VBPW34FAS, VBPW34FASR www.vishay.com Vishay Semiconductors Silicon PIN Photodiode FEATURES • • • • VBPW34FAS Package type: surface mount Package form: GW, RGW Dimensions (L x W x H in mm): 6.4 x 3.9 x 1.2 Radiant sensitive area (in mm2): 7.5 • High radiant sensitivity • Daylight blocking filter matched with 870 nm to 950 nm emitters • Fast response times • Angle of half sensitivity: ϕ = ± 65° • Floor life: 168 h, MSL 3, acc. J-STD-020 • Lead (Pb)-free reflow soldering • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC • Halogen-free according to IEC 61249-2-21 definition VBPW34FASR 21726 DESCRIPTION APPLICATIONS VBPW34FAS and VBPW34FASR are high speed and high sensitive PIN photodiodes. It is a surface mount device (SMD) including the chip with a 7.5 mm2 sensitive area and a daylight blocking filter matched with IR emitters operating at wavelength 870 nm or 950 nm. • High speed detector for infrared radiation • Infrared remote control and free air data transmissionsystems, e.g. in combination with TSFFxxxx PRODUCT SUMMARY COMPONENT Ira (μA) ϕ (deg) λ0.5 (nm) VBPW34FAS 55 ± 65 780 to 1050 VBPW34FASR 55 ± 65 780 to 1050 PACKAGE FORM Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS VBPW34FAS Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Gullwing VBPW34FASR Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Reverse gullwing Note • MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION Reverse voltage Power dissipation Tamb ≤ 25 °C Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient Rev. 1.2, 24-Aug-11 Acc. reflow sloder profile fig. 8 SYMBOL VALUE VR 60 UNIT V PV 215 mW Tj 100 °C Tamb - 40 to + 100 °C Tstg - 40 to + 100 °C Tsd 260 °C RthJA 350 K/W Document Number: 81127 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBPW34FAS, VBPW34FASR www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) TYP. MAX. UNIT 1 1.3 V Iro 2 30 nA VR = 0 V, f = 1 MHz, E = 0 CD 70 VR = 3 V, f = 1 MHz, E = 0 CD 25 40 pF PARAMETER TEST CONDITION SYMBOL IF = 50 mA VF IR = 100 μA, E = 0 V(BR) VR = 10 V, E = 0 Forward voltage Breakdown voltage Reverse dark current Diode capacitance MIN. 60 V pF Open circuit voltage Ee = 1 mW/cm2, λ = 950 nm Vo 350 mV Temperature coefficient of Vo Ee = 1 mW/cm2, λ = 950 nm TKVo - 2.6 mV/K Short circuit current Ee = 1 mW/cm2, λ = 950 nm Ik 50 μA Temperature coefficient of Ik Ee = 1 mW/cm2, λ = 950 nm TKIk 0.1 %/K Reverse light current Ee = 1 mW/cm2, λ = 950 nm, VR = 5 V Ira 55 μA 45 Angle of half sensitivity ϕ ± 65 deg Wavelength of peak sensitivity λp 950 nm λ 0.5 780 to 1050 nm Range of spectral bandwidth Noise equivalent power VR = 10 V, λ = 950 nm NEP 4 x 10-14 W/√Hz Rise time VR = 10 V, RL = 1 kΩ, λ = 820 nm tr 100 ns Fall time VR = 10 V, RL = 1 kΩ, λ = 820 nm tf 100 ns BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) I ra rel - Relative Reverse Light Current Iro - Reverse Dark Current (nA) 1000 100 10 VR = 10 V 1 20 94 8403 40 60 80 Tamb - Ambient Temperature (°C) VR = 5 V λ = 950 nm 1.2 1.0 0.8 0.6 0 100 Fig. 1 - Reverse Dark Current vs. Ambient Temperature Rev. 1.2, 24-Aug-11 1.4 94 8409 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 2 - Relative Reverse Light Current vs. Ambient Temperature Document Number: 81127 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBPW34FAS, VBPW34FASR www.vishay.com Vishay Semiconductors S(λ)φ, rel - Relative Spectral Sensitivity 100 10 VR = 5 V λ = 950 nm 1 0.1 0.01 0.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 600 10 Ee - Irradiance (mW/cm2) 12787 1.0 700 21743 Fig. 3 - Reverse Light Current vs. Irradiance 800 900 1000 λ - Wavelength (nm) Fig. 6 - Relative Spectral Sensitivity vs. Wavelength 0° 100 Srel - Relative Radiant Sensitivity Ira - Reverse Light Current (µA) 0.5 mW/cm 2 0.2 mW/cm 2 10 0.1 mW/cm 2 0.05 mW/cm 2 λ = 950 nm 0.1 1 10 20° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 100 VR - Reverse Voltage (V) 12788 10° 30° 1 mW/cm 2 1 1100 ϕ - Angular Displacement Ira - Reverse Light Current (µA) 1000 80° 0.6 0.4 0.2 0 94 8406 Fig. 4 - Reverse Light Current vs. Reverse Voltage Fig. 7 - Relative Radiant Sensitivity vs. Angular Displacement CD - Diode Capacitance (pF) 80 E=0 f = 1 MHz 60 40 20 0 0.1 948407 1 10 100 VR - Reverse Voltage (V) Fig. 5 - Diode Capacitance vs. Reverse Voltage Rev. 1.2, 24-Aug-11 Document Number: 81127 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBPW34FAS, VBPW34FASR www.vishay.com Vishay Semiconductors 0.1 -0.1 0.15 ± 0.02 1.2 ± 0.1 (0.47 ref.) 0.75 ± 0.05 PACKAGE DIMENSIONS FOR VBPW34FAS in millimeters Flat area 0.3 min. 4.4 ± 0.1 0.18 ± 0.2 2.2 Chip Size 0.8 ± 0.1 1.6 ± 0.1 Cathode Anode 3.9 ± 0.1 1.95 3x3 1 ± 0.15 6.4 ± 0.3 technical drawings according to DIN specifications Recommended solder pad 8.9 1.8 5.4 Drawing-No.: 6.541-5086.01-4 Issue: 1; 15.04.10 22105 Rev. 1.2, 24-Aug-11 Document Number: 81127 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBPW34FAS, VBPW34FASR www.vishay.com Vishay Semiconductors (0.47 ref.) 0.1 min. Flat area 0.3 min 0.15 ± 0.02 1.2 ± 0.1 0.75 ± 0.05 PACKAGE DIMENSIONS FOR VBPW34FASR in millimeters 4.4 ± 0.1 0.18 ± 0.2 2.2 Chip Size 3.9 ± 0.1 Cathode Anode 0.8 ± 0.1 1.6 ± 0.1 1.95 3x3 1 ± 0.3 6.4 ± 0.3 Recommended solder pad technical drawings according to DIN specifications 8.9 1.8 5.4 Drawing-No.: 6.541-5085.01-4 Issue: 1; 15.04.10 22104 Rev. 1.2, 24-Aug-11 Document Number: 81127 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBPW34FAS, VBPW34FASR www.vishay.com Vishay Semiconductors TAPING DIMENSIONS FOR VBPW34FAS in millimeters 21730 TAPING DIMENSIONS FOR VBPW34FASR in millimeters 21731 Rev. 1.2, 24-Aug-11 Document Number: 81127 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBPW34FAS, VBPW34FASR www.vishay.com Vishay Semiconductors REEL DIMENSIONS FOR VBPW34FAS AND VBPW34FASR in millimeters 21732 SOLDER PROFILE DRYPACK 300 255 °C 240 °C 217 °C 250 Temperature (°C) max. 260 °C 245 °C FLOOR LIFE 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 50 100 150 200 250 300 Time (s) Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.2, 24-Aug-11 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Time between soldering and removing from MBB must not exceed the time indicated in J-STD-020: Moisture sensitivity: level 3 Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or recommended conditions: 192 h at 40 °C (+ 5 °C), RH < 5 % or 96 h at 60 °C (+ 5 °C), RH < 5 %. Document Number: 81127 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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