TEMD5110X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released FEATURES • • • • • Package type: surface mount Package form: top view Dimensions (L x W x H in mm): 5 x 4.24 x 1.12 Radiant sensitive area (in mm2): 7.5 Product designed and qualified acc. AEC-Q101 for the automotive market • High radiant sensitivity • Daylight blocking filter matched with 870 to 950 nm emitters • Fast response times 20535_1 DESCRIPTION TEMD5110X01 is a high speed and high sensitive PIN photodiode. It is a miniature surface mount device (SMD) including the chip with a 7.5 mm2 sensitive area and a daylight blocking filter matched with IR emitters operating at wavelength 870 nm or 950 nm. • • • • Angle of half sensitivity: ϕ = ± 65° Floor life: 72 h, MSL 4, acc. J-STD-020 Lead (Pb)-free reflow soldering Lead (Pb)-free component in accordance RoHS 2002/95/EC and WEEE 2002/96/EC with APPLICATIONS • High speed detector for infrared radiation • Infrared remote control and free air data transmissionsystems, e.g. in combination with TSFFxxxx series IR emitters PRODUCT SUMMARY COMPONENT Ira (µA) ϕ (deg) λ0.5 (nm) TEMD5110X01 55 ± 65 790 to 1050 Note Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM TEMD5110X01 Tape and reel MOQ: 1500 pcs, 1500 pcs/reel Top view Note MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITION Reverse voltage Tamb ≤ 25 °C Power dissipation SYMBOL VALUE VR 60 UNIT V PV 215 mW Tj 100 °C Operating temperature range Tamb - 40 to + 100 °C Storage temperature range Tstg - 40 to + 100 °C Tsd 260 °C RthJA 350 K/W Junction temperature Soldering temperature Acc. reflow sloder profile fig. 8 Thermal resistance junction/ambient Note Tamb = 25 °C, unless otherwise specified Document Number: 84658 Rev. 1.4, 17-Sep-08 For technical questions, contact: [email protected] www.vishay.com 455 TEMD5110X01 Vishay SemiconductorsSilicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released BASIC CHARACTERISTICS PARAMETER TEST CONDITION Forward voltage MIN. TYP. MAX. UNIT 1 1.3 V 30 nA 40 pF IF = 50 mA VF IR = 100 µA, E = 0 V(BR) VR = 10 V, E = 0 Iro 2 VR = 0 V, f = 1 MHz, E = 0 CD 70 VR = 3 V, f = 1 MHz, E = 0 CD 25 Breakdown voltage Reverse dark current Diode capacitance SYMBOL 60 V pF Open circuit voltage Ee = 1 mW/cm2, λ = 950 nm Vo 350 mV Temperature coefficient of Vo Ee = 1 mW/cm2, λ = 950 nm TKVo - 2.6 mV/K Short circuit current Ee = 1 mW/cm2, λ = 950 nm Ik 50 µA TKIk 0.1 %/K 55 µA mW/cm2, λ = 950 nm Temperature coefficient of Ik Ee = 1 Reverse light current Ee = 1 mW/cm2, λ = 950 nm, VR = 5 V 45 Ira Angle of half sensitivity ϕ ± 65 deg Wavelength of peak sensitivity λp 940 nm λ 0.5 790 to 1050 nm Range of spectral bandwidth Noise equivalent power VR = 10 V, λ = 950 nm NEP 4 x 10-14 W/√Hz Rise time VR = 10 V, RL = 1 kΩ, λ = 820 nm tr 100 ns Fall time VR = 10 V, RL = 1 kΩ, λ = 820 nm tf 100 ns Note Tamb = 25 °C, unless otherwise specified BASIC CHARACTERISTICS Tamb = 25 °C, unless otherwise specified I ra rel - Relative Reverse Light Current Iro - Reverse Dark Current (nA) 1000 100 10 VR = 10 V 1 20 94 8403 40 60 80 Tamb - Ambient Temperature (°C) VR = 5 V λ = 950 nm 1.2 1.0 0.8 0.6 0 100 Fig. 1 - Reverse Dark Current vs. Ambient Temperature www.vishay.com 456 1.4 94 8409 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 2 - Relative Reverse Light Current vs. Ambient Temperature For technical questions, contact: [email protected] Document Number: 84658 Rev. 1.4, 17-Sep-08 TEMD5110X01 Silicon PIN Photodiode, RoHS Compliant, Released for Vishay Semiconductors Lead (Pb)-free Reflow Soldering, AEC-Q101 Released 1.2 S(λ)rel - Relative Spectral Sensivity 100 10 VR = 5 V λ= 950 nm 1 0.1 0.01 0.1 1 0.8 0.6 0.4 0.2 0.0 750 10 Ee - Irradiance (mW/cm 2) 12787 1.0 850 Fig. 3 - Reverse Light Current vs. Irradiance 950 0° Srel - Relative Radiant Sensitivity Ira - Reverse Light Current (μA) 0.5 mW/cm 2 0.2 mW/cm 2 10 0.1 mW/cm 2 0.05 mW/cm 2 λ = 950 nm 1 10 20° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 100 V R - Reverse Voltage (V) 12788 10° 30° 1 mW/cm 2 0.1 1150 Fig. 6 - Relative Spectral Sensitivity vs. Wavelength 100 1 1050 λ - Wavelength (nm) 94 8426 ϕ - Angular Displacement Ira - Reverse Light Current (μA) 1000 80° 0.6 0.4 0.2 0 94 8406 Fig. 4 - Reverse Light Current vs. Reverse Voltage Fig. 7 - Relative Radiant Sensitivity vs. Angular Displacement CD - Diode Capacitance (pF) 80 E=0 f = 1 MHz 60 40 20 0 0.1 948407 1 10 100 VR - Reverse Voltage (V) Fig. 5 - Diode Capacitance vs. Reverse Voltage Document Number: 84658 Rev. 1.4, 17-Sep-08 For technical questions, contact: [email protected] www.vishay.com 457 TEMD5110X01 Vishay SemiconductorsSilicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released PACKAGE DIMENSIONS in millimeters Drawing-No.: 6.541-5060.01-4 Issue: 3; 05.02.08 Not indicated tolerances ± 0.1 20536 www.vishay.com 458 For technical questions, contact: [email protected] Document Number: 84658 Rev. 1.4, 17-Sep-08 TEMD5110X01 Silicon PIN Photodiode, RoHS Compliant, Released for Vishay Semiconductors Lead (Pb)-free Reflow Soldering, AEC-Q101 Released TAPING DIMENSIONS in millimeters 20537 REEL DIMENSIONS in millimeters 20874 Document Number: 84658 Rev. 1.4, 17-Sep-08 For technical questions, contact: [email protected] www.vishay.com 459 TEMD5110X01 Vishay SemiconductorsSilicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released SOLDER PROFILE DRYPACK 300 255 °C 240 °C 217 °C 250 Temperature (°C) max. 260 °C 245 °C 200 FLOOR LIFE max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 50 100 150 200 250 300 Time (s) Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D www.vishay.com 460 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Time between soldering and removing from MBB must not exceed the time indicated in J-STD-020: Moisture sensitivity: level 4 Floor life: 72 h Conditions: Tamb < 30 °C, RH < 60 % DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or recommended conditions: 192 h at 40 °C (+ 5 °C), RH < 5 % or 96 h at 60 °C (+ 5 °C), RH < 5 %. For technical questions, contact: [email protected] Document Number: 84658 Rev. 1.4, 17-Sep-08 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1