DIODES DVRN6056-7-F

DVRN6056
VOLTAGE REFERENCE ARRAY
Features
Mechanical Data
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Epitaxial Planar Die Construction
Ideally Suited for Automated Assembly Processes
Lead Free/RoHS Compliant Version (Notes 2 & 3)
“Green” Device (Note 3)
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Case: SOT-26
Case Material: Molded Plastic, “Green” Molding Compound
(Note 3) UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Matte Tin Finish annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.008 grams (approximate)
NC
K1
Z1
A1
Top View
E1
Q1
B1
C1
Device Schematic
Maximum Ratings, NPN Transistor Element (Q1) @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
(Note 1)
Symbol
VCBO
VCEO
VEBO
IC
Value
60
40
6.0
600
Unit
V
V
V
mA
Symbol
VF
Value
0.9
Unit
V
Symbol
PD
RθJA
TJ, TSTG
Value
300
417
-55 to +150
Unit
mW
°C/W
°C
Maximum Ratings, Zener Element (Z1) @TA = 25°C unless otherwise specified
Characteristic
Forward Voltage
@ IF = 10mA
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Notes:
(Note 1)
(Note 1)
1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Product manufactured with date code WN (Week 45, 2009) and newer are built with Green Molding Compound and Lead-free plating. Product
manufactured prior to date code WO are built with Tin-Lead plating, Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DVRN6056
Document number: DS30556 Rev. 5 - 2
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March 2010
© Diodes Incorporated
DVRN6056
Electrical Characteristics, NPN Transistor Element (Q1) @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 4)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Base Cutoff Current
ON CHARACTERISTICS (Note 4)
Symbol
Min
Max
Unit
V(BR)CBO
V(BR)CEO
V(BR)EBO
ICEX
IBL
60
40
6.0
⎯
⎯
⎯
⎯
⎯
100
100
V
V
V
nA
nA
hFE
20
40
80
100
40
⎯
⎯
⎯
300
⎯
Collector-Emitter Saturation Voltage
VCE(SAT)
⎯
0.40
0.75
V
Base-Emitter Saturation Voltage
VBE(SAT)
0.75
⎯
0.95
1.2
V
Ccb
Ceb
hie
hre
hfe
hoe
fT
⎯
⎯
1.0
0.1
40
1.0
250
6.5
30
15
8.0
500
30
⎯
pF
pF
kΩ
-4
x 10
⎯
μS
MHz
td
tr
ts
tf
⎯
⎯
⎯
⎯
15
20
225
30
ns
ns
ns
ns
DC Current Gain
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Input Capacitance
Input Impedance
Voltage Feedback Ratio
Small Signal Current Gain
Output Admittance
Current Gain-Bandwidth Product
SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
⎯
Test Condition
IC = 100μA, IE = 0
IC = 1.0mA, IB = 0
IE = 100μA, IC = 0
VCE = 35V, VEB(OFF) = 0.4V
VCE = 35V, VEB(OFF) = 0.4V
IC = 100µA, VCE = 1.0V
IC = 1.0mA, VCE = 1.0V
IC = 10mA, VCE = 1.0V
IC = 150mA, VCE = 1.0V
IC = 500mA, VCE = 2.0V
IC = 150mA, IB = 15mA
IC = 500mA, IB = 50mA
IC = 150mA, IB = 15mA
IC = 500mA, IB = 50mA
VCB = 5.0V, f = 1.0MHz, IE = 0
VEB = 0.5V, f = 1.0MHz, IC = 0
VCE = 10V, IC = 1.0mA, f = 1.0kHz
VCE = 10V, IC = 20mA, f = 100MHz
VCC = 30V, IC = 150mA,
VBE(off) = 2.0V, IB1 = 15mA
VCC = 30V, IC = 150mA,
IB1 = IB2 = 15mA
Electrical Characteristics, Zener Element (Z1) @TA = 25°C unless otherwise specified
Zener Voltage Range (Note 4)
VZ @ IZT
Min (V)
5.49
Nom (V)
5.6
Notes:
Max (V)
5.73
Maximum Zener Impedance
IZT
mA
5
ZZT @ IZT
ZZK @ IZK = 0.5mA
Ω
200
60
Maximum Reverse
Leakage Current (Note 4)
IR
@ VR
V
μA
1.0
2.5
4. Short duration pulse test used to minimize self-heating effect.
NPN Transistor Section (Q1)
1,000
400
TA = 125°C
300
hFE, DC CURRENT GAIN
PD, POWER DISSIPATION (mW)
350
250
100
200
150
100
TA = -25°C
TA = +25°C
10
50
VCE = 1.0V
0
50
75 100 125 150 175 200
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Dissipation vs. Ambient Temperature (Total Device)
0
25
DVRN6056
Document number: DS30556 Rev. 5 - 2
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1
0.1
1,000
1
10
100
IC, COLLECTOR CURRENT (mA)
Fig. 2 Typical DC Current Gain vs. Collector Current
March 2010
© Diodes Incorporated
DVRN6056
NPN Transistor Section (Q1)
2.0
30
VCE, COLLECTOR-EMITTER VOLTAGE (V)
f = 1MHz
20
10
5.0
C obo
1.0
0.1
0.5
VCE(SAT), COLLECTOR-EMITTER
SATURATION VOLTAGE (V)
IC
IB = 10
0.4
TA = 25°C
0.3
TA = 150°C
0.2
0.1
T A = -50°C
0
1
1,000
10
100
IC, COLLECTOR CURRENT (mA)
Fig. 5 Typical Collector-Emitter Saturation Voltage
vs. Collector Current
IC = 30mA
IC = 1mA
IC = 10mA
1.6
IC = 100mA
1.4
IC = 300mA
1.2
1.0
0.8
0.6
0.4
0.2
0
0.001
1.0
10
50
VR, REVERSE VOLTAGE (V)
Fig. 3 Typical Capacitance Characteristics
VBE(ON), BASE-EMITTER TURN-ON VOLTAGE (V)
CAPACITANCE (pF)
Cibo
1.8
0.1
10
1
IB, BASE CURRENT (mA)
Fig. 4 Typical Collector Saturation Region
0.01
100
1.0
0.9
0.8
0.7
VCE = 5V
TA = -50°C
T A = 25°C
0.6
0.5
TA = 150°C
0.4
0.3
0.2
0.1
10
1
100
IC, COLLECTOR CURRENT (mA)
Fig. 6 Typical Base-Emitter Turn-On Voltage
vs. Collector Current
fT, GAIN-BANDWIDTH PRODUCT (MHz)
1,000
VCE = 5V
100
10
1
1
10
100
IC, COLLECTOR CURRENT (mA)
Fig. 7 Typical Gain-Bandwidth Product vs. Collector Current
DVRN6056
Document number: DS30556 Rev. 5 - 2
3 of 5
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March 2010
© Diodes Incorporated
DVRN6056
IF, INSTANTANEOUS FORWARD CURRENT (mA)
Zener Section (Z1)
1,000
100
10
1.0
0.1
0.01
0
1.2
0.6
0.8
0.4
1.0
0.2
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 8 Typical Forward Characteristics
Ordering Information
(Note 5)
Part Number
DVRN6056-7-F
Notes:
Case
SOT-26
Packaging
3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
YM
AH1
Date Code Key
Year
2003
Code
P
Month
Code
Jan
1
2004
R
2005
S
Feb
2
2006
T
Mar
3
2007
U
Apr
4
AH1 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: P = 2003)
M = Month (ex: 9 = September)
2008
V
May
5
2009
W
Jun
6
2010
X
Jul
7
2011
Y
Aug
8
2012
Z
Sep
9
2013
A
Oct
O
2014
B
Nov
N
2015
C
Dec
D
Package Outline Dimensions
A
B C
H
K
J
DVRN6056
Document number: DS30556 Rev. 5 - 2
M
D
L
4 of 5
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SOT-26
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
⎯
⎯ 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
0°
8°
α
⎯
All Dimensions in mm
March 2010
© Diodes Incorporated
DVRN6056
Suggested Pad Layout
C2
Z
C2
C1
G
Y
Dimensions Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
2.40
C2
0.95
X
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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1. are intended to implant into the body, or
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labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
DVRN6056
Document number: DS30556 Rev. 5 - 2
5 of 5
www.diodes.com
March 2010
© Diodes Incorporated