LITTELFUSE SP3003_11

TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
SP3003 Series 0.65pF Rail Clamp Array
RoHS
Pb GREEN
The SP3003 has ultra low capacitance rail-to-rail diodes with
an additional zener diode fabricated in a proprietary silicon
avalanche technology to protect each I/O pin providing a
high level of protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC 61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins
such as HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
Features
SP3003-02X/J
NC
SP3003-04X/J
I/O 1
GND
I/O 2
VCC
I/O 1
I/O 4
GND
VCC
I/O 2
I/O 3
SP3003-04A
I/O 1
NC
I/O 2
NC
NC
I/O 4
NC
t&4%QSPUFDUJPOPGœL7
contact discharge,
±15kV air discharge,
(IEC61000-4-2)
t4NBMMQBDLBHFTTBWF
board space (SC70,
SOT553, SOT563,
MSOP10)
t&'5QSPUFDUJPO
IEC61000-4-4, 40A
(5/50ns)
t-JHIUOJOH1SPUFDUJPO
IEC61000-4-5, 2.5A
(8/20μs)
t $PNQVUFS1FSJQIFSBMT
t/FUXPSL)BSEXBSF1PSUT
t.PCJMF1IPOFT
t5FTU&RVJQNFOU
t1%"T
t.FEJDBM&RVJQNFOU
t%JHJUBM$BNFSBT
Functional Block Diagram
SP3003-02
t-PXMFBLBHFDVSSFOUPG
0.5μA (MAX) at 5V
Applications
GND
VCC
I/O 3
t-PXDBQBDJUBODFPG
0.65pF (TYP) per I/O
SP3003-04
VCC
I/O2
VCC
I/O4
Application Example
+5V
I/O1
I/O2
D2+
D2+
Gnd
D2-
D2-
GND
I/O1
GND
6
5
4
SP300x-04
1
2
3
I/O3
D1+
D1+
Gnd
D1HDMI
or DVI
Connector
D1HDMI
or DVI
Interface
IC
D0+
D0+
Gnd
D0-
D06
5
4
SP300x-04
1
2
3
Clk+
Clk+
Gnd
Clk-
ClkGnd
A single 4 channel SP300x-04
device can be used to protect
four of the data lines in a
HDMI/DVI interface. Two (2)
SP300x-04 devices provide
protection for the main data
lines. Low voltage ASIC
HDMI/DVI drivers can also be
protected with the SP300x-04,
the +VCC pins on the SP300x-04
can be substituted with a
suitable bypass capacitor or in
some backdrive applications the
+VCC of the SP300x-04 can be
floated or NC.
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
95
Revision: April 14, 2011
SP3003 Series
SP3003
Description
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
IPP
Peak Current (tp=8/20μs)
TOP
Operating Temperature
TSTOR
Storage Temperature
Parameter
Units
2.5
A
-40 to 85
°C
-50 to 150
Storage Temperature Range
°C
Rating
Units
-65 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 10s)
260
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Max
Units
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1μA
6
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
μA
Clamp Voltage1
VC
ESD Withstand Voltage1
VESD
Diode Capacitance1
CI/O-GND
Diode Capacitance1
CI/O-I/O
Min
Typ
IPP=1A, tp=8/20μs, Fwd
10.0
12.0
V
IPP=2A, tp=8/20μs, Fwd
11.8
15.0
V
IEC61000-4-2 (Contact)
±8
kV
IEC61000-4-2 (Air)
±15
Reverse Bias=0V
0.7
0.8
0.95
pF
Reverse Bias=1.65V
0.55
0.65
0.8
pF
kV
Reverse Bias=0V
0.35
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1.00
1
0
0.95
0.90
-2
I/O Capacitance (pF)
Insertion Loss [dB]
-1
-3
-4
-5
-6
-7
VCC = Float
0.75
0.70
VCC = 3.3V
0.65
VCC = 5V
0.55
-9
0.50
-10
1.E+07
1.E+08
1.E+09
0.0
1.E+10
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
Frequency [Hz]
SP3003 Series
0.80
0.60
-8
1.E+06
0.85
96
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Product Characteristics
1.4E-12
Lead Plating
Matte Tin (SC70-x, MSOP-10) Pre-Plated
Frame (SOT5x3)
1.2E-12
Lead Material
Copper Alloy
1E-12
Lead Coplanarity
0.0004 inches (0.102mm)
8E-13
Subsitute Material Silicon
6E-13
Body Material
Molded Epoxy
Flammability
UL94-V-0
4E-13
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
2E-13
0
1.E+06
1.E+07
1.E+08
SP3003
Capacitance [F]
Capacitance vs. Frequency
1.E+09
Frequency [Hz]
Soldering Parameters
Reflow Condition
Pb – Free assembly
tP
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
+0/-5
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
25
Peak Temperature (TP)
250
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
Temperature
TP
time to peak temperature
Time
°C
97
Revision: April 14, 2011
SP3003 Series
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SC70-5
e
e
5
6
Package
Solder Pad Layout
4
not used
E
HE
SC70-5
Pins
5
JEDEC
MO-203 Issue A
Millimeters
3
2
1
B
D
A2 A
A1
C
Min
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
e
L
Inches
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package Dimensions — SC70-6
e
e
6
5
Package
SC70-6
Pins
6
Solder Pad Layout
4
JEDEC
E
1
2
HE
MO-203 Issue A
Millimeters
B
D
A2 A
A1
Inches
Min
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
3
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
C
e
L
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package Dimensions — SOT553
6
5
(not used)
2
Package
A
D
L
4
E
Solder Pad Layout
Min
Max
Min
Max
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
A
c
e
98
Revision: April 14, 2011
Inches
0.50
HE
B
SP3003 Series
5
Millimeters
3
e
SOT 553
Pins
0.50 BSC
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SOT563
Package
L
SOT 563
Pins
6
5
E
2
6
4
Millimeters
Solder Pad Layout
HE
Min
3
e
c
B
Inches
Max
Min
Max
0.024
A
0.50
0.60
0.020
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
e
0.50 BSC
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
Package Dimensions — MSOP10
Package
MSOP10
Pins
10
Millimeters
Solder Pad Layout
Max
Min
Max
A
-
1.10
-
0.043
A1
0.00
0.15
0.000
0.006
B
0.17
0.27
0.007
0.011
c
0.08
0.23
0.003
0.009
D
2.90
3.10
0.114
0.122
E
4.67
5.10
0.184
0.200
E1
2.90
3.10
0.114
0.122
e
HE
SP3003-04 X T G
G= Green
T= Tape & Reel
Package
A = MSOP-10, 3000 quantity
J = SC70-5 or SC70-6, 3000 quantity
X = SOT553 or SOT563, 5000 quantity
Number of Channels
0.50 BSC
0.40
0.020 BSC
0.80
0.016
0.031
Ordering Information
Part Numbering System
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
Series
Inches
Min
-02 = 2 channel
(SC70-5, SOT553 packages)
-04 = 4 channel
(SC70-6, SOT563, MSOP-10 packages)
Part Number
Package
Marking
Min. Order Qty.
SP3003-02JTG
SC70-5
FX2
3000
SP3003-02XTG
SOT553
FX2
5000
SP3003-04ATG
MSOP-10
FX4
4000
SP3003-04JTG
SC70-6
FX4
3000
SP3003-04XTG
SOT563
FX4
5000
Part Marking System
XXX
XXX
Product Series
Number of Channels
(varies) F, H or P =
SP3003 series
(varies) 2 or 4
Assembly Site
(varies)
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
99
Revision: April 14, 2011
SP3003 Series
SP3003
A
D
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Embossed Carrier Tape & Reel Specification — MSOP-10
Millimetres
Inches
Min
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
5.40
5.60
0.213
0.220
D
1.50
1.60
0.059
0.063
D1
P0
10P0
1.50 Min
0.059 Min
3.90
4.10
40.0+/- 0.20
0.154
0.161
1.574+/-0.008
W
11.90
12.10
0.469
0.476
P
7.90
8.10
0.311
0.319
A0
5.20
5.40
0.205
0.213
B0
3.20
3.40
0.126
0.134
K0
1.20
1.40
0.047
0.055
t
0.30 +/- 0.05
0.012+/- 0.002
Millimetres
Inches
Embossed Carrier Tape & Reel Specifications — SC70-5 and SC70-6
Min
Max
Min
Max
E
1.65
1.85
0.064
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
10P0
40.0+/- 0.20
1.574+/-0.008
W
7.70
8.10
0.303
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.960
K0
1.12
1.32
0.044
0.052
t
0.27 max
0.318
0.010 max
Embossed Carrier Tape & Reel Specifications — SOT553 and SOT563
Millimetres
Max
Min
Max
E
1.65
1.85
0.064
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.076
0.081
D
1.40
1.60
0.055
0.063
D1
0.45
0.55
0.017
0.021
P0
3.90
4.10
0.154
0.161
10P0
100
Revision: April 14, 2011
40.0+/- 0.20
1.574+/-0.008
W
7.70
8.10
0.303
P
3.90
4.10
0.153
0.161
A0
1.73
1.83
0.068
0.072
0.318
B0
1.73
1.83
0.068
0.072
K0
0.64
0.74
0.025
0.029
t
SP3003 Series
Inches
Min
0.22 max
0.009 max
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.