TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP0524P Series SP0524P Series 0.5pF Diode Array RoHS Pb GREEN The SP0524P integrates 4 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features 6 5 7 4 8 3 9 2 10 • ESD, IEC61000-4-2, ±12kV contact, ±25kV air • Low leakage current of 1.5μA (MAX) at 5V • EFT, IEC61000-4-4, 40A (tP=5/50ns) •Small form factor μDFN (JEDEC MO-229) package saves board space • Lightning, IEC61000-4-5, 4A (tP=8/20μs) 1 • Low capacitance of 0.5pF (TYP) per I/O *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. Functional Block Diagram Applications Pin 1 Pin 2 Pin 4 Pin 5 • LCD/PDP TVs • Set Top Boxes • External Storages • Mobile Phones • DVD/ Blue-Ray Players • Notebooks • Desktops • Digital Cameras • MP3/PMP Application Example for USB3.0 USB Port GND (Pins 3,8) USB Controller VBUS D+ DSP3003 Optional NC IC SSTX+ SSTXGND SP0524P SSRX+ SSRX*Package is shown as transparent Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 1 Revision: August 13, 2012 Case GND Signal GND SP0524P Series SP0524P Description TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP0524P Series Absolute Maximum Ratings Parameter Value Peak Current (tp=8/20μs) TOP TSTOR Units 4.0 A Operating Temperature -55 to 125 °C Storage Temperature -60 to 150 °C SP3012 Symbol IPP CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR ≤ 1µA 5.0 V Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 1.5 µA Clamp Voltage1 IPP=1A, tp=8/20µs, Fwd VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD 6.6 V IPP=2A, tp=8/20µs, Fwd 7.0 V (VC2 - VC1) / (IPP2 - IPP1) 0.4 Ω IEC61000-4-2 (Contact) ±12 kV IEC61000-4-2 (Air) ±25 kV Diode Capacitance CI/O-GND Reverse Bias=0V, f=1 MHz 0.5 pF Diode Capacitance1 CI/O-/O Reverse Bias=0V, f=1 MHz 0.3 pF 1 Note: Parameter is guaranteed by design and/or device characterization. 1 Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 1.0 0 -3 -6 Attenuation (dB) Capacitance (pF) 0.8 -9 -12 0.6 -15 -18 0.4 -21 -24 0.2 -27 0.0 -30 0.0 2.0 1.0 3.0 Bias Voltage (V) 4.0 100 5.0 Clamping Voltage vs. IPP Frequency (MHz) 1000 Pulse Waveform 10.0 110% 100% 90% 8.0 Percent of IPP 80% Clamp Voltage (V) 6.0 4.0 70% 60% 50% 40% 30% 20% 2.0 10% 0.0 SP0524P Series 0% 1 2 Current (A) 3 4 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) 2 Revision: August 13, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP0524P Series Soldering Parameters 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Temperature Pre Heat - Temperature Min (Ts(min)) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP 0524P U T G G= Green T= Tape & Reel Series tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time Product Characteristics Part Numbering System Silicon Protection Array (SPATM) Family of TVS Diode Arrays Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) tP TP Package µDFN-10 (2.5x1.0mm) Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. V* 4 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Number of Product Series Channels V = SP0524P Assembly Site Ordering Information Part Number Package Marking Min. Order Qty. SP0524PUTG µDFN-10 V*4 3000 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 3 Revision: August 13, 2012 SP0524P Series SP0524P Pb – Free assembly Reflow Condition TVS Diode Arrays (SPA™ Family of Products) Top View Low Capacitance ESD Protection - SP0524P Series A D E B Package Dimensions — µDFN-10 (2.5x1.0x0.5mm) Side View 0.05 C µDFN-10 (2.5x1.0x0.5mm) A Seating PlaneMO-229 b1 C b Millimeters Inches JEDEC Top View Symbol A D B Max 0.515 0.55 A1 0.00 -- 0.05 b 0.15 0.20 0.25 b1 0.35 0.40 0.45 D 2.40 2.50 2.60 E 0.90 1.00 1.10 Side View A 0.05 C b1 Min M C A BMax 0.10Nom 0.020 0.021 0.05 M C 0.000 0.022 0.005 Ref View 0.012 0.006Bottom 0.008 0.014 R0.125 0.016 0.018 0.094 0.098 0.102 0.035 0.039 0.043 L 0.020 BSC 0.012 0.014 0.016 2xR0.075mm (7x) e 0.50 BSC 0.30 L A1 A3 0.365 0.43 Recomended Soldering Pad Layout Soldering Pad Layout Dimensions b 0.10 M C A B 0.05 M C Bottom View R0.125 Inch Millimeter C (0.034) (0.875) G 0.008 0.20 P 0.020 0.50 P1 0.039 1.00 X 0.008 0.20 X1 0.016 0.40 Y 0.027 0.675 Y1 (0.061) (1.55) Z 0.061 1.55 0.05 C 0.019 0.125 Ref e 0.05 C C Nom 0.48 A3 E Seating Plane Min A A1 A3 P1 P Y (Y1) Z (C) G X X1 Alternative Soldering Pad Layout L P1 2xR0.075mm (7x) P e Y (Y1) Z (C) G Recomended Soldering Pad Layout X P1 P X1 Embossed Carrier Tape & Reel YSpecification — µDFN-10 (Y1) Z (C) G Package P0 T X Millimeters A0 1.30 +/- 0.10 B0 F D1 5º Max Pin 1 Location A0 K0 5º Max SP0524P Series µDFN-10 (2.5x1.0x0.5mm) Symbol W X1 User Feeding Direction E D 0 P1 P2 4 Revision: August 13, 2012 B0 2.83 +/- 0.10 D0 Ø 1.50 + 0.10 D1 Ø 1.00 + 0.25 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 0.65 +/- 0.10 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.254 +/- 0.02 W 8.00 + 0.30 /- 0.10 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SP3012 Package