bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 Free Positioning, Qi Compliant Wireless Power Transmitter Manager Check for Samples: bq500410A FEATURES DESCRIPTION • The bq500410A is a free-positioning digital wireless power controller that integrates all functions required to control wireless power transfer to a WPC compliant receiver. It is WPC 1.1 ready and designed for 12-V systems but applicable to other supply voltages. The bq500410A pings the surrounding environment for WPC compliant devices to be powered, safely engages the device, reads the packet feedback from the powered device, and manages the power transfer. A charging area of at least 70 mm x 20 mm provides flexible receiver placement on a transmitter pad. The bq500410A supports both Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) by continuously monitoring the efficiency of the established power transfer, protecting from power lost due to metal objects misplaced in the wireless power transfer path. Should any abnormal condition develop during power transfer, the bq500410A handles it and provides fault indicator outputs. Comprehensive protection features provide a robust design to protect the system in all receiver placements. 1 • • • • • • • Expanded Free Positioning Using Three Coil Transmit Array Intelligent Control of Wireless Power Transfer Conforms to Wireless Power Consortium (WPC) A6 Transmitter Specification Digital Demodulation Reduces Components WPC1.1 Ready, Including Foreign Object Detection (FOD) Enhanced Parasitic Metal Detection (PMOD) Assures Safety Over-Current Protection LED Indication of Charging State and Fault Status APPLICATIONS • • WPC 1.1 Ready Wireless Chargers for: – Smart Phones and other Handhelds – Hermetically Sealed Devices and Tools – Cars and Other Vehicles – Tabletop Charge Surfaces See www.ti.com/wirelesspower for More Information on TI's Wireless Charging Solutions The bq500410A is available in an area saving 48-pin, 7 mm x 7 mm QFN package and operates over a temperature range from –40°C to 110°C. Functional Diagram and Efficiency Versus System Output Current 80 Transmitter Receiver Power AC-DC Rectification Voltage Conditioning Communication BQ500410 A Controller Feedback bq51k Load Efficiency (%) 70 Power Stage 60 50 40 30 20 0 1 2 3 Output Power (W) 4 5 G000 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION (1) OPERATING TEMPERATURE RANGE, TA ORDERABLE PART NUMBER PIN COUNT SUPPLY PACKAGE TOP-SIDE MARKING bq500410ARGZR 48 pin Reel of 2500 QFN bq500410A bq500410ARGZT 48 pin Reel of 250 QFN bq500410A -40°C to 110°C (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE MIN MAX Voltage applied at V33D to DGND –0.3 3.6 Voltage applied at V33A to AGND –0.3 3.6 –0.3 3.6 –40 150 Voltage applied to any pin (2) Storage temperature, TSTG (1) (2) 2 UNIT V °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to GND. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM 3.3 V Supply voltage during operation, V33D, V33A 3.0 TA Operating free-air temperature range –40 TJ Junction temperature MAX UNIT 3.6 V 110 °C 110 THERMAL INFORMATION bq500410A THERMAL METRIC (1) RGZ UNITS 48 PINS θJA Junction-to-ambient thermal resistance (2) 27.1 θJCtop Junction-to-case (top) thermal resistance (3) 12.9 (4) θJB Junction-to-board thermal resistance ψJT Junction-to-top characterization parameter (5) 0.2 ψJB Junction-to-board characterization parameter (6) 4.3 θJCbot Junction-to-case (bottom) thermal resistance (7) 0.6 (1) (2) (3) (4) (5) (6) (7) 4.3 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 3 bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN NOM MAX V33A = 3.3 V 8 15 V33D = 3.3 V 42 55 V33D = V33A = 3.3 V 52 60 3.3 3.6 4 4.6 UNIT SUPPLY CURRENT IV33A IV33D Supply current ITotal mA INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS V33 3.3-V linear regulator V33FB 3.3-V linear regulator feedback IV33FB Series pass base drive Beta Series NPN pass device Emitter of NPN transistor 3.25 VIN = 12 V; current into V33FB pin 10 V mA 40 EXTERNALLY SUPPLIED 3.3 V POWER V33D Digital 3.3-V power TA = 25°C 3 3.6 V33A Analog 3.3-V power TA = 25°C 3 3.6 V33Slew 3.3-V slew rate 3.3-V slew rate between 2.3 V and 2.9 V, V33A = V33D 0.25 V V/ms DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_BVCM Common mode voltage each pin COMM+, COMM- –0.15 Modulation voltage digital resolution REA Input Impedance Ground reference 0.5 IOFFSET Input offset current 1-kΩ source impedance –5 1.631 1 1.5 V mV 3 MΩ 5 µA 0.36 V ANALOG INPUTS: V_IN, V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR VADC_OPEN Voltage indicating open pin LED_MODE, LOSS_THR open VADC_SHORT Voltage indicating pin shorted to GND LED_MODE, LOSS_THR shorted to ground 2.37 VADC_RANGE Measurement range for voltage monitoring ALL ANALOG INPUTS INL ADC integral nonlinearity Ilkg Input leakage current 3 V applied to pin RIN Input impedance Ground reference CIN Input capacitance 0 -2.5 2.5 2.5 100 8 mV nA MΩ 10 pF DIGITAL INPUTS/OUTPUTS DGND1 + 0.25 VOL Low-level output voltage IOL = 6 mA , V33D = 3 V VOH High-level output voltage IOH = -6 mA , V33D = 3 V VIH High-level input voltage V33D = 3 V VIL Low-level input voltage V33D = 3.5 V IOH(MAX) Output high source current 4 IOL(MAX) Output low sink current 4 V33D - 0.6 V 2.1 V 3.6 1.4 mA SYSTEM PERFORMANCE VRESET Voltage where device comes out of reset V33D Pin tRESET Pulse width needed for reset RESET pin fSW Switching Frequency tdetect Time to detect presence of device requesting power 4 2.3 112 Submit Documentation Feedback 2.4 2 V µs 205 kHz 0.5 s Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 DEVICE INFORMATION Functional Block Diagram bq500410A LED Control / Low Power Supervisor Interface COMM _A+ 37 COMM_A- 38 COMM _B+ 39 7 MSP_RST/LED1 8 MSP_MISO/LED2 9 MSP_TEST 14 MSP_SYNC 18 MSP_CLK Digital Demodulation 25 MSP_MOSI/LPWR_EN 26 MSP_RDY COMM_B- 40 12 DPWM_A FOD 6 Controller PMOD 13 PWM/ Coil_Select V_IN 46 15 Coil 1.1 16 Coil 1.2 17 Coil 1.3 V_SENSE 45 I_SENSE 42 T_SENSE 2 COIL_PEAK 1 12-Bit ADC LOSS _THR 43 23 BUZ_AC Buzzer Control 24 BUZ_DC Power Control LED_MODE 44 11 PMB_DATA I2C 10 PMB_CLK TEMP_INT 5 RESET Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 5 bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com COMM_B- COMM_A- COMM_A+ 38 37 RESERVED 41 COMM_B+ I_SENSE 42 39 LOSS_THR 43 40 LED_MODE V_IN 46 44 GND 47 45 ADCREF 48 48-Pin RGZ (QFN) Package (Top View) COIL_PEAK 1 36 GND T_SENSE 2 35 BPCAP AD03 3 34 V33A AD08 4 33 V33D RESET 5 32 GND FOD 6 bq500410A RESERVED 30 RESERVED MSP_RST/LED1 7 MSP_MISO/LED2 8 29 RESERVED MSP _TEST 9 28 RESERVED PMB_CLK 10 27 RESERVED PMB _DATA 11 26 MSP _RDY 25 MSP _MOSI /LPWR_EN EPAD 49 13 14 15 16 17 18 19 20 21 22 23 24 PMOD MSP_SYNC Coil 1.1 Coil 1.2 Coil 1.3 MSP_CLK RESERVED RESERVED DOUT_TX DOUT_RX BUZ_AC BUZ_DC DPWM_A 12 6 31 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 Table 1. bq500410A Pin Description PIN NO. NAME 1 COIL_PEAK 2 T_SENSE 3 AD03 4 5 6 FOD 7 MSP_RST/LED1 8 I/O DESCRIPTION I Input from peak detect circuit I Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply connecting to 3.3-V supply I This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding AD08 I Reserved. Connect to 3.3-V supply RESET I Device reset. Use 10-kΩ to 100-kΩ pull-up resistor to 3.3-V supply O FOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It controls the FOD threshold resistor read at startup. I A dual function pin. MSP – RST provides serial communication to the external supervisor. LED1 -- If external MSP430 is not used, connect to a (green) LED via 470-Ω resistor for status indication. Grounding pin 25 determines this pin's function. I A dual function pin. MSP – MISO provided serial communication to the external supervisor. LED2 -- If external MSP430 is not used, connect to a (red) LED via 470-Ω resistor for status indication. Grounding pin 25 determines this pin's function. I MSP – Test, If external MSP430 is not used, leave this pin open MSP_MISO/LED2 9 MSP_TEST 10 PMB_CLK I/O 10-kΩ pull-up resistor to 3.3-V supply. I2C/PMBus is for factory use only. 11 PMB_DATA I/O 10-kΩ pull-up resistor to 3.3-V supply. I2C/PMBus is for factory use only. 12 DPWM_A O PWM Output to half bridge driver. Switching dead times must be externally generated. 13 PMOD O PMOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It controls the PMOD threshold resistor read at startup. 14 MSP_SYNC O MSP SPI_SYNC, If external MSP430 is not used, leave this pin open 15 COIL 1.1 O Enables the first coil drive train and COMM signal selector 16 COIL 1.2 O Enables the second coil drive train and COMM signal selector 17 COIL 1.3 O Enables the third coil drive train and COMM signal selector 18 MSP_CLK I/O MSP430 JTAG_CLK, SPI_CLK. Used for boot loading the MSP430 supervisor 19 RESERVED O Reserved, leave this pin open. 20 RESERVED I Reserved, connect to GND. 21 DOUT_TX I Reserved, leave this pin open 22 DOUT_RX I Reserved, leave this pin open 23 BUZ_AC O AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins 24 BUZ_DC O DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected to an LED via 470-Ω resistor. 25 MSP_MOSI/LPWR_EN I/O MSP-TDI, SPI-MOSI, Low Standby Power Supervisor Enable. Connect to GND if separate MSP430 low power supervisor is not used. 26 MSP_RDY I/O MSP_RDY, MSP430 Programmed Indication 27 RESERVED I/O Reserved, leave this pin open 28 RESERVED I/O Reserved, leave this pin open 29 RESERVED I/O Reserved, leave this pin open 30 RESERVED I/O Reserved, leave this pin open 31 RESERVED I/O Reserved, connect 10-kΩ pull-down resistor to GND. Do not leave open. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 7 bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com Table 1. bq500410A Pin Description (continued) PIN NO. 8 NAME I/O DESCRIPTION 32 GND — GND 33 V33D — Digital Core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as possible. 34 V33A — Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ω resistor and additional bypass capacitors 35 BPCAP — Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND 36 GND — GND 37 COMM_A+ I Digital demodulation noninverting input A, connect parallel to input B+ 38 COMM_A- I Digital demodulation inverting input A, connect parallel to input B- 39 COMM_B+ I Digital demodulation noninverting input B, connect parallel to input A+ 40 COMM_B- I Digital demodulation inverting input B, connect parallel to input A- 41 RESERVED I Reserved, leave this pin open 42 I_SENSE I Transmitter input current, used for parasitic loss calculations. Use 20-mΩ sense resistor and A=50 gain current sense amp 43 LOSS_THR I Input to program foreign metal object detection (FOD) threshold 44 LED_MODE I LED Mode Select 45 V_SENSE I Transmitter power train input voltage, used for FOD and Loss calculations. Voltage sample point should be after current input sense resistor. Use 76.8-kΩ to 10-kΩ divider to minimize quiescent loss. 46 V_IN I System input voltage selector. Connect this input to GND for 12-V operation. 47 GND — 48 ADCREF 49 EPAD I — GND External reference voltage input. Connect this input to GND. Flood with copper GND plane and stitch vias to PCB internal GND plane Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 Principles of Operation Fundamentals The principle of wireless power transfer is simply an open cored transformer consisting of a transmitter and receiver coils. The transmitter coil and electronics are typically built into a charger pad and the receiver coil and electronics are typically built into a portable device, such as a cell-phone. When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs once the transmitter coil is driven. The flux is coupled into the secondary coil which induces a voltage and current flows. The secondary voltage is rectified, and power can be transferred effectively to a load, wirelessly. Power transfer can be managed via any of various familiar closed-loop control schemes. Wireless Power Consortium (WPC) The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC Standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard defines the physical parameters and the communication protocol to be used in wireless power. For more information, or to download a copy of the WPC specification, go to http://www.wirelesspowerconsortium.com/. Power Transfer Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle. Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer. The closer the space between the coils is, the better the coupling. However, the practical distance is set to be less than 5 mm, as defined within the WPC Specification, to account for housing and interface surfaces. Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to contain the fields to avoid coupling to other adjacent system components. Regulation can be achieved by controlling any one of the coil coupling parameters. However, for WPC compatibility, the transmitter-side coils and capacitance are specified and the resonant frequency point is fixed. Power transfer is thus regulated by changing the frequency along the resonance curve from 112 kHz to 205 kHz, (that is the higher the frequency is, the lower the power). Duty cycle remains constant at 50% throughout the power band and is reduced only once 205 kHz is reached. The WPC standard describes the dimensions, materials of the coils and information regarding the tuning of the coils to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system efficiency. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 9 bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com Principles of Operation (continued) Communication Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM), sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual message and a checksum, as defined by the WPC standard. The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter-side electronics and the frequency of its coil-drive output is adjusted to close the regulation loop. The bq500410A features internal digital demodulation circuitry. The modulated impedance network on the receiver can either be resistive or capacitive. Figure 1 shows the resistive modulation approach, where a resistor is periodically added to the load, Figure 2 shows the resulting amplitude change in the transmitter voltage. Figure 2 shows the capacitive modulation approach, where a capacitor is periodically added to the load and the resulting amplitude change in the transmitter voltage. Rectifier Receiver Coil Receiver Capacitor Amax Modulation Resitor Operating state at logic “0” A(0) Operating state at logic “1” A(1) Comm Fsw a) F, kHz b) Figure 1. Receiver Resistive Modulation Circuit Rectifier Receiver Coil Receiver Capacitor Modulation Capacitors Amax Comm A(0) Operating state at logic “ 0” A(1) Operating state at logic “ 1” Fsw F, kHz Fo(1) < Fo(0) a) b) Figure 2. Receiver Capacitive Modulation Circuit 10 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 The bq500410A Description of Operation The bq500410A pings the surroundings in 400-ms intervals by sequentially firing the three coils in the array. The COMM feedback signal is multiplexed through analog switches and is synchronized to the coil being driven. To select the best coil match, the bq500410A looks for the strongest COMM signal. The coil is engaged and driven, note that only one coil is driven at a time. The driven coil is tolerant of slight misalignment of the RX while power is being transferred. Actually displacing the RX to an adjacent coil while charging is allowable, the sequential ping sequence and detection to determine the best matching coil to drive continues to repeat. Capacitor Selection Capacitor selection is critical to proper system operation. The total capacitance value of 2 nF x 68 nF (+5.6-nF center coil) is required in the resonant tank. This is the WPC system compatibility requirement, not a guideline. NOTE A total capacitance value of 2 nF x 68 nF/100 V (68 nF + 5.6 nF center coil) (C0G dielectric type) is required in the resonant tank to achieve the correct resonance frequency. The capacitors chosen must be rated for at least 100 V and must be of a high quality C0G dielectric (sometimes also called NP0). These are typically available in a 5% tolerance, which is adequate. The use of X7R types or below is not recommended if WPC compliance is required because critical WPC Certification Testing, such as the minimum modulation or ensured power requirements, might fail. The designer can combine capacitors to achieve the desired capacitance value. Various combinations can work depending on market availability. All capacitors must be of C0G types, not mixed with any other dielectric types. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 11 bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com A6 Coil Specification The coil and matching capacitor specification for the A6 transmitter has been established by WPC Standard. This is fixed and cannot be changed on the transmitter side. The bq500410A is primarily intended to drive a 3 coil array but it can also be used to drive a single coil. For single coil operation the two outer coils and associated electronics are simply omitted. Please refer to the application schematic at the end of this datasheet (See Figure 6). Doo Dol Doe Diw Dow Dil Figure 3. Coil Specification Drawing Table 2. Coil Specification PARAMETER SYMBOL SPECIFICATION Outer length Dol 53.2, (±0.5) Inner length Dil 27.5, (±0.5) Outer width Dow 45.2, (±0.5) Inner width Diw 19.5, (±0.5) Thickness Dc 1.5, (±0.5) Turns N 12 Layers - 1 Odd displacement Doo 49.2, (±4) Even displacement Doe 24.6, (±2) UNIT mm Turns mm NOTE The performance of an A6 transmitter can vary based on the design of the A6 coil set. For best performance with small receiver coils under heavy loading, it is best to design the coil set such that the Doo dimension is on the low end of the specified tolerance. For a current list of coil vendors please see: • bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649 12 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 Option Select Pins Two pins (pin 43 and pin 44) on the bq500410A are allocated to program the Loss Threshold and the LED mode of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting voltage measured in order to identify the value of the attached programming resistor. The values of the operating parameters set by these pins are determined using Table 4. For LED_MODE, the selected bin determines the LED behavior based on Table 3; for the LOSS_THR, the selected bin sets a threshold used for parasitic metal object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) section). bq500410A LED_MODE Resistors to set options 44 LOSS_THR 43 To 12-bit ADC Figure 4. Option Programming LED Modes The bq500410A can directly drive two LED outputs (pin 7 and pin 8) through a simple current limit resistor (typically 470 Ω), based on the mode selected. The two current limit resistors can be individually adjusted to tune or match the brightness of the two LEDs. Do not exceed the maximum output current rating of the device. The selection resistor connected between pin 44 and GND selects one of the desired LED indication schemes presented in Table 3. Table 3. LED Modes OPERATIONAL STATES LED CONTROL OPTION LED SELECTION RESISTOR 0 <36.5 kΩ LEDs off 1 42.2 kΩ Generic 2 3 4 48.7 kΩ 56.2 kΩ 64.9 kΩ > 75 kΩ (1) (2) DESCRIPTION LED STANDBY POWER TRANSFER CHARGE COMPLETE FAULT LED1, Green Off Blink slow (1) On Off Off LED2, Red Off Off Off On Blink fast (2) LED1, Green On Blink slow (1) On Off Off LED2, Red On Off Off On Blink fast (2) LED1, Green Off Off On Off Off LED2 Red Off On Off Blink fast (2) On LED1, Green Off On Off Off Off LED2 Red Off Off Off On Blink fast (2) Generic + standby Generic Opt 1 Generic Opt 2 PMOD or FOD WARNING Reserved Blink slow = 0.625 Hz Blink fast = 2.5 Hz Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 13 bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD) The bq500410A is WPC1.1 ready and supports both enhanced PMOD and FOD features by continuously monitoring the input voltage and current to calculate input power. Combining input power, known losses, and the value of power reported by the RX device being charged, the bq500410A can estimate how much power is unaccounted for and presumed lost due to metal objects placed in the wireless power transfer path. If this unexpected loss exceeds the threshold set by the LOSS_THR resistor, a fault is indicated and power transfer is halted. Whether the PMOD or the FOD algorithm is used is determined by the ID packet of the receiver being charged. PMOD has certain inherent weaknesses as rectified power is not ensured to be accurate per WPC1.0 Specification. The user has the flexibility to adjust the LOSS_THR resistor or to disable PMOD by leaving pin 43 open should issues with compliance or interoperability arise. The FOD algorithm uses information from an in-system characterized and WPC1.1 certified RX and it is therefore more accurate. Where the WPC1.0 specification requires merely the Rectified Power packet, the WPC1.1 specification additionally uses the Received Power packet which more accurately tracks power used by the receiver. As default, PMOD and FOD share the same LOSS_THR setting resistor for which the recommended starting point is 400 mW (selected by a 56.2-kΩ resistor on the LOSS_THR option pin 43). If, for some reason, the application requires disabling one or the other or setting separate PMOD and FOD thresholds, Figure 5 can be used. Resistor R39 sets the FOD threshold and R24 sets the PMOD threshold in this configuration. The control lines (FOD and PMOD) are driven briefly at power-up when the resistor values are read. To selectively disable PMOD support, R24 and Q8-B should be omitted from the above design. 14 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 Table 4. Option Select Bins BIN NUMBER RESISTANCE (kΩ) LOSS THRESHOLD (mW) 0 <36.5 250 1 42.2 300 2 48.7 350 3 56.2 400 4 64.9 450 5 75.0 500 6 86.6 550 7 100 600 8 115 650 9 133 700 10 154 750 11 178 800 12 205 850 13 >237 Feature Disabled SEE_NOTE SEE_NOTE R22 R39 Q8-A FOD R24 Q8-B AGND PMOD Figure 5. LOSS_THR Connection Circuits NOTE Either one of these circuits is connected to LOSS_THR, but not both. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 15 bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com Shut Down by Thermal Sensor or Trigger Typical applications of the bq500410A does not require additional thermal protection. This shutdown feature is provided for enhanced applications and is not limited to thermal shutdown. The key parameter is the 1.0-V threshold on pin 2. Voltage below 1.0 V on pin 2 causes the device to shut down. The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are connected to the bq500410A device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the system shuts down and a fault is indicated (depending on LED mode chosen). To 1. 2. 3. 4. implement this feature follow these steps: Consult the NTC datasheet and find the resistence vs temperature curve. Determine the actual temperature where the NTC will be placed by using a thermal probe. Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC. Use the following formula to determine the upper leg resistor (R_Setpoint): R _ Setpoint = 2.3 ´ R _ NTC (1) The system restores normal operation after approximately five minutes or if the receiver is removed. If the feature is not used, this pin must be pulled high. NOTE Pin 2 must always be terminated, else erratic behavior may result. Fault Handling and Indication The following is a table of End Power Transfer (EPT) packet responses, fault conditions, the duration how long the condition lasts until a retry in attempted. The LED mode selected determines how the LED indicates the condition or fault. Table 5. Fault Handling and Indication 16 CONDITION DURATION (before retry) EPT-00 Immediate Unknown EPT-01 5 seconds Charge complete EPT-02 Infinite Internal fault EPT-03 5 minutes Over temperature EPT-04 Immediate Over voltage EPT-05 Immediate Over current HANDLING EPT-06 Infinite Battery failure EPT-07 Not applicable Reconfiguration EPT-08 Immediate No response OVP (over voltage) Immediate OC (over current) 1 minute NTC (external sensor) 5 minutes PMOD/FOD warning 12 seconds PMOD/FOD 5 minutes 10 seconds LED only, 2 seconds LED + buzzer Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 Power Transfer Start Signal The bq500410A features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400 ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized indication scheme. Do not exceed 4 mA loading from either of these pins which is more than adequate for small signaling and actuation. If not used, these pins should be left open. Power-On Reset The bq500410A has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed. External Reset, RESET Pin The bq500410A can be forced into a reset state by an external circuit connected to the RESET pin. A logic low voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-kΩ pull-up resistor. Trickle Charge and CS100 CS100 is supported. If CS100 is reported by the RX, the bq500410A indicates that charge is complete. The WPC specification provides an End-of-Power Transfer message (EPT) to indicate charge complete. Upon receipt of the charge complete message, the bq500410A changes the LED indication to solid green LED output and halt power transfer for 5 seconds. Subsequently, transmitters pings the receiver again to see if its status has changed, assuming it receives another EPT, the LED mode stays the same. The WPC specification also provides reporting of the level of battery charge (Charge Status). In some battery charging applications there is a benefit to continue the charging process in trickle-charge mode to top off the battery. The bq500410A changes the LED indication to reflect charge complete when a 'Charge Status 100%' message is received, but unlike the response to an EPT message, it does not halt power transfer while the LED is solid green. The RX, the mobile device being charged, uses a CS100 packet to enable trickle charge mode. Current Monitoring Requirements The bq500410A is WPC1.1 ready. In order to enable the PMOD or FOD features, current monitoring must be provided in the design. Current monitoring is optional however, it is used for the foreign metal protection features and over current protection. The system designer can choose not to include the current monitor and remain WPC1.0 compliant. Alternately, the additional current monitoring circuitry can be added to the hardware design but not loaded. This would enable a forward migration path to future WPC1.1 compatibility. For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current shunt amplifier should have a gain of 50, such as the INA199A1. The current sense resistor has a temperature stability of ±200 PPM. Proper current sensing techniques in the application hardware should also be observed. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 17 bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com Over-Current Protection The bq500410A has an integrated current protection feature which monitors the input current reported by the current sense resistor and amplifier. If the input current exceeds a safety threshold, a fault is indicated and power transfer is halted for one minute. If this feature is desired, the sense resistor and amplifier are required. If this feature is not desired, the I_SENSE input pin to the bq500410A (pin 42) should be grounded. NOTE Always terminate the I_SENSE pin (pin 42), either with the output of a current monitor circuit or by connecting to ground. MSP430G2101 Low Power Supervisor This is an optional low-power feature. By adding the MSP430G2101, as recommended in the bq500410A application schematic, the bq500410A device is periodically shut down to conserve power, yet all relevant states are recalled and all running LED status indicators remain active. Since the bq500410A needs an external low-power mode to significantly reduce power consumption, the most direct way to reduce power is to remove its supply and completely shut it down. In doing so, however, the bq500410A goes through a reset and any data in memory would be lost. Important information regarding charge state, fault condition, operating mode and indicator pins driven would be cleared. The MSP430G2101, in its role as a low-power supervisor, is used to provide accurate 'ping' timing, retains charge state, operating mode, fault condition and all relevant operation states. The LEDs are now driven and controlled by the MSP430, not the bq500410A, which directly drives and maintains the LED status indication during the bq500410A reset periods. Since the LED indicators are now driven by the MSP430G2101, care should be taken not to exceed the pin output current drive limit. Using the suggested circuitry, a standby power reduction from 300 mW to less than 90 mW can be expected making it possible to achieve Energy Star rating. The user does not need to program the MSP430G2101, an off-the-shelf part can be used. The required MSP430G2101 firmware is embedded in the bq500410A and is boot loaded at first power up, similar to a field update. The MSP430G2101 code cannot be modified by the user. NOTE The user cannot program the MSP430G2101 in this system. All Unused Pins All unused pins can be left open unless otherwise indicated. Please refer to Table 1. Grounding of unused pins, if it is an option, can improve PCB layout. 18 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A bq500410A www.ti.com SLUSB96 – NOVEMBER 2012 APPLICATION INFORMATION Overview The application schematic for the transmitter with reduced standby power is shown in Figure 7. CAUTION Please check the bq500410A product page for the most up-to-date schematic and list of materials reference design package before starting a new project. Input Regulator The bq500410A requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down from the 12-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements with respect to cost or efficiency. The application example circuit utilizes a low-cost buck regulator, TPS54231. Power Trains The bq500410A drives three independent half bridges. Each half bridge drives one coil from the coil set assembly. The TPS28225 is the recommended driver device for this application. It features high-side drive capability which enables the use of N-channel MOSFETs throughout. Gate-drive supply can be derived from a primitive active voltage divider. A highly regulated supply is not required to drive MOSFET gates. Signal Processing Components The COMM signal used to control power transfer is derived from the coil voltage. Each coil has its own signal processing chain. The coil voltage is AC coupled and divided down to a manageable level and biased to a 1-V offset. Series connected diodes are provided for protection from any possible transients. The three signal processing chains are then multiplexed together via analog switches. Thus, the correct signal processing chain and COMM signal used to control power transfer is from the coil being driven. Low-Power Supervisor Power reduction is achieved by periodically disabling the bq500410A while LED and housekeeping control functions are continued by U4, the low-cost, low quiescent current micro controller MSP430G2101. When U4 is present in the circuit (which is set by a pull-up resistor on bq500410A pin 25), the bq500410A at first power-up boots the MSP430G2101 with the necessary firmware and the two chips operate in tandem. During standby operation, the bq500410A periodically issues SLEEP command, Q1 pulls the supply to the bq500410A, therefore eliminating its power consumption. Meanwhile, the MSP430G2101 maintains the LED indication and stores previous charge state during this bq500410A reset period. This bq500410A off period is set by the MSP430G2101. WPC compliance mandates the power transmitter controller, bq500410A, awakes every 400 ms to produce an analog ping and check if a valid device is present. This time constant can not be altered to further reduce power. Disabling Low-Power Supervisor Mode For lowest cost or if the low-power supervisor is not needed, please refer to Figure 8 for an application schematic example. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 19 bq500410A SLUSB96 – NOVEMBER 2012 www.ti.com Input Power Requirements For full wireless power system capability and WPC compliance, the AC power adapter selected for the application should have a minimum rating of 12 V at 750 mA. PCB Layout Careful PCB layout practice is critical to proper system operation. There are many references on proper PCB layout techniques. A few good tips are repeated here: The TX layout requires a 4-layer PCB layout for best ground plane technique. A 2-layer PCB layout can be achieved though not as easily. Ideally, the approach to the layer stack-up has been: • Layer 1 component placement and as much ground plane as possible. • Layer 2 clean ground. • Layer 3 finish routing. • Layer 4 clean ground. Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also provides a noise free voltage reference plane for device operation. Keep as much copper as possible. Make sure the bq500410A GND pins and the power pad have a continuous flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also acts as a heat sink for the bq500410A. A good GND reference is necessary for proper bq500410A operation, such as analog-digital conversion, clock stability and best overall EMI performance. Separate the analog ground plane from the power ground plane and use only ONE tie point to connect grounds. Having several tie points defeats the purpose of separating the grounds! The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as differential routing and shielding, but the COMM signal lines do not need to be impedance matched. The DC-to-DC buck regulator used from the 12-V input supplies the bq500410A with 3.3 V. Typically a singlechip controller solution with integrated power FET and synchronous rectifier or outboard diode is used. Pull in the buck inductor and power loop as close as possible to create a tight loop. Likewise, the power-train, full-bridge components should be pulled together as tight as possible. See the bq500410A EVM for an example of a good layout technique. References 1. Technology, Wireless Power Consortium, http://www.wirelesspowerconsortium.com/ 2. Analog Applications Journal, An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, Johns, Bill, (Texas Instruments Literature Number SLYT401) 3. Datasheet, Qi Compliant Wireless Power Transmitter Manager, (Texas Instruments Literature Number SLUSAL8) 4. Datasheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, (Texas Instruments Literature Number SLVSAT9) 5. Application Note, Building a Wireless Power Transmitter, (Texas Instruments Literature Number SLUA635) 6. Application Note, bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649 20 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A Copyright © 2012, Texas Instruments Incorporated Product Folder Links: bq500410A 2 1 12V-IN DC in J2 N/C D7 C28 D3 BAT54SW D2 4 7 N/C C4 C26 C32 R37 76.8k 6 5 8 1 7 6 5 4 3 2 1 COMM+ R10 NoPop R33 76.8K R31 10.0K P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 VCC 2700pF R40 100K 330pF MSP_MISO MSP_CLK 475 475 475 R9 R32 R3 NoPop C29 COMP VSENS PH BOOT U5 TPS54231D GND SS EN 0.01uF GND ties JP1 JP2 JP3 0.1uF 10uF 3 C25 STATUS C6 2 PILOT VIN 3V3_VCC 2 R4 3.16k C31 4.7nF R5 10.0K NTC 3V3_VCC 14 C11 4.7uF C33 MSP_TEST MSP_SYNC R13 10.0K COMM+ COMM- MSP_CLK MSP_RST 4.7nF MSP_MISO MSP_TEST I_SENSE 0.1uF C22 10.0K R25 RESET 1.0uF 37 COMM_A+ 38 COMM_A39 COMM_B+ 40 COMM_B- 18 MSP_CLK 21 DOUT_TX 22 DOUT_RX 6 FOD 7 MSP_RST/LED1 8 MSP_MISO/LED2 9 MSP_TEST 46 V_IN 45 V_SENSE 42 I_SENSE 3V3_VCC 4.7uF 4 AD08 3 AD03 2 T_SENSE 1 COIL_PEAK 5 41 RESERVED 48 ADCREF C1 C19 2.2nF C7 47p 26 25 24 23 12 13 14 15 16 17 LED_MODE 44 LOSS_THR 43 MSP_RDY MSP_MOSI/LPWR_EN BUZ_DC BUZ_AC DPWM_A PMOD MSP_SYNC COIL1.1 COIL1.2 COIL1.3 RESERVED 20 RESERVED 19 11 PMB_DATA 10 PMB_CLK 35 31 30 29 28 27 1.0uF C3 BPCAP RESERVED RESERVED RESERVED RESERVED RESERVED 4.7uF C5 R22 100K R7 10.0K C20 I_SENSE R23 42.2k R45 10.0K MSP_RDY MSP_MOSI COIL1.2 MSP_SYNC BUZ R12 10.0K R67 150k R68 249k R17 10.0K TP18 R11 10.0K R8 10.0 Q14 BC847CL 12V-IN C30 0.01uF 3V3_VCC 3V3_VCC TP14 C78 0.1uF 3V3_VCC R71 1.00k V+ R18 1.00 VIN_BRD C69 0.1uF R15 1.00 REF GND U17 INA199A1 MSP_RST 1.0uF 1.0nF C34 3V3_VCC Q2 BSS215P R21 10.0K Q1 BSS215P R6 100K U11 BQ500410A 22 R46 MSP_RDY R20 10.0K R19 10.0 1.0 MSP_MOSI C12 R14 47K 0.1uF R29 9 3V3_VCC C10 0.01uF C2 47uF VCC 8 10 11 12 13 C16 P1.6 P1.7 RST TEST XOUT XIN GND 10.0K R1 D1 MBR0540 L1 330uH U4 MSP430G2101 0.1uF VIN_BRD IN- 12V-IN V33D 33 IN+ 1 OUT J1 V33A 34 GND GND GND EPAD R69 0.020 DPWM-1A 0.1uF C70 COIL1.2 DPWM-1A TP32 0.1uF C72 V_GATE 6 4 7 3 GND EN/PG PWM VDD LGATE PHSE BOOT UGATE U18 TPS28225D 1 C73 TP34 0.22uF R27 10.0 R35 0 5 8 2 COMM- COMM+ Q15 TP31 Q13 F R72 10.0 R2 10.0 C79 R66 10.0K R28 200k 4700pF C76 0.068uF C75 0.068uF TP33 R70 33pF C74 D5 BAT54SW 23.2k C77 22uF 3V3_VCC C23 5.6nF C21 5.6nF VIN_BRD www.ti.com 47 36 32 49 TP16 TP15 12V-IN bq500410A SLUSB96 – NOVEMBER 2012 bq500410A Single, Low-Power and Low-Cost Schematics Figure 6. bq500410A Single Coil Application Diagram Submit Documentation Feedback 21 DC in J2 2 1 12V-IN D7 C28 D3 BAT54SW D2 7 VIN GND SS EN 0.01uF GND ties JP1 JP2 JP3 0.1uF 10uF 4 2 N/C 3 C25 STATUS C6 1 PILOT 475 R32 N/C C4 C26 C32 R37 76.8k 6 5 7 6 5 4 3 2 1 R33 76.8K R4 3.16k C31 4.7nF R5 10.0K FOD NTC 3V3_VCC C11 4.7uF MSP_TEST MSP_SYNC MSP_TEST MSP_MISO Q8-A COMM+ COMM- 4.7nF MSP_RST FOD I_SENSE 0.1uF C22 10.0K R25 R39 MSP_CLK DOUT_TX DOUT_RX R13 10.0K RESET Q8-B PMOD COMM_A+ COMM_ACOMM_B+ COMM_B- SEE_NOTE 37 38 39 40 18 MSP_CLK 21 DOUT_TX 22 DOUT_RX R24 1.0uF 6 FOD 7 MSP_RST/LED1 8 MSP_MISO/LED2 9 MSP_TEST 46 V_IN 45 V_SENSE 42 I_SENSE 3V3_VCC 4.7uF 4 AD08 3 AD03 2 T_SENSE 1 COIL_PEAK 5 41 RESERVED 48 ADCREF C1 C19 2.2nF 12 13 14 15 16 17 20 19 11 10 AGND R22 LED_MODE 44 LOSS_THR 43 MSP_RDY 26 MSP_MOSI/LPWR_EN 25 BUZ_DC 24 BUZ_AC 23 DPWM_A PMOD MSP_SYNC COIL1.1 COIL1.2 COIL1.3 RESERVED RESERVED PMB_DATA PMB_CLK 35 31 30 29 28 27 1.0uF C3 BPCAP RESERVED RESERVED RESERVED RESERVED RESERVED 4.7uF SEE_NOTE LOSS_THR 1 C7 47p R23 42.2k R45 10.0K MSP_RDY MSP_MOSI PMOD MSP_SYNC COIL1.1 COIL1.2 COIL1.3 Parts labeled "NoPop" are not installed R7 10.0K C20 I_SENSE C69 0.1uF C78 0.1uF BUZ R12 10.0K R8 10.0 R67 150k R17 10.0K TP18 R11 10.0K 3V3_VCC C30 0.01uF 3V3_VCC R18 1.00 TP14 V+ 3V3_VCC R71 1.00k REF GND U17 INA199A1 MSP_RST 1.0uF 1.0nF C34 Q2 BSS215P R21 10.0K C5 R6 100K U11 BQ500410A 22 R46 MSP_MOSI R20 10.0K R19 10.0 8 C12 R14 47K 0.1uF C33 1.0 MSP_RDY 3V3_VCC C10 0.01uF 47uF C2 R29 9 10 11 12 13 14 C16 P1.6 P1.7 RST TEST XOUT XIN GND 10.0K R1 D1 MBR0540 L1 330uH U4 MSP430G2101 0.1uF R15 1.00 R68 249k TP32 COIL1.3 DPWM-1A COIL1.2 DPWM-1A 0.1uF COIL1.1 DPWM-1A C70 DPWM-1A Q14 BC847CL 12V-IN 0.1uF C90 V_GATE 0.1uF C82 V_GATE 0.1uF C72 V_GATE 6 4 7 3 6 4 7 3 6 4 7 3 VDD GND 1 LGATE PHSE BOOT UGATE COIL1.1 LGATE PHSE BOOT UGATE C73 C83 A VCC S C91 3V3_VCC A VCC S U23 C97 0.1uF TP42 0.22uF U21 C89 0.1uF R82 10.0 R41 0 5 8 2 1 U19 0.22uF TP38 3V3_VCC R36 0 5 8 2 1 A VCC S C81 0.1uF R74 10.0 3V3_VCC TP34 0.22uF R27 10.0 R35 0 5 8 2 U22 TPS28225D COIL1.2 EN/PG PWM VDD GND LGATE PHSE BOOT UGATE U20 TPS28225D COIL1.1 EN/PG PWM VDD GND EN/PG PWM U18 TPS28225D B1 GND B2 B1 GND B2 B1 GND B2 TP15 COMM+ Q17 COMM+ Q19 TP40 Q18 COMM- C79 R66 10.0K R28 200k 4700pF COMM- COMM- R84 10.0K R83 200k 4700pF C96 R78 10.0K R77 200k 4700pF C88 Middle Coil TP36 Q16 TP16 COMM+ Q15 TP31 Q13 C76 0.068uF C93 0.068uF TP41 C94 0.068uF C85 0.068uF TP37 C86 0.068uF C75 0.068uF TP33 R70 D5 R79 D10 R85 D11 33pF C92 BAT54SW 23.2k 3V3_VCC C27 NoPop 22uF C95 VIN_BRD C24 NoPop 33pF C84 BAT54SW 23.2k 3V3_VCC C15 5.6nF 22uF C87 VIN_BRD C14 5.6nF 33pF C74 BAT54SW 23.2k C77 22uF 3V3_VCC C23 NoPop C21 NoPop VIN_BRD SLUSB96 – NOVEMBER 2012 Note: Either one of these circuits is connected to LOSS_THR but not both R31 10.0K P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 VCC R10 NoPop COMM+ 330pF MSP_MISO 1 8 2700pF R40 100K 475 R9 MSP_CLK 475 R3 NoPop C29 COMP VSENS PH BOOT Q1 BSS215P 3V3_VCC VIN_BRD IN- 2 3V3_VCC IN+ VCC OUT J1 VIN_BRD R69 0.020 10.0 U5 TPS54231D V33A 34 R72 R80 12V-IN V33D 33 47 GND 36 GND 32 GND 49 EPAD 10.0 F 10.0 F 10.0 F R2 R73 R81 Product Folder Links: bq500410A 10.0 Submit Documentation Feedback 10.0 22 R86 12V-IN bq500410A www.ti.com Figure 7. bq500410A Low-Power Application Diagram Copyright © 2012, Texas Instruments Incorporated D3 BAT54SW N/C DC in R10 NoPop COMM+ 330pF C4 R40 100K J2 2 1 R33 76.8K N/C R31 10.0K C31 4.7nF D2 4 7 COMM+ COMM- R32 1 C32 R37 76.8k 6 5 8 RESET 37 38 39 40 COMM_A+ COMM_ACOMM_B+ COMM_B- 18 MSP_CLK 21 DOUT_TX 22 DOUT_RX 6 FOD 7 MSP_RST/LED1 8 MSP_MISO/LED2 9 MSP_TEST 46 V_IN 45 V_SENSE 42 I_SENSE 4 AD08 3 AD03 2 T_SENSE 1 COIL_PEAK 5 41 RESERVED 48 ADCREF 4.7uF 1.0uF C1 DPWM_A PMOD MSP_SYNC COIL1.1 COIL1.2 COIL1.3 12 13 14 15 16 17 RESERVED 20 RESERVED 19 11 PMB_DATA 10 PMB_CLK BPCAP RESERVED RESERVED RESERVED RESERVED RESERVED 1.0uF C3 35 31 30 29 28 27 4.7uF C5 LED_MODE 44 LOSS_THR 43 MSP_RDY 26 MSP_MOSI/LPWR_EN 25 BUZ_DC 24 BUZ_AC 23 U11 BQ500410A 22 R46 10.0K R1 D1 MBR0540 L1 330uH R4 3.16k VCC 0.1uF C19 C26 2700pF 475 R9 475 0.1uF C22 10.0K R25 VCC NoPop C29 COMP VSENS PH BOOT U5 TPS54231D GND SS EN VIN 0.01uF C28 GND ties JP1 JP2 JP3 C25 0.1uF C6 12V-IN 10uF 2 3 1 2 VCC 12V-IN VCC 12V-IN V33A 34 C2 C33 0.1uF R23 42.2k COIL1.1 COIL1.2 COIL1.3 1.0uF R7 10.0K C20 47uF VCC R17 10.0K TP18 R11 10.0K VCC R8 10.0 R12 10.0K VCC R67 150k DPWM-1A R68 249k COIL1.3 DPWM-1A COIL1.2 DPWM-1A 0.1uF C70 COIL1.1 DPWM-1A TP32 0.1uF C90 V_GATE 0.1uF C82 V_GATE 0.1uF C72 V_GATE 4 7 3 6 4 7 3 6 4 7 3 6 GND LGATE PHSE BOOT UGATE COIL1.1 LGATE PHSE BOOT UGATE C73 1 C83 1 A VCC S C91 3V3_VCC A VCC S U23 C97 0.1uF TP42 0.22uF U21 C89 0.1uF R82 10.0 R41 0 5 8 2 U19 0.22uF TP38 3V3_VCC R36 0 5 8 2 A VCC S C81 0.1uF R74 10.0 3V3_VCC TP34 0.22uF R27 10.0 R35 0 5 8 2 1 U22 TPS28225D COIL1.2 EN/PG PWM VDD GND LGATE PHSE BOOT UGATE U20 TPS28225D COIL1.1 EN/PG PWM VDD GND EN/PG PWM VDD U18 TPS28225D B2 B1 GND B2 B1 GND B2 B1 GND TP15 COMM+ Q17 COMM+ Q19 TP40 Q18 COMM- C79 R66 10.0K R28 200k 4700pF COMM- COMM- R84 10.0K R83 200k 4700pF C96 R78 10.0K R77 200k 4700pF C88 Middle Coil TP36 Q16 TP16 COMM+ Q15 TP31 Q13 10.0 Q14 BC847CL R72 R80 J1 STATUS V33D 33 47 GND 36 GND 32 GND 49 EPAD 10.0 F 10.0 F 10.0 F R2 R73 R81 Product Folder Links: bq500410A 10.0 Copyright © 2012, Texas Instruments Incorporated 10.0 C76 0.068uF C93 0.068uF TP41 C94 0.068uF C85 0.068uF TP37 C86 0.068uF C75 0.068uF TP33 R70 R79 R85 33pF C92 D11 BAT54SW 23.2k 3V3_VCC C27 NoPop 22uF C95 VIN_BRD C24 NoPop 33pF C84 D10 BAT54SW 23.2k 3V3_VCC C15 5.6nF 22uF C87 VIN_BRD C14 5.6nF 33pF C74 D5 BAT54SW 23.2k C77 22uF 3V3_VCC C23 NoPop C21 NoPop VIN_BRD www.ti.com R86 12V-IN bq500410A SLUSB96 – NOVEMBER 2012 Figure 8. bq500410A Low-Cost Application Diagram Submit Documentation Feedback 23 PACKAGE OPTION ADDENDUM www.ti.com 12-Nov-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Samples (3) (Requires Login) BQ500410ARGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR BQ500410ARGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Nov-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ500410ARGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 BQ500410ARGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Nov-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ500410ARGZR VQFN RGZ 48 2500 367.0 367.0 38.0 BQ500410ARGZT VQFN RGZ 48 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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