrams Table 4. Ref. C1,C2 X1 R1 Dual-device typical application passive component list Typ. value Comment Ref. 18 pF For USB interface only C3,C4,C3’,C4’ 16 MHz For USB interface only (1) – R2 10KΩ R3,R4 4.7KΩ For USB interface only For I2C interface only Typ. value Comment 100 nF Decoupling capacitors C5, C5’ 1 µF Filtering capacitors C6 10 nF Reset filter R5 1.5 KΩ For USB interface only R6 10 KΩ Reset filter 1. Value depends on resonator or crystal RS resistance. Doc ID 16925 Rev 1 15/18 Part numbering 4 STM32TS60 Part numbering Table 5. Ordering information scheme Example: STM32 TS 60 Z H 6 xx y Device family STM32 = ARM-based 32-bit microcontroller Device sub-family TS = touchscreen family Touch sensing technology 60 = multitouch resistive Pin count Z = 144 pins Package H = UFBGA Temperature range 6 = industrial temperature range –40°C to 85°C Firmware configuration Firmware revision For further information on any aspect of this device, please contact your nearest ST Sales Office. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. 16/18 Doc ID 16925 Rev 1 STM32TS60 5 Revision history Revision history Table 6. Document revision history Date Revision 16-Dec-2009 1 Changes Initial release Doc ID 16925 Rev 1 17/18 STM32TS60 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 18/18 Doc ID 16925 Rev 1