ROHM RZL025P01

RZL025P01
Transistors
1.5V Drive Pch MOSFET
RZL025P01
zDimensions (Unit : mm)
zStructure
Silicon P-channel MOSFET
0.2Max.
TUMT6
zFeatures
1) Low on-resistance.
2) High power package.
3) Low voltage drive. (1.5V)
Abbreviated symbol : YC
zApplication
Switching
zPackaging specifications
Package
Type
zEquivalent circuit
Taping
(6)
(5)
(4)
TR
Code
Basic ordering unit (pieces)
3000
∗2
RZL025P01
∗1
(1)
(2)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
(3)
(1) Drain
(2) Drain
(3) Gate
(4) Source
(5) Drain
(6) Drain
zAbsolute maximum ratings (Ta=25°C)
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body diode)
Continuous
Pulsed
Continuous
Pulsed
Total power dissipation
Channel temperature
Range of Storage temperature
Symbol
VDSS
VGSS
ID
IDP ∗1
IS
ISP ∗1
PD ∗2
Tch
Tstg
Limits
−12
±10
±2.5
±10
−0.8
−10
1.0
150
−55 to +150
Unit
V
V
A
A
A
A
W
°C
°C
Symbol
Rth (ch-a) ∗
Limits
125
°C / W
∗1 Pw≤10µs, Duty cycle≤1%
∗2 Mounted on a ceramic board
zThermal resistance
Parameter
Channel to ambient
Unit
∗ When mounted on a ceramic board.
1/5
RZL025P01
Transistors
zElectrical characteristics (Ta=25°C)
Parameter
Symbol Min.
IGSS
Gate-source leakage
−
Drain-source breakdown voltage V(BR) DSS −12
Zero gate voltage drain current
−
IDSS
Gate threshold voltage
VGS (th) −0.3
−
Static drain-source on-state
−
∗
RDS (on)
resistance
−
−
Forward transfer admittance
Yfs ∗ 3.5
Ciss
Input capacitance
−
−
Coss
Output capacitance
−
Crss
Reverse transfer capacitance
td (on) ∗
−
Turn-on delay time
tr ∗
−
Rise time
td (off) ∗
−
Turn-off delay time
tf ∗
−
Fall time
−
Qg ∗
Total gate charge
−
Qgs ∗
Gate-source charge
−
Qgd ∗
Gate-drain charge
Typ.
Max.
−
−
−
−
44
60
81
±10
−
−1
−1.0
61
84
121
110
−
1350
130
125
9
35
130
85
13
2.5
2.0
220
−
−
−
−
−
−
−
−
−
−
−
Unit
µA
V
µA
V
mΩ
mΩ
mΩ
mΩ
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
Conditions
VGS=±10V, VDS=0V
ID= −1mA, VGS=0V
VDS= −12V, VGS=0V
VDS= −6V, ID= −1mA
ID= −2.5A, VGS= −4.5V
ID= −1.2A, VGS= −2.5V
ID= −1.2A, VGS= −1.8V
ID= −0.5A, VGS= −1.5V
VDS= −6V, ID= −2.5A
VDS= −6V
VGS=0V
f=1MHz
ID= −1.2A
VDD −6V
VGS= −4.5V
RL 5Ω
RG=10Ω
VDD −6V, ID= −2.5A
VGS= −4.5V
RL 2.4Ω, RG=10Ω
∗Pulsed
zBody diode characteristics(Source-drain) (Ta=25°C)
Parameter
Forward voltage
Symbol
VSD
∗
Min.
Typ.
Max.
Unit
−
−
−1.2
V
Conditions
IS= −2.5A, VGS=0V
∗ Pulsed
2/5
RZL025P01
Transistors
zElectrical characteristic curves
10
10
8
6
VGS= -1.6V
4
2
Ta=25℃
Pulsed
8
4
VGS= -1.5V
2
VGS= -1.2V
VGS= -1.2V
0
0
0.0
0.2
0.4
0.6
0.8
1.0
0
6
8
100
.
VGS= -1.5V
VGS= -1.8V
VGS= -2.5V
VGS= -4.5V
10
0.1
1
Ta=125℃
Ta=75℃
Ta=25℃
Ta= -25℃
10
0.1
1
10
100
Ta=125℃
Ta=75℃
Ta=25℃
Ta= -25℃
10
0.1
1
10
DRAIN CURRENT : -ID [A]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅳ)
REVERSE DRAIN CURRENT : -Is [A]
Ta=125℃
Ta=75℃
Ta=25℃
Ta= -25℃
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅲ)
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅱ)
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) [mΩ]
100
VGS= -1.5V
Pulsed
100
Ta=125℃
Ta=75℃
Ta=25℃
Ta= -25℃
10
0.1
1
10
DRAIN CURRENT : -ID [A]
1000
VGS= -1.8V
Pulsed
1.5
VGS= -2.5V
Pulsed
DRAIN CURRENT : -ID [A]
1000
1.0
Fig.3 Typical Transfer Characteristics
100
10
1
0.5
GATE-SOURCE VOLTAGE : -VGS [V]
1000
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅰ)
0.1
0.1
0.0
VGS= -4.5V
Pulsed
DRAIN CURRENT : -ID [A]
10
Ta= 125°C
Ta= 75℃
Ta= 25℃
Ta= - 25℃
0.01
10
1000
Ta=25℃
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) [mΩ]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) [mΩ]
4
1
Fig.2 Typical Output Characteristics(Ⅱ)
Fig.1 Typical Output Characteristics(Ⅰ)
1000
2
VDS= -6V
Pulsed
DRAIN-SOURCE VOLTAGE -VDS[V]
DRAIN-SOURCE VOLTAGE -VDS[V]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) [mΩ]
VGS= -1.8V
VGS= -10V
VGS= -4.5V
VGS= -2.5V
6
DRAIN CURRENT : -ID [A]
VGS= -10V
VGS= -4.5V
VGS= -4.0V
VGS= -2.5V
VGS= -2.0V
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) [mΩ]
Ta=25℃
Pulsed
DRAIN CURRENT -ID[A]
DRAIN CURRENT -ID[A]
10
10
DRAIN CURRENT : -ID [A]
Fig.8 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅳ)
10
VGS=0V
Pulsed
1
Ta=125℃
Ta=75℃
Ta=25℃
Ta=-25℃
0.1
0.01
0.0
0.2
0.4
0.6
0.8
1.0
SOURCE-DRAIN VOLTAGE : -VSD [V]
Fig.9 Reverse Drain Current
vs. Sourse-Drain Voltage
3/5
1.2
RZL025P01
200
VDS= -6V
Pulsed
150
ID= -2.5A
100
ID= -1.2A
50
0
10
Ta= -25℃
Ta=25℃
Ta=75℃
Ta=125℃
1
5
0.1
10
GATE-SOURCE VOLTAGE : -VGS [V]
1.0
10.0
DRAIN CURRENT : -ID [A]
Ta=25℃
VDD= -6V
ID= -2.5A
RG=10Ω
Pulsed
4
3
2
1
0
2
4
6
8
10
Ciss
Crss
100
Coss
Ta=25℃
f=1MHz
VGS=0V
10
0.01
0.1
1
10
DRAIN-SOURCE VOLTAGE : -VDS [V]
Fig.13 Typical Capacitance
vs. Drain-Source Voltage
100
SWITCHING TIME : t [ns]
1000
tf
100
10
td(on)
Ta=25℃
VDD= -6V
VGS=-4.5V
RG=10Ω
Pulsed
tr
1
0.01
0.1
14
Fig.12 Dynamic Input Characteristics
1000
td(off)
12
TOTAL GATE CHARGE : Qg [nC]
Fig.11 Forward Transfer Admittance
vs. Drain Current
Fig.10 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
10000
5
0
0
0
CAPACITANCE : C [pF]
GATE-SOURCE VOLTAGE : -VGS [V]
100
Ta=25℃
Pulsed
FORWARD TRANSFER
ADMITTANCE : |Yfs| [S]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) [mΩ]
Transistors
1
10
DRAIN CURRENT : -ID [A]
Fig.14 Switching Characteristics
4/5
RZL025P01
Transistors
zMeasurement circuits
Pulse width
VGS
ID
VDS
VGS
10%
50%
50%
90%
RL
D.U.T.
10%
10%
RG
VDD
VDS
90%
td(on)
90%
td(off)
tr
ton
tf
toff
Fig.16 Switching Time Waveforms
Fig.15 Switching Time Test Circuit
VG
VGS
ID
VDS
RL
IG (Const.)
D.U.T.
Qg
VGS
Qgs
RG
Qgd
VDD
Charge
Fig.17 Gate Charge Test Circuit
Fig.18 Gate Charge Waveform
zNotice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
5/5
Appendix
Notes
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The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
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exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
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Appendix1-Rev2.0