CYPRESS CYRF8935_13

CYRF8935
WirelessUSB™-NL 2.4 GHz
Low Power Radio
WirelessUSB™-NL 2.4 GHz Low Power Radio
using a differentiated single-mixer, closed-loop modulation
design that optimizes power efficiency and interference
immunity. Closed-loop modulation effectively eliminates the
problem of frequency drift, enabling WirelessUSB-NL to transmit
up to 255-byte payloads without repeatedly having to pay power
penalties for re-locking the phase locked loop (PLL) as in
open-loop designs.
Features
■
Fully integrated 2.4-GHz radio on a chip
■
1-Mbps over-the-air data rate
■
Transmit power typical: 0 dBm
■
Receive sensitivity typical: –87 dBm
■
1 µA typical [1] current consumption in sleep state
■
Closed-loop frequency synthesis
■
Supports frequency-hopping spread spectrum
■
On-chip packet framer with 64-byte first in first out (FIFO) data
buffer
■
Built-in auto-retry-acknowledge protocol simplifies usage
■
Built-in cyclic redundancy check (CRC), forward error
correction (FEC), data whitening
■
Supports DC ~ 12-MHz SPI bus interface
■
Additional outputs for interrupt request (IRQ) generation
■
Digital readout of received signal strength indication (RSSI)
■
4 × 4 mm quad flat no-leads (QFN) package, bare die, or wafer
sales
Product Description
WirelessUSB™-NL, optimized to operate in the 2.4-GHz ISM
band, is Cypress's third generation of 2.4-GHz low-power RF
technology, bringing the next level of low-power performance
into a small 4-mm × 4-mm footprint. WirelessUSB-NL
implements a Gaussian frequency-shift keying (GFSK) radio
Among the advantages of WirelessUSB-NL are its fast lock times
and channel switching, along with the ability to transmit larger
payloads. Use of longer payload packets, compared to multiple
short payload packets, can reduce overhead, improve overall
power efficiency, and help alleviate spectrum crowding.
Combined with Cypress's enCoRe™ family of USB and wireless
microcontrollers, WirelessUSB-NL also provides the lowest bill
of materials (BOM) cost solution for PC peripheral applications
such as wireless keyboards and mice, as well as best-in-class
wireless performance in other demanding applications such as
toys, remote controls, fitness, automation, presenter tools, and
gaming.
Applications
■
Wireless keyboards and mice
■
Handheld remote controls
■
Wireless game controllers
■
Hobby craft control links
■
Home automation
■
Industrial wireless links and networks
■
Cordless audio and low-rate video
Note
1. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VIN = 3 VDC, Ta = +25 °C.
Cypress Semiconductor Corporation
Document Number: 001-61351 Rev. *J
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 21, 2013
CYRF8935
Logic Block Diagram
VIN
VDD1 ...VDD7
VOUT
VDD_IO
LDO Linear
Regulator
GFSK
Modulator
PKT
FIFO
MISO
MOSI
RST_n
Framer
CLK
SPI Registers
SPI_SS
PA
Synthesizer
ANT
ANTb
VCO
Pwr/ Reset
BRCLK
[2]
Xtal Osc
GFSK
Demodulator
X
Image
Rej. Mxr.
XTALi
XTALo
LNA + BPF
GND GND
Note
2. BRCLK signal is available on bare die only, not packaged parts.
Document Number: 001-61351 Rev. *J
Page 2 of 40
CYRF8935
Contents
Pin Configuration ............................................................. 4
Pin Descriptions ............................................................... 4
Functional Description ..................................................... 5
Power-on and Register Initialization Sequence ........... 5
Enter Sleep and Wakeup ............................................ 6
Packet Data Structure ................................................. 6
FIFO Pointers .............................................................. 6
Packet Payload Length ............................................... 6
Framer: Packet Length Handling ................................. 7
MCU or Application Handles Packet Length ............... 9
Typical Application ......................................................... 12
Setting the Radio Frequency ..................................... 13
Crystal Oscillator ....................................................... 13
Minimum Pin Count ................................................... 14
Reset Pull-up ............................................................. 14
Transmit Power Control ............................................. 14
Reading RSSI ............................................................ 14
Automatic ACK .......................................................... 15
Receive CRC and FEC Result .................................. 15
Sync Word Selection ................................................. 15
Scramble On/Off Selection ........................................ 16
Measuring Receiver Sensitivity ................................. 16
Receive Spurious Responses ................................... 17
RF VCO Calibration ................................................... 17
Regulatory Compliance ................................................. 18
United States FCC .................................................... 18
Register Settings for Test Purposes .......................... 19
Document Number: 001-61351 Rev. *J
Recommendations for PCB Layout .............................. 19
Antenna Type and Location .......................................... 19
IR Reflow Standard ......................................................... 20
Register Definitions ........................................................ 21
Recommended Register Values ................................ 26
Absolute Maximum Ratings .......................................... 28
Operating Range ............................................................. 28
Electrical Characteristics ............................................... 28
SPI .................................................................................... 31
SPI Transaction Formats and Timing ........................ 31
Specifications ............................................................ 32
Electrical Operating Characteristics ............................. 33
State Diagram ................................................................. 34
Ordering Information ...................................................... 35
Ordering Code Definitions ......................................... 35
Package Diagram ............................................................ 36
Acronyms ........................................................................ 37
Document Conventions ................................................. 37
Units of Measure ....................................................... 37
Document History Page ................................................. 38
Sales, Solutions, and Legal Information ...................... 40
Worldwide Sales and Design Support ....................... 40
Products .................................................................... 40
PSoC® Solutions ...................................................... 40
Cypress Developer Community ................................. 40
Technical Support ..................................................... 40
Page 3 of 40
CYRF8935
Pin Configuration
1
19
20
VDD6
VIN
21
VOUT
22
VDD7
23
VDD1
RST_n
VDD2
MISO
ANTb
MOSI
2
3
XTALo
XTALi
24
Figure 1. 24-pin QFN pinout (Top View)
18
17
16
25 GND
VDD3
PKT
SPI_SS
15
14
GND
13
12
VDD_IO
11
10
VDD4
8
7
FIFO
Test2
Test3
6
CLK
VDD5
5
ANT
9
4
Pin Descriptions
Table 1. CYRF8935 24-pin QFN (4 × 4 mm) pinout
Pin Number
Pin Name
Type
6, 7
Test2, Test3
--
1, 2, 5, 8, 9, 19, 22
VDD1 to VDD7
PWR
3, 4
ANTb, ANT
RF
10
FIFO
O
12, 25
GND
GND
Description
Reserved for factory test. Do not connect.
Core power supply voltage. Connect all VDD pins to VOUT pin.
Differential RF input/output. See Typical Application on page 12 for recommended antenna hookup. Each of these pins must be DC grounded, 20 k or
less
FIFO status indicator bit
Ground connection
11
VDD_IO
PWR
13
SPI_SS
I
Enable input for SPI, active low. Also used to bring device out of sleep state.
14
PKT
O
Transmit/receive packet status indicator bit
15
CLK
I
Clock input for SPI interface
16
MOSI
I
17
MISO
O/High-Z
18
RST_n
I
20
VIN
PWR
Unregulated input voltage to the on-chip low drop out (LDO) voltage regulator
21
VOUT
PWR
+1.8 V output from on-chip LDO. Connect to all VDD pins, do not connect to
external loads.
23
XTALo
AO
Output of the crystal oscillator gain block
24
XTALi
AI
Input to the crystal oscillator gain block
Document Number: 001-61351 Rev. *J
VDD for the digital interface
Data input for the SPI bus
Data output (tristate when not active)
RST_n Low: Chip shutdown to conserve power. Register values lost
RST_n High: Turn on chip, registers restored to default value
Page 4 of 40
CYRF8935
Functional Description
The CYRF8935 RF transceiver can add wireless capability to a
wide variety of applications.
The product is a low-cost, fully-integrated CMOS RF transceiver,
GFSK data modem, and packet framer, optimized for use in the
2.4-GHz ISM band. It contains transmit, receive, RF synthesizer,
and digital modem functions, with few external components. The
transmitter supports digital power control. The receiver uses
extensive digital processing for excellent overall performance,
even in the presence of interference and transmitter
impairments.
The product transmits GFSK data at approximately 0-dBm
output power. Sigma-Delta PLL delivers high-quality DC-coupled
transmit data path.
The low-IF receiver architecture produces good selectivity and
image rejection, with typical sensitivity of –87 dBm or better on
most channels. Sensitivity on channels that are integer multiples
of the crystal reference oscillator frequency (12 MHz) may show
approximately 5 dB degradation. Digital RSSI values are
available to monitor channel quality.
On-chip transmit and receive FIFO registers are available to
buffer the data transfer with MCU. Over-the-air data rate is
always 1 Mbps even when connected to a slow, low-cost MCU.
Built-in CRC, FEC, data whitening, and automatic
retry/acknowledge are all available to simplify and optimize
performance for individual applications.
Power-on and Register Initialization Sequence
For proper initialization at power up, VIN must ramp up at the
minimum overall ramp rate no slower than shown by TVIN specification in the following figure. During this time, the RST_n line
must track the VIN voltage ramp-up profile to within approximately 0.2 V. Since most MCU GPIO pins automatically default
to a high-Z condition at power up, it only requires a pull-up
resistor, as shown in Figure 11 on page 14. When power is stable
and the MCU POR releases, and MCU begins to execute instructions, RST_n must then be pulsed low as shown in Figure 2,
followed by writing Reg[27] = 0x4200. During or after this SPI
transaction, the State Machine status can be read to confirm
FRAMER_ST= 1, indicating a proper initialization.
Figure 2. Power-on and Register Programming Sequence
TVIN
VIN
RST_n
Clock stable
BRCLK
Clock unstable
SPI_SS
SPI Activity
TRPW
TRSU
TCMIN
Write Reg[27]=
0x4200
(not drawn to scale)
Table 2. Initialization Timing Requirements
Timing Parameter
Min
Max
Unit
TRSU
–
TRPW
Notes
20
ms
2 < TVIN ≤ 6.5 [ms/V]
1
10
µs
Reset pulse width necessary to ensure complete reset
TCMIN
3
–
ms
Minimum recommended crystal oscillator and APLL settling time
TVIN
–
6.5
ms/V
Reset setup time necessary to ensure
complete reset
Maximum ramp time for VIN, measured from 0 to 100% of final voltage. For
example, if VIN= 3.3 V, the max ramp time is 6.5 × 3.3 = 21.45 ms. If VIN=
1.9 V, the max ramp time = 6.5 × 1.9 = 12.35 ms.
■
After RST_n transitions from 0 to 1, BRCLK[3] begins running at 12-MHz clock.
■
After register initialization, CYRF8935 is ready to transmit or receive.
Note
3. BRCLK signal is available on bare die only, not packaged parts.
Document Number: 001-61351 Rev. *J
Page 5 of 40
CYRF8935
Figure 3. Initialization Flowchart
Initialize
CYRF8935 at
power-up
MCU generates
negative- going
RST_n pulse
Wait Crystal
Enable Time
Initialize
Registers,
beginning with
Reg[27]
Initialization
Done
RST_n pulls up
along with Vin
Enter Sleep and Wakeup
When the MCU or application writes to the CYRF8935 register 35[14] to enter sleep mode and deasserts SPI_SS, CYRF8935 enters
the sleep state where current consumption is extremely low.
Later, when SPI_SS is reasserted, CYRF8935 automatically wakes up from the sleep state. At this time the crystal oscillator is
reactivated. The crystal oscillator takes 1 to 3 ms to become fully stable. During wakeup, there is no requirement to clear register
35[14] and no requirement to hold SPI_SS asserted.
There are two sleep current choices available, selectable by Reg[27] setting: 1 µA[4] and 8 µA. If you use the 1-µA setting, Vin must
be greater than or equal to 3.0 VDC. If Vin is ever expected to be < 3.0 VDC during Sleep, use the 8-µA setting. The 1-µA Sleep
setting should only be used for long-term sleep such as 8 to 10 seconds or more.
To achieve the lowest sleep current, a special sleep state firmware patch is required. The patch is as follows:
SLEEP PATCH: Before writing register 35 to enter sleep, write Reg[10]= 0x8FFD, wait 30 µs or more, then write Reg[10] back to the
default value of 0x7FFD. Next, write Reg[35] to enter sleep, as usual.
Packet Data Structure
Figure 4. Packet Structure
Preamble
Sync word(s)
Trailer
Each over-the-air CYRF8935 packet is structured as follows:
■
Preamble: 1 to 8 bytes, programmable
■
SYNC: 16/32/48/64 bits, programmable as device sync word
■
Trailer: 4 to 18 bits, programmable
■
Payload: TX/RX data
■
CRC:16-bit CRC (Optional)
FIFO Pointers
The FIFO write pointer must be cleared before the application
writes data to FIFO for transmit. This is done by writing '1' to
register 52[15].
<== P a y l o a d ==>
CRC
The FIFO write pointer is automatically cleared when the
receiver receives SYNC.
The FIFO read pointer is automatically cleared when the receiver
receives SYNC, or after transmitting SYNC in transmit mode.
Packet Payload Length
There are two ways to handle the TX/RX packet lengths in
CYRF8935. If register 41[13] is equal to 1, the CYRF8935
internal framer detects the packet length based on the value of
the first payload byte. If register 41[13] is equal to 0, the first byte
of the payload has no particular meaning, and packet length is
determined by either TX FIFO running empty or TX_EN bit
cleared (see Table 3).
After receiving a packet, the write pointer at register 52[13:8]
indicates how many bytes of receive data are waiting in the FIFO
buffer to be read by the user MCU or the application.
Note
4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VIN = 3 VDC, Ta = +25 °C.
Document Number: 001-61351 Rev. *J
Page 6 of 40
CYRF8935
Table 3. CYRF8935 Configuration for Packet Length
Register 41[13]
PACK_LENGTH_EN
Register 41[12]
FW_TERM_TX
0
(MCU or application handles
packet length)
0
Transmit stops only when Register 7 TX_EN = 0.
See FW_TERM_TX = 0 (Transmit) on page 10 for details.
Receive stops only when Register 7 RX_EN = 0.
See FW_TERM_TX= 0 (Receive) on page 11 for details.
1
Transmit automatically stops whenever FIFO runs empty.
Receive stops only when Register 7 RX_EN = 0.
See Receive Timing on page 8.
x
(do not care)
1
(CYRF8935 framer handles
packet length)
CYRF8935 Framer Start/Stop
The first byte of payload is regarded as packet length, 0 to 255 bytes.
Transmit automatically stops when all 0 to 255 bytes are transmitted.
See Framer: Packet Length Handling on page 7 for details.
The following sections show the detailed timing diagrams. All timing diagrams show active high for PKT and FIFO flags. Active low is
also available through register 41[10] setting.
Framer: Packet Length Handling
The CYRF8935 framer handles packet length by setting register
41[13] = 1. The first byte of the payload is regarded as packet
length (this length byte is not counted in the packet length). The
CYRF8935 supports packet lengths up to 255 bytes. The framer
handles Tx/Rx start and stop.
Transmit Timing
The Tx timing diagram is shown in Figure 5. After MCU writes
register 7[8]= TX_EN = 1, the framer automatically generates the
Tx packet using payload data from the FIFO register. The
frequency (RF channel) will be as specified in register 7 at the
time TX_EN is written to 1.
The MCU or application must load transmit data into the FIFO
register before the framer sends trailer bits. You can do this by
loading the transmit payload data into the FIFO register either
before or after writing TX_EN = 1. For slower applications, it is
easier to load the FIFO register, and then write TX_EN = 1. For
the higher frame rate (faster) applications, write register 7
TX_EN = 1, and then load the FIFO register with payload data
during the Tx on delay time, as shown in Figure 5.
If the packet length exceeds the FIFO length, the MCU must
write FIFO data multiple times. The FIFO flag indicates whether
FIFO is empty in transmit state.
Figure 5. Tx Timing Diagram when Register 41[13] = 1 (Framer Handles Packet Length)
PKT and FIFO Flags are Active High
Write Reg. 7
SPI_SS
Internal
Tx On
2 µs
Tx On Delay
PA Ramp Up
Transmit Data
Tx Packet
PKT
PKT = 1 after Tx packet has been sent.
FIFO
MCU fills FIFO before framer sends trailer bits.
FIFO = 1 when FIFO is empty
Document Number: 001-61351 Rev. *J
Page 7 of 40
CYRF8935
Receive Timing
Figure 6 shows the Rx timing diagram. The receive process
begins when the MCU writes register 7[7] = 1. At this time, the
CYRF8935 framer turns on the receiver and waits while
attempting to detect a valid syncword. The receive frequency is
specified within register 7. The two register 7 fields of interest,
RX_EN and RF_PLL_CH_NO, may be sent to CYRF8935 during
the same SPI transaction. If sent in separate SPI transactions,
send the RF_PLL_CH_NO first, followed by RX_EN.
If a valid syncword is found, the CYRF8935 framer processes the
packet automatically. When the received packet processing is
complete, the CYRF8935 framer sets the state to IDLE.
If the received packet length is longer than 63 bytes, the FIFO
flag goes active, which means the MCU must read out data from
the FIFO.
A valid syncword might not always be found, either due to a weak
signal, multi-path cancellation, or devices being out of range. To
accommodate such a condition and to prevent lockup, the
application or the MCU must incorporate a 'receive timeout' timer
to clear RX_EN and return to the IDLE state.
Figure 6. Rx Timing Diagram when Register 41[13] = 1 (Framer Handles Packet Length)
PKT and FIFO Flags are Active High
Write Reg. 7
SPI_SS
Internal Rx_on
2 µs
Receive On Delay
Received Data
PKT
Rx Packet
PKT = 1 when Rx packet has been
received by Framer.
FIFO
FIFO = 1 when FIFO is full.
Document Number: 001-61351 Rev. *J
Page 8 of 40
CYRF8935
MCU or Application Handles Packet Length
When register 41[13] = 0, the first byte of the payload data has no special significance and the packet length depends on register
41[12].
FW_TERM_TX = 1
If register 41[12] = 1, the CYRF8935 framer continues to compare the FIFO write point and the FIFO read point during packet
transmission. If the MCU or application stops writing data to FIFO, the framer eventually detects that there is no data to send (FIFO
is empty), and CYRF8935 exits ‘cease transmission’ automatically (see Figure 7).
Figure 7. Tx Timing When Register 41[13:12] = '01b PKT and FIFO Flags are Set as Active High
Write Reg. 7
TX_ EN = 1
SPI_SS
Internal
Tx on
2 µs
Tx On Delay
PA On Delay
Internal
Tx Data
Framer will terminate Tx when FIFO
write point equals FIFO read point
.
Packet Tx
PKT
FIFO
MCU fills FIFO before framer sends trailer bits
.
FIFO = 1 when
FIFO is empty.
Note When register 41[13] = 0 (MCU or application handles packet length), never let FIFO underflow or overflow. FIFO full and empty
thresholds can be controlled using register 40 FIFO_EMPTY_THRESHOLD and FIFO_FULL_THRESHOLD settings. The best value
depends on SPI speed and the speed at which the MCU or application can stream the data into FIFO.
Document Number: 001-61351 Rev. *J
Page 9 of 40
CYRF8935
FW_TERM_TX = 0 (Transmit)
When register 41[13:12] = '00b, the CYRF8935 framer does not stop packet transmission until MCU or application writes register 7[8]
TX_EN bit = 0. Packet transmission continues even if FIFO is empty (see Figure 8).
Figure 8. TX Timing Diagram when Register 41[13:12] = '00b PKT and FIFO Flags are Shown Active High
Write Reg. 7
TX_ EN = 1
Write Reg. 7
TX_ EN = 0
SPI_SS
2 µs
Internal Tx
2 µs
Transmit Delay
PA On Delay
Internal Tx Data
Framer terminates Tx when MCU or
application writes Reg
. 7 TX_ EN = 0.
Packet TX
PKT
FIFO
MCU fills FIFO before framer sends trailer bits
.
FIFO = 1
when FIFO is empty
.
Note When register 41[13] = 0 (MCU or application handles packet length), never let FIFO underflow or overflow. FIFO full and empty
thresholds can be controlled through register 40 FIFO_EMPTY_THRESHOLD and FIFO_FULL_THRESHOLD settings. The best
value depends on SPI speed and the speed at which the MCU or application can stream the data into FIFO.
Document Number: 001-61351 Rev. *J
Page 10 of 40
CYRF8935
FW_TERM_TX= 0 (Receive)
When register 41[13] = 0, packet reception starts when MCU or
application writes register 7[7] RX_EN = 1. At this time, the
framer automatically turns on the receiver to the frequency and
channel specified in register 7. After waiting for the internal
synthesizer and receiver delays, the framer circuitry of the
CYRF8935 begins searching the incoming signal for a syncword.
When the syncword is detected, the framer sets the PKT flag
active, and then starts to fill the FIFO with receive data bytes. The
PKT flag remains active until the MCU or application reads out
the first byte of data from the FIFO register. After the MCU or
application reads the first byte of receive data, the PKT flag goes
inactive until the next Tx/Rx period.
With register 41[13:12] = '00b or '01b, the CYRF8935 framer
always needs the MCU or application to write register 7[7] to 0
to stop the Rx state.
The Rx timing diagram is shown in Figure 9.
Figure 9. RX Timing Diagram when Register 41[13:12] = '00b or '01b
PKT_flag and FIFO_flag are Active High
Write
Reg. 7
Write
Reg. 7
SPI_SS
Internal Rx On
2 µs
2 µs
Internal Rx On Delay
Internal Rx Data
Packet Rx Data
PKT
PKT = 1 when syncword received.
PKT = 0 when MCU/application reads first byte from FIFO register.
FIFO
FIFO = 1 when FIFO is full.
Document Number: 001-61351 Rev. *J
Page 11 of 40
CYRF8935
Typical Application
FIFO_flag
+1.8V
+3.3V
C4
+3.3V
7
Test3
VDD1
5
C3
1.0pF
4
R1
51
3
L1
R4
20k
Note 1
50 Ohm
Antenna conn.
1
2.2nH
J1
SMA
2
C1
0.10uF
1
+1.8V
GND
RST_n
6
4
3
2
8
VDD4
VDD5
FIFO
9
10
11
VDD2
25
R5
10k
MISO
XTALi
18
ANTb
24
RST_n
MOSI
XTALo
17
25
GND
23
SPI_miso
ANT
VDD7
16
CLK
VDD6
SPI_mosi
VDD3
22
15
PKT
Vout
SPI_CLK
U1
Test2
21
14
VDD_IO
PKT_flag
SPI_SS
Vin
13
20
SPI_ss
19
MCU Interface
GND
12
0.10uF
CYRF8935
+3.3V
Note 2
C5
0.10uF
Notes:
+1.8V
C6
4.7uF
Ceramic
ESR < 4 Ohms
R3
2.2k
680k
C7
15pF
Document Number: 001-61351 Rev. *J
1. ANT pin requires DC path to ground. If
antenna or RF test equipment does not provide
this, R4= 20k Ohm is required.
R2
2. Max. input noise on Vin: 50 mV pk.
C8
Y1
Quartz xtal 12MHz
15pF
Page 12 of 40
CYRF8935
Setting the Radio Frequency
Some sample Register 7 examples are as shown in Table 4.
Programming by channel number is the easiest way to set
frequency. In the CYRF8935, RF carrier frequency and RF
channel number are always related by the expression:
During Regulatory Compliance testing, you can jump directly to
another frequency any time without going through IDLE state. If
you change between Tx and Rx, however, you must pass
through IDLE state. For IDLE state, write Register 7 to clear bits
8 and 7. Tx or Rx operation is initiated when Register 7 bit 8 or
7 is set. Radio frequency is also determined at that time.
Freq. = 2402 + Ch. #
Channel number is loaded into bits [6:0] of Register 7. Bits 7 and
8 initiate the desired Rx or Tx operation, respectively.
Table 4. Sample Register 7 Settings
Carrier Frequency,
MHz
DUT Channel Number
(decimal)
DUT Channel
Number
(hex)
Tx setting:
Reg. 7 value
for TX_EN= 1
Rx setting:
Reg. 7 value
for RX_EN= 1
2402
0
00
0100
0080
2403
1
01
0101
0081
2404
2
02
0102
0082
|
|
32
20
|
|
39
27
|
|
78
4E
|
2434
|
2441
|
2480
Crystal Oscillator
The CYRF8935 contains the on-chip gain block for the quartz
crystal frequency standard.
|
|
0120
00A0
|
|
0127
00A7
|
|
014E
00CE
Table 5. Crystal Specifications
Crystal Parameter
Specification
Frequency
12.000 MHz
Quartz Crystal Application
Initial frequency tolerance
±15 ppm
As shown in Figure 10 on page 14, the series resistor Rs limits
power to the crystal and contributes to the phase-shift necessary
for oscillation. The ideal Rs value may need to be determined
empirically, adjusted for certain crystal manufacturer part
numbers and designs. The series equivalent combinations of C1
and C2 largely determine the capacitive load seen by the crystal,
which should match the crystal vendor's specification. These
capacitor values are chosen to center the crystal oscillator
frequency at the correct value, 12 MHz. The feedback resistor Rf
from the buffer output to input serves to self-bias the on-chip
buffer to the center of the linear region for maximum gain.
Frequency tolerance over
temperature
±15 ppm
Frequency tolerance after
aging
±5 ppm
Frequency drift due to load
cap. drift
±5 ppm
Verifying correct crystal oscillator frequency may require special
test methods. Because connecting a frequency counter probe to
either XTALi or XTALo adds capacitive loading and alters the
crystal oscillation frequency, other methods must be used. For
bare die applications involving COB packaging, use the
BRCLK[5] test point to verify correct frequency of oscillation. This
requires register 32[3:1] set accordingly (see Register Definitions on page 21). For 24-QFN packaged parts, the correct
crystal frequency is determined by transmitting a continuous
carrier frequency (see Register Settings for Test Purposes on
page 19) and using a RF frequency counter to ensure correct
frequency. Irrespective of which method is used, initial tolerance
should be within budget as recommended in Table 5, such that
the total frequency error stays within budget.
Total
±40 ppm
Equivalent series resistance
80  max
Resonance mode
Fundamental, parallel resonant
Load capacitance
In accordance with external load
capacitors (see C1 and C2 in
Figure 10)
Note For proper operation, the total frequency error must not
exceed what is shown in Table 5. Individual error contributions
can be adjusted; for example 10+20+5+5=40, or 5+30+2+3=40.
Note
5. BRCLK signal is available on bare die only, not packaged parts.
Document Number: 001-61351 Rev. *J
Page 13 of 40
CYRF8935
Figure 10. Simplified Schematic of Crystal Oscillator
CRYSTAL
C2
Figure 11. Reset Pull-up Circuit
Vin
C1
When a low-cost MCU drives the CYRF8935, the MCU pin count
must be minimized.
■
■
■
FIFO pin: Only needed when the Tx or Rx packet length is
greater than around 63 bytes, up to infinity. For short packets
(< 63 bytes), FIFO is not needed.
PKT pin: Gives a hardware indication of a packet received. If
you are willing to poll register 48 for this information, then this
pin is not needed.
SPI lines: All four lines are needed.
7
Test3
8
VDD4
VDD5
9
10
VDD1
25
24
19
3
2
1
GND
RST_n
XTALi
VDD2
Note When crystal oscillator is constructed as shown in Typical
Application on page 12, Table 5 on page 13, and Figure 10, the
oscillation frequency should be stable within 3 mS (max) after
startup.
Minimum Pin Count
FIFO
MISO
XTALo
18
4
ANTb
23
RST_n
MOSI
VDD7
17
5
ANT
25
GND
22
Connect to
Frequency Counter
to verify correct
crystal osc. frequency.
CLK
VDD6
BRCLK
(bare die only)
6
VDD3
Vout
16
PKT
21
15
CYRF8935
U1
Test2
Vin
14
Xtal. Osc.
Gain Block
SPI_SS
20
13
Clock
Logic
VDD_IO
12
GND
XTALo
XTALi
R5
10k
11
Rs
Rf
CYRF8935
Vin
Transmit Power Control
Table 6 lists recommended settings for register 9 for short-range
applications, where reduced transmit RF power is a desirable
trade off for lower current.:
Table 6. Transmit Power Control
Power Setting
Description
Typical
Transmit
Power
(dBm)
Value of Register 9
Silicon ID
0x1002 [6]
Silicon ID
0x2002 [6]
PA0 - Highest power
+1
0x1820
0x7820
Reset Pull-up
PA2 - High power
0
0x1920
0x7920
For proper power-up initialization, the RST_n pin must have a
pull-up to VIN, as shown in Figure 11. The exact value of the 10-k
pull-up resistor is not critical. The pull-up resistor ensures proper
operation of the CYRF8935 internal-level shifter circuitry while
power is applied. Subsequently, the RST_npulse resets the
internal registers to their default state.
PA4 - High power
–3
0x1A20
0x7A20
PA8 - Low power
–7.5
0x1C20
0x7C20
PA12 - Lower power
–11.2
0x1E20
0x7E20
Reading RSSI
The CYRF8935 contains internal RSSI circuitry that is roughly
linearized to 1 dB for every LSB. Results are read from register
6[15:10], RAW_RSSI. See Register Definitions on page 21 for
details.
The framer must read the RSSI register after the receiver is
enabled and set on frequency using register 7, and after the RF
PLL has settled according to the correct receive frequency.
Note
6. Silicon Id can be read from Register 31.
Document Number: 001-61351 Rev. *J
Page 14 of 40
CYRF8935
The wait time between programming RX_EN, and reading
Register 6, can be determined by any of the following methods,
or any desired combination, depending on the application:
■
Wait in accordance with RF PLL Settling Time spec. to be sure
RF PLL is settled.
■
Read register 3[12] RF_SYNTH_LOCK to be sure CYRF8935
RF PLL is settled.
■
Read register 48[7] SYNCWORD_RECV to indicate the signal
being received is a desired packet.
Note that RSSI can be read without receiving a syncword. In
other words, CYRF8935 RSSI circuitry also responds to CW and
interference signals.
If the RSSI feature is not needed, disable it to conserve receiver
DC current budget. When register 11[9] is changed from 0 to 1,
the receiver current consumption decreases by about 0.3 mA.
Figure 12. Typical Room Temperature RSSI Response
Receive CRC and FEC Result
The CYRF8935 returns CRC and FEC error check status in
register 48[15:14]. For convenience, the entire top byte of
register 48 is returned in the SPI status word. These eight bits
are normally available from the SPI hardware block of the MCU
or application, saving the time necessary to do an additional read
of register 48 for the same information.
CRC is calculated only on the payload portion of the packet.
CRC_ERROR only clears after another valid syncword is
detected by the receiver or after transmission of a packet
payload.
Sync Word Selection
At the beginning of each packet, after transmission of a
01010101 preamble, is a sync word, programmable to be 16, 32,
48, or 64 bits long. For the devices to communicate, these must
be programmed to the same value at both ends of the link. The
sync word can be thought of as a MAC address in this respect.
In the CYRF8935 receiver, there is an adjustable tolerance for
sync word bit errors that may occur. This adjustment is called
SYNCWORD_THRESHOLD, set via Register 40, bits 5:0. If set
too tight, performance is good but less-than-optimum receive
sensitivity and link budget is obtained. If set too loose, Frame
Errors increase because of false synchronization.
The situation can sometimes be further complicated if the
chosen sync word, combined with the 01010101 preamble, has
unusually high auto correlation, or correlation with other devices
that may be on the air on a different sync word network. This
undesired condition is likely to happen when the sync word bits
that immediately follow the 01010101 preamble continues the
1010... sequence. In such cases, it becomes difficult for the
receiver to separate the actual sync word from the preamble. The
solution is to either tighten the SYNCWORD_THRESHOLD, or
choose a better sync word. Sometimes increasing the sync word
length is also an option.
Register 36 sets the sync word for the bits that immediately follow
the preamble. If a false sync problem is observed, try changing
this word first.
The following table summarizes some recommended settings.
Following is the pseudocode for measuring RSSI:
Write Reg11 = 0x0208
;disable RSSI before reading
Read RSSI = Reg6[15:10] ;do the read
Write Reg11 = 0x0008
;enable RSSI for next measurement
Table 7. Recommended SYNCWORD_THRESHOLD Settings
Sync Word
Application Length (see
Register 32)
Sync Word
Selection
Automatic ACK
The CYRF8935 provides an automatic retry/acknowledge
feature. This means that if the TX packet does not successfully
arrive at the receiving end, the TX end automatically attempts a
given number of retries. In a weak signal environment, this
feature makes the bit error rate (BER) appear to be zero at the
expense of the frame error rate (FER). Refer to State Diagram
on page 34 for details.
To use automatic retry/acknowledge, see Register Definitions on
page 21 for register 41[11] and register 35[11:8].
Document Number: 001-61351 Rev. *J
Simple
Advanced
Recommended
Reg. 40
SYNCWORD_THR
ESHOLD setting
(decimal)
32
Better
(almost every sync
word must work)
1
32
Good
(Most sync words
work)
2
64
Better
(almost every sync
word must work)
6 or tighter
64
Good
(Most sync words
work)
7
Page 15 of 40
CYRF8935
Scramble On/Off Selection
Measuring Receiver Sensitivity
The CYRF8935 incorporates a built-in hardware data scrambling
and descrambling function. This function is designed to make the
transmit data more random, removing long strings of continuous
mark or space. When enabled, it causes payload data to be
modified by a PN code that is initialized according to the setting
of Register 35 SCRAMBLE_DATA.
Receive sensitivity and BER can be measured using these
methods:
Systems based on CYRF8935 will normally function either way,
scramble on or off.
Setting SCRAMBLE_ON=1 will indeed cause a small 'token'
increase in over-the-air security, similar to what WEP adds to
WiFi. In other words, it renders the OTA data coded, but it should
not be considered highly secure. For truly secure applications,
consider using scramble combined with other security
algorithms.
To function properly, both ends of the RF link need the same
setting, enabled or disabled. Both ends must also have the same
Register 35 SCRAMBLE_DATA setting.
Method 1: Link Budget Method
In this method, another CYRF8935 or a compatible transceiver
is used as a transmit packet source. It connects to the device
under test (DUT) through a calibrated attenuation path. The
transmit power should also be known or measured. The receiver
sensitivity can be calculated from the following equation, based
on the largest RF attenuation that can be sustained between Tx
and Rx, while maintaining adequate link performance.
Link_Budget = (TxP – RxSens) [dB]
Where
TxP = Transmit Power [dBm]
RxSens = Receive Sensitivity [dBm]
Figure 13. Measuring Overall Link Budget, Method 1
CYRF
8935
DUT
CYRF
8935
MCU
Packet TX
Variable atten.
Trilithic BMA-35110
or equiv.
When using this method, make sure that the RF signal is not
leaking around the attenuator or coupling directly into the
receiver, which renders the attenuation setting meaningless. You
can verify this by simply increasing the attenuation and verifying
that the packets cease to be received at higher attenuator
settings.
RF leakage around the attenuator can be caused by:
■
Loose RF cable connector
■
Poorly shielded RF cables
■
Poor PCB layout at either Tx or Rx
■
RF boards too close together
■
Coupling by or over the DC power leads
Note that interference from other 2.4-GHz services could be
leaking into the test setup and degrade the BER measurement.
When properly set up and working, the link budget method is a
simple and reliable way to test and characterize CYRF8935 RF
performance.
Document Number: 001-61351 Rev. *J
MCU
Packet RX
Test Variations
■
Automatic loopback can be added to test both Tx and Rx in the
same test.
■
Frequency hopping can be added to test over the design
frequency range.
Method 2: Packet Signal Generator method
In this method, an RF signal generator is used as the packet
source. The shielded, adjustable RF output of the signal
generator connects to the receiver input. The signal generator
must have digital pattern storage ability for the modulation. A
packet of valid data is downloaded into the signal generator, and
these packets are repetitively sent to the CYRF8935 receiver
under test. An MCU or PC program monitors the CYRF8935 PKT
flag signal, which causes the MCU or PC to download each
packet as it is received, compare the packet against the
expected values, and report the packet statistics to the end user.
Page 16 of 40
CYRF8935
Figure 14. Measuring Receiver Sensitivity with Signal Generator, Method 2
RF Signal Generator
PC
Programmer
With Pattern Gen.
Packet Transmitter
CYRF
8935
DUT
MCU
bd.
RS-232
Term.
Packet Receiver
Packet data pattern downloaded
into signal generator
In this setup, the signal generator is set as follows:
RF VCO Calibration
Modulation: GFSK, 2-level, Bt = 0.5, peak deviation 320 kHz,
symbol rate 1 Msps.
Over-the-air Transmit and Receive frequencies for the
CYRF6935 RF transceiver are derived from the 12 MHz crystal
oscillator, multiplied up by the internal fractional-N RF PLL. Low
phase noise is obtained by keeping the PLL KVCO relatively low.
In order for the VCO to cover the desired frequency range over
the expected VDD, temperature, and process extremes, the VCO
must be calibrated prior to use. The CYRF8935 contains a fully
automatic calibration algorithm, but the algorithm does require
approximately 150 us extra time, compared to automatic
calibration turned off.
Frequency, amplitude: As required for test.
Receive Spurious Responses
This receiver, like many other low-cost receivers, may exhibit
spurious responses in-band, often at multiples of certain digital
frequencies. In the case of the CYRF8935, this response
sometimes occurs at multiples of 4 MHz or four channels, offset
from the desired receiver passband. During frequency hopping,
a signal may be found on the wrong frequency, causing incorrect
hopping synchronization.
The workaround for this is to program one of the payload bytes
to contain the channel number on which the packet is being
transmitted. When a packet is received, this byte is checked to
determine if it matches the receive channel setting. If not, the
packet should be discarded.
Document Number: 001-61351 Rev. *J
Page 17 of 40
CYRF8935
Regulatory Compliance
United States FCC
When operating in the 2402- to 2480-MHz band, the second and third harmonics always fall into what is defined in 47CFR, section
15.205 as ‘restricted bands of operation’. The field strength of radiated emissions greater than 1 GHz in a restricted band must not
exceed 500 µV/m at a distance of 3 meters. Using the equation for free space propagation, you can translate the field strength to an
equivalent RF power level at the DUT, if an assumption is made regarding the effective antenna gain at the second and third harmonic
frequencies.
Figure 15. Calculation of Maximum Spurious Level
Unit of
M easure
54.0 dBµV/m
Param eter
Fie ld Streng th
or
or
501 µV/m
0.50 1 mV/m
Tx an tenna gain o ve r isotropic
Imp edan ce of free space
dista nce
6 dBi
377 ohm s
0 .003 km
or
or
or
3.9 810 7170 6 powe r ra tio
120*pi ohm s
3 m
Re sult
T x p wr, desired sign al
Tx pwr, und esired sp uriou s
or
0 dBm
-47.2 dBm
-47.2 dBc
or
or
0.00 1 W
1 .892 87E-0 8 W
The antenna gain assumption of +6 dBi is based on the fact that the measurement requires that the position of the DUT and
measurement antennae be maximized to yield the highest spurious signal. Since the second and third harmonics, by definition, fall
on integer multiples of the carrier wavelength, many common DUT antennae may have good, usable gain at higher frequencies such
as 0 dBi. Accounting for the maximization of the measurement, +6 dBi is a good, conservative antenna gain for harmonic frequencies.
In practice, harmonic emissions are much less of a problem, primarily because the antenna is not specifically optimized for such
harmonics.
The calculation in Figure 15 shows the maximum spurious level at the antenna as –47 dBm. Because the typical second harmonic is
specified as –45 dBm, it follows that an additional 2 dB attenuation could be required. However, no additional attenuation is required
to pass the FCC-radiated emissions test. Individual test results may vary.
Table 8 lists a summary of FCC precompliance test results. The antenna used is a common half-wave end-fed dipole. The results
easily pass the U.S. FCC test for a Part 15.247 device. If there is a problem with qualification because of spurious emissions in
restricted bands, you can add a filter, or perhaps reduce Tx Power through Register 9.
Table 8. FCC Test Results
Run
No.
1a
Mode
Channel
Non hopping
2402 MHz
Power
Setting
Default
Measured
Power
NA
Default
NA
1b
Non hopping
2441 MHz
Default
NA
1c
Non hopping
2480 MHz
Default
NA
Default
NA
Document Number: 001-61351 Rev. *J
Test Performed
Restricted band edge
(2390 MHz)
Radiated emissions
(1–0 GHz)
Radiated emissions
(1–18 GHz)
Restricted band edge
(2483.5 MHz)
Radiated emissions
(1–10 GHz)
Limit
Result/Margin
FCC Part 15.209 /
15.247(c)
FCC Part 15.209 /
15.247(c)
FCC Part 15.209 /
15.247(c)
FCC Part 15.209 /
15.247(c)
FCC Part 15.209 /
15.247(c)
46.8 dbV/m at
2390.0 MHz (–7.2 dB)
45.7 dbV/m at
4804.1 MHz (–8.3 dB)
45.0 dbV/m at
4882.2 MHz (–9.0 dB)
47.8 dbV/m at
2484.1 MHz (–6.2 dB)
45.3 dbmV/m at
4960.1 MHz (–8.7 dB)
Page 18 of 40
CYRF8935
Register Settings for Test Purposes
To pass various regulatory agency EMC tests, the DUT may need to enter various test states as shown below. After loading the
recommended register values shown in Table 12 on page 26, load the registers in the order shown in the following table.
Table 9. Register Settings for Test Purposes
Test State
Notes
Register Settings
Tx continuously,
CW mode
Primarily used to verify proper crystal oscillator
frequency.
The Tx turns on and stays on continuously. There will
be no on/off bursting of the carrier. Modulation will be
absent. Carrier frequency will be half-way between
mark and space.
Occasionally used during EMC testing.
Reg. 11= 0x8008
(CW_MODE= 1)
Reg. 41= 0xC000
(SCRAMBLE_ON= 1,
PACK_LENGTH_EN= 0, and
FW_TERM_TX= 0)
Reg. 7 as shown in Table 4 on page 13.
Tx continuously,
Random data mode
During EMC testing, this is the most commonly used
Tx test.
Modulation will be normal, GFSK. Tx data will continuously cycle through the FIFO data bits. A data scrambling function will be applied. In other words, even if the
FIFO has all zeros (not yet loaded with data), Tx data
will appear random. Radiated emissions resemble
normal operation except that the carrier is on continuously, which significantly speeds up testing.
Reg. 11= 0x0008
(CW_MODE= 0)
Reg. 41= 0xC000
(SCRAMBLE_ON= 1,
PACK_LENGTH_EN= 0, and
FW_TERM_TX= 0)
Reg. 7 as shown in Table 4 on page 13.
Rx continuously
Sometimes required for EMC testing.
Reg. 41= 0xC000
(PACK_LENGTH_EN= 0, and
FW_TERM_TX= 0)
Reg. 7 as shown in Table 4 on page 13.
Tx and Rx off
(IDLE state)
When neither Tx nor Rx is desired.
Reg. 7:
clear bits 8 and 7.
Reg. 7 binary:
xxxx xxx0 0xxx xxxx
(x = don’t care)
Recommendations for PCB Layout
Antenna Type and Location
Though the PCB layout is not too critical, here are some
recommendations:
The most significant factor affecting RF performance for the
CYRF8935 or any other over-the-air RF device is the antenna
type, placement, and orientation. Antenna gain is normally
measured with respect to isotropic, that is, an ideal radiator that
sends or receives power equally to or from any direction. An ideal
antenna choice for most low-power, short-range wireless
applications is the theoretical isotropic reference antenna.
Unfortunately, these do not exist in practice. A simple dipole with
a theoretical gain of +2 dBi is usually a good choice. However,
you should take care when placing the antenna, because dipole
antennas have a radiation pattern where the null can be very
deep.
■
RF path: Adhere closely to the recommended reference design
circuit.
■
Clock traces: Keep the quartz crystal traces simple and direct.
The self-bias resistor should be close to the XTALi and XTALo
pins. The oscillation loop, consisting of the series resistor and
crystal, should be a simple, small loop. The crystal-loading
capacitors should be near the crystal. The ground connection
to these capacitors must be good, clean, and quiet. This
prevents noise from being injected into the oscillator. It is best
to have one ground plane for the entire RF section.
■
Power distribution and decoupling: Capacitors should be
located near the VDD pins, as shown in Typical Application on
page 12.
■
Antenna placement: When using an antenna, follow the
manufacturer's recommendation regarding layout.
■
Digital interface: To provide a good ground return for the digital
lines, it is a good idea to provide at least two pins for ground
on the digital interface connector. Good grounding between RF
and MCU can help reduce noise 'seen' at the antenna, thus
improving performance.
Document Number: 001-61351 Rev. *J
The antenna must be kept away from human tissue, particularly
sensitive spots like the heart, brain, and eyes. Violating this
design principle makes the end product perform poorly and can
be dangerous for the user. Refer to www.fcc.gov/oet/rfsafety for
guidance on this subject. For best operation, design the product
so that the main antenna radiation is away from the body, or at
least not proximity-loaded by the human body or dielectric
objects within the product.
Remember to keep the antenna away from clock lines and digital
bus signals; otherwise, harmonics of the clock frequency will jam
certain receive frequencies.
Page 19 of 40
CYRF8935
IR Reflow Standard
■
Reference: IPC/JEDEC J-STD-020D.1
Figure 16. Recommended IR Reflow Profile
Temp: °C
30 seconds
(See Jedec J-STD-020 latest rev.)
Tp = 250 +0, -5
Ramp-down
6 °C per sec. (max)
Ramp-up
3 °C per second (max)
Liquidous temp.
TL= 217
60 to 150
seconds
Tsmax = 200
Tsmin = 150
60 to 120
seconds
T= 25
8 minutes max.
Document Number: 001-61351 Rev. *J
Time
Page 20 of 40
CYRF8935
Register Definitions
The following registers are accessed using the SPI protocol.
Some of the internal registers and bit fields are not intended for end-user adjustment. Such registers are not described here and
should not be altered from the factory-recommended value
Table 10. RF Register Information
Bit No.
Bit Name
Description
Register 3 – Read only
15:13
(Reserved)
(Reserved)
12
RF_SYNTH_LOCK
Indicates the phase lock status of RF synthesizer.
1: Locked
0: Unlocked
11:0
(Reserved)
(Reserved)
Register 6 – Read only
15:10
RAW_RSSI[5:0]
Indicates 6-bit raw RSSI value from analog circuit.
Each LSB is approximately 1 dB. See Reading
RSSI on page 14 for details.
9:0
(Reserved)
(Reserved)
Register 7
15:9
(Reserved)
(Reserved)
8
TX_EN
Initiates the transmit sequence for state machine
control.
Note that TX_EN and RX_EN cannot be set to ‘1’
at the same time.
7
RX_EN
Initiates the receive sequence for state machine
control.
Note that TX_EN and RX_EN cannot be set to ‘1’
at the same time.
6:0
RF_PLL_CH_NO [6:0]
Sets Tx and Rx RF channel number, for example:
Write 0 for channel 0 (2402 MHz)
Write 39 for channel 39 (2441 MHz)
Write 78 for channel 78 (2480 MHz)
Register 9
15:11
(Reserved)
(Reserved)
10:7
PA_GN[3:0]
PA power level control
6:0
(Reserved)
(Reserved)
Register 10
15:1
(Reserved)
(Reserved)
0
XTAL_OSC_EN
1: Enable crystal oscillator gain block
0: Disable crystal oscillator gain block
15:1
(Reserved)
(Reserved)
Register 11
15
CW_MODE
1: Disables Tx modulation; CW only.
0: Normal Tx mode
14:10
(Reserved)
(Reserved)
9
RSSI_DIS
1: Disable RSSI
0: RSSI operates normally.
8:0
(Reserved)
(Reserved)
Document Number: 001-61351 Rev. *J
Page 21 of 40
CYRF8935
Table 10. RF Register Information (continued)
Bit No.
Bit Name
Description
Register 23
15:3
(Reserved)
(Reserved)
2
TXRX_VCO_CAL_EN
1: enable automatic VCO calibration with every
Tx/Rx.
0: disable feature
1:0
(Reserved)
(Reserved)
Register 27
15:11
LDO_SP_SLEEP
Sets LDO sleep current. See Electrical
Characteristics on page 28 for Register 27
settings.
10:0
(Reserved)
(Reserved)
15:8
(Reserved)
(Reserved)
7:4
RF_VER_ID [3:0]
This field is used to identify minor RF revisions to
the design.
3
(Reserved)
(Reserved)
2:0
Digital version
This field is used to identify minor digital revisions
to the design.
Register 29 - Read only - 0x00xx
Register 30 - Read only - 0xf413
15:0
(Reserved)
(Reserved)
Register 31 - Read only
15:0
Silicon ID
Document Number: 001-61351 Rev. *J
This field is used to identify Silicon ID. Valid values
are 0x1002 and 0x2002
Page 22 of 40
CYRF8935
Table 11. Framer Register Information
Bit No.
Bit Name
R/W
Description
Default
Register 32
15:13
PREAMBLE_LEN
R/W
000b: 1 byte
001b: 2 bytes
010b: 3 bytes
.
.
111b: 8 bytes
010b
12:11
SYNCWORD_LEN
R/W
11b: 64 bits
{{Reg39[15:0],Reg38[15:0],Reg37[15:0],Reg36[15:0]}
10b: 48 bits, {Reg39[15:0],Reg38[15:0],Reg36[15:0]}
01b: 32 bits, {Reg39[15:0],Reg36[15:0]
00b: 16 bits,{Reg36[15:0]}
11b
10:8
TRAILER_LEN
R/W
000b: 4 bits
001b: 6 bits
010b: 8 bits
011b: 10 bits
.
.
111b: 18 bits
000b
7:6
DATA_PACKET_TYPE
R/W
00b: Non return to zero (NRZ) law data
00b
5:4
FEC_TYPE
R/W
00b: No FEC
01b: Reserved
10b: FEC23
11b: Reserved
00b
3:1
BRCLK_SEL
R/W
Selects output clock signal to BRCLK[7] pin:
000b: Keep low
001b: Crystal buffer out
010b: Crystal divided by 2
011b: Crystal divided by 4
100b: Crystal divided by 12
101b: TXCLK 1 MHz
110b: APLL_CLK (12 MHz during Tx, Rx)
111b: Keep low
011b
0
(Reserved)
W/R
(Reserved)
0B
Register 35
15
(Reserved)
14
SLEEP_MODE
13
(Reserved)
12
BRCLK_ON_SLEEP
(Reserved)
W
1: Enter SLEEP state (set crystal gain block to off. Keep LDO 0B
regulator on (register values will be preserved).
Wakeup begins when SPI_SS goes low. This restarts the on-chip
clock oscillator to begin normal operation.
0: Normal (IDLE) state
(Reserved)
R/W
1: Crystal running at sleep mode
Draws more current but enables fast wakeup
0: Crystal stops during sleep mode
Saves current but takes longer to wake up
1B
Note
7. BRCLK signal is available on bare die only, not packaged parts.
Document Number: 001-61351 Rev. *J
Page 23 of 40
CYRF8935
Table 11. Framer Register Information (continued)
Bit No.
Bit Name
R/W
Description
Default
11:8
RE-TRANSMIT_TIMES
R/W
Max retransmit packet attempts when AUTO_ACK= 1.
3H
7
MISO_TRI_OPT
R/W
1: MISO drives low-Z even when SPI_SS = 1 (Only one SPI slave 0B
device on the SPI)
0: MISO goes tristate when SPI_SS = 1 (Allows multiple SPI
slave devices on the SPI)
6:0
SCRAMBLE_DATA
R/W
Whitening seed for data scramble. Must be set the same at both 00H
ends of radio link (Tx and Rx). Must be nonzero.
Register 36
15:0
SYNC_WORD[15:0]
R/W
Least significant bits of sync word are sent first
0000H
Register 37
15:0
SYNC_WORD[31:16]
R/W
Least significant bits of sync word are sent first
0000H
Register 38
15:0
SYNC_WORD[47:32]
R/W
Least significant bits of sync word are sent first
0000H
Register 39
15:0
SYNC_WORD[63:48]
R/W
Least significant bits of sync word are sent first
0000H
Register 40
15:11
FIFO_EMPTY_THRESHOLD R/W
During Tx, this field adjusts the point at which the FIFO flag signal 00100B
notifies the MCU or application to indicate that the FIFO register
is almost empty.
The best value depends on the individual application and the
speed at which the MCU or application can access the FIFO.
10:6
FIFO_FULL_THRESHOLD
During Rx, this field adjusts the point at which the FIFO flag signal 00100B
notifies the MCU or application to indicate that the FIFO register
is almost full.
The best value depends on the individual application and the
speed at which the MCU or application can access the FIFO.
5:0
SYNCWORD_THRESHOLD R/W
R/W
Sets maximum number of received syncword bits that may be in 07H
error to start a packet receive. The number of bits is
(SYNCWORD_THRESHOLD - 1). For example, a setting of 7
means up to 6 sync word bits can be in error
Register 41
15
CRC_ON
R/W
1: CRC on
0: CRC off
1B
14
SCRAMBLE_ON
R/W
Removes long patterns of continuous 0 or 1 in transmit data.
Automatically restores original unscrambled data on receive.
1: Scramble on
0: Scramble off
0B
13
PACK_LENGTH_EN
R/W
1: CYRF8935 regards the first byte of payload as packet length 1B
descriptor byte.
12
FW_TERM_TX
R/W
1: When FIFO write point equals read point, CYRF8935
terminates Tx when the FW handles packet length.
0: FW (MCU) handles length and terminates Tx
11
AUTO_ACK
R/W
1: After receiving data, automatically send ACK to acknowledge 1B
that the packet was received correctly.
0: After receiving data, do not send ACK; just go to IDLE.
Document Number: 001-61351 Rev. *J
1B
Page 24 of 40
CYRF8935
Table 11. Framer Register Information (continued)
Bit No.
Bit Name
R/W
Description
Default
10
PKT_FIFO_POLARITY
R/W
1: PKT flag, FIFO flag active low
0: Active high
0B
9:8
(Reserved)
R/W
(Reserved)
00B
7:0
CRC_INITIAL_DATA
R/W
Initialization constant for CRC calculation
00H
Register 48 – Read only
15
CRC_ERROR
R
Received CRC error
14
FEC23_ERROR
R
Indicate FEC23 error
13:8
FRAMER_ST
R
Framer status
7
SYNCWORD_RECV
R
1: syncword received. It is only available in receive status,
After out receive status, always set to ‘0’
6
PKT_FLAG
R
PKT flag indication
5
FIFO_FLAG
R
FIFO flag indication
4:0
(Reserved)
R
(Reserved)
Register 50
15:0
TXRX_FIFO_REG
R/W
00H
For MCU read/write data between the FIFO
Reading this register removes data from FIFO;
Writing to this register adds data to FIFO.
Note MCU or application access to the FIFO register is
byte by byte (8 bits at a time), not 16 bits as with other registers.
Register 52
15
CLR_W_PTR
W
14
(Reserved)
W
13:8
FIFO_WR_PTR
R
FIFO write pointer
7
CLR_R_PTR
W
1: Clear Rx FIFO point to 0 when writing this bit to ‘1’
It is not available in Tx status.
6
(Reserved)
5:0
FIFO_RD_PTR
R
FIFO read pointer (number of bytes to be read by MCU)
Document Number: 001-61351 Rev. *J
1: Clear Tx FIFO pointer to 0 when writing this bit to ‘1’
It is not available in RX status.
0B
0B
Page 25 of 40
CYRF8935
Recommended Register Values
The following register values are recommended for most typical applications. Some changes may be required depending on the
application.
Table 12. Recommended Register Values
Reset Value
Register No. Power-up
(hex)
Recommended value for applications (hex)
Silicon ID 0x1002 [8]
Silicon ID 0x2002 [8]
Notes
0
6FEF
6FE1
6FE1
Internal Usage
1
5681
5681
5681
Internal Usage
2
6619
5517
5517
Internal Usage
4
5447
9CC9
9CD4
Internal Usage
5
F000
6647
651F
Internal Usage
7
0030
0000
0000
Use for setting RF frequency, and to
start/stop Tx/Rx packets.
Register details in Table 10
8
71AF
6C90
6C90
Internal Usage
9
3000
1920
7920
Sets Tx power level.
Register details in Table 10
10
7FFD
7FFD
7FFD
Crystal oscillator enabled. Used for
sleep patch.
Register details in Table 10
11
4008
0008
0008
RSSI enabled
Register details in Table 10
12
0000
0000
0000
Internal Usage
13
4855
4880
48BF
Internal Usage
22
C0FF
00FF
00FF
Internal Usage
23
8005
0005
0005
Register details in Table 10
24
307b
0067
0067
Internal Usage
25
1659
1659
1659
Internal Usage
26
1833
19E0
1A30
Internal Usage
27
9100
4200
4200
8 µA sleep current
Register details in Table 10
28
1800
1800
1800
Internal Usage
32
1806
1000
1000
Packet data type: NRZ, no FEC,
BRCLK[9] = 12 divided by 4 = 3 MHz
Register details in Table 11
33
6307
32A0
32A0
Internal Usage
34
030B
1000
1000
Internal Usage
35
1300
0F01
0F01
AutoACK max Tx retries = 3
Register details in Table 11
36
0000
Unique sync word
Unique sync word
Similar to a MAC address
Register details in Table 11
37
0000
Unique sync word
Unique sync word
Similar to a MAC address
Register details in Table 11
38
0000
Unique sync word
Unique sync word
Similar to a MAC address
Register details in Table 11
39
0000
Unique sync word
Unique sync word
Similar to a MAC address
Register details in Table 11
Notes
8. Silicon Id can be read from Register 31.
9. BRCLK signal is available on bare die only, not packaged parts.
Document Number: 001-61351 Rev. *J
Page 26 of 40
CYRF8935
Table 12. Recommended Register Values (continued)
Reset Value
Register No. Power-up
(hex)
Recommended value for applications (hex)
Silicon ID 0x1002 [8]
Silicon ID 0x2002 [8]
Notes
40
2107
2047
2047
Configure FIFO flag
Register details in Table 11
41
B800
F800
F800
CRC on. SCRAMBLE off
First byte is packet length
AutoACK off
Register details in Table 11
42
FD6B
FDFF
FDFF
Internal Usage
43
000F
000F
000F
Internal Usage
Document Number: 001-61351 Rev. *J
Page 27 of 40
CYRF8935
Absolute Maximum Ratings
Current into outputs (LOW) ........................................ 10 mA
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.[10, 11]
Electrostatic discharge voltage, HBM (QFN package only)
RF pins (ANT, ANTb) .......................................... >500 V
Analog pins XTALi, XTALo .................................. >500 V
All other pins ....................................................... 2000 V
Storage temperature ................................ –55 °C to +125 °C
Latch up current (JEDEC JESD78B, Class II) ........ ±140 mA
Ambient temperature with
power applied .......................................... –55 °C to +125 °C
Supply voltage on VDD relative to GND ............ 0 to + 1.98 V
Operating Range
Supply voltage on VDD_IO
or VIN relative to GND ........................................ 0 to +3.63 V
Range
DC voltage applied to outputs
in tristate .................................. (VSS – 0.5) to (VDD_IO + 0.5)
Commercial
Ambient
Temperature
0 °C to 70 °C
VIN
VDD_IO
+1.9 to 3.6 V
+1.9 to 3.6 V
DC input voltage ...................... (VSS – 0.5) to (VDD_IO + 0.5)
Electrical Characteristics
For wafer and die products, RF and AC specifications are guaranteed by characterization only – not production tested.
Symbol
Min
Typ
Max
Units
1.9
–
3.6
VDC
Input to VDD_IO and VIN pins
–
–
–
–
–
18.5
13.7
18
1.1
1
–
–
–
–
–
mA
mA
mA
mA
µA[12]
IDD_SLPr
–
8
–
µA
IDD_SLPh
–
38
–
µA
Transmit power PA2. BRCLK[13] off.
Transmit power PA12. BRCLK[13] off
BRCLK[13] off
Configured for BRCLK[13] output off
Temperature = +25 °C.
Using firmware sleep patch. (Enter
Sleep and Wakeup on page 6)
Register 27 = 0x1200, for
VIN ≥ 3.00 VDC only
Temperature = +25 °C; using
firmware sleep patch (Enter Sleep
and Wakeup on page 6)
Register 27 = 0x4200.
Temperature = +70 °C
‘C’ grade part; using firmware sleep
patch (Enter Sleep and Wakeup on
page 6)
Register 27 = 0x4200
0.8 VDDIO
0
–
0.8 VDD_IO
–
–
–
–
–
–
–
–
–
8
1.2 VDDIO
0.8
10
–
0.4
10
25
V
V
µA
V
V
µA
ns
VIN
IDD_TX2
IDD_TX12
IDD_RX
IDD_IDLE1
IDD_SLPx
VIH
VIL
I_LEAK_IN
VOH
VOL
I_LEAK_OUT
T_RISE_OUT
Description
Supply voltage
DC power supply voltage range
Current consumption
Current consumption – Tx
Current consumption – Rx
Current consumption – idle
Current consumption – sleep
Logic input high
Logic input low
Input leakage current
Logic output high
Logic output low
Output leakage current
Rise/fall time (SPI MISO)
Test Condition and Notes
IOH = 100 µA source
IOL = 100 µA sink
MISO in tristate
7 pF cap. load
Notes
10. Absolute maximum ratings indicate limits beyond which damage to the device may occur. Recommended operating conditions indicate conditions for which the device
is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see Electrical Characteristics.
11. These devices are electrostatic-sensitive. Devices should be transported and stored in anti-static containers. Equipment and personnel contacting the devices need
to be properly grounded. Cover workbenches with grounded conductive mats.
12. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VIN = 3 VDC, Ta = +25 °C.
13. BRCLK signal is available on bare die only, not packaged parts.
Document Number: 001-61351 Rev. *J
Page 28 of 40
CYRF8935
Electrical Characteristics (continued)
For wafer and die products, RF and AC specifications are guaranteed by characterization only – not production tested.
Symbol
T_RISE_IN
Tr_spi
Description
Rise/fall time (SPI MOSI)
CLK rise, fall time (SPI)
Min
–
–
Typ
–
–
Max
25
25
F_OP
Operating frequency range
2400
–
2482
VSWR_I
Antenna port mismatch
(Z0 = 50 )
–
<2:1
–
–
<2:1
–
–
–87
–
RxStemp
–
–84
–
RxSppm
–
–84
–
RxStemp+ppm
–
–80
–
–20
–
0
1
–
–
–
–
+9
+6
–
–
–
–12
–
dB
–60-dBm desired signal
–
–24
–
dB
–67-dBm desired signal
–
 –27
–
dBm
VSWR_O
Receive section
RxSbase
Receiver sensitivity
(FEC off)
Rxmax-sig
Maximum usable signal
Ts
Data (Symbol) rate
Minimum Carrier/Interference ratio
CI_cochannel
CI_1
CI_2
CI_3
OBB
Co-channel interference
Adjacent channel interference,
1-MHz offset
Adjacent channel
interference, 2-MHz offset
Adjacent channel
interference, 3-MHz offset
Out-of-band blocking
Units
Test Condition and Notes
ns
ns
Requirement for error-free register
reading, writing.
MHz Usage on-the-air is subject to local
regulatory agency restrictions
regarding operating frequency.
VSWR Receive mode. Measured using LC
matching circuit shown in Typical
Application on page 12
VSWR Transmit mode. Measured using LC
matching circuit shown in Typical
Application on page 12
Measured using LC matching circuit
shown in
Typical Application on page 12
For BER  0.1%
dBm Room temperature only
0-ppm crystal frequency error.
dBm Over temperature;
0-ppm crystal frequency error.
dBm Room temperature only
80-ppm total frequency error
(± 40-ppm crystal frequency error,
each end of RF link)
dBm Over temperature;
80-ppm total frequency error
(± 40-ppm crystal frequency error,
each end of RF link)
dBm Room temperature only
µs
For BER  0.1%.
Room temperature only.
dB
–60-dBm desired signal
dB
–60-dBm desired signal
30 MHz to 12.75 GHz [14]
Measured with ACX BF2520
ceramic filter [15] on ant. pin.
–67-dBm desired signal,
BER  0.1%.
Room temperature only.
Notes
14. The test is run at one midband frequency, typically 2460 MHz. With blocking frequency swept in 1-MHz steps, up to 24 exception frequencies are allowed. Of these,
no more than five will persist with blocking signal reduced to –50 dBm. For blocking frequencies below desired receive frequency, in-band harmonics of the out-of-band
blocking signal are the most frequent cause of failure, so be sure blocking signal has adequate harmonic filtering.
15. In some applications, this filter may be incorporated into the antenna, or be approximated by the effective antenna bandwidth.
Document Number: 001-61351 Rev. *J
Page 29 of 40
CYRF8935
Electrical Characteristics (continued)
For wafer and die products, RF and AC specifications are guaranteed by characterization only – not production tested.
Symbol
Transmit section
PAVH
Description
RF output power
PAVL
Min
Typ
Max
Units
–
+1
–
dBm
–
–11.2
–
dBm
TxPfx2
Second harmonic
–
–45
–
dBm
TxPfx3
Third and higher harmonics
–
–45
–
dBm
–
–
263
255
–
–
kHz
kHz
–
–
–
–
–
–30
–20
–30
–
dBm
dBm
dBm
–40
1
–75
–105
–
–
–
–
+40
–
100
150
THOP_AC
–
250
350
LDO voltage regulator section
VDO
Dropout voltage
–
0.17
0.3
Modulation characteristics
Df1avg
Df2avg
In-band spurious emission
IBS_2
2-MHz offset
IBS_3
3-MHz offset
 4-MHz offset
IBS_4
RF VCO and PLL section
Channel (Step) size
Fstep
SSB phase noise
L100k
L1M
Crystal oscillator frequency
dFX0
error
THOP
RF PLL settling time[18]
Test Condition and Notes
Measured using a LC matching
circuit as shown in Typical
Application on page 12[16]
PA0 (PA_GN = 0,
Reg9 = 0x1820
for Silicon ID [17] 0x1002 /
Reg9 = 0x7820
for Silicon ID [17] 0x2002).
Room temperature only.
PA12 (PA_GN = 12,
Reg9 = 0x1E20
for Silicon ID [17] 0x1002 /
Reg9 = 0x7E20
for Silicon ID [17] 0x2002).
Room temperature only.
Measured using a LC matching
circuit as shown in
Typical Application on page 12.
Room temperature only.
Measured using a LC matching
circuit as shown in
Typical Application on page 12.
Room temperature only.
Modulation pattern: 11110000...
Modulation pattern: 10101010...
MHz
dBc/Hz 100-kHz offset
dBc/Hz 1-MHz offset
ppm Relative to 12-MHz crystal reference
frequency
µs
Settle to within 30 kHz of final value.
AutoCAL off.
µs
Settle to within 30 kHz of final value.
AutoCAL on.
V
Measured during receive state
Notes
16. Transmit power measurement is at output of matching circuit shown in Typical Application on page 12.
17. Silicon Id can be read from Register 31.
18. Max PLL settling time is guaranteed by design (not production tested).
Document Number: 001-61351 Rev. *J
Page 30 of 40
CYRF8935
SPI
The CYRF8935 supports a 4-wire slave SPI. All of the function control is under SPI command.
There are four pins in the SPI.
■
SPI_SS: Slave selection input (active low)
■
CLK: Serial clock input
■
MOSI: Master out slave in
■
MISO: Master in slave out
SPI Transaction Formats and Timing
SPI read and write data is always in multiples of bytes. The first byte (MSB) consists of the R/W direction bit, followed by a 7-bit register
address. Following this byte, there are one or more data bytes.
When using the SPI to access the internal registers, note that some registers are accessed differently than others. Table 13 shows
the three types of registers:
Table 13. SPI Access Methods for Various Registers
Group 1
Register
Number(s)
0 to 31
RF/analog registers
Group 2
Group 3
32 to 42, 52
50
State and framer configuration registers
FIFO read/write
Group No.
Description
Access Method
Write an even number of data bytes
Read out any number of data bytes; Register high
byte is read out first
Read/writeable any data bytes
Always byte by byte
Figure 17. Single-Byte Data Format
TSSS
TSSH
T1
TSS_HD
SPI_SS
CLK
MOSI
W/R
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
MISO
S7
S6
S5
S4
S3
S2
S1
S0
d7
d6
d5
d4
d3
d2
d1
d0
Figure 18. Two-Byte Data Format
TSSS
T1
TSSH
T1
TSS_HD
SPI_SS
CLK
MOSI
W/R
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
MISO
S7
S6
S5
S4
S3
S2
S1
S0
d7
d6
d5
d4
d3
d2
d1
d0
d7
d6
d5
d4
d3
d2
d1
d0
Figure 19. Multi-Byte Data Format[19]
T SSS
T1
T1
T SSH
T1
TSS_HD
SPI_SS
CLK
MOSI
W/R
A6
A5
A4
A3
A2
A1
A0
D7
D6
D0
D7
D0
D7
D0
D7
D0
D7
D0
MISO
S7
S6
S5
S4
S3
S2
S1
S0
d7
d6
d0
d7
d0
d7
d0
d7
d0
d7
d0
address
address + 1
address + n
Note
19. For all registers except register 50, the internal register address auto-increments by one when reading or writing more than two bytes of data in a single SPI transaction.
This is an optional, built-in feature designed to save time when reading or writing multiple registers in ascending sequence.
Document Number: 001-61351 Rev. *J
Page 31 of 40
CYRF8935
Specifications
■
W/R bit:
❐ 0: Write SPI
❐ 1: Read SPI
■
Dx: Data bits from SPI master. When reading, these bits are ignored.
■
dx: Data bits from SPI slave. When writing, dx is the same as Sx.
■
Sx: Data from Reg48[15:8], MSB first (status byte).
Figure 20. SPI Timing Diagram
SPI_SS
TSS_SU
TSCK
TSSS
TSSH
TSCKL
CLK
TSCKH
TSSU TSHD
MOSI
TSDO
TSDO2
MISO
TSDO1
Table 14. SPI Timing Requirements
Timing Parameter
Min
Max
Unit
Notes
TSSS
20
–
ns
Setup time from assertion of SPI_SS to CLK edge
TSSH
200
–
ns
Hold time required deassertion of SPI_SS
TSCKH
40
–
ns
CLK minimum high time
TSCKL
40
–
ns
CLK minimum low time
TSCK
83
–
ns
Maximum CLK clock is 12 MHz
TSSU
30
–
ns
MOSI setup time
TSHD
10
–
ns
MOSI hold time
TSS_SU
10
–
ns
Before SPI_SS enable, CLK hold low time requirement
TSS_HD
200
–
ns
Minimum SPI inactive time
TSDO
–
35
ns
MISO setup time, ready to read
TSDO1
–
5
ns
If MISO is configured as tristate, MISO assertion time
TSDO2
–
250
ns
If MISO is configured as tristate, MISO deassertion time
T1 Min_R50
350
–
ns
When reading register 50 (FIFO)
T1 Min
83
–
ns
When writing Register 50 (FIFO), or reading/writing any registers other than register 50.
Document Number: 001-61351 Rev. *J
Page 32 of 40
CYRF8935
Electrical Operating Characteristics
Figure 21. Typical Transmit EVM, EVM spectrum, Tx eye
Figure 22. EVM equip. setup
Document Number: 001-61351 Rev. *J
Page 33 of 40
CYRF8935
State Diagram
OFF
VCO_Wait
vc
o_
ca
l
Sleep
ke
wa
ep
sle
up
IDLE
VCO_SEL
ck
_a
Document Number: 001-61351 Rev. *J
no a
uto_
ack
ck
_a
o
t
au
TX
packet
to
au
TX ack
RX
packet
TX_en
CK
NA
et
ck
p a ro r
er
ACK
received
k
ac
to_
au
RX_en
no
no CRC error
Wake Up
RX ack
Page 34 of 40
CYRF8935
Ordering Information
Ordering Code[20]
Package
Temperature Range
CYRF8935A-24LQXC
24 pin (4 × 4 × 0.55 mm) Sawn QFN
Commercial
CYRF8935A-4X14C
Die (14-mil) in waffle pack
Commercial
CYRF8935A-4XW14C
Die (14-mil) in wafer form
Commercial
Ordering Code Definitions
CY
RF 8935
A ( 24 LQX / XXX ) ( C , I , E)
Thermal Rating
C = Commercial, I = Industrial, E = Extended
KGD Level /Package Type/ Die Thickness
24 - pin Sawn QFN package
X = Pb- free
Internal revision code
Part Number
Marketing code: RF = Wireless
( radio frequency) product family
Company ID: CY= Cypress
Note
20. For die and wafer sales, consult your Cypress sales representative.
Document Number: 001-61351 Rev. *J
Page 35 of 40
CYRF8935
Package Diagram
Figure 23. 24-pin QFN (4 × 4 × 0.55 mm) LQ24A 2.65 × 2.65 E-Pad (Sawn) Package Outline, 001-13937
001-13937 *E
Document Number: 001-61351 Rev. *J
Page 36 of 40
CYRF8935
Acronyms
Document Conventions
Table 15. Acronyms Used in this Document
Units of Measure
Acronym
Description
Table 16. Units of Measure
ACK
Acknowledge (packet received, no errors)
BER
Bit Error Rate
°C
degree Celsius
BOM
Bill Of Materials
dB
decibels
CMOS
Complementary Metal Oxide Semiconductor
dBc
decibel relative to carrier
COB
Chip On Board
dBm
decibel-milliwatt
CRC
Cyclic Redundancy Check
Hz
hertz
DUT
Device Under Test
KB
1024 bytes
EMC
Electromagnetic Compatibility
Kbit
1024 bits
EVM
Error Vector Magnitude
kHz
kilohertz
FEC
Forward Error Correction
k
kilohm
FER
Frame Error Rate
MHz
megahertz
GFSK
Gaussian Frequency-Shift Keying
M
megaohm
HBM
Human Body Model
A
microampere
ISM
Industrial, Scientific, and Medical
s
microsecond
V
microvolts
IRQ
Interrupt Request
Vrms
microvolts root-mean-square
MAC
Media Access Control
W
microwatts
MCU
Microcontroller Unit
mA
milliampere
NRZ
Non Return to Zero
ms
millisecond
OTA
Over-the-Air
mV
millivolts
PLL
Phase Locked Loop
nA
nanoampere
PN
Pseudo-Noise
ns
nanosecond
QFN
Quad Flat No-leads
nV
nanovolts
RSSI
Received Signal Strength Indication

ohm
RF
Radio Frequency
pp
peak-to-peak
Rx
Receive
ppm
parts per million
Tx
Transmit
ps
picosecond
VCO
Voltage Controlled Oscillator
sps
samples per second
WEP
Wired Equivalent Privacy
V
volts
VDC
volts direct current
Document Number: 001-61351 Rev. *J
Symbol
Unit of Measure
Page 37 of 40
CYRF8935
Document History Page
Document Title: CYRF8935, WirelessUSB™-NL 2.4 GHz Low Power Radio
Document Number: 001-61351
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
2963911
HEMP
06/28/2010
New data sheet.
*A
3039285
HEMP
09/27/2010
Updated Block diagram
Updated Init, Xtal Osc, RxSens measurement.
Revised state diagram and package diagram.
Updated Functional Description.
Payload format NRZ only. Revised power control table; showed absolute, not
relative power.
Deleted reference to NAK.
Added RSSI curve.
Corrected Reg. 7, 32, 41 definition.
Updated recommended register values table.
Updated Absolute Maximum voltages and temperature range.
Updated Rx I typical value.
Used PAxx to show power level settings.
Updated third harmonics and VDO values.
Added die information to ordering code.
*B
3112690
HEMP
12/16/2010
No technical updates; integrated with EROS.
*C
3296429
HEMP /
KKCN
06/29/2011
Removed Preliminary status from datasheet.
Modified product description.
Changed GND1...GND5 to GND in the Logic Block Diagram.
Added note about BRCLK’s availability only on bare die.
Replaced 32-pin with 24-pin and package details.
Updated ‘Enter Sleep and Wakeup’ functional description.
Updated figures 7 and 8.
Updated typical application diagram.
Adding ‘Setting the Radio Frequency’ section.
Modified ‘Crystal Oscillator’ section
Deleted BRCLK pin, CKPHA signal, and FEC13 mode.
Updated ‘Reading RSSI’ section.
Updated register definitions
Updated various electrical specs.
Updated ordering information.
*D
3363798
HEMP
09/07/2011
Added information on die and wafer parts in Features, Ordering Information,
and Ordering Code Definitions.
*E
3440958
HEMP
11/17/2011
Updated Power-on and Register Initialization Sequence section.
Updated Initialization Timing Requirements table.
Updated Initialization Flowchart.
Updated Typical Application and Reset Pull-up Circuit diagram.
Added Reset Pull-up section.
Added Register 27 in RF Register Information table.
Added footnote for RF PLL settling time.
Updated TSDO max value.
*F
3794924
SELV
12/10/2012
Updated Logic Diagram.
Added notes 1, 3, 4, 5, 7, 9, and 13.
Updated values of TSCKH, TSCKL, TSSU parameters in Table 14.
Updated Package Diagram as per spec 001-13937 *E.
Document Number: 001-61351 Rev. *J
Description of Change
Page 38 of 40
CYRF8935
Document History Page (continued)
Document Title: CYRF8935, WirelessUSB™-NL 2.4 GHz Low Power Radio
Document Number: 001-61351
Rev.
ECN No.
Orig. of
Change
Submission
Date
Description of Change
*G
3841304
SELV
01/10/2013
Updated Typical Application:
Updated Table 6 under Transmit Power Control to include values of Register 9
for each Silicon ID.
Added Note 6 and referred the same Note in both Silicon ID columns.
Updated Register Definitions:
Updated details of “Register 31 - Read only” in Table 10.
Updated Table 12 under Recommended Register Values to include
recommended value for applications for each Silicon ID.
Added Note 8 and referred the same Note for Silicon ID columns.
Updated Electrical Characteristics:
Updated Test Condition and Notes of PAVH and PAVL parameters to include
values of Register 9 for each silicon ID.
Added Note 17 and referred the same Note for Silicon IDs in PAVH and PAVL
parameters.
*H
3928385
SELV
03/11/2013
Updated Enter Sleep and Wakeup, Receive Timing, and Reset Pull-up
sections.
*I
3980337
SELV
04/24/2013
Updated Register Definitions:
Updated Table 12 under Recommended Register Values with new values in
columns “Silicon ID 0x1002” and “Silicon ID 0x2002” for Registers 7, 23, 32,
33, 34, 35, and 41.
*J
4036152
SELV
06/21/2013
Updated Register Definitions:
Updated Table 12 under Recommended Register Values with new value in
column “Silicon ID 0x2002” for Register 26.
Completing Sunset Review.
Document Number: 001-61351 Rev. *J
Page 39 of 40
CYRF8935
Sales, Solutions, and Legal Information
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cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2010-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
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and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-61351 Rev. *J
Revised June 21, 2013
Page 40 of 40
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