CYPRESS CY7C1049CV33_11

CY7C1049CV33
4-Mbit (512 K × 8) Static RAM
4-Mbit (512 K × 8) Static RAM
Features
Functional Description
■
Temperature ranges
❐ Commercial: 0 °C to 70 °C
The CY7C1049CV33 is a high performance CMOS Static RAM
organized as 524,288 words by eight bits. Easy memory
expansion is provided by an active LOW Chip Enable (CE), an
active LOW Output Enable (OE), and three-state drivers. Writing
to the device is accomplished by taking Chip Enable (CE) and
Write Enable (WE) inputs LOW. Data on the eight I/O pins (I/O0
through I/O7) is then written into the location specified on the
address pins (A0 through A18).
■
High speed
❐ tAA = 8 ns
■
Low active power
❐ 360 mW (max)
■
2.0 V data retention
■
Automatic power down when deselected
■
TTL-compatible inputs and outputs
■
Easy memory expansion with CE and OE features
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing Write Enable
(WE) HIGH. Under these conditions, the contents of the memory
location specified by the address pins appear on the I/O pins.
The eight input and output pins (I/O0 through I/O7) are placed in
a high impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), or during a write
operation (CE LOW, and WE LOW).
The CY7C1049CV33 is available in standard 44-pin TSOP II
package with center power and ground (revolutionary) pinout.
For best practice recommendations, refer to the Cypress
application note AN1064, SRAM System Guidelines.
Logic Block Diagram
SENSE AMPS
IO1
512K x 8
ARRAY
IO2
IO3
IO4
IO5
IO6
CE
•
IO7
POWER
DOWN
A18
A17
A15
A13
A14
OE
A16
COLUMN DECODER
WE
Cypress Semiconductor Corporation
Document #: 38-05006 Rev. *K
IO0
INPUT BUFFER
ROW DECODER
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
198 Champion Court
•
San Jose, CA 95134-1709
•408-943-2600
Revised March 02, 2011
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CY7C1049CV33
Contents
Selection Guide ................................................................ 3
Pin Configuration ............................................................. 3
Pin Definitions .................................................................. 3
Maximum Ratings ............................................................. 4
Operating Range ............................................................... 4
Electrical Characteristics ................................................. 4
Capacitance ...................................................................... 4
Thermal Resistance .......................................................... 4
AC Switching Characteristics ......................................... 6
Switching Waveforms ...................................................... 7
Truth Table ........................................................................ 8
Document #: 38-05006 Rev. *K
Ordering Information ....................................................... 9
Ordering Code Definitions ........................................... 9
Package Diagram ........................................................... 10
Acronyms ........................................................................ 11
Document Conventions ................................................. 11
Units of Measure ....................................................... 11
Document History Page ................................................. 12
Sales, Solutions, and Legal Information ...................... 13
Worldwide Sales and Design Support ....................... 13
Products .................................................................... 13
PSoC Solutions ......................................................... 13
Page 2 of 13
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CY7C1049CV33
Selection Guide
Description
-8
Unit
8
ns
Maximum Operating Current
100
mA
Maximum CMOS Standby Current
10
mA
Maximum Access Time
Pin Configuration
Figure 1. 44-pin TSOP II (Top View)
NC
NC
A0
A1
A2
A3
A4
CE
I/O0
I/O1
VCC
VSS
I/O2
I/O3
WE
A5
A6
A7
A8
A9
NC
NC
1
44
2
3
43
42
4
41
40
39
38
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
NC
A18
A17
A16
A15
OE
I/O7
I/O6
VSS
VCC
I/O5
I/O4
A14
A13
A12
A11
A10
NC
NC
NC
Pin Definitions
Pin Name
44-pin TSOP II
Pin Number
A0–A18
3–7, 16–20, 26–30,
38–41
Input
I/O0–I/O7
9, 10, 13, 14, 31,
32, 35, 36
Input/Output
Bidirectional data I/O lines. Used as input or output lines depending on
operation.
NC[1]
1, 2, 21, 22, 23, 24,
25, 42, 43, 44
No Connect
No connects. This pin is not connected to the die.
WE
15
Input/Control
Write Enable input, active LOW. When selected LOW, a WRITE is
conducted. When selected HIGH, a READ is conducted.
CE
8
Input/Control
Chip Enable input, active LOW. When LOW, selects the chip. When HIGH,
deselects the chip.
OE
37
Input/Control
Output Enable, active LOW. Controls the direction of the I/O pins. When
LOW, the I/O pins are allowed to behave as outputs. When deasserted
HIGH, I/O pins are three-stated, and act as input data pins.
VSS, GND
12, 34
Ground
VCC
11, 33
Power Supply
I/O Type
Description
Address inputs used to select one of the address locations.
Ground for the device. Should be connected to ground of the system.
Power supply inputs to the device.
Note
1. NC pins are not connected on the die.
Document #: 38-05006 Rev. *K
Page 3 of 13
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CY7C1049CV33
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ............................... –65 C to +150 C
Voltage Applied to Outputs
in High Z State[2] .................................. –0.5 V to VCC + 0.5 V
Input Voltage[2] .................................... –0.5 V to VCC + 0.5 V
Current into Outputs (LOW) ........................................ 20 mA
Operating Range
Ambient Temperature with
Power Applied .......................................... –55 C to +125 C
Range
Supply Voltage on VCC to Relative GND[2]–0.5 V to +4.6 VDC
Ambient Temperature
VCC
0 C to +70 C
3.3 V  0.3 V
Commercial
Electrical Characteristics
Over the Operating Range
Parameter
Description
Test Conditions
VOH
Output HIGH Voltage VCC = Min; IOH = –4.0 mA
VOL
Output LOW Voltage VCC = Min; IOL = 8.0 mA
VIH
Input HIGH Voltage
Voltage[2]
-8
Unit
Min
Max
2.4
–
V
–
0.4
V
2.0
VCC + 0.3
V
VIL
Input LOW
–0.3
0.8
V
IIX
Input Load Current
GND < VI < VC
–1
+1
A
ICC
VCC Operating
Supply Current
VCC = Max, f = fMAX = 1/tRC
–
100
mA
ISB1
Max. VCC, CE > VIH, VIN > VIH or VIN < VIL, f = fMAX
Automatic CE
Power Down Current
—TTL Inputs
–
40
mA
ISB2
Automatic CE
Max. VCC, CE > VCC – 0.3 V, VIN > VCC – 0.3 V,
Power Down Current or VIN < 0.3 V, f = 0
—CMOS Inputs
–
10
mA
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter[3]
Description
CIN
Input Capacitance
COUT
I/O Capacitance
Test Conditions
TA = 25 C, f = 1 MHz, VCC = 3.3 V
Max
Unit
8
pF
8
pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter[3]
Description
JA
Thermal Resistance
(Junction to Ambient)
JC
Thermal Resistance
(Junction to Case)
Test Conditions
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA / JESD51.
44-pin TSOP-II
Unit
41.66
°C/W
10.56
°C/W
Notes
2. VIL (min) = –2.0 V and VIH(max) = VCC + 0.5 V for pulse durations of less than 20 ns.
3. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05006 Rev. *K
Page 4 of 13
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CY7C1049CV33
Figure 2. AC Test Loads and Waveforms [4]
10-ns devices:
12-, 15-ns devices:
Z = 50
50
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
3.0 V
GND
Rise Time: 1 V/ns
R 317
3.3 V
OUTPUT
30 pF*
OUTPUT
(a)
(b)
High Z characteristics:
ALL INPUT PULSES
90%
10%
(c)
R 317
3.3 V
90%
10%
R2
351
30 pF
1.5 V
Fall Time: 1 V/ns
OUTPUT
R2
351
5 pF
(d)
Note
4. AC characteristics (except High Z) for 10 ns parts are tested using the load conditions shown in Figure 2 (a). All other speeds are tested using the Thevenin load
shown in Figure 2 (b). High Z characteristics are tested for all speeds using the test load shown in Figure 2 (d).
Document #: 38-05006 Rev. *K
Page 5 of 13
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CY7C1049CV33
AC Switching Characteristics
Over the Operating Range [5]
-8
Parameter
Description
Min
Max
Unit
100
–
s
Read Cycle
tpower[6]
VCC(typical) to the first access
tRC
Read Cycle Time
8
–
ns
tAA
Address to Data Valid
–
8
ns
tOHA
Data Hold from Address Change
3
–
ns
tACE
CE LOW to Data Valid
–
8
ns
tDOE
OE LOW to Data Valid
–
5
ns
tLZOE
OE LOW to Low Z
0
–
ns
–
4
ns
3
–
ns
–
4
ns
Z[7, 8]
tHZOE
OE HIGH to High
tLZCE
CE LOW to Low Z[8]
Z[7, 8]
tHZCE
CE HIGH to High
tPU
CE LOW to Power Up
0
–
ns
tPD
CE HIGH to Power Down
–
8
ns
tWC
Write Cycle Time
8
–
ns
tSCE
CE LOW to Write End
6
–
ns
tAW
Address Setup to Write End
6
–
ns
tHA
Address Hold from Write End
0
–
ns
tSA
Address Setup to Write Start
0
–
ns
tPWE
WE Pulse Width
6
–
ns
tSD
Data Setup to Write End
4
–
ns
tHD
Data Hold from Write End
0
–
ns
WE HIGH to Low
Z[8]
3
–
ns
WE LOW to High
Z[7, 8]
–
4
ns
Write Cycle [9, 10]
tLZWE
tHZWE
Notes
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V.
6. tPOWER gives the minimum amount of time that the power supply should be at stable, typical VCC values until the first memory access can be performed.
7. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (d) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.
8. At any temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any device.
9. The internal Write time of the memory is defined by the overlap of CE LOW, and WE LOW. CE and WE must be LOW to initiate a Write, and the transition of either of
these signals can terminate the Write. The input data setup and hold timing should be referenced to the leading edge of the signal that terminates the Write.
10. The minimum Write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 38-05006 Rev. *K
Page 6 of 13
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CY7C1049CV33
Switching Waveforms
Figure 3. Read Cycle No. 1 (Address Transition Controlled) [11, 12]
tRC
RC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
Figure 4. Read Cycle No. 2 (OE Controlled) [12, 13]
ADDRESS
tRC
CE
tACE
OE
tHZOE
tDOE
tHZCE
tLZOE
HIGH IMPEDANCE
DATA OUT
DATA VALID
tLZCE
tPD
tPU
VCC
SUPPLY
CURRENT
HIGH
IMPEDANCE
50%
50%
ICC
ISB
Figure 5. Write Cycle No. 1 (WE Controlled, OE HIGH During Write) [14, 15]
tWC
ADDRESS
tSCE
CE
tAW
tSA
tHA
tPWE
WE
OE
tSD
DATA I/O
NOTE 16
tHD
DATA VALID
tHZOE
Notes
11. Device is continuously selected. OE, CE = VIL.
12. WE is HIGH for read cycles.
13. Address valid before or similar to CE transition LOW.
14. Data I/O is high impedance if OE = VIH.
15. If CE goes HIGH simultaneously with WE HIGH, the output remains in high impedance state.
16. During this period, the I/Os are in output state. Do not apply input signals.
Document #: 38-05006 Rev. *K
Page 7 of 13
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CY7C1049CV33
Switching Waveforms
(continued)
Figure 6. Write Cycle No. 2 (WE Controlled, OE LOW) [17]
tWC
ADDRESS
tSCE
CE
tAW
tSA
tHA
tPWE
WE
tSD
NOTE 18
DATA I/O
tHD
DATA VALID
tLZWE
tHZWE
Truth Table
CE
OE
WE
I/O0–I/O7
H
X
X
High Z
Mode
Power Down
Power
Standby (ISB)
L
L
H
Data Out
Read
Active (ICC)
L
X
L
Data In
Write
Active (ICC)
L
H
H
High Z
Selected, Outputs Disabled
Active (ICC)
Notes
17. If CE goes HIGH simultaneously with WE HIGH, the output remains in high impedance state.
18. During this period, the I/Os are in output state. Do not apply input signals.
Document #: 38-05006 Rev. *K
Page 8 of 13
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CY7C1049CV33
Ordering Information
Speed
(ns)
8
Package
Diagram
Ordering Code
CY7C1049CV33-8ZSXC
51-85087
Package Type
44-pin TSOP II (Pb-free)
Operating
Range
Commercial
Ordering Code Definitions
CY 7C
1
04
9
C V33 - 8
ZS
X
C
Temperature Range:
C = Commercial
X = Pb-free; X Absent = Leaded
Package Type:
ZS = 44-pin TSOP II
Speed Grade: 8 ns
V33 = 3.0 V to 3.6 V
Process Technology:C  150 nm
Data width: × 8-bits
4-Mbit density
Fast Asynchronous SRAM
Marketing Code: 7C = SRAMs
Company ID: CY = Cypress
Document #: 38-05006 Rev. *K
Page 9 of 13
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CY7C1049CV33
Package Diagram
Figure 7. 44-pin TSOP II, 51-85087
51-85087 *C
Document #: 38-05006 Rev. *K
Page 10 of 13
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CY7C1049CV33
Acronyms
Acronym
Description
CMOS
complementary metal oxide semiconductor
CE
Chip Enable
OE
Output Enable
RAM
Random Access Memory
I/O
Input/Output
SOJ
small outline J-lead
TTL
transistor-transistor logic
TSOP
thin small outline package
WE
Write Enable
Document Conventions
Units of Measure
Symbol
Unit of Measure

ohms
ns
nano seconds
V
Volts
µs
micro seconds
µA
micro Amperes
mA
milli Amperes
mm
milli meter
ms
milli seconds
MHz
Mega Hertz
pF
pico Farad
%
percent
mW
milli Watts
W
Watts
°C
degree Celcius
Document #: 38-05006 Rev. *K
Page 11 of 13
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CY7C1049CV33
Document History Page
Document Title: CY7C1049CV33 4-Mbit (512 K × 8) Static RAM
Document Number: 38-05006
Rev.
ECN
Orig. of
Change
Submission
Date
Description of Change
**
112569
HGK
03/06/02
New data sheet
*A
114091
DFP
04/25/02
Changed Tpower unit from ns to s
*B
116479
CEA
09/16/02
Add applications foot note to data sheet, page 1.
*C
262949
RKF
See ECN
Added Automotive-E Specs
Added JA and JC values on Page #3.
*D
300091
RKF
See ECN
Added -20-ns Speed bin
*E
344595
SYT
See ECN
Added Pb-free package on page #8
Removed shading for CY7C1049CV33-15ZSXE in the ordering Information on
page 9
*F
2615344
VKN/PYRS
12/03/08
Added Automotive-A information
Removed 8 ns and 20 ns speed bins,
Changed tPOWER spec from 1 s to 100 s,
Updated Ordering Information table.
*G
2841563
NXR/
*H
2898958
AJU
01/07/2010 Added CY7C1049CV33-10VXA to Ordering Info table.
03/25/10
Removed inactive parts from the ordering informaiton table. Updated package
diagrams.
*I
2954734
AJU
*J
3072834
PRAS
11/12/2010 Removed obsolete parts and updated package diagram.
*K
3185812
PRAS
03/02/2011 Updated Features.
Updated Functional Description.
Updated Selection Guide (Added -8 ns speed grade devices and removed
-10 ns, -12 ns, and -15 ns speed grade devices).
Removed Figure 36-pin SOJ (Top View) in Pin Configuration.
Updated Electrical Characteristics (Added -8 ns speed grade devices and
removed -10 ns, -12 ns, and -15 ns speed grade devices).
Deleted 36-pin SOJ column in Thermal Resistance.
Updated AC Switching Characteristics (Added -8 ns speed grade devices and
removed -10 ns, -12 ns, and -15 ns speed grade devices).
Added Units of Measure.
Dislodged Automotive information to 001-67511.
Removed SOJ package related information in all instances in the document.
Document #: 38-05006 Rev. *K
06/30/2010 New Part Number added CY7C1049CV33-10ZXC to Ordering Info table.
Page 12 of 13
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CY7C1049CV33
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2002-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document #: 38-05006 Rev. *K
Revised March 02, 2011
Page 13 of 13
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