TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1006 Series SP1006 Series RoHS Pb GREEN Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation. Additionally, each diode can safely dissipate 5A of 8/20µs surge current (IEC61000-4-5) with very low clamping voltages. Features Pinout 1 • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Low leakage current of 0.5µA (MAX) at 5V • EFT, IEC61000-4-4, 40A (5/50ns) • Industries smallest ESD footprint available (0201) • Lightning, IEC61000-4-5, 5A (8/20µs) 2 Applications Functional Block Diagram • Mobile phones 1 • Smart phones • Portable navigation devices • PDAs • Portable medical devices • Digital cameras Application Example 2 Keypads I/O Controller P1 P2 Outside World P3 IC P4 Case GND SP1006 (x4) Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 149 Revision: April 21, 2011 SP1006 Series SP1006 Description TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1006 Series Absolute Maximum Ratings Symbol Parameter Value Units 5 A Operating Temperature -40 to 85 °C Storage Temperature -60 to 150 °C IPP Peak Pulse Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ Max Units 6.0 V Reverse Voltage Drop VR IR=1mA (Pin 1 to 2) 7.8 V Forward Voltage Drop VF IR=1mA (Pin 2 to 1) 0.8 V Leakage Current ILEAK Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 VR=5V 0.1 Ipp=1A, tp=8/20µs (Pin 1 to 2) 8.3 Ipp=2A, tp=8/20µs (Pin 1 to 2) 9.2 V (VC2 - VC1) / (IPP2 - IPP1) 0.9 Ω IEC61000-4-2 (Contact Discharge) ±30 IEC61000-4-2 (Air Discharge) ±30 CD 0.5 μA V kV kV Reverse Bias=0V 25 pF Reverse Bias=2.5V 15 pF Note: Parameter is guaranteed by design and/or device characterization. 1 Capacitance vs. Reverse Bias Pulse Waveform 110% 30 100% 25 90% 80% Percent of IPP Capacitance (pF) 20 15 10 70% 60% 50% 40% 30% 5 20% 10% 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0% 5.0 SP1006 Series 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) Bias Voltage (V) 150 Revision: April 21, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1006 Series Clamping Voltage vs. IPP 16.0 12.0 10.0 SP1006 Clamp Voltage (VC) 14.0 8.0 6.0 4.0 2.0 0.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Peak Pulse Current-IPP (A) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow tP TP - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Package Dimensions — uDFN-2 uDFN-2 BOTTOM VIEW TOP VIEW 2X 0.10 D Symbol C 2X K1 1 2 b 0.10 0.05 L C A B C 0.10 C A SEATING PLANE A1 A2 SIDE VIEW ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 0.08 A 0.34 0.40 0.014 0.016 A1 0.00 0.05 0.000 0.002 151 Revision: April 21, 2011 Min Max A2 0.075 REF 0.003 REF b 0.20 REF 0.008 REF D 0.55 0.65 0.022 0.026 E 0.25 0.35 0.010 0.014 L 0.175 0.275 0.007 0.011 K1 C Inches Max 0.10 C E Millimeters Min 0.15 REF 0.006 REF SP1006 Series TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1006 Series Product Characteristics Part Numbering System SP 1006 – 01 U T G Silicon Protection Array (SPA ) Family of TVS Diode Arrays Series TM G= Green T= Tape & Reel Package Number of Channels U: uDFN-2 Part Marking System Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Pin 1 Stripe Pin 2 Ordering Information Part Number Package Marking Min. Order Qty. SP1006-01UTG uDFN-2 - 10000 Embossed Carrier Tape & Reel Specification — uDFN-2 P0 P1 P2 D0 Symbol E F W 0.20 ± 0.05 T 0º MAX A0 SP1006 Series K0 0º MAX B0 152 Revision: April 21, 2011 Millimetres Inches Min Max Min Max A0 0.36 0.42 0.014 0.017 B0 0.66 0.72 0.026 0.028 D0 1.40 1.60 0.055 0.063 E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 K0 0.39 0.45 0.015 0.018 P0 1.95 2.05 0.077 0.081 P1 1.95 2.05 0.077 0.081 P2 3.90 4.10 0.154 0.161 T 0.18 0.22 0.007 0.009 W 7.90 8.30 0.311 0.327 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.