VISHAY GB100TS60NPBF

GB100TS60NPbF
Vishay High Power Products
INT-A-PAK "Half-Bridge"
(Ultrafast Speed IGBT), 108 A
FEATURES
• Generation 5 Non Punch Through (NPT)
technology
• Ultrafast: Optimized for hard switching speed
8 kHz to 60 kHz
• Low VCE(on)
• 10 μs short circuit capability
• Square RBSOA
• Positive VCE(on) temperature coefficient
• HEXFRED® antiparallel diode with ultrasoft reverse
recovery characteristics
INT-A-PAK
• Industry standard package
• Al2O3 DBC
• UL approved file E78996
• Compliant to RoHS directive 2002/95/EC
PRODUCT SUMMARY
VCES
600 V
• Designed for industrial level
IC DC
108 A
BENEFITS
VCE(on) at 100 A, 25 °C
2.6 V
• Benchmark efficiency for UPS and welding application
• Rugged transient performance
• Direct mounting on heatsink
• Very low junction to case thermal resistance
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter voltage
VCES
Continuous collector current
IC
TEST CONDITIONS
TC = 25 °C
TC = 80 °C
MAX.
UNITS
600
V
108
74
Pulsed collector current
ICM
200
Clamped inductive load current
ILM
200
Diode continuous forward current
IF
Gate to emitter voltage
VGE
Maximum power dissipation
PD
Isolation voltage
Document Number: 94501
Revision: 04-May-10
VISOL
A
TC = 25 °C
106
TC = 80 °C
69
± 20
TC = 25 °C
390
TC = 80 °C
219
Any terminal to case, t = 1 min
2500
For technical questions, contact: [email protected]
V
W
V
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GB100TS60NPbF
Vishay High Power Products
INT-A-PAK "Half-Bridge"
(Ultrafast Speed IGBT), 108 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown voltage
Collector to emitter voltage
Gate threshold voltage
Collector to emitter leakage current
Diode forward voltage drop
Gate to emitter leakage current
SYMBOL
VBR(CES)
VCE(on)
VGE(th)
ICES
VFM
IGES
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
VGE = 0 V, IC = 500 μA
600
-
-
VGE = 15 V, IC = 50 A
-
1.95
2.1
VGE = 15 V, IC = 100 A
-
2.6
2.85
VGE = 15 V, IC = 50 A, TJ = 125 °C
-
2.21
2.44
VGE = 15 V, IC = 100 A, TJ = 125 °C
-
3.05
3.38
VCE = VGE, IC = 500 μA
3
4.6
6
VGE = 0 V, VCE = 600 V
-
0.01
0.1
VGE = 0 V, VCE = 600 V, TJ = 150 °C
-
3.7
10
IC = 50 A
-
1.35
1.66
IC = 100 A
-
1.57
1.96
IC = 50 A, TJ = 125 °C
-
1.27
1.50
IC = 100 A, TJ = 125 °C
-
1.57
1.89
VGE = ± 20 V
-
-
± 200
nA
MIN.
TYP.
MAX.
UNITS
-
0.6
-
-
1.1
-
V
mA
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Turn-on switching loss
SYMBOL
TEST CONDITIONS
Eon
IC = 100 A, VCC = 360 V, VGE = 15 V,
Rg = 4.7 Ω, L = 200 μH, TJ = 25 °C
Turn-off switching loss
Eoff
Total switching loss
Etot
-
1.7
-
Turn-on switching loss
Eon
-
0.8
-
Turn-off switching loss
Eoff
-
1.3
-
Total switching loss
Etot
-
2.1
-
Turn-on delay time
Rise time
Turn-off delay time
Fall time
mJ
IC = 100 A, VCC = 360 V, VGE = 15 V,
Rg = 4.7 Ω, L = 200 μH, TJ = 125 °C
-
197
-
tr
-
50
-
td(off)
-
225
-
tf
-
72
-
td(on)
ns
Reverse bias safe operating area
RBSOA
TJ = 150 °C, IC = 200 A,
Rg = 27 Ω, VGE = 15 V to 0
Short circuit safe operating area
SCSOA
TJ = 150 °C, VCC = 400 V, VP = 600 V,
Rg = 27 Ω, VGE = 15 V to 0
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
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IF = 50 A, dIF/dt = 200 A/μs,
VCC = 400 V, TJ = 25 °C
IF = 50 A, dIF/dt = 200 A/μs,
VCC = 400 V, TJ = 125 °C
For technical questions, contact: [email protected]
Fullsquare
10
-
-
-
116
140
ns
-
11
15
A
-
600
1050
nC
-
152
190
ns
-
16
20
A
-
1215
1900
nC
Document Number: 94501
Revision: 04-May-10
GB100TS60NPbF
INT-A-PAK "Half-Bridge"
Vishay High Power Products
(Ultrafast Speed IGBT), 108 A
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNITS
TJ, TStg
- 40
-
150
°C
-
0.23
0.32
-
0.38
0.64
-
0.1
-
case to heatsink
-
-
4
case to terminal 1, 2, 3
-
-
3
-
185
-
Operating junction and storage temperature range
IGBT
Junction to case per leg
Diode
Case to sink per module
RthJC
RthCS
°C/W
Mounting torque
Nm
Weight
200
200
Vge = 18V
Vge = 15V
Vge = 12V
150
180
160
Vge = 9V
140
IcE (A)
IcE (A)
g
100
120
100
80
60
50
Tj = 125°C
40
Tj = 25°C
20
0
0
0
1
2
3
4
5
0
6
4
6
8
10
VGE (V)
Fig. 1 - Typical IGBT Output Characteristics
TJ = 25 °C, tp = 500 μs
Fig. 3 - Typical Transfer Characteristics
VCE = 20 V, tp = 500 μs
200
5
VCE, Collector -to-Emitter Voltage (V)
Vge = 18V
Vge = 15V
Vge = 12V
150
IcE (A)
2
VCE (V)
Vge = 9V
100
50
Ic = 200A
4.5
4
3.5
Ic = 100A
3
2.5
Ic = 50A
2
1.5
0
0
1
2
3
4
5
6
0
20
40
60
80
100 120 140 160
VCE (V)
TJ, Junction Temperature (°C)
Fig. 2 - Typical IGBT Output Characteristics
TJ = 125 °C, tp = 500 μs
Fig. 4 - Typical Collector to Emitter Voltage vs.
Junction Temperature,
VGE = 15 V, 500 μs pulse width
Document Number: 94501
Revision: 04-May-10
For technical questions, contact: [email protected]
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GB100TS60NPbF
Vishay High Power Products
INT-A-PAK "Half-Bridge"
(Ultrafast Speed IGBT), 108 A
200
1000
Switching Time (ns)
IF (A)
150
100
50
td(off)
td(on)
100
tf
Tj = 125°C
tr
Tj = 25°C
0
10
0.0
0.5
1.0
1.5
20
2.0
60
80
100
I (A)
Fig. 5 - Diode Forward Characteristics, tp = 500 μs
Fig. 8 - Typical Switching Time vs. IC
TJ = 125 °C, L = 200 μH, VCC = 360 V,
Rg = 4.7 Ω, VGE = 15 V
5000
160
4500
140
4000
120
Eon
3500
Energy (mJ)
TC, Case Temperature (°C)
40
VF (V)
100
DC
80
60
3000
Eoff
2500
2000
1500
40
1000
20
500
0
0
0
20
40
60
80
100
0
120
10
20
30
40
50
Maximum DC Collector Current (A)
RG (Ω)
Fig. 6 - Maximum Collector Current vs.
Case Temperature
Fig. 9 - Typical Energy Loss vs. Rg
TJ = 125 °C, L = 200 μH, VCC = 360 V,
ICE = 100 A, VGE = 15 V
1400
1000
1200
Energy Time (ns)
Energy (mJ)
td(off)
Eoff
1000
800
Eon
600
400
td(on)
100
tf
tr
200
10
0
0
20
40
60
80
100
120
0
10
Fig. 7 - Typical Energy Loss vs. IC, TJ = 125 °C,
L = 200 μH, VCC = 360 V, Rg = 4.7 Ω, VGE = 15 V
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20
30
40
50
RG (Ω)
IC (A)
Fig. 10 - Typical Switching Time vs. Rg
TJ = 125 °C, L = 200 μH, VCC = 360 V,
ICE = 100 A, VGE = 15 V
For technical questions, contact: [email protected]
Document Number: 94501
Revision: 04-May-10
GB100TS60NPbF
INT-A-PAK "Half-Bridge"
Vishay High Power Products
(Ultrafast Speed IGBT), 108 A
100
9
Total Switching Losses (mJ)
90
4.7 ohm
80
IRR (A)
70
60
27 ohm
50
40
30
47 ohm
20
8
7
6
5
4
3
2
10
1
0
0
20
40
60
80
100
0
120
10
20
Fig. 11 - Typical Diode Irr vs. IF,
TJ = 125 °C
50
Total Switching Losses (mJ)
10
80
IRR (A)
40
Fig. 14 - Typical Switching Losses vs. Gate Resistance,
TJ = 125 °C, L = 200 μH, Rg = 10 Ω,
VCC = 360 V, VGE = 15 V
100
60
40
20
0
Ic = 100A
Ic = 50A
1
Ic = 25A
0.1
0
10
20
30
40
50
0
25
50
75
100
125
RG (Ω)
TJ - Junction Temperature (°C)
Fig. 12 - Typical Diode Irr vs. Rg,
TJ = 125 °C, IF = 100 A
Fig. 15 - Typical Switching Losses vs. Junction Temperature,
L = 200 μH, Rg = 10 Ω, VCC = 360 V, VGE = 15 V
90
Total Switching Losses (mJ)
2.5
80
IRR (A)
30
RG (Ω)
IF (A)
70
60
50
2
1.5
1
0.5
0
600
800
1000
1200
1400
1600
1800
20
40
Fig. 13 - Typical Diode Irr vs. dIF/dt,
TJ = 125 °C, VCC = 360 V, IF = 150 A, VGE = 15 V
Document Number: 94501
Revision: 04-May-10
60
80
100
IC (A)
dIF / dt (A/μs)
Fig. 16 - Typical Switching Losses vs.
Collector to Emitter Current,
TJ = 125 °C, Rg1 = 4.7 V, Rg2 = 0 Ω, VCC = 360 V, VGE = 15 V
For technical questions, contact: [email protected]
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GB100TS60NPbF
Vishay High Power Products
INT-A-PAK "Half-Bridge"
(Ultrafast Speed IGBT), 108 A
Thermal response (Z thJC)
1
D = 0.5
0.1
D = 0.2
D = 0.1
D = 0.05
0.01
D = 0.02
D = 0.01
Notes:
1. Duty Factor D = t1/t2
Single Pulse
(Thermal Response)
0.001
1E-05
1E-04
1E-03
2. Peak Tj = Pdm x ZthJC + Tc
1E-02
1E-01
1E+00
1E+01
t1 , Rectangular Pulse Duration (sec)
Fig. 17 - Maximum Transient Thermal Impedance, Junction to Case (IGBT)
1
Thermal response (Z thJC)
D = 0.5
D = 0.2
0.1
D = 0.1
D = 0.05
D = 0.02
D = 0.01
0.01
Single Pulse
(Thermal Response)
0.001
1E-05
1E-04
1E-03
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = Pdm x ZthJC + Tc
1E-02
1E-01
1E+00
t1 , Rectangular Pulse Duration (sec)
Fig. 18 - Maximum Transient Thermal Impedance, Junction to Case (HEXFRED®)
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For technical questions, contact: [email protected]
Document Number: 94501
Revision: 04-May-10
GB100TS60NPbF
INT-A-PAK "Half-Bridge"
Vishay High Power Products
(Ultrafast Speed IGBT), 108 A
ORDERING INFORMATION TABLE
Device code
G
B
100
T
S
60
N
PbF
1
2
3
4
5
6
7
8
1
-
Insulated Gate Bipolar Transistor (IGBT)
2
-
B = IGBT Generation 5 NPT
3
-
Current rating (100 = 100 A)
4
-
Circuit configuration (T = Half-bridge)
5
-
Package indicator (S = INT-A-PAK)
6
-
Voltage rating (60 = 600 V)
7
-
Speed/type (N = Ultrafast IGBT)
8
-
Lead (Pb)-free
CIRCUIT CONFIGURATION
3
6
7
1
4
5
2
LINKS TO RELATED DOCUMENTS
Dimensions
Document Number: 94501
Revision: 04-May-10
www.vishay.com/doc?95173
For technical questions, contact: [email protected]
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Outline Dimensions
Vishay Semiconductors
INT-A-PAK IGBT/Thyristor
29 (1.15)
28 (1.10)
9 (0.33)
30 (1.18)
7 (0.28)
DIMENSIONS in millimeters (inches)
Ø 6.5 (0.25 DIA)
80 (3.15)
23 (0.91)
7
6
4
5 (0.20)
5
23 (0.91)
1
3 screws M6 x 10
2
2.8 x 0.8
(0.11 x 0.03)
14.5 (0.57)
35 (1.38)
17 (0.67)
3
66 (2.60)
37 (1.44)
94 (3.70)
Document Number: 95067
Revision: 15-Feb-08
For technical questions, contact: [email protected]
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
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including but not limited to the warranty expressed therein.
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Document Number: 91000
Revision: 11-Mar-11
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