TI BQ500110

bq500110
SLUSAE0A – NOVEMBER 2010 – REVISED APRIL 2011
www.ti.com
Qi Compliant Wireless Power Transmitter Manager
Check for Samples: bq500110
FEATURES
APPLICATIONS
•
•
1
•
•
•
•
•
•
Intelligent Control of the Power Transfer
between Base Station and Mobile Device
Conforms to Version 1.0 of the Wireless Power
Consortium (WPC) Transmitter Specifications
Demodulates and Decodes WPC Complaint
Message Packets from the Power Receiving
Device Over the Same Wireless Link that
Transfers Electrical Power
Implements Closed-Loop Power Transfer PID
Control by Varying Frequency of the Voltage
on the Transmitting Coil
Parasitic Metal Object Detection (PMOD)
Operating Modes Status Indicators
– Standby
– Power Transfer
– Charge Complete
– Fault
Overload and Over Temperature Protection
•
WPC 1.0 Compliant Wireless Chargers for:
– Mobile and Smart Phones
– MP3 Players
– Global Positioning Devices
– Digital Cameras
Other Wireless Power Base Stations and
Transmitters in:
– Cars and Other Vehicles
– Hermetically Sealed Devices, Tools and
Appliances
– Furniture Built-in Wireless Chargers
– Toy Power Supplies and Chargers
DESCRIPTION
The bq500110 is the industry’s first wireless power dedicated digital controller that integrates most of the logic
functions required to control Wireless Power Transfer in a single channel WPC compliant contactless charging
base station. The bq500110 is an intelligent device that periodically pings the surrounding environment for
available devices to be powered; monitors all communication from the mobile device being wirelessly powered;
adjusts power applied to the transmitter coil per feedback received from the powered device. The bq500110 also
manages fault conditions associated with power transfer and controls the operating modes status indicator. The
bq500110 is also the first wireless power controller with parasitic metal object detection that in real time analyzes
efficiency of the established power transfer and protects itself and the power receiver from excessive power loss
and heat associated with parasitic metal objects placed in the power transfer path.
The bq500110 comes in the area saving 48-pin, 7mm x 7mm QFN package and operates over temperature
range from –40°C to 110°C.
ORDERING INFORMATION (1)
OPERATING
TEMPERATURE
RANGE, TA
-40°C to 110°C
(1)
ORDERABLE PART NUMBER
PIN COUNT
SUPPLY
PACKAGE
TOP SIDE
MARKING
bq500110RGZR
48 pin
Reel of 2500
QFN
bq500110
bq500110RGZT
48 pin
Reel of 250
QFN
bq500110
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2011, Texas Instruments Incorporated
bq500110
SLUSAE0A – NOVEMBER 2010 – REVISED APRIL 2011
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN
MAX
Voltage applied at V33D to DGND
–0.3
3.8
V
Voltage applied at V33A to AGND
–0.3
3.8
V
–0.3
3.8
V
–40
150
°C
Voltage applied to any pin
(2)
Storage temperature,TSTG
(1)
(2)
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to GND.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX
V
Supply voltage during operation, V33D, V33A
TA
Operating free-air temperature range
TJ
Junction temperature
(1)
2
3.0
(1)
3.3
–40
(1)
UNIT
3.6
V
125
°C
125
°C
When operating continuously, the bq500110's typical power consumption causes a 15°C temperature rise from ambient.
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
SUPPLY CURRENT
IV33A
V33A = 3.3 V
8
15
IV33D
V33D = 3.3 V
42
55
V33D = 3.3 V while storing configuration
parameters in flash memory
53
65
3.3
3.6
4
4.6
Supply current
IV33D
mA
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33
3.3-V linear regulator
V33FB
3.3-V linear regulator feedback
IV33FB
Series pass base drive
Beta
Series NPN pass device
Emitter of NPN transistor
3.25
VIN = 12 V; current into V33FB pin
V
10
mA
40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
Digital 3.3-V power
TA = 25°C
3
3.6
V
V33A
Analog 3.3-V power
TA = 25°C
3
3.6
V
V33 slew rate
V33 slew rate between 2.3V and 2.9V,
V33A = V33D
V33Slew
0.25
V/ms
MODULATION AMPLIFIER INPUTS EAP-A, EAN-A, EAP-B, EAN-B
–0.15
VCM
Common mode voltage each pin
EAP-EAN
Modulation voltage digital resolution
REA
Input Impedance
Ground reference
0.5
IOFFSET
Input offset current
1 kΩ source impedance
–5
1.631
V
1
1.5
mV
3
MΩ
5
µA
ANALOG INPUTS V_IN, I_IN, TEMP_IN, I_COIL, LED_MODE, PMOD_THR
VADDR_OPEN
Voltage indicating open pin
LED_MODE, PMOD_THR open
VADDR_SHORT
Voltage indicating pin shorted to GND
LED_MODE, PMOD_THR shorted to ground
2.37
VADC_RANGE
Measurement range for voltage monitoring
Inputs: V_IN, I_IN, TEMP_IN, I_COIL
INL
ADC integral nonlinearity
Ilkg
Input leakage current
3V applied to pin
RIN
Input impedance
Ground reference
CIN
Input capacitance
V
0.36
V
0
2.5
V
-2.5
2.5
mV
100
nA
8
MΩ
10
pF
DGND
1 +0.25
V
DIGITAL INPUTS/OUTPUTS
(1)
VOL
Low-level output voltage
IOL = 6 mA
, V33D = 3 V
VOH
High-level output voltage
IOH = -6 mA
VIH
High-level input voltage
V33D = 3V
VIL
Low-level input voltage
V33D = 3.5 V
IOH(MAX)
Output high source current
4
mA
IOL(MAX)
Output low sink current
4
mA
(2)
, V33D = 3 V
V33D
-0.6V
2.1
V
3.6
V
1.4
V
SYSTEM PERFORMANCE
VRESET
Voltage where device comes out of reset
V33D Pin
tRESET
Pulse width needed for reset
RESET pin
FSW
Switching Frequency
tdetect
Time to detect presence of device requesting power
tretention
Retention of configuration parameters
TJ = 25°C
Write_Cycles
Number of nonvolatile erase/write cycles
TJ = 25°C
(1)
(2)
(3)
(4)
2.3
2.4
V
µs
2
110
205
kHz
0.6
(3) (4)
sec
100
Years
20
K cycles
The maximum IOL, for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop specified.
The maximum IOH, for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified.
With default device calibration. PMBus calibration can be used to improve the regulation tolerance.
Time from close of error ADC sample window to time when digitally calculated control effort (duty cycle) is available. This delay must be
accounted for when calculating the system dynamic response. Includes EADC conversion time.
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DEVICE INFORMATION
Functional Block Diagram
bq500110
LED /
Supervisor
Control
Digital
High Res
PWM
COMM-1
6
COMM-2
7
3
PWR
3
GND
BPCAP
35
EXTREF
48
LED_MODE
PMOD_THRESH
44
Internal
3.3V & 1.8V
Regulator
Flash memory
with ECC
3
IIN
46
VIN
4
I_COIL
42
Osc
POR/BOR
watchdog
RESERVED
TEMP_IN
12-bit
ADC
260
ksps
JTAG
PMBUS
Internal Temp
Sense
4
LED2/SS
17
LED1/SCLK
25
LP_KILL/MOSI
26
LED3/MISO
9
DRV_SEL
12
PWM-A
13
DRIVE_EN/PWM-B
8
COILDIS
23
WD
24
21
Rsvd (lrClk)
SCI_TX
22
SCI_RX
18
DIAG_DISABLE
31
TRST
30
TMS
29
TDI
28
TDO
27
TCK
20
PMB_CTRL
19
PMB_ALERT
11
PMB_SDA
10
PMB_SCI
ARM-7 core
DEBUG
43
16
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EXTREF
AGND2
I_IN
AIN7
LED_MODE
PMOD_THR
I_COIL
V33FB
AIN4
AIN3
ANI2
AIN1
48
47
46
45
44
43
42
41
40
39
38
37
48-PIN QFN PACKAGE
(TOP VIEW)
AIN5
1
36
AGND 1
AIN6
2
35
BPCap
TEMP_IN
3
34
V33 A
V_IN
4
33
V33 D
RESET
5
32
DGND
COMM 1
6
31
TRST
bq500110
24
MOSI
BUZ_AC
25
23
12
WDO
COIL _PWM
SCI_RX
LED 3/ MISO/NO_SUP
22
26
21
11
SCI_TX
PMB_SDA
20
TCK
PMB_CTRL
27
19
10
PMB_ALERT
PMB_SCI
18
TDO
DIAG_DIS
28
17
9
LED1/ SCLK
DRV _SEL
16
TDI
LED2/ SS
29
15
8
BUZ_DC
COIL _DIS
14
TMS
LOGO1
30
13
7
DRV_EN
COMM 2
PIN FUNCTIONS
PIN
NO.
I/O
DESCRIPTION
NAME
1
AIN5
I
Connect this pin to GND
2
AIN6
I
Connect this pin to GND
3
TEMP_IN
I
Thermal protection Input
4
V_IN
I
Input-voltage ADC Input
5
RESET
I
Device reset
6
COMM1
I
Primary communication channel
7
COMM2
I
Alternate communication channel
8
COIL_DIS
I
Coil disable
Gate Driver mode select
9
DRV_SEL
I
10
PMB_SCI
I/O
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
11
PMB_SDA
I/O
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
12
COIL_PWM
O
PWM Output
13
DRV_EN
O
PWM Enable Output
14
LOGO1
O
Optional Logic Output. Leave this pin floating.
15
BUZ_DC
O
DC Buzzer Output
16
LED2 / SS
O
LED Drive Output 2 / Slave Select output
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PIN FUNCTIONS (continued)
PIN
NO.
6
I/O
DESCRIPTION
NAME
17
LED1 / SCLK
O
LED Drive Output 1 / Serial Clock Output
18
DIAG_DIS
I/O
Disable Diagnostic Output. Leave this pin floating to inhibit diagnostic.
19
PMB_ALERT
I/O
Optional Programming I/O. Connect to GND.
20
PMB_CTRL
I/O
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
21
SCI-TX
I/O
Optional Programming I/O. Leave floating.
22
SCI-RX
I/O
Optional Programming I/O. Leave floating.
23
WDO
O
External Watchdog Output
24
BUZ_AC
O
AC Buzzer Output
25
MOSI
I/O
Master Out Slave In
26
LED3/MISO/NO_SUP
I/O
LED Drive Output 3 / Master In Slave Out / Select stand alone operation (no supervisor)
27
TCK
I/O
Optional Programming I/O. Leave floating.
28
TDO
I/O
Optional Programming I/O. Leave floating.
29
TDI
I/O
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
30
TMS
I/O
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
31
TRST
I/O
Optional programming I/O. Pull to GND via 10kΩ resistor.
32
DGND
—
Digital GND
33
V33D
—
Digital Core 3.3V Supply
34
V33A
—
Analog 3.3V Supply
35
BPCAP
—
1.8V Bypass Capacitor Connect Pin
36
AGND
—
Analog GND
37
AN1
I
Reserved Analog Input. Connect this pin to GND.
38
AN2
I
Reserved Analog Input. Connect this pin to GND.
39
AN3
I
Reserved Analog Input. Connect this pin to GND.
40
AN4
I
Reserved Analog Input. Connect this pin to GND.
41
V33FB
I
3.3V Linear-Regulator Feedback Input. Leave this pin floating.
42
I_COIL
I
Coil Current Input
43
PMOD_THR
I
Input to Program Parasitic Metal Object Detection Threshold
44
LED_MODE
I
Input to Select LED Mode
45
AIN7
I
Reserved Analog Input. Connect this pin to GND.
46
I_IN
I
Transmitter Input Current
47
AGN2
48
EXTREF
—
I
Analog GND 2.
External Reference Voltage Input. Connect this Input to GND.
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TYPICAL CHARACTERISTICS
SPACER
EFFICIENCY
vs
RECEIVER LOAD CURRENT
RECTIFIER LOADING
vs
OUTPUT POWER
2.5
80
75
Rectifier Loading - W
Efficiency - %
70
65
60
1.5
1
Bin 2;
R51 = 48.7 kW
Bin 1;
R51 = 42.2 kW
0.5
55
50
100
Bin 5;
R51 = 75 kW
2
300
500
700
900
RL - Load Current - mA
1100
0
Bin 0;
R51 = 0 kW
0
Figure 1.
1
2
3
4
PO - Output Power - W
5
6
Figure 2.
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FUNCTIONAL OVERVIEW
The typical Wireless Power Transfer System consists of the primary and the secondary coils that are positioned
against each other in the way to maximize mutual coupling of their electromagnetic fields. Both coils have ferrite
shields as parts of their structure to even further maximize field coupling. The primary coil is exited with the
switching waveform of the transmitter power driver that gets its power from AC-DC wall adapter. The secondary
coil is connected to the rectifier that can either directly interface the battery or can have an electronic charger or
post-regulator connected to its output. The capacitors in series with the coils are tuned to create resonance in the
system. The system being in resonance facilitates better energy transfer compared to the inductive transfer.
Power transfer in the resonant system can also be easier controlled with the variable frequency control approach.
The rectifier output voltage is monitored by the secondary side microcontroller that generates signals to control
modulation circuit to pass coded information from the secondary side to the primary side. The coded information
is organized into information packets that have Preamble bytes, Header bytes, message bytes and the
Checksum bytes. Per WPC standard information packets can be related to Identification, Configuration, Control
Error, Rectified Power, Charge Status and End of Power Transfer. For detailed information on WPC standard
visit Wireless Power Consortium web site at http://www.wirelesspowerconsortium.com/.
There are two ways the coupled electromagnetic field can be manipulated to achieve information transfer from
the secondary side to the primary side. With resistive modulation approach shown in Figure 3, the
communication resistor periodically loads the rectifier output changing system Q factor and as a result value of
the voltage on the primary side coil. With capacitive modulation approach shown in Figure 4 a pair of
communication capacitors are periodically connected to the receiver coil network. These extra capacitance
application changes slightly the resonance frequency of the system and its response on the current operating
frequency, which in turn leads to coil voltage variation on the primary side.
With both modulation techniques primary side coil voltage variations are detected with demodulation circuit and
further interpreted in bq500110 to restore the content of the information packets and adjust controls to the
transmitter schematic.
Rectifier
Receiver Coil
Receiver
Capacitor
Amax
Modulation
Resitor
Operating state at logic “0”
A(0)
Operating state at logic “1”
A(1)
Modulation
Fsw
a)
F, kHz
b)
Figure 3. Resistive Modulation Circuit
8
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Rectifier
Receiver Coil
Receiver
Capacitor
Modulation
Capacitors
Amax
Modulation
A(0)
Operating state at logic “ 0”
A(1)
Operating state at logic “ 1”
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 4. Capacitive Modulation Circuit
The bq500110 is the industry's first wireless power dedicated transmitter controller that simplifies integration of
wireless power technology in consumer electronics, such as digital cameras, smart phones, MP3 players and
global positioning systems, along with infrastructure applications such as furniture and cars.
The bq500110 is a specialized digital power microcontroller that controls WPC A1, single coil, transmitter
functions such as analog ping, digital ping, variable frequency output power control, parasitic metal object
detection, protection against transmitter coil over-current, over temperature protection of the transmitter top
surface, and indication of the transmitter states of operation.
The bq500110 digital inputs receive and interpret signals from the analog demodulator circuit that provides first
stage of demodulation for digital commands sent by the WPC compliant Receiver. Based on the received
commands the controller provides control signals to the transmitter coil half-bridge power-driver. The controller
analog inputs monitor input DC voltage, Input Current, the Coil Current and the Thermal Protection input. These
analog inputs support monitoring and protective functions of the controller.
The bq500110 directly controls two LEDs to indicate the controller standby, power transfer, PMOD warning,
PMOD-stop and system fault states.
Option Select Pins
Two pins in bq500110 are allocated to program the LED mode and the PMOD mode of the device. At power–up,
a bias current is applied to pins LED_MODE and PMOD_THR and the resulting voltage measured in order to
identify the value of the attached programming resistor. The values of the operating parameters set by these pins
are determined using Option Select Bins. For LED_MODE the selected bin determines the LED behavior based
on LED Modes; for the PMOD_THR the selected bin sets a threshold used for parasitic metal object detection
(see Metal Object Detection (MOD) section).
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V33
LED_MODE
MOD_THRESH
bq500110
10 mA
IBIAS
Resistors
to set
options
To 12 -bit ADC
Figure 5. Option Programming
Table 1. Option Select Bins
BIN NUMBER
RESISTANCE
(kΩ)
LED OPTION
PMD
THRESHOLD
(mW)
0
GND
0
1400
1
42.2
1
1500
2
48.7
2
1600
3
56.2
3
1700
4
64.9
4
1800
5
75.0
5
1900
6
86.6
6
2000
7
100
7
2100
8
115
8
2200
9
133
9
2300
10
154
10
2400
11
178
11
2500
12
205
12
2600
13
open
13
OFF
LED Modes
The bq500110 can directly control up to three LED outputs. They are driven based on one of twelve selectable
modes. Using the resistor of the 44 pin to GND select one of the desired LED Indication scheme presented in
Table 2.
10
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Table 2. LED Modes
Operational States
LED
Control
Option
0
1
I/O
Supervisory
Register
Recommended
LED
Colors
Initialization
Uses Operating Blink Rate
PLD Blink
Power
Xfer
Charged
PLD
Fault
Standby
Uses Fault Blink Rate
Dev
Fault
Sys
Fault
NVM
Fault
Diag
LED
On
Diag
LED
Off
26
LED1
Red
ON
ON
OFF
OFF
ON
ON
ON
ON
ON
OFF
16
LED2
Green
ON
ON
Blink
ON
OFF
OFF
OFF
OFF
ON
OFF
17
LED3
Red (Pilot)
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
n/a
n/a
Pilot (Blue)
x
x
x
x
x
x
x
x
x
x
17
LED1
x
x
x
x
x
x
x
x
x
x
x
16
LED2
x
x
x
x
x
x
x
x
x
x
x
26
LED3
x
x
x
x
x
x
x
x
x
x
x
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
17
LED1
Green
OFF
OFF
ON
Blink
Blink
Blink
Blink
Blink
ON
OFF
16
LED2
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
26
LED3
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
2
Fault
Blink
Period
(ON time
+ OFF
time) (ms)
200
x
200
17
LED1
Red
OFF
OFF
ON
OFF
ON
ON
ON
Blink
ON
OFF
16
LED2
Green
OFF
OFF
ON
ON
OFF
OFF
OFF
Blink
ON
OFF
26
LED3
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
3
17
LED1
Red
ON
ON
OFF
OFF
ON
ON
ON
ON
ON
OFF
16
LED2
Green
ON
ON
Blink
ON
OFF
OFF
OFF
OFF
ON
OFF
26
LED3
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
4
PLD Blink
Period
(ON time
+ OFF
time) (ms)
200
x
200
Operating
Blink
Period
(ON time
+ OFF
time) (ms)
2000
x
2000
Initialization
Delay
(holds LED
state at Init)
Remarks
1000
Reserved for
support of
"legacy"
hardware,
uses NVM to
define LED
activity.
NOTE: Uses
active HIGH
LED drive!
x
Reserved for
future
custom
implementati
ons, LED
activity
defined by
NVM.
0
Simplest,
generic
single LED
indication
scheme that
signals
Power Xfer
and End of
Charge.
Optional Pilot
Power
indicator is of
any color
other than
Green
Simplest,
generic dual
LED
indication
scheme that
signals
Power Xfer
and End of
Charge.
Optional Pilot
Power
indicator is of
any color
other than
Green and
Red.
200
200
N/A
0
200
200
2000
0
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11
bq500110
SLUSAE0A – NOVEMBER 2010 – REVISED APRIL 2011
www.ti.com
Table 2. LED Modes (continued)
17
LED1
Red
OFF
OFF
Blink
OFF
Blink
Blink
Blink
Blink
ON
OFF
16
LED2
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
26
LED3
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
17
LED1
Red
OFF
OFF
OFF
OFF
Blink
Blink
Blink
Blink
ON
OFF
16
LED2
Green
OFF
OFF
Blink
ON
OFF
OFF
OFF
OFF
ON
OFF
26
LED3
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
17
LED1
Red
OFF
OFF
ON
OFF
Blink(1)
Blink
Blink
Blink
ON
OFF
16
LED2
Green
OFF
OFF
ON
ON
OFF
OFF
OFF
OFF
ON
OFF
26
LED3
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
17
LED1
Red
OFF
OFF
OFF
OFF
16
LED2
Green
OFF
OFF
Blink
ON
26
LED3
not used
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
17
LED1
Red
ON
ON
16
LED2
Green
ON
ON
26
LED3
not used
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
ON
17
LED1
Red
ON
OFF
Blink
OFF
Blink
Blink
16
LED2
not used
OFF
OFF
OFF
OFF
OFF
OFF
26
LED3
not used
OFF
OFF
OFF
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
ON
17
LED1
Red
ON
OFF
OFF
OFF
Blink
Blink
16
LED2
Green
OFF
OFF
Blink
ON
OFF
OFF
OFF
26
LED3
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
ON
17
LED1
Red
OFF
OFF
ON
OFF
Blink(1)
Blink
16
LED2
Green
ON
OFF
ON
ON
OFF
OFF
OFF
26
LED3
not used
OFF
OFF
OFF
OFF
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
ON
ON
17
LED1
Red
OFF
OFF
OFF
OFF
16
LED2
Green
ON
OFF
Blink
ON
26
LED3
not used
OFF
OFF
OFF
n/a
n/a
Pilot (Blue)
ON
ON
ON
5
6
7
8
ON
ON
ON
ON
ON
Blink
Blink
Blink
ON
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
ON
ON
ON
ON
ON
ON
OFF
OFF
ON
ON
ON
ON
ON
OFF
Blink
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
ON
ON
Blink
Blink
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
ON
ON
Blink
Blink
ON
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
ON
ON
ON
Blink
Blink
ON
OFF
OFF
ON
OFF
OFF
OFF
OFF
(1)
Blink
9
10
11
12
13
12
ON
ON
ON
ON
ON
Blink
Blink
Blink
ON
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
ON
ON
ON
ON
ON
(1)
Blink
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200
200
2000
0
200
200
2000
0
(1)
400
2000
2000
0
PLD Blinks
Operational
Blink.
(1)
400
2000
2000
0
200
200
2000
1000
200
200
2000
1000
200
200
2000
1000
400
2000
2000
1000
400
2000
2000
1000
PLD Blinks
Operational
Blink.
(1)
PLD Blinks
Operational
Blink.
(1)
PLD Blinks
Operational
Blink.
Copyright © 2010–2011, Texas Instruments Incorporated
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bq500110
SLUSAE0A – NOVEMBER 2010 – REVISED APRIL 2011
www.ti.com
Thermal Protection
The bq500110 can provide thermal protection to the transmitter. An external NTC resistor can be placed in the
most thermally challenged area, which usually is the center of the transmitting coil, and connected between VCC
and the dedicated pin 3. The threshold on the pin 3 is set 1.25V. The NTC resistor and the resistor from the pin 3
to GND create temperature sensitive divider. User has full flexibility choosing the NTC resistor and the value of
the resistor from the pin 3 to GND to set the desired temperature when the system shuts down.
RTEMP_IN = 0.6097 x RNTC(TMAX)
(1)
The system will attempt to restore normal operation after approximately five minutes being in the suspended
mode due to tripping the over-temperature threshold, or if the receiver is removed.
Audible Notification on Initiation of Power Transfer
The bq500110 is capable of activating two types of buzzers to indicate that power transfer has begun. Pin 15
outputs a high logic signal for 0.5s which is suitable to activate DC type buzzers with built in tone generation,
other types of sound generators, or custom indication systems. Pin 24 outputs a 0.2s, 4000Hz square wave
signal suitable for inexpensive AC type ceramic buzzers.
Gate Driver Modes
The inner PID (proportional-integral-derivative) loop feeds the variable frequency driver, which produces a digital
signal of 50% duty cycle with variable frequency. In operation, the inner PID loop calculates the necessary
frequency, which is then generated by the variable frequency driver. The variable frequency is then fed into a
MOSFET power train that excites the serial resonance transmitter coil.
The bq500110 can operate with several types of MOSFET gate drivers to accommodate various power train
topologies. The DRV_SEL input, pin 9, selects between two modes of drive. When pin 9 is pulled to GND, the
DRV_EN output, pin 13, will be driven high while the COIL_PWM output sends a square waveform to the gate
driver. The most typical and suggested solution is to use a synchronous buck driver like the TPS28225 that
drives n-channel upper and lower power MOSFETs with a safe dead-time.
An alternative solution that may utilize a combination of p-channel and n-channel MOSFETs can be used when
input DRV_SEL input, pin 9, is pulled high to VCC. In this case the outputs COIL_PWM and DRV_EN, both output
the square waveforms to discrete gate drivers. The dead-time is provided by pulse duration difference between
the two waveforms.
Coil Disable Signal
As the part of the WPC 1.0 compliance communication protocol, the bq500110 has the coil damping control
signal that is provided on the output COIL_DIS, pin 8. The damping signal activates the MOSFET that loads the
output of the half-bridge with the 100Ω resistor.
Power-On Reset
The bq500110 has an integrated power-on reset (POR) circuit that monitors the supply voltage. At power-up, the
POR circuit detects the V33D rise. When V33D is greater than VRESET, the device initiates an internal startup
sequence. At the end of the startup sequence, the device begins normal operation.
External Reset
The device can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. To avoid an erroneous trigger caused by noise, a 10kΩ pull up
resistor to 3.3V is recommended.
Non-Volatile Memory Error Correction Coding
The device uses Error Correcting Code (ECC) to improve data integrity and provide high reliability storage of
Data Flash contents. ECC uses dedicated hardware to generate extra check bits for the user data as it is written
into the Flash memory. This adds an additional six bits to each 32-bit memory word stored into the Flash array.
These extra check bits, along with the hardware ECC algorithm, allow for any single bit error to be detected and
corrected when the Data Flash is read. Note that the Data Flash configuration has been factory programmed and
is not generally available for customization.
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13
bq500110
SLUSAE0A – NOVEMBER 2010 – REVISED APRIL 2011
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Parasitic Metal Object Detection (PMOD)
As a safety feature, the bq500110 can be configured to detect presence of a parasitic metal object placed in the
vicinity of the magnetic field. The BQ500100 uses the Rectified Power Packet information and the measured
transmitter input-power to calculate parasitic losses in the system. When an excessive power loss is detected the
device will lit the red LED to warn about this undesirable condition, If during a twenty second warning time the
parasitic metal object was not removed , the controller will disable power transfer. After being in halt for five
minutes bq500110 will attempt normal operation. If the object that caused excessive power dissipation is still
present, the sequence will be repeated over and over again. If the metal object is removed during this twenty
second warning time, the normal operation will be restored momentarily.
To facilitate parasitic loss function, the bq500110 monitors the input voltage and the input current supplied to the
coil power drive circuit.
The PMOD_THR pin is used to set the threshold at which the MOD is activated. The MOD operation can be
disabled by selecting the highest bin( leaving the pin is left floating).
The threshold is set by Equation 2:
Threshold = 1400 mW + Bin_Number x 100 mW
(2)
Note: The WPC Specification V1.0 does not define the requirements and thresholds for MOD feature, thus metal
object detection may perform differently with different products. Therefore make your own decision when setting
the threshold. In most desktop wireless charger applications setting the PMOD threshold to 1.5W shown to give
good results in stopping power transfer and preventing small metal objects like coins, pharmaceutical wraps, etc.
getting hot when placed in the path of wireless power transfer. Figure 1 depicts PMOD performance measured
on bq500110 EVM. .
APPLICATION INFORMATION
Typical application diagrams for the WPC 1.0 compliant transmitter are shown on the following pages.
14
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Product Folder Link(s) :bq500110
J7
J2
1
VIN
J5
10k
5%
R11
0
R24
2
1
VCC
C16
4.7uF
25V
NTC THERMISTOR 20k
J6
CON100-2
2
1
19Vin
CON100-2
2
1
2
C11
0.01uF
25V
THERM
C9
0.01uF
25V
COIL_CURRENT
INPUT_CURRENT
C2
0.1uF
10V
C13
4.7uF
25V
U4
PH
VSEN
R16
76.8k
6
5
8
1
R37
15.4k
21V Range
TP10
VIN
GNDCOMP
SS
ENA
VIN BOOT
TP7
7
4
3
2
C14
0.1uF
50V
R52 2.00k
R49 10.0k
R38
2.00k
C12
2700pF
50V
CON2MM-8P
C28
0.022uF
6.3V
C24
4700pF
50V
D3
J1
8
7
6
5
4
3
2
1
L1
330uH
8
7
6
5
4
3
2
1
J3
R4
10k
5%
C17
47uF
6.3V
R17 22 5%
R3
10k
5%
C29
0.01uF
25V
C18
0.01uF
25V
10k
5%
R39
VCC
R12
3.16K
R15
10.0k
R6 22 5%
2
1
VCC
COMM1
COMM2
COILDIS
THERM
VIN_SENSE
C72
47uF
6.3V
C20
0.1uF
10V
37
38
39
40
18
21
22
6
7
8
9
46
45
42
4
3
2
1
5
41
48
AIN1
AIN2
AIN3
AIN4
GPIO-1
SCI_TX
SCI_RX
COMM1
COMM2
COIL_DIS
DRV_SEL
I_IN
AIN7
I_COIL
V_IN
TEMP_IN
AIN6
AIN5
RESET#
V33FB
EXTREF
C22
10uF
6.3V
CTRL
ALERT
SDA
SCI
BPCAP
TRST#
TMS
TDI
TDO
TCK
C31
10uF
6.3V
LED_MODE
PMOD_THR
LED1/MISO
SHTDWN/MOSI
LOGO4
WDO
COIL_PWM
DRV_EN
LOGO1
LOGO2
LED2/SS
LED1/SCLK
C26
0.01uF
25V
BQ500110
U7
C21
0.01uF
25V
VAA
AGND2
AGND1
47
36
CON100-2
33
34
V33D
V33A
DGND
PPAD
32
49
TCK
R50
64.9k
TP3
TP4
TP9
TP8
R9
R7
R8
5.1k
5%
VCC
R5 10k 5%
TP1
C25
0.1uF
10V
C30
2.2uF
16V
TP2
TP5
~TRST
R51
NoPop
44
43
26
25
24
23
12
13
14
15
16
17
20
19
11
10
35
31
30
29
28
27
22 5%
R42
VCC
TP6
R23
5.1k
5%
VCC
TP11
VCC
LED1
LED2
R34
10k
5%
VCC
C15
33pF
50V
COIL_PWM
R30
10k
5%
VCC
R40
10k
5%
VCC
PMB-CNTL
PMB-ALERT
PMB-SDA
PMB-SCL
~TRST
TMS
TDI
TDO
SCHEME 1: R7=0, R9=NoPop
SCHEME 2: R7=NoPop, R9=0
DRIVE_EN
R13
5.1k
5%
VCC
14
13
12
11
10
9
8
7
6
5
4
3
2
1
J4
JTAG/PROGRAMMING
HEADER
53047_1.25mm
DRIVE_EN
COIL_PWM
C27
.0uF
25V
1
2
3
4
IN
NC
NC
GND
9
8
7
6
5
3
PWM
2
4R
LED1
681
R1
R2 1.8k 5%
R14 680 5%
U9
TPS28225DRB
D1
LED-0603
1
D2
9
1
8
5
C36
0.22uF
16V
C32
2.2uF
16V
R47
V_GATE
VCC
VINA
C59
22uF
25V
VINA
0
4
R56 12.4 Ohm 4
C48
22uF
25V
VINA
V_GATE = 5.1 VDC
V_GATE
UGATE
PH
LGATE
4
EN/PG
2
LED2
7
6
V_GATE
R41
10.0k
R48
32.4k
3G
R43
10k
5%
C23
0.1uF
10V
OUT
NC
NC
FB/NC
PAD
U8
TPS-715A01
BT
GND
VIN
VDD
PAD
Q6
CSD17308Q3
1 2 3
5
Q7
R35
0.047
1/10W
CSD17308Q3
1 2 3
5
C67
22uF
25V
VINA
VIN
2
-
+
3
COILDIS
U6
1
VCC
C44
NoPop
5
4
C47
NoPop
VINA
C19
0.1uF
10V
10k
5%
R33
6
Q4
DMN5L06K
R46
100
5%
C34
C52
C42
C35
T1
0.033uF
250V
0.033uF
250V
0.033uF
250V
NoPop
100k
R60
7
8
R63
1
3
C45
0.1uF
16V
TPX2
To
Primary
X2 Coil
X1
TPX1
100k
R91
51.1
1/4W
IN- 6
IN+ 5
C43
0.22uF
16V
+
U10-B
-
10Hz 2-pole filter
D7
7
OUT
C71
0.01uF R95
100k
25V
INPUT_CURRENT
10.0k
10.0k
AC_COIL_CURRENT
R86
R85
C70
2200pF
50V
IN- 6
IN+ 5
11 V-
4 V+
+
U13-B
-
10V
AVCC
C65
0.1uF
C64
4700pF
50V
5kHz 2-pole filter
7
OUT
COIL_CURREN
COIL_CURRENT
AC_COIL_CURRENT
VCC
C1
0.22uF
16V
22 5%
R59
10.0k
R92
D4
C38
10uF
6.3V
3.3V
AVCC
10.0k
10.0k
R98
R88
10.0k
R94
5.11k
R82
R93
IN- 2
IN+ 3
R96
10.0k
1
10.0k
10.0k
R83
49.9
C62
0.01uF
25V
IN- 13
IN+ 12
100k
+
U10-D
-
R76
C55
100pF
25V
14 OUT
Pulse Amplifier
VBIAS
VBIAS
OUT
14 OUT
10.0k
R77
10.0k
AVCC
+
U13-A
-
+
U13-D
-
R99
IN- 13
IN+ 12
R97
2
B1
B2
U12
10.0k
R70
11 V-
+
U11-D
-
4 V+
14 OUT
AVCC
C46
2200pF
50V
IN- 9
IN+ 10
C56
4700pF
50V
+
U10-C
-
8
OUT
R90
10.0k
R89
10.0k
AVCC
5kHz 2-pole filter
IN- 13
IN+ 12
10V
C58
4700pF
50V
C40
0.1uF
5kHz 2-pole filter
C51
2200pF
50V
10.0k
R79
PHASE
C66
0.1uF
10V
10.0k
10.0k
R69
6
4
R73
S
A
VCC GND
COIL_PWM
3
1
5
AVCC
C63
0.22uF
16V
R64
D5
C69
0.01uF
25V
R61
10.0k
49.9
5.11k
8
R71
49.9
R72
10.0k
AVCC
+
U13-C
-
R84
IN- 9
IN+ 10
R87
100k
+
U11-A
-
R65
C39
0.01uF
25V
IN- 6
+
U11-B
-
7
OUT
1
100k
10.0k
Comparator
C50
0.01uF
25V
IN- 2
IN+ 3
R78
50V
330pF
OUT
VBIAS
Pulse Amplifier
C57
IN+ 5
OUT
TP13
R66
49.9
COMM2
R62
10.0k
C41
0.01uF
25V
IN- 9
IN+ 10
R67
+
U11-C
-
8
10.0k
Comparator
OUT
S2-1
TP12
COMM
bq500110
SLUSAE0A – NOVEMBER 2010 – REVISED APRIL 2011
www.ti.com
Changes from Original (November 2010) to Revision A
•
Page
Updated the data sheet for product release ......................................................................................................................... 1
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15
PACKAGE OPTION ADDENDUM
www.ti.com
1-Apr-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
BQ500110RGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
BQ500110RGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Mar-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ500110RGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
BQ500110RGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Mar-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ500110RGZR
VQFN
RGZ
48
2500
346.0
346.0
33.0
BQ500110RGZT
VQFN
RGZ
48
250
190.5
212.7
31.8
Pack Materials-Page 2
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