8EWF..SPbF Soft Recovery Series Vishay High Power Products Surface Mountable Fast Soft Recovery Diode, 8 A FEATURES/DESCRIPTION Base common cathode + 2 The 8EWF..SPbF fast soft recovery rectifier series has been optimized for combined short reverse recovery time, low forward voltage drop and low leakage current. The glass passivation ensures stable reliable operation in the most severe temperature and power cycling conditions. D-PAK 1 Anode - This series is designed and qualified for industrial level. 3 - Anode Compliant to RoHS directive 2002/95/EC. APPLICATIONS PRODUCT SUMMARY • Output rectification and freewheeling diode in inverters, choppers and converters VF at 8 A < 1.2 V trr 55 ns VRRM 200 to 600 V • Input rectifications where severe restrictions on conducted EMI should be met MAJOR RATINGS AND CHARACTERISTICS SYMBOL IF(AV) CHARACTERISTICS VALUES UNITS 8 A 200 to 600 V 170 A 1.2 V Sinusoidal waveform VRRM IFSM VF 8 A, TJ = 25 °C trr 1 A, 100 A/µs TJ Range 55 ns - 40 to 150 °C VRRM, MAXIMUM PEAK REVERSE VOLTAGE V VRSM, MAXIMUM NON-REPETITIVE PEAK REVERSE VOLTAGE V IRRM AT 150 °C mA 8EWF02SPbF 200 300 8EWF04SPbF 400 500 8EWF06SPbF 600 700 VOLTAGE RATINGS PART NUMBER 3 ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL Maximum average forward current IF(AV) Maximum peak one cycle non-repetitive surge current IFSM Maximum I2t for fusing I2t Maximum I2√t for fusing I2√t Document Number: 94108 Revision: 01-Jul-09 TEST CONDITIONS TC = 96 °C, 180° conduction half sine wave VALUES 10 ms sine pulse, rated VRRM applied 170 10 ms sine pulse, no voltage reapplied 200 10 ms sine pulse, rated VRRM applied 140 10 ms sine pulse, no voltage reapplied 200 t = 0.1 ms to 10 ms, no voltage reapplied 2000 For technical questions, contact: [email protected] UNITS 8 A A2s A2√s www.vishay.com 1 8EWF..SPbF Soft Recovery Series Vishay High Power Products Surface Mountable Fast Soft Recovery Diode, 8 A ELECTRICAL SPECIFICATIONS PARAMETER Maximum forward voltage drop Forward slope resistance Threshold voltage Maximum reverse leakage current SYMBOL VFM rt VF(TO) IRM TEST CONDITIONS 8 A, TJ = 25 °C TJ = 150 °C TJ = 25 °C VALUES UNITS 1.2 V 16 mΩ 1.13 V 0.1 VR = Rated VRRM TJ = 150 °C mA 3 RECOVERY CHARACTERISTICS PARAMETER SYMBOL Reverse recovery time trr Reverse recovery current Irr Reverse recovery charge Snap factor Qrr TEST CONDITIONS IF at 8 Apk 25 A/µs TJ = 25 °C VALUES UNITS 140 ns 2.6 A 0.25 S IFM trr ta tb t di dt µC Qrr Irr 0.5 THERMAL - MECHANICAL SPECIFICATIONS PARAMETER Maximum junction and storage temperature range Soldering temperature Maximum thermal resistance, junction to case Typical thermal resistance, junction to ambient (PCB mount) SYMBOL TEST CONDITIONS TJ, TStg TS RthJC VALUES UNITS - 40 to 150 °C For 10 seconds 240 DC operation 2.5 °C/W RthJA (1) 50 1 g Approximate weight 0.03 Marking device Case style TO-252AA (D-PAK) oz. 8EWF06S Note (1) When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 µm) copper 40 °C/W For recommended footprint and soldering techniques refer to application note #AN-994 www.vishay.com 2 For technical questions, contact: [email protected] Document Number: 94108 Revision: 01-Jul-09 8EWF..SPbF Soft Recovery Series 8EWF..SSeries R thJC (DC) = 2.5 °C/ W 140 130 120 Conduction Angle 110 100 90 30° 80 60° 90° 120° 180° 70 60 0 1 2 3 4 5 6 7 8 9 Maximum Average Forward Power Loss (W) 150 DC 180° 120° 90° 60° 30° 14 12 10 8 RMSLimit 6 Conduction Period 4 8EWF..SSeries TJ = 150°C 2 0 0 2 4 6 8 10 12 14 Average Forward Current (A) Average Forward Current (A) Fig. 4 - Forward Power Loss Characteristics 150 8EWF..S Series R thJC (DC) = 2.5 °C/ W 140 130 120 110 Conduction Period 100 30° 60° 90 90° 120° 180° 80 DC 70 0 2 4 6 8 10 12 180° 120° 90° 60° 30° RMS Limit 6 4 Conduction Angle 2 8EWF..SSeries T J= 150°C 0 0 1 2 3 4 5 6 7 175 150 125 100 75 8EWF..SSeries 50 10 8 9 200 180 160 Maximum Non Repetitive Surge Current Versus Pulse Tra in Duration. Initial TJ = 150°C No Voltage Reap plied Rated VRRM Reapplied 140 120 100 80 60 8EWF..S Series 40 0.01 Fig. 3 - Forward Power Loss Characteristics 0.1 1 Pulse Tra in Duration (s) Average Forward Current (A) Document Number: 94108 Revision: 01-Jul-09 100 Fig. 5 - Maximum Non-Repetitive Surge Current Peak Half Sine Wave Forward Current (A) 12 8 At Any Ra ted Load Condition And With Rated V RRM Ap plied Following Surge . Initial TJ = 150°C @60 Hz 0.0083 s @50 Hz 0.0100 s Numb er Of Eq ua l Amp litude Ha lf Cyc le Current Pulses (N) Average Forward Current (A) 10 200 1 14 Fig. 2 - Current Rating Characteristics Maximum Average Forward Power Loss (W) 16 Fig. 1 - Current Rating Characteristics Peak Half Sine Wave Forward Current (A) Maximum Allowable Case Temperature (°C) Maximum Allowable Case Temperature (°C) Surface Mountable Vishay High Power Products Fast Soft Recovery Diode, 8 A Fig. 6 - Maximum Non-Repetitive Surge Current For technical questions, contact: [email protected] www.vishay.com 3 8EWF..SPbF Soft Recovery Series Instantaneous Forward Current (A) 100 10 T J= 25°C TJ= 150°C 8EWF..SSeries 1 0.5 1 1.5 2 2.5 3 Maximum Reverse Recovery Charge - Qrr (µC) Surface Mountable Fast Soft Recovery Diode, 8 A Vishay High Power Products 0.4 8EWF..SSeries TJ = 25 °C 0.3 I FM = 20 A 10 A 8A 5A 2A 1A 0 0 40 80 120 160 200 Rate Of Fall Of Forward Current - dI/ dt (A/ µs) 0.4 8EWF..S Series TJ = 150 °C 0.3 I FM = 20 A 10 A 8A 5A 0.1 2A 1A 0 0 40 80 120 160 200 Rate Of Fall Of Forward Current - dI/ dt (A/ µs) Fig. 9 - Recovery Time Characteristics, TJ = 150 °C www.vishay.com 4 1 10 A 0.8 8A 0.6 5A 0.4 2A 1A 0.2 0 0 40 80 120 160 200 2.4 I FM = 20 A 8EWF..SSeries TJ = 150 °C 2.2 2 1.8 10 A 1.6 8A 1.4 1.2 5A 1 0.8 2A 0.6 0.4 1A 0.2 0 40 80 120 160 200 Rate Of Fall Of Forward Current - dI/ dt (A/ µs) Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C Maximum Reverse Recovery Current - Irr (A) Maximum Re verse Recovery Time - Trr (µs) Fig. 8 - Recovery Time Characteristics, TJ = 25 °C 0.2 I FM = 20 A Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C Maximum Reverse Recovery Charge - Qrr (µC) Maximum Reverse Recovery Time - Trr (µs) Fig. 7 - Forward Voltage Drop Characteristics 0.1 8EWF..S Series TJ = 25 °C 1.2 Rate Of Fall Of Forward Current - dI/ dt (A/ µs) Instantaneous Forward Voltage (V) 0.2 1.4 16 8EWF..SSeries TJ = 25 °C 14 I FM = 20 A 10 A 12 8A 10 5A 8 2A 6 1A 4 2 0 0 40 80 120 160 200 Rate Of Fall Of Forward Current - dI/ dt (A/ µs) Fig. 12 - Recovery Current Characteristics, TJ = 25 °C For technical questions, contact: [email protected] Document Number: 94108 Revision: 01-Jul-09 8EWF..SPbF Soft Recovery Series Maximum Reverse Recovery Current - Irr (A) Surface Mountable Vishay High Power Products Fast Soft Recovery Diode, 8 A 20 I FM = 20 A 8EWF..SSeries TJ = 150 °C 18 16 10 A 14 8A 12 5A 10 2A 8 1A 6 4 2 0 0 40 80 120 160 200 Rate Of Fall Of Forward Current - dI/ dt (A/ µs) Transient Thermal Impedance Z thJC (°C/ W) Fig. 13 - Recovery Current Characteristics, TJ = 150 °C 10 Steady State Value (DC Operation) 1 D= D= D= D= D= 0.50 0.33 0.25 0.17 0.08 Single Pulse 8EWF..SSeries 0.1 0.0001 0.001 0.01 0.1 Square Wave Pulse Duration (s) Fig. 14 - Thermal Impedance ZthJC Characteristics Document Number: 94108 Revision: 01-Jul-09 For technical questions, contact: [email protected] www.vishay.com 5 8EWF..SPbF Soft Recovery Series Vishay High Power Products Surface Mountable Fast Soft Recovery Diode, 8 A ORDERING INFORMATION TABLE Device code 8 E W F 06 S TR PbF 1 2 3 4 5 6 7 8 1 - Current rating (8 = 8 A) 2 - Circuit configuration: E = Single diode 3 - Package: 4 - Type of silicon: W = D-PAK F = Fast soft recovery rectifier 5 - Voltage code x 100 = VRRM 6 - S = Surface mountable 7 - TR = Tape and reel 02 = 200 V 04 = 400 V 06 = 600 V TRR = Tape and reel (right oriented) TRL = Tape and reel (left oriented) 8 - PbF = Lead (Pb)-free LINKS TO RELATED DOCUMENTS Dimensions www.vishay.com/doc?95016 Part marking information www.vishay.com/doc?95059 Packaging information www.vishay.com/doc?95033 www.vishay.com 6 For technical questions, contact: [email protected] Document Number: 94108 Revision: 01-Jul-09 Outline Dimensions Vishay High Power Products D-PAK (TO-252AA) DIMENSIONS in millimeters and inches (5) A E b3 Pad layout C A (3) 0.010 M C A B c2 A L3 (3) Ø1 4 Ø2 4 B Seating plane H D (5) 1 2 0.245 MIN. (6.23) D1 L4 3 3 (2) L5 2 b 1 A c b2 0.06 MIN. (1.524) 0.010 M C A B 2x e 0.093 (2.38) 0.085 (2.18) (L1) Detail “C” Rotated 90 °CW Scale: 20:1 H (7) Lead tip C Gauge plane L2 MILLIMETERS MIN. 0.488 (12.40) 0.409 (10.40) 0.089 MIN. (2.28) Detail “C” SYMBOL 0.265 MIN. (6.74) E1 INCHES MAX. MIN. MAX. C Seating plane C Ø L NOTES A1 SYMBOL MILLIMETERS MIN. MAX. MAX. A 2.18 2.39 0.086 0.094 e A1 - 0.13 - 0.005 H 9.40 10.41 0.370 0.410 b 0.64 0.89 0.025 0.035 L 1.40 1.78 0.055 0.070 b2 0.76 1.14 0.030 0.045 L1 3 2.29 BSC INCHES MIN. 2.74 BSC L2 0.51 BSC NOTES 0.090 BSC 0.108 REF. b3 4.95 5.46 0.195 0.215 c 0.46 0.61 0.018 0.024 L3 0.89 1.27 0.035 0.020 BSC 0.050 c2 0.46 0.89 0.018 0.035 L4 - 1.02 - 0.040 D 5.97 6.22 0.235 0.245 5 L5 1.14 1.52 0.045 0.060 D1 5.21 - 0.205 - 3 Ø 0° 10° 0° 10° E 6.35 6.73 0.250 0.265 5 Ø1 0° 15° 0° 15° E1 4.32 - 0.170 - 3 Ø2 25° 35° 25° 35° 3 2 Notes (1) Dimensioning and tolerancing as per ASME Y14.5M-1994 (2) Lead dimension uncontrolled in L5 (3) Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad (4) Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip (5) Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (6) Dimension b1 and c1 applied to base metal only (7) Datum A and B to be determined at datum plane H (8) Outline conforms to JEDEC outline TO-252AA Document Number: 95016 Revision: 04-Nov-08 For technical questions concerning discrete products, contact: [email protected] For technical questions concerning module products, contact: [email protected] www.vishay.com 1 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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