MURD530 SWITCHMODE Power Rectifier DPAK Surface Mount Package http://onsemi.com These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. ULTRAFAST RECTIFIER 5.0 AMPERES, 300 VOLTS Features • • • • Ultrafast 50 Nanosecond Recovery Time Low Forward Voltage Drop Low Leakage Pb−Free Package is Available 1 4 3 Mechanical Characteristics • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Available in 16 mm Tape and Reel, 2500 Units Per Reel, by Adding a “T4’’ Suffix to the Part Number MARKING DIAGRAM 4 1 2 AYWW U 530G DPAK CASE 369C 3 A Y WW G = Assembly Location = Year = Work Week = Pb−Free Package MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 300 V Average Rectified Forward Current (Rated VR, TC = 165°C) IF(AV) 5.0 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 165°C) IFRM 10 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) IFSM 75 A TJ, Tstg −65 to +175 °C Operating Junction and Storage Temperature Range ORDERING INFORMATION Device MURD530T4G Package Shipping† DPAK (Pb−Free) 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2011 January, 2011 − Rev. 3 1 Publication Order Number: MURD530/D MURD530 THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance − Junction−to−Case (Note 1) RqJC 3 °C/W Thermal Resistance − Junction−to−Ambient (Note 2) RqJA 92 °C/W RqJA 57 °C/W Thermal Resistance − Junction−to−Ambient (Note 3) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage Drop (Note 4) (iF = 3 A, TJ = 25°C) (iF = 3 A, TJ = 125°C) (iF = 5 A, TJ = 25°C) (iF = 5 A, TJ = 125°C) vF Maximum Instantaneous Reverse Current (Note 4) (TJ = 25°C, Rated dc Voltage) (TJ = 125°C, Rated dc Voltage) iR Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 A/ms, VR = 30 V, TJ = 25°C) trr 1. 2. 3. 4. 0.95 0.80 1.05 0.90 Volts mA 5.0 150 ns 50 Rating applies for one diode leg. Rating applies when for both diode legs when mounted on 130 mm2 pad size. Rating applies for both diode legs when mounted on 1 in pad size. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. 100 TJ = 175°C 85°C 125°C 1 25°C −40°C 0.1 0 0.5 1.0 1.5 85°C 25°C 1 −40°C 0.1 2.0 125°C 0 0.5 1.0 1.5 vF, INSTANTANEOUS VOLTAGE (V) vF, INSTANTANEOUS VOLTAGE (V) Figure 2. Typical Forward Voltage 125°C 10 85°C 1.0 25°C 0.1 0.01 −40°C 0.001 50 2.0 1000 175°C 100 0 0 175°C 10 Figure 1. Maximum Forward Voltage 1000 IR, REVERSE CURRENT (mA) IF, FORARD CURRENT (A) 10 IR, REVERSE CURRENT (A) IF, FORARD CURRENT (A) 100 100 150 200 vR, REVERSEE VOLTAGE (V) 250 125°C 10 85°C 1.0 0.1 25°C 0.01 −40°C 0.001 0 0 300 175°C 100 Figure 3. Maximum Reverse Voltage 50 100 150 200 250 vR, REVERSEE VOLTAGE (V) Figure 4. Typical Reverse Voltage http://onsemi.com 2 300 MURD530 5 15 10 dc SQUARE WAVE 5 80 90 dc SQUARE WAVE 0 100 110 120 130 140 150 160 170 180 80 90 100 110 120 130 140 150 160 170 18 TC, CASE TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 5. Typical Current Derating, Case Figure 6. Typical Current Derating, Ambient 8 1000 TJ = 25°C 7 6 5 C, CAPACITANCE (pF) PFO, AVERAGE POWER DISSIPATION (W) 0 Rated Voltage Applied RqJA = 57°C/W IF, AVERAGE FORWARD CURRENT (mA) IF, AVERAGE FORWARD CURRENT (mA) Rated Voltage Applied RqJA = 3°C/W SQUARE WAVE 4 dc 3 2 100 10 1 0 0 1 2 3 4 5 6 7 8 1 9 0 50 100 150 200 IO, AVERAGE FORWARD CURRENT (A) VR, REVERSE VOLTAGE (V) Figure 7. Forward Power Dissipation Figure 8. Typical Capacitance 250 10 R(t), (°C/W) D = 0.5 1 0.2 0.1 0.05 0.1 0.01 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 PULSE TIME (s) Figure 9. R(t) on an Infinite Heatsink Power (J1) 0.800 W Power (J2) 0.800 W http://onsemi.com 3 100 1000 MURD530 100 D = 0.5 0.2 0.1 R(t), (°C/W) 10 0.05 1 0.01 0.1 Single Pulse 0.01 0.001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 PULSE TIME (s) Figure 10. PCB Cu Area 650 mm2 PCB Cu thk 1 oz Power (J1) 0.800 W Power (J2) 0.800 W http://onsemi.com 4 1000 MURD530 PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE D A E b3 c2 B Z D 1 L4 A 4 L3 b2 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C H DETAIL A 3 c b 0.005 (0.13) M H C L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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