VISHAY VSML3710-GS08

VSML3710
Vishay Semiconductors
High Power Infrared Emitting Diode, 940 nm, GaAlAs/GaAs
FEATURES
• Package type: surface mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• Peak wavelength: λp = 940 nm
• High reliability
• High radiant power
• High radiant intensity
• Angle of half intensity: ϕ = ± 60°
94 8553
• Low forward voltage
• Suitable for high pulse current operation
• Good spectral matching with Si photodetectors
• Package matched with IR emitter series VEMT3700
DESCRIPTION
• Floor life: 168 h, MSL 3, acc. J-STD-020
VSML3710 is an infrared, 940 nm emitting diode in
GaAlAs/GaAs technology with high radiant power, molded
in a PLCC-2 package for surface mounting (SMD).
• Lead (Pb)-free reflow soldering
• AEC-Q101 qualified
• Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
• Find out more about Vishay’s Automotive Grade Product
requirements at: www.vishay.com/applications
APPLICATIONS
• IR emitter in photointerrupters, sensors and reflective
sensors
• IR emitter in low space applications
• Household appliance
• Tactile keyboards
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
ϕ (deg)
λp (nm)
tr (ns)
8
± 60
940
800
VSML3710
Note
Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSML3710-GS08
Tape and reel
MOQ: 7500 pcs, 1500 pcs/reel
PLCC-2
VSML3710-GS18
Tape and reel
MOQ: 8000 pcs, 8000 pcs/reel
PLCC-2
Note
MOQ: minimum order quantity
** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902
Document Number: 81300
Rev. 1.4, 03-Nov-09
For technical questions, contact: [email protected]
www.vishay.com
1
VSML3710
Vishay Semiconductors High Power Infrared Emitting Diode,
940 nm, GaAlAs/GaAs
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
Reverse voltage
VR
5
V
Forward current
IF
100
mA
mA
Peak forward current
tp/T = 0.5, tp = 100 μs
IFM
200
Surge forward current
tp = 100 μs
IFSM
1
A
PV
160
mW
°C
Power dissipation
Junction temperature
Tj
100
Operating temperature range
Tamb
- 40 to + 85
°C
Storage temperature range
Tstg
- 40 to + 100
°C
Acc. figure 11, J-STD-020
Tsd
260
°C
J-STD-051, soldered on PCB
RthJA
250
K/W
Soldering temperature
Thermal resistance junction/ambient
Note
Tamb = 25 °C, unless otherwise specified
120
160
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
140
120
100
RthJA = 250 K/W
80
60
40
100
80
60
RthJA = 250 K/W
40
20
20
0
0
0
21343
10
20 30
40
50
60
70 80
90
0
100
Tamb - Ambient Temperature (°C)
21344
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
10
20 30 40
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS
PARAMETER
Forward voltage
Temperature coefficient of VF
Reverse current
Junction capacitance
Radiant intensity
TEST CONDITION
SYMBOL
TYP.
MAX.
IF = 100 mA, tp = 20 ms
VF
1.35
1.6
V
IF = 1 A, tp = 100 μs
VF
2.6
3
V
IF = 1 mA
TKVF
- 1.8
VR = 5 V
IR
VR = 0 V, f = 1 MHz, E = 0
Cj
IF = 100 mA, tp = 20 ms
Ie
MIN.
mV/K
100
μA
20
mW/sr
25
4
8
UNIT
pF
IF = 1 A, tp = 100 μs
Ie
60
IF = 100 mA, tp = 20 ms
φe
35
mW
IF = 100 mA
TKφe
- 0.6
%/K
ϕ
± 60
deg
Peak wavelength
IF = 100 mA
λp
940
nm
Spectral bandwidth
IF = 100 mA
Δλ
50
nm
Temperature coefficient of λp
IF = 100 mA
TKλp
0.2
nm/K
IF = 20 mA
tr
800
ns
IF = 1 A
tr
500
ns
IF = 20 mA
tf
800
ns
IF = 1 A
tf
500
ns
d
0.44
mm
Radiant power
Temperature coefficient of φe
Angle of half intensity
Rise time
Fall time
Virtual source diameter
mW/sr
Note
Tamb = 25 °C, unless otherwise specified
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2
For technical questions, contact: [email protected]
Document Number: 81300
Rev. 1.4, 03-Nov-09
VSML3710
High Power Infrared Emitting Diode, Vishay Semiconductors
940 nm, GaAlAs/GaAs
BASIC CHARACTERISTICS
Tamb = 25 °C, unless otherwise specified
100
10 000
I e - Radiant Intensity (mW/sr)
Tamb < 60 °C
tp/T = 0.005
IF - Forward Current (mA)
0.01
1000
0.02
0.05
100
0.2
0.5
DC
0.1
10
1
0.01
0.1
1
0.1
10 0
10 1
10 2
10 3
I F - Forward Current (mA)
15903
10 4
Fig. 6 - Radiant Intensity vs. Forward Current
Fig. 3 - Pulse Forward Current vs. Pulse Duration
104
1000
Radiant Power (mW)
IF - Forward Current (mA)
1
100
10
tp - Pulse Length (ms)
95 9985
10
103
102
10
Φe -
tP = 100 µs
tP/T = 0.001
100
101
100
0
1
2
3
0.1
10 0
4
VF - Forward Voltage (V)
13600
1
10 1
10 2
10 3
I F - Forward Current (mA)
94 8740
10 4
Fig. 7 - Radiant Power vs. Forward Current
Fig. 4 - Forward Current vs. Forward Voltage
1.2
1.6
1.1
1.2
Ie rel; Φe rel
IF - Forward Voltage (V)
IF = 1 mA
1.0
0.9
0.8
0.4
0.8
0.7
0
16848
IF = 20 mA
10 20 30 40 50 60 70 80 90 100
Tamb - Ambient Temperature (°C)
Fig. 5 - Forward Voltage vs. Ambient Temperature
Document Number: 81300
Rev. 1.4, 03-Nov-09
0
- 10 0 10
94 7993
50
100
140
T amb - Ambient Temperature (°C)
Fig. 8 - Relative Radiant Intensity/Power vs. Ambient Temperature
For technical questions, contact: [email protected]
www.vishay.com
3
VSML3710
Vishay Semiconductors High Power Infrared Emitting Diode,
940 nm, GaAlAs/GaAs
0°
10°
20°
1.0
0.75
0.5
0.25
IF = 100 mA
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
30°
Ie, rel - Relative Radiant Intensity
Φe rel - Relative Radiant Power
1.25
80°
0
890
0.6
990
940
0.4
0.2
0
94 8013
λ - Wavelength (nm)
14291
Fig. 9 - Relative Radiant Power vs. Wavelength
Fig. 10 - Relative Radiant Intensity vs. Angular Displacement
PACKAGE DIMENSIONS in millimeters
technical drawings
according to DIN
specifications
0.9
1.75 ± 0.1
3.5 ± 0.2
Pin identification
Mounting Pad Layout
4
A
area covered with
solder resist
2.6 (2.8)
C
2.2
2.8 ± 0.15
1.2
4
1.6 (1.9)
Ø 2.4
3 + 0.15
Drawing-No.: 6.541-5067.01-4
Issue: 5; 04.11.08
20541
DRYPACK
SOLDER PROFILE
300
Temperature (°C)
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
FLOOR LIFE
200
max. 30 s
150
max. 100 s
max. 120 s
100
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
0
50
100
150
200
250
300
Time (s)
Fig. 11 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
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4
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
0
19841
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
For technical questions, contact: [email protected]
Document Number: 81300
Rev. 1.4, 03-Nov-09
VSML3710
High Power Infrared Emitting Diode, Vishay Semiconductors
940 nm, GaAlAs/GaAs
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
Adhesive tape
10.0
9.0
120°
Blister tape
4.5
3.5
13.00
12.75
2.5
1.5
Component cavity
94 8670
Fig. 12 - Blister Tape
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
2.2
2.0
3.5
3.1
4.1
3.9
94 8665
4.0
3.6
10.4
8.4
120°
8.3
7.7
4.5
3.5
2.5
1.5
1.85
1.65
1.6
1.4
14.4 max.
180
178
Fig. 15 - Dimensions of Reel-GS08
5.75
5.25
3.6
3.4
63.5
60.5
13.00
12.75
62.5
60.0
0.25
4.1
3.9
2.05
1.95
94 8668
Fig. 13 - Tape Dimensions in mm for PLCC-2
MISSING DEVICES
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
De-reeling direction
94 8158
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
321
329
14.4 max.
18857
Fig. 16 - Dimensions of Reel-GS18
COVER TAPE REMOVAL FORCE
The removal force lies between 0.1 N and 1.0 N at a removal
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
> 160 mm
Tape leader
40 empty
compartments
min. 75 empty
compartments
Carrier leader
Carrier trailer
Fig. 14 - Beginning and End of Reel
Document Number: 81300
Rev. 1.4, 03-Nov-09
For technical questions, contact: [email protected]
www.vishay.com
5
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
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damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 11-Mar-11
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1