TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3010 Series SP3010 Series 0.45pF Rail Clamp Array RoHS Pb GREEN The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features 6 5 7 4 8 3 9 2 10 t -PXMFBLBHFDVSSFOUPG 0.1μA (TYP) at 5V t &'5*&$" (5/50ns) t 4NBMMGPSNGBDUPSV%'/ package saves board space t -JHIUOJOH*&$ 3A (tP=8/20μs) 1 t -PXDBQBDJUBODFPG 0.45pF (TYP) per I/O *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. Functional Block Diagram Pin 1 Pin 2 Pin 4 Pin 5 t &4%*&$ ±8kV contact, ±15kV air Applications GND (Pins 3,8) t-$%1%157T t4FU5PQ#PYFT t%7%1MBZFST t.PCJMF1IPOFT t%FTLUPQT t/PUFCPPLT t.11.1 t%JHJUBM$BNFSBT Application Example HDMI Port HDMI Chipset Ground D2+ D2- Outside World SP3010-04 Ground Ground D1+ D1D0+ D0- SP3010-04 Ground CLK+ CLK- * Package is shown as transparent Case Ground Life Support Note: Signal Ground Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 105 Revision: April 14, 2011 SP3010 Series SP3010 Description TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3010 Series Absolute Maximum Ratings Symbol Parameter Value IPP Peak Current (tp=8/20μs) TOP TSTOR Units 3.0 A Operating Temperature -55 to 125 °C Storage Temperature -60 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Reverse Standoff Voltage Parameter VRWM IR ≤ 1μA Reverse Leakage Current ILEAK Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 Typ Max Units 6.0 V 0.5 μA VR=5V, Any I/O to GND 0.1 IPP=1A, tp=8/20μs, Fwd 10.8 V IPP=2A, tp=8/20μs, Fwd 12.3 V (VC2 - VC1) / (IPP2 - IPP1) VESD Diode Capacitance1 Min 1.5 IEC61000-4-2 (Contact) ±8 IEC61000-4-2 (Air) ±15 CI/O-GND Ω kV kV Reverse Bias=0V 0.45 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 0.6 0 -5 Attenuation (dB) I/O Capacitance (pF) 0.5 0.4 0.3 0.2 0.1 -10 -15 -20 -25 0.0 -30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 100 1000 10000 Frequency (MHz) I/O Bias Voltage (V) Clamping Voltage vs. IPP Pulse Waveform 16.0 110% 100% 14.0 90% 80% 70% 10.0 Percent of IPP Clamp Voltage (VC) 12.0 8.0 6.0 60% 50% 40% 30% 4.0 20% 2.0 10% 0% 0.0 1.0 1.5 2.0 2.5 0.0 3.0 Peak Pulse Current-IPP (A) SP3010 Series 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) 106 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3010 Series Soldering Parameters Pb – Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Temperature TP TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C time to peak temperature Time Product Characteristics Part Numbering System SP 3010 – 0x U T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays G= Green T= Tape & Reel Series Number of Channels Critical Zone TL to TP Ramp-up Package UDFN-10 (2.5x1.0mm) -04 = 4 Channel Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. QH 4 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Number of Product Series Channels Q = SP3010 Assembly Site 6. Package surface matte finish VDI 11-13. Ordering Information Part Number Package Marking Min. Order Qty. SP3010-04UTG uDFN-10 QH4 3000 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 107 Revision: April 14, 2011 SP3010 Series SP3010 Reflow Condition TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3010 Series Embossed Carrier Tape & Reel Specification — UDFN-10 Package P0 0 P1 P2 Millimeters A0 1.30 +/- 0.10 B0 2.83 +/- 0.10 D0 Ø 1.50 + 0.10 D1 Ø 1.00 + 0.25 B0 F W E D T D1 uDFN-10 (2.5x1.0x0.5mm) Symbol 5º Max A0 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 0.65 +/- 0.10 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.254 +/- 0.02 W 8.00 + 0.30 /- 0.10 K0 5º Max Package Dimensions — uDFN-10 (2.5x1.0x0.5mm) uDFN-10 (2.5x1.0x0.5mm) Top View Millimeters E Side View b1 C Nom Max Min Nom Max A 0.48 0.515 0.55 0.019 0.020 0.021 A1 0.00 -- 0.05 0.000 b 0.15 0.20 0.25 0.006 0.008 0.012 0.35 0.40 0.45 0.014 0.016 0.018 D 2.40 2.50 2.60 0.094 0.098 0.102 E 0.90 1.00 1.10 0.035 0.039 0.043 0.43 0.012 0.05 M C Bottom View R0.125 0.50 BSC 0.30 0.365 Soldering Pad Layout Dimensions b 0.10 M C A B 0.005 Ref b1 L 0.05 C 0.022 0.125 Ref e A1 A3 A Seating Plane Min A3 B 0.05 C Inches Symbol A D Inch Millimeter C (0.034) (0.875) G 0.008 0.20 P 0.020 0.50 P1 0.039 1.00 0.20 X 0.008 X1 0.016 0.40 Y 0.027 0.675 Y1 (0.061) (1.55) Z 0.061 1.55 L 0.020 BSC 0.014 0.016 Recomended Soldering Pad Layout P1 P Y (Y1) Z (C) G X X1 Alternative Soldering Pad Layout P1 2xR0.075mm (7x) P e Y (Y1) Z (C) G X X1 SP3010 Series 108 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.