IMX8 DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR Features • • • • • Epitaxial Planar Die Construction Complementary PNP Type Available (IMT4) Small Surface Mount Package Lead Free/RoHS Compliant (Note 3) "Green" Device, Note 4 and 5 • • • • • • • B1 C2 Case: SOT-26 Case Material: Molded Plastic, "Green" Molding Compound, Note 5. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminal Connections: See Diagram Terminals: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish annealed over Copper leadframe). Marking Information: KX8, See Page 3 Ordering & Date Code Information: See Page 3 Weight: 0.016 grams (approximate) E2 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D ⎯ ⎯ 0.95 F ⎯ ⎯ 0.55 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 α 0° 8° ⎯ C1 H K M J D B2 B1 F L E1 All Dimensions in mm C2 Maximum Ratings E1 B C Mechanical Data • • SOT-26 A B2 E2 C1 @TA = 25°C unless otherwise specified Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient (Note 1) Symbol VCBO VCEO VEBO IC Pd RθJA Value 120 120 5.0 50 300 417 Unit V V V mA mW °C/W Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C Electrical Characteristics Characteristic OFF CHARACTERISTICS (Note 2) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current ON CHARACTERISTICS (Note 2) DC Current Gain Collector-Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS Current Gain-Bandwidth Product Notes: @TA = 25°C unless otherwise specified Symbol Min Typ Max Unit Test Condition V(BR)CBO V(BR)CEO V(BR)EBO ICBO IEBO 120 120 5.0 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 0.5 0.5 V V V μA μA IC = 50μA IC = 1.0mA IE = 50μA VCB = 100V VEB = 4.0V hFE VCE(SAT) 180 ⎯ ⎯ ⎯ 820 0.5 ⎯ V IC = 2.0mA, VCE = 6.0V IC = 10mA, IB = 1.0mA fT ⎯ 140 ⎯ MHz VCE = 12V, IC = 2.0mA, f = 100MHz 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 200mW per element must not be exceeded. 2. Short duration pulse test used to minimize self-heating effect. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. DS30304 Rev. 8 - 2 1 of 3 www.diodes.com IMX8 © Diodes Incorporated 600 PD, POWER DISSIPATION (mW) 350 T A = 75°C 500 hFE, DC CURRENT GAIN 300 250 200 150 100 T A = 25°C 300 T A = -25°C 200 100 50 0 400 0 25 50 75 100 125 150 175 TA, AMBIENT TEMPERATURE (°C) Fig. 1, Max Power Dissipation vs. Ambient Temperature 200 0 1.0 100 10.0 IC, COLLECTOR CURRENT (mA) Fig. 2 Typical DC Current Gain vs. Collector Current 100 1.0 10.0 TA = 75°C TA = -25°C 1.0 0.1 0 VCE(SAT), COLLECTOR TO EMITTER SATURATION VOLTAGE (V) IC, COLLECTOR CURRENT (mA) TA = 25° C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VBE(ON), BASE-EMITTER VOLTAGE (V) Fig. 3 Typical Collector Current vs. Base-Emitter Voltage TA = 150° C 0.100 TA = 25° C T A = -50°C 0.010 0.9 1 6 1,000 IB = 16µA IC, COLLECTOR CURRENT (mA) fT, GAIN BANDWIDTH PRODUCT (MHz) VCE = 5 Volts 100 10 1 1 10 100 1,000 IC, COLLECTOR CURRENT (mA) Fig. 4 Typical Collector-Emitter Voltage vs. Collector Current 5 IB = 14µA IB = 12µA 4 IB = 10µA 3 IB = 8µA 2 IB = 6µA IB = 4µA 1 0 10 IC, COLLECTOR CURRENT (mA) Fig. 5 Typical Gain Bandwidth Product vs. Collector Current DS30304 Rev. 8 - 2 0 100 2 of 3 www.diodes.com 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VCE, COLLECTOR-EMITTER VOLTAGE (V) Fig. 6 Typical Collector Current vs. Collector-Emitter Voltage IMX8 © Diodes Incorporated Ordering Information (Note 5 & 6 ) Device IMX8-7-F Notes: Packaging SOT-26 Shipping 3000/Tape & Reel 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. KX8 YM Marking Information KX8 = Product Type Marking Code YM = Date Code Marking Y =Year ex: T = 2006 M = Month ex: 9 = September Date Code Key Year 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 Code N P R S T U V W X Y Z Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. DS30304 Rev. 8 - 2 3 of 3 www.diodes.com IMX8 © Diodes Incorporated