VISHAY 8EWF06STRLPBF

8EWF..SPbF Soft Recovery Series
Vishay High Power Products
Surface Mountable
Fast Soft Recovery Diode, 8 A
FEATURES/DESCRIPTION
Base
common
cathode
+
2
The 8EWF..SPbF fast soft recovery rectifier series
has been optimized for combined short reverse
recovery time, low forward voltage drop and low
leakage current.
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
D-PAK
1
Anode -
This series is designed and qualified for industrial level.
3
- Anode
Compliant to RoHS directive 2002/95/EC.
APPLICATIONS
PRODUCT SUMMARY
• Output rectification and freewheeling diode in inverters,
choppers and converters
VF at 8 A
< 1.2 V
trr
55 ns
VRRM
200 to 600 V
• Input rectifications where severe restrictions on conducted
EMI should be met
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
IF(AV)
CHARACTERISTICS
VALUES
UNITS
8
A
200 to 600
V
170
A
1.2
V
Sinusoidal waveform
VRRM
IFSM
VF
8 A, TJ = 25 °C
trr
1 A, 100 A/µs
TJ
Range
55
ns
- 40 to 150
°C
VRRM, MAXIMUM PEAK
REVERSE VOLTAGE
V
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
IRRM
AT 150 °C
mA
8EWF02SPbF
200
300
8EWF04SPbF
400
500
8EWF06SPbF
600
700
VOLTAGE RATINGS
PART NUMBER
3
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average forward current
IF(AV)
Maximum peak one cycle
non-repetitive surge current
IFSM
Maximum I2t for fusing
I2t
Maximum I2√t for fusing
I2√t
Document Number: 94108
Revision: 01-Jul-09
TEST CONDITIONS
TC = 96 °C, 180° conduction half sine wave
VALUES
10 ms sine pulse, rated VRRM applied
170
10 ms sine pulse, no voltage reapplied
200
10 ms sine pulse, rated VRRM applied
140
10 ms sine pulse, no voltage reapplied
200
t = 0.1 ms to 10 ms, no voltage reapplied
2000
For technical questions, contact: [email protected]
UNITS
8
A
A2s
A2√s
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8EWF..SPbF Soft Recovery Series
Vishay High Power Products
Surface Mountable
Fast Soft Recovery Diode, 8 A
ELECTRICAL SPECIFICATIONS
PARAMETER
Maximum forward voltage drop
Forward slope resistance
Threshold voltage
Maximum reverse leakage current
SYMBOL
VFM
rt
VF(TO)
IRM
TEST CONDITIONS
8 A, TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
VALUES
UNITS
1.2
V
16
mΩ
1.13
V
0.1
VR = Rated VRRM
TJ = 150 °C
mA
3
RECOVERY CHARACTERISTICS
PARAMETER
SYMBOL
Reverse recovery time
trr
Reverse recovery current
Irr
Reverse recovery charge
Snap factor
Qrr
TEST CONDITIONS
IF at 8 Apk
25 A/µs
TJ = 25 °C
VALUES
UNITS
140
ns
2.6
A
0.25
S
IFM
trr
ta
tb
t
di
dt
µC
Qrr
Irr
0.5
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and storage
temperature range
Soldering temperature
Maximum thermal resistance,
junction to case
Typical thermal resistance,
junction to ambient (PCB mount)
SYMBOL
TEST CONDITIONS
TJ, TStg
TS
RthJC
VALUES
UNITS
- 40 to 150
°C
For 10 seconds
240
DC operation
2.5
°C/W
RthJA (1)
50
1
g
Approximate weight
0.03
Marking device
Case style TO-252AA (D-PAK)
oz.
8EWF06S
Note
(1) When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 µm) copper 40 °C/W
For recommended footprint and soldering techniques refer to application note #AN-994
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For technical questions, contact: [email protected]
Document Number: 94108
Revision: 01-Jul-09
8EWF..SPbF Soft Recovery Series
8EWF..SSeries
R thJC (DC) = 2.5 °C/ W
140
130
120
Conduction Angle
110
100
90
30°
80
60°
90°
120°
180°
70
60
0
1
2
3
4
5
6
7
8
9
Maximum Average Forward Power Loss (W)
150
DC
180°
120°
90°
60°
30°
14
12
10
8
RMSLimit
6
Conduction Period
4
8EWF..SSeries
TJ = 150°C
2
0
0
2
4
6
8
10
12
14
Average Forward Current (A)
Average Forward Current (A)
Fig. 4 - Forward Power Loss Characteristics
150
8EWF..S Series
R thJC (DC) = 2.5 °C/ W
140
130
120
110
Conduction Period
100
30°
60°
90
90°
120°
180°
80
DC
70
0
2
4
6
8
10
12
180°
120°
90°
60°
30°
RMS Limit
6
4
Conduction Angle
2
8EWF..SSeries
T J= 150°C
0
0
1
2
3
4
5
6
7
175
150
125
100
75
8EWF..SSeries
50
10
8
9
200
180
160
Maximum Non Repetitive Surge Current
Versus Pulse Tra in Duration.
Initial TJ = 150°C
No Voltage Reap plied
Rated VRRM Reapplied
140
120
100
80
60
8EWF..S Series
40
0.01
Fig. 3 - Forward Power Loss Characteristics
0.1
1
Pulse Tra in Duration (s)
Average Forward Current (A)
Document Number: 94108
Revision: 01-Jul-09
100
Fig. 5 - Maximum Non-Repetitive Surge Current
Peak Half Sine Wave Forward Current (A)
12
8
At Any Ra ted Load Condition And With
Rated V RRM Ap plied Following Surge .
Initial TJ = 150°C
@60 Hz 0.0083 s
@50 Hz 0.0100 s
Numb er Of Eq ua l Amp litude Ha lf Cyc le Current Pulses (N)
Average Forward Current (A)
10
200
1
14
Fig. 2 - Current Rating Characteristics
Maximum Average Forward Power Loss (W)
16
Fig. 1 - Current Rating Characteristics
Peak Half Sine Wave Forward Current (A)
Maximum Allowable Case Temperature (°C)
Maximum Allowable Case Temperature (°C)
Surface Mountable
Vishay High Power Products
Fast Soft Recovery Diode, 8 A
Fig. 6 - Maximum Non-Repetitive Surge Current
For technical questions, contact: [email protected]
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3
8EWF..SPbF Soft Recovery Series
Instantaneous Forward Current (A)
100
10
T J= 25°C
TJ= 150°C
8EWF..SSeries
1
0.5
1
1.5
2
2.5
3
Maximum Reverse Recovery Charge - Qrr (µC)
Surface Mountable
Fast Soft Recovery Diode, 8 A
Vishay High Power Products
0.4
8EWF..SSeries
TJ = 25 °C
0.3
I FM = 20 A
10 A
8A
5A
2A
1A
0
0
40
80
120
160
200
Rate Of Fall Of Forward Current - dI/ dt (A/ µs)
0.4
8EWF..S Series
TJ = 150 °C
0.3
I FM = 20 A
10 A
8A
5A
0.1
2A
1A
0
0
40
80
120
160
200
Rate Of Fall Of Forward Current - dI/ dt (A/ µs)
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
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1
10 A
0.8
8A
0.6
5A
0.4
2A
1A
0.2
0
0
40
80
120
160
200
2.4
I FM = 20 A
8EWF..SSeries
TJ = 150 °C
2.2
2
1.8
10 A
1.6
8A
1.4
1.2
5A
1
0.8
2A
0.6
0.4
1A
0.2
0
40
80
120
160
200
Rate Of Fall Of Forward Current - dI/ dt (A/ µs)
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
Maximum Reverse Recovery Current - Irr (A)
Maximum Re verse Recovery Time - Trr (µs)
Fig. 8 - Recovery Time Characteristics, TJ = 25 °C
0.2
I FM = 20 A
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
Maximum Reverse Recovery Charge - Qrr (µC)
Maximum Reverse Recovery Time - Trr (µs)
Fig. 7 - Forward Voltage Drop Characteristics
0.1
8EWF..S Series
TJ = 25 °C
1.2
Rate Of Fall Of Forward Current - dI/ dt (A/ µs)
Instantaneous Forward Voltage (V)
0.2
1.4
16
8EWF..SSeries
TJ = 25 °C
14
I FM = 20 A
10 A
12
8A
10
5A
8
2A
6
1A
4
2
0
0
40
80
120
160
200
Rate Of Fall Of Forward Current - dI/ dt (A/ µs)
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
For technical questions, contact: [email protected]
Document Number: 94108
Revision: 01-Jul-09
8EWF..SPbF Soft Recovery Series
Maximum Reverse Recovery Current - Irr (A)
Surface Mountable
Vishay High Power Products
Fast Soft Recovery Diode, 8 A
20
I FM = 20 A
8EWF..SSeries
TJ = 150 °C
18
16
10 A
14
8A
12
5A
10
2A
8
1A
6
4
2
0
0
40
80
120
160
200
Rate Of Fall Of Forward Current - dI/ dt (A/ µs)
Transient Thermal Impedance Z thJC (°C/ W)
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
10
Steady State Value
(DC Operation)
1
D=
D=
D=
D=
D=
0.50
0.33
0.25
0.17
0.08
Single Pulse
8EWF..SSeries
0.1
0.0001
0.001
0.01
0.1
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Document Number: 94108
Revision: 01-Jul-09
For technical questions, contact: diod[email protected]
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8EWF..SPbF Soft Recovery Series
Vishay High Power Products
Surface Mountable
Fast Soft Recovery Diode, 8 A
ORDERING INFORMATION TABLE
Device code
8
E
W
F
06
S
TR
PbF
1
2
3
4
5
6
7
8
1
-
Current rating (8 = 8 A)
2
-
Circuit configuration:
E = Single diode
3
-
Package:
4
-
Type of silicon:
W = D-PAK
F = Fast soft recovery rectifier
5
-
Voltage code x 100 = VRRM
6
-
S = Surface mountable
7
-
TR = Tape and reel
02 = 200 V
04 = 400 V
06 = 600 V
TRR = Tape and reel (right oriented)
TRL = Tape and reel (left oriented)
8
-
PbF = Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95016
Part marking information
www.vishay.com/doc?95059
Packaging information
www.vishay.com/doc?95033
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For technical questions, contact: [email protected]
Document Number: 94108
Revision: 01-Jul-09
Outline Dimensions
Vishay High Power Products
D-PAK (TO-252AA)
DIMENSIONS in millimeters and inches
(5)
A
E
b3
Pad layout
C
A
(3)
0.010 M C A B
c2
A
L3 (3)
Ø1
4
Ø2
4
B
Seating
plane
H
D (5)
1
2
0.245
MIN.
(6.23)
D1
L4
3
3
(2) L5
2
b
1
A
c
b2
0.06
MIN.
(1.524)
0.010 M C A B
2x e
0.093 (2.38)
0.085 (2.18)
(L1)
Detail “C”
Rotated 90 °CW
Scale: 20:1
H (7)
Lead tip
C
Gauge
plane
L2
MILLIMETERS
MIN.
0.488 (12.40)
0.409 (10.40)
0.089
MIN.
(2.28)
Detail “C”
SYMBOL
0.265
MIN.
(6.74)
E1
INCHES
MAX.
MIN.
MAX.
C Seating
plane
C
Ø
L
NOTES
A1
SYMBOL
MILLIMETERS
MIN.
MAX.
MAX.
A
2.18
2.39
0.086
0.094
e
A1
-
0.13
-
0.005
H
9.40
10.41
0.370
0.410
b
0.64
0.89
0.025
0.035
L
1.40
1.78
0.055
0.070
b2
0.76
1.14
0.030
0.045
L1
3
2.29 BSC
INCHES
MIN.
2.74 BSC
L2
0.51 BSC
NOTES
0.090 BSC
0.108 REF.
b3
4.95
5.46
0.195
0.215
c
0.46
0.61
0.018
0.024
L3
0.89
1.27
0.035
0.020 BSC
0.050
c2
0.46
0.89
0.018
0.035
L4
-
1.02
-
0.040
D
5.97
6.22
0.235
0.245
5
L5
1.14
1.52
0.045
0.060
D1
5.21
-
0.205
-
3
Ø
0°
10°
0°
10°
E
6.35
6.73
0.250
0.265
5
Ø1
0°
15°
0°
15°
E1
4.32
-
0.170
-
3
Ø2
25°
35°
25°
35°
3
2
Notes
(1)
Dimensioning and tolerancing as per ASME Y14.5M-1994
(2)
Lead dimension uncontrolled in L5
(3)
Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad
(4)
Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip
(5)
Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(6)
Dimension b1 and c1 applied to base metal only
(7)
Datum A and B to be determined at datum plane H
(8)
Outline conforms to JEDEC outline TO-252AA
Document Number: 95016
Revision: 04-Nov-08
For technical questions concerning discrete products, contact: [email protected]
For technical questions concerning module products, contact: [email protected]
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Document Number: 91000
Revision: 11-Mar-11
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