LT8900 Datasheet Revision 1.1
LT8900
Low Cost 2.4GHz Radio Transceiver
FEATURES
z Complete 2.4 GHz radio transceiver includes
fully integrated RF PLL and channel filtering
z Supports
Frequency-Hopping
Spread
Spectrum
z Supports SPI and I2C bus interface
z Built-in smart auto-acknowledge Tx/Rx
protocol simplifies usage
z Packet data rate 1 Mbps over-the-air
z FIFO flag signal permits continuous streaming
data at 1 Mbps over-the-air
z Power management for minimizing current
consumption
z Digital readout of RSSI and temperature
z Lead-free 4x4mm QFN Package & SOP16
for best RF performance
Application
z Remote controls
z Wireless keyboards and mice
z Proprietary Wireless Networks
z Home automation
z Commercial and industrial short-range
wireless
z Wireless voice, VoIP, Cordless headsets
z Robotics and machine connectivity
GENERAL DESCRIPTION
The
LT8900
is
a
low-cost,
fully
integrated
CMOS
RF transceiver, GFSK data
modem, and packet framer, optimized for use in the 2.4
GHz ISM band. It contains transmit, receive, RF
synthesizer, and digital modem functions, with few
external components. The transmitter supports digital
power control. The receiver utilizes extensive digital
processing for excellent overall performance, even in
the presence of interference and transmitter
impairments.
The LT8900 transmits GFSK data at approximately 1
dBm output power. The low-IF receiver architecture
produces good selectivity, with sensitivity down to
approx. -87 dBm. Digital RSSI values are available to
monitor channel quality.
On-chip transmit and receive FIFO registers are
available to buffer the data transfer with MCU.
Over-the-air data rate is always 1 Mbps even
when connected to a slow, low-cost MCU.
Built-in CRC, FEC, data whitening, and automatic
retry/acknowledge are all available to simplify and
optimize performance for individual applications.
The digital baseband interface can be either 4-wire SPI
or 2-wire I2C-bus. Three additional pins are available
for optional reset and buffer control.
For extended battery life, power consumption is
minimized all key areas. A sleep mode is available to
reduce standby current consumption to just 1 uA
typ. while preserving register settings.
This product is available in RoHS compliant 24-lead
4x4 mm JEDEC standard QFN package, featuring an
exposed pad on the bottom for best RF characteristics.
Also available in bare die form.
LT8900 Datasheet Revision 1.1
1. Block Diagram
Page 2
July 2010
LT8900 Datasheet Revision 1.1
2. Absolute Maximum Ratings
Table 1. Absolute Maximum Rating
Parameter
Symbol
MIN
TYP
MAX
Unit
Operating Temp.
TOP
-40
+85
ºC
Storage Temp.
TSTORAGE
-55
+125
ºC
LDO_VDD, VDD_IO Voltage
VIN_MAX
+3.7
VDD pins
VDD_MAX
+2.5
VDC
Applied Voltages to
VOTHER
-0.3
+3.7
VDC
Other Pins
Input RF Level
PIN
+10
dBm
Output Load mismatch (Z0=50Ω)
VSWROUT
10:1
VSWR
Notes:
1.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended operating conditions
indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For
guaranteed specifications and test conditions, see the Electrical Characteristics section below.
2.
These devices are electro-static sensitive. Devices should be transported and stored in anti-static containers. Equipment and
personnel contacting the devices need to be properly grounded. Cover workbenches with grounded conductive mats.
Page 3
July 2010
LT8900 Datasheet Revision 1.1
3. Electrical Characteristics
Table 2. Electrical Characteristics
The following specifications are guaranteed for TA = 25 C, LDO_VDD= VDD_IO = 3.3 VDC, unless otherwise noted.
Parameter
Symbol
MIN
TYP
MAX
Units
Test Condition and Notes
3.6
VDC`
Input to VDD_IO and LDO_VDD
pins.
Supply Voltage
DC power supply voltage range
1.9
Current Consumption
Current Consumption - TX
Current Consumption - RX
Current Consumption –IDLE
Current Consumption - SLEEP
IDD_TXH
18
mA
POUT = high power setting
IDD_TXL
12
mA
POUT = low power setting
IDD_RX
17
mA
IDD_IDLE1
1.4
mA
Configured
running.
IDD_IDLE2
1.1
mA
Configured for BRCLK output OFF.
IDD_SLP
1
uA
for
BRCLK
output
Digital Inputs
Logic input high
0.8
1.2
VDD_IN
VDD_IN
0
0.8
V
VIH
V
Logic input low
VIL
Input Capacitance
C_IN
10
pF
Input Leakage Current
I_LEAK_IN
10
uA
VDD_IN
V
Digital Outputs
0.8
Logic output high
VOH
VDD_IN
Logic output low
VOL
0.4
V
Output Capacitance
C_OUT
10
pF
Output Leakage Current
I_LEAK_OUT
10
uA
Rise/Fall Time (SPI)
T_RISE_OUT
5
nS
CLK rise, fall time (SPI)
Tr_spi
25
nS
CLK frequency range (SPI)
FSPI
0
Operating Frequency Range
F_OP
2400
Antenna port mismatch
VSWR_I
<2:1
VSWR
Receive mode.
(Z0=50Ω)
VSWR_O
<2:1
VSWR
Transmit mode.
Clock Signals
12
Requirement for error-free register
reading, writing.
MHz
Overall Transceiver
Page 4
2482
MHz
July 2010
LT8900 Datasheet Revision 1.1
Parameter
Symbol
MIN
TYP
MAX
Unis
Test Condition and Notes
Measured using 50 Ohm balun. For
BER ≤ 0.1%:
Receive Section
Receiver sensitivity
Maximum useable signal
Data (Symbol) rate
-20
-87
dBm
1
dBm
Ts
1
us
CI_cochannel
+9
dB
-60 dBm desired signal.
CI_1
+6
dB
-60 dBm desired signal.
CI_2
-12
dB
-60 dBm desired signal.
CI_3
-24
dB
-67 dBm desired signal.
Min. Carrier/Interference ratio
Co-Channel Interference
FEC off.
For BER ≤ 0.1%
Adjacent Ch. Interference,
1MHz offset
Adjacent Ch. Interference,
2MHz offset
Adjacent Ch. Interference,
3MHz offset
OBB_1
Out-of-Band Blocking
For additional test conditions, see
footnote1.
-10
dBm
OBB_2
-27
dBm
OBB_3
-27
dBm
OBB_4
-10
dBm
30 MHz
2000 MHz
2000 MHz
2400 MHz
2500 MHz
3000 MHz
3000 MHz
12.75 GHz
to
to
Meas. with ACX
BF2520 ceramic filter
2 on ant. pin .
to
to
Desired
sig.
-67
dBm, BER ≤ 0.1%.
Transmit Section
Measured using 50 Ohm balun3:
RF Output Power
POUT=
maximum
Reg09=0x4000
POUT = nominal
Reg09=0x1840
POUT=minimum
power,Reg09=1FC0
PAV
6
dBm
2
-17
Second harmonic
-50
dBm
Conducted to ANT pin.
Third harmonic
-50
dBm
Conducted to ANT pin.
output
power
output
power,
output
Modulation Characteristics
Peak
FM
Deviation
00001111 pattern
∆f1avg
280
kHz
01010101 pattern
∆f2max
225
kHz
In-Band Spurious Emission
2MHz offset
IBS_2
>3MHz offset
IBS_3
OBS_O_1
Out-of-Band Spurious
Emission, Operation
< -60
-40
dBm
-60
dBm
-36
dBm
30 MHz ~ 1 GHz
OBS_O_2
-45
-30
dBm
1 GHz ~ 12.75 GHz, excludes desired
signal and harmonics.
OBS_O_3
< -60
-47
dBm
1.8 GHz ~ 1.9 GHz
OBS_O_4
< -65
-47
dBm
5.15 GHz ~ 5.3 GHz
Note:
1.
The test is run at one midband frequency, typically 2460 MHz. With blocking frequency swept in 1 MHz steps, up to 24 exception
frequencies are allowed. Of these, no more than 5 shall persist with blocking signal reduced to -50dBm. For blocking
frequencies below desired receive frequency, in-band harmonics of the out-of-band blocking signal are the most frequent cause
of failure, so be sure blocking signal has adequate harmonic filtering.
2.
In some applications, this filter may be incorporated into the antenna, or be approximated by the effective antenna bandwidth.
3.
Transmit power measurement is corrected for insertion loss of Balun, in order to indicate the transmit power at the IC pins.
Page 5
July 2010
LT8900 Datasheet Revision 1.1
Parameter
Symbol
MIN
FLOCK
2366
TYP
MAX
Unit
2516
MHz
Test Condition and Notes
RF VCO and PLL Section
Typical PLL lock range
Tx, Rx Frequency Tolerance
--
ppm
Channel (Step) Size
1
MHz
SSB Phase Noise
Crystal oscillator freq. range
(Reference Frequency)
Same as XTAL pins frequency tolerance
≤ -95
dBc/Hz
550kHz offset
≤ -115
dBc/Hz
2MHz offset
12.00
0
MHz
Designed for 12 MHz crystal reference freq.
See Register 27 description.
Crystal oscillator digital trim
range, typ.
RF PLL Settling Time
Spurious Emissions
±20
ppm
Amount of pull depends on crystal spec. and
operating point.
THOP
75
150
uS
Settle to within 30 kHz of final value.
OBS_1
< -75
-57
dBm
30 MHz ~ 1 GHz
OBS_2
-68
-47
dBm
1 GHz ~ 12.75 GHz
Vdo
0.17
0.5
V
Measured during Receive state
IDLE
Synthesizer
VCO ON.
state,
and
LDO Voltage Regulator Section
Dropout Voltage
Page 6
July 2010
LT8900 Datasheet Revision 1.1
4. Typical Application
2.4 GHz Wireless Data Transceiver with SPI
Figure 1. LT8900 Typical Application Schematic
C3 12pF
C4 12pF
VDD_IO
VDD1.8V
VDD
VDD
LDO_VDD
LDO_OUT
VDD
R1 2.2K
XTALO
XTALI
R2 680K
VDD
C5 1uF
RST_n
MISO/I2C_DAT
MOSI/A4
ANTb
ANT
I2C_SEL
VDD
SPI_CLK
VDD1.8V
BRCLK
PKT
VDD_IO
RESET_n
SPI_miso
SPI_miso
R3 1K
SPI_mosi
SPI_CLK
PKT_flag
SPI_mosi
SPI_SS
VDD_IO
SPI_CLK
VDD_IO
R4 1K
PKT_flag
BRCLK
SPI_SS
SPI_SS
VSS
FIFO
FIFO_FLAG
VDD
VDD
VDD_IO
R3 10K
RESET_n
VDD_IO
R4:1K
R3:1K
VDD18
R2:680K
Page 7
July 2010
LT8900 Datasheet Revision 1.1
5. Pin Description
Table 3. Pin Description
QFN24
Pin No.
Pin Name
Type
Description
1, 2, 5, 6, 7,
19, 22
VDD
PWR
Power supply voltage.
3, 4
ANTb, ANT
Balanced RF
RF input/output.
8
FIFO
O
FIFO status indicator bit.
9
GND
GND
Ground connection.
10
VDD_IO
PWR
Vdd for the digital interface.
11
SPI_SS
I
SPI: Enable input for the SPI bus, active low. Also used to bring
device out of SLEEP state.
I2C: Used to bring device out of SLEEP state.
12
BRCLK
O
Output from internal clock
13
PKT
O
Transmit/Receive packet status indicator bit.
14
SPICLK
I
Clock input for SPI/I2C interface.
15
I2C_SEL
I
Mode selection:
0: Interface is SPI
1: Interface is I2C
16
MOSI/A4
I
SPI: Data input for the SPI bus. I2C: Specifies I2C address bit 4.
17
MISO/I2C_DAT
I/O
SPI: Data output (tri-state when not active) I2C: Data in/out
18
RST_n
I
When RST_n is low, most of the chip shuts down to conserve
power. Register values will be lost. To preserve register values,
use SLEEP mode instead.
When raised high, RST_n is used to turn on the chip, restoring all
registers to their default value.
Page 8
20
LDO_VDD
PWR
Input power to the on-chip LDO.
21
LDO_OUT
PWR
+1.8V output from the on-chip LDO voltage regulator.
Normally this will connect to all VDD pins of the chip, supplying
clean, well-regulated power to all critical sections.
DO NOT CONNECT TO EXTERNAL LOADS.
23
XTALO
AO
Output of the crystal oscillator gain block.
24
XTALI
AI
Input to the crystal oscillator gain block.
25 (Exposed
pad)
GND
GND
Ground reference connection.
July 2010
LT8900 Datasheet Revision 1.1
6. SPI Interface
6.1.
SPI Default Format
Figure 2. SPI Signal Format when CKPHA = 1
(Standard configuration for QFN packaged parts)
6.2.
SPI Optional Format
Figure 3. SPI Signal Format when CKPHA = 0
(For QFN packaged parts, this option available by special order only)
Notes:
1.
Polarity of SPI read/write bit:
Write= 0,
Read= 1.
2.
Access to FIFO Register 50 is byte-by-byte (always integer multiples of 8-bits). Access to multiple FIFO bytes may be combined
into one or more SPI_SS cycle(s) if desired.
3.
Access to all registers other than FIFO is always word length (16-bits per register).
4.
Access to multiple registers (except FIFO register) may be combined into one SPI_SS cycle. If combined, address is written
only once at the beginning of the SPI cycle, then each 16-bit register value follows. The LT8900 will auto-increment the register
number that each word of data is placed into. If in doubt, simply use separate SPI_SS cycles for each 16-bit register write.
5.
MISO return status byte S7:S0 will be the same as the top byte of Register 48 (contains result of CRC and FEC error check, and
framer state status).
Page 9
July 2010
LT8900 Datasheet Revision 1.1
6.3.
SPI Timing Requirements
Table 4. SPI Timing Requirements
Name
Min
Typ.
Max
Description
T1
250ns
T2a, T2b
41.5ns
T3
Note 1
T4
Note 1
T5
Note 2
Interval time between two register data
T6
83ns
SPI_CLK period
Interval between two SPI accesses
Relationship between SPI_SS &
SPI_CLK
Interval time between address and data
Interval time between high byte and low
byte data
Notes:
1. When MCU/application reads register 50 FIFO data, at least 450ns wait time is required for framer to get correct FIFO read point.
For all other registers, T3min = 41.5ns.
2. When reading register 50 FIFO data, at least 450ns wait time is required.
For all other registers, T5min = 41.5ns.
Page 10
July 2010
LT8900 Datasheet Revision 1.1
7. IIC Interface
7.1.
I2C Command Format
Figure 4. Example I2C Data Transfers
7.2.
I2C Supported Features
Table 5. I2C Supported Feature List
I2C device Slave Mode Optional Feature List
Page 11
LT8900 Support?
Standard-mode – 100 kbps
Yes
Fast-mode – 400 kbps
Yes
Fast-mode Plus – 1000 kbps
Yes
High-speed mode – 3200 kbps
No
Clock Stretching
No
10-bit slave address
No
general call address
No
software reset
No
device ID
No
July 2010
LT8900 Datasheet Revision 1.1
7.3.
I2C Device Address
In I2C mode, the LT8900 responds to the following device address:
A6
A5
Determined
jumper.
0
A4
by
bonding
pad
QFN packaged parts: Standard is
‘1’.
Special order option is ‘0’.
Bare Die: can be bonded however
required.
Page 12
A3
A2
A1
A0
R/W
Determined by bonding pad jumper.
QFN
packaged
determined by
parts:
Read=1
As
1
0
0
0
pin 15, MOSI/A4.
Write=0
Bare Die: can be bonded however
required.
July 2010
LT8900 Datasheet Revision 1.1
8. Top Level State Diagram
Page 13
July 2010
LT8900 Datasheet Revision 1.1
9. Register Information
The following registers are accessed using SPI or I2C serial interface protocol.
Some of the internal registers and bit fields are not intended for end-user adjustment. Such registers are not
described herein, and should not be altered from the factory-recommended value.
9.1.
Register 3 – Read only
Table 6. Register 3 information
Bit No.
Bit Name
Description
15:13
(Reserved)
(Reserved)
Indicates the phase lock status of RF synthesizer.
12
RF_SYNTH_LOCK
1: Locked.
0: Unlocked.
11:0
9.2.
(Reserved)
(Reserved)
Register 6 – Read only
Table 7. Register 6 information
Bit No.
Bit Name
Description
15:10
RAW_RSSI[5:0]
Indicate 4-bit raw RSSI values from analog circuit.
9:0
(Reserved)
(Reserved)
9.3.
Register 7
Table 8. Register 7 information
Bit No.
Bit Name
Description
15:9
(Reserved)
(Reserved)
8
TX_EN
7
RX_EN
Initiate the Transmit Sequence for state machine control.
Note that TX_EN and RX_EN cannot be “HIGH” at the same time.
Initiate the Receive Sequence for state machine control.
Note that TX_EN and RX_EN cannot be “HIGH” at the same time.
6:0
Page 14
RF_PLL_CH_NO [6:0]
This will be the 7 bit RF channel number.
The on-air frequency will be: f = 2402 +
RF_PLL_CH_NO.
July 2010
LT8900 Datasheet Revision 1.1
9.4.
Register 9
Table 9. Register 9 information
Bit No.
Bit Name
Description
15:12
PA_PWCTR[3:0]
PA current control
11
(Reserved)
(Reserved)
10:7
PA_GN[3:0]
4-bit power amplifier gain setting.
6:0
(Reserved)
(Reserved)
9.5.
Register 10
Table 10. Register 10 information
Bit No.
Bit Name
Description
15:1
(Reserved)
(Reserved)
0
XTAL_OSC_EN
9.6.
Register 11
1:
Enable crystal oscillator gain block.
0:
Disable crystal oscillator gain block.
Table 11. Register 11 information
Bit No.
Bit Name
Description
15:9
(Reserved)
(Reserved)
8
RSSI_PDN
7:0
(Reserved)
9.7.
1: Power down RSSI.
0: RSSI operates normally.
(Reserved)
Register 23
Table 12. Register 23 information
Bit No.
Bit Name
Description
15:3
(Reserved)
(Reserved)
2
TxRx_VCO_CAL_EN
1:0
(Reserved)
Page 15
1: Calibrate VCO before each and every Tx/Rx enable.
0: Do not calibrate VCO before each and every Tx/Rx enable.
(Reserved)
July 2010
LT8900 Datasheet Revision 1.1
9.8.
Register 27
Table 13. Register 27 information
Bit No.
Bit Name
Description
15:6
(Reserved)
(Reserved)
5:0
XI_trim[5:0]
Crystal frequency trim adjust.
9.9.
Register 29 – Read only
Table 14. Register 29 information
Bit No.
Bit Name
Description
15:8
(Reserved)
(Reserved)
7:4
RF_VER_ID [3:0]
This field is used to identify minor RF revisions to the design.
3
(Reserved)
(Reserved)
2:0
Digital version
This field is used to identify minor digital revisions to the design.
9.10. Register 30 – Read only
Table 15. Register 30 information
Bit No.
Bit Name
15:0
ID_CODE_L [15:0]
Description
Lower bits of JEDEC JEP106-K Manufacture’s ID code, containing manufacturer,
part number, and version. The LSB is always “1”.
9.11. Register 31 – Read only
Table 16. Register 31 information
Bit No.
Bit Name
Description
15:12
RF_CODE_ID
JEDEC JEP106-K revision level.
11:0
ID_CODE_M [31:16]
Upper bits of Manufacture’s ID code.
Page 16
July 2010
LT8900 Datasheet Revision 1.1
9.12. Register 32
Table 17. Register 32 information
Bit
Name
R/W
Description
default
000: 1byte,
001: 2bytes,
15:13
PREAMBLE_LEN
R/W
010: 3 bytes,
010B
…
111: 8 bytes
11:
64 bits
{Reg39[15:0],Reg38[15:0],Reg37[15:0],Reg36[15:0]}
12:11
SYNCWORD_LEN
R/W
10: 48bits, {Reg39[15:0],Reg38[15:0],Reg36[15:0]}
11B
01: 32bits, {Reg39[15:0],Reg36[15:0]
00: 16 bits,{Reg36[15:0]}
000: 4 bits,
001: 6bits,
10:8
TRAILER_LEN
R/W
010: 8 bits,
011: 10 bits
000B
….
111: 18 bits
00: NRZ law data
7:6
DATA_PACKET_TYPE
R/W
01: Manchester data type
10: 8bit/10bit line code
00B
11: Interleave data type
00: No FEC
5:4
FEC_TYPE
R/W
01: FEC13
10: FEC23
00B
11: reserved
Page 17
July 2010
LT8900 Datasheet Revision 1.1
Bit
Name
R/W
Description
default
Selects output clock signal to BRCLK pin:
3’b000: keep low
3’b001: crystal buffer out
3:1
BRCLK_SEL
R/W
3’b010: crystal divided by 2
3’b011: crystal divided by 4
011B
3’b100: crystal divided by 8
3’b101: TXCLK 1 MHz
3’b110: APLL_CLK (12 MHz during Tx, Rx)
3’b111: keep low
0
Page 18
(Reserved)
W/R
(Reserved)
0B
July 2010
LT8900 Datasheet Revision 1.1
9.13. Register 33
Table 18. Register 33 information
Bit
Name
R/W
Description
default
15-8
VCO_ON_DELAY_CNT[7:0]
R/W
After set TX or RX wait delay timer for internal VCO setting time.
Each time increment is 1 uS.
63H
7-6
TX_PA_OFF_DELAY[1:0]
R/W
Set PA off after PA_OFF
4us
00B
5:0
TX_PA_ON_DELAY[5:0]
R/W
After set VCO_ON, it will wait this timer , than internal PA fully
on,
command, 1 represents 1us, base is
07H
9.14. Register 34
Table 19. Register 34 information
Bit
Name
R/W
15
Bpktctl_direct
R/W
14-8
TX_CW_DLY[6:0]
R/W
7-6
Reserved
R/W
5:0
TX_SW_ON_DELAY[5:0]
R/W
Description
When direct mode, it is used control PA on at TX and
wide/narrow mode control at RX
Transmit CW modulation data at before transmit data, after PA
on, continue TX CW mode time.
default
0B
03H
0B
Set VCO_ON, wait this timer, internal TW switch turn on, 1
represents 1us
0BH
9.15. Register 35
Table 20. Register 35 information
Page 19
July 2010
LT8900 Datasheet Revision 1.1
Bit
Name
R/W
Description
1:
15
POWER_DOWN
W
default
First set crystal off, then set LDO low-power mode
(register values will be lost).
0B
0:
Leave power on.
1:
Enter SLEEP state (set crystal gain block to off.
Keep
LDO regulator on (register values will be preserved).
14
SLEEP_MODE
W
Wakeup begins when SPI_SS goes low. This will restart the
on-chip clock oscillator to begin normal operation.
0:
13
(Reserved)
0B
Normal (IDLE) state.
(Reserved)
1: crystal running at sleep mode.
12
BRCLK_ON_SLEEP
R/W
Draws more current but enables fast wakeup.
0: crystal stops during sleep mode.
1B
Saves current but takes longer to wake up.
11:8
RE-TRANSMIT_TIMES
R/W
7
MISO_TRI_OPT
R/W
6:0
SCRAMBLE_DATA
R/W
Max. re-transmit packet attempts when auto_ack function is
enabled.
1: MISO stays low-Z even when SPI_SS=1.
0: MISO is tri-state when SPI_SS=1.
Whitening seed for data scramble.
Must be set the same at
3H
0B
00H
both ends of radio link (Tx and Rx).
9.16. Register 36
Table 21. Register 36 information
Bit
Name
R/W
Description
default
15:0
SYNC_WORD[15:0]
R/W
LSB bits of sync word is sent first.
0000H
9.17. Register 37
Table 20. Register 37 information
Bit
Name
R/W
Description
default
15:0
SYNC_WORD[31:16]
R/W
LSB bits of sync word is sent first.
0000H
Page 20
July 2010
LT8900 Datasheet Revision 1.1
9.18. Register 38
Table 21. Register 38 information
Bit
Name
R/W
Description
default
15:0
SYNC_WORD[47:32]
R/W
LSB bits of sync word is sent first.
0000H
9.19. Register 39
Table 22. Register 39 information
Bit
Name
R/W
Description
default
15:0
SYNC_WORD[63:48]
R/W
LSB bits of sync word is sent first.
0000H
9.20. Register 40
Table 23. Register 40 information
Bit
Name
R/W
Description
15:11
FIFO_EMPTY_THRESHOLD
R/W
00100B
10:6
FIFO_FULL_THRESHOLD
R/W
00100B
5:0
SYNCWORD_THRESHOLD
R/W
The minimum allowable error bits of SYNCWORD,
default
07H
07 means 6 bits，01 means 0 bit
9.21. Register 41
Table 24. Register 41 information
Bit
Name
R/W
15
CRC_ON
R/W
Description
1: CRC on.
0: CRC off.
default
1B
Removes long patterns of continuous 0 or 1 in transmit data.
14
SCRAMBLE_ON
R/W
Automatically restores original unscrambled data on receive.
1: scramble on.
0B
0: scramble off.
13
PACK_LENGTH_EN
R/W
1: LT8900 regards first byte of payload as packet length
descriptor byte.
1B
1: When FIFO write point equals read point, LT8900 will
12
FW_TERM_TX
R/W
terminate TX when FW handle packet length.
1B
0: FW (MCU) handles length and terminates TX.
Page 21
July 2010
LT8900 Datasheet Revision 1.1
Bit
Name
R/W
Description
11
AUTO_ACK
R/W
10
PKT_FIFO_POLARITY
R/W
9:8
(Reserved)
R/W
(Reserved)
00B
7:0
CRC_INITIAL_DATA
R/W
Initialization constant for CRC calculation.
00H
1: After receiving data, automatically send ACK/NACK.
0: After receive, do not send ACK or NACK; just go to IDLE.
1: PKT flag, FIFO flag Active low.
0: Active high
default
1B
0B
9.22. Register 42
Table 25. Register 42 information
Bit
Name
R/W
Description
15:10
SCAN_RSSI_CH_NO
R./W
9:8
(Reserved)
R/W
(Reserved)
01B
7:0
Rx_ACK_TIME[7:0]
R/W
Wait RX_ack ID timer setting. 1 represents 1us
6BH
Number of consecutive channels to scan for RSSI value. RSSI
result of each channel is returned in FIFO registers.
default
00H
9.23. Register 43
Table 26. Register 43 information
Bit
Name
R/W
Description
default
15
SCAN_RSSI_EN
R./W
1: Start scan_RSSI process.
0B
Normally an RSSI scan would start at 2402 MHz (channel 0).
This field introduces a starting offset.
14:8
SCAN_STRT_CH_OFFST[6:0]
R/W
EXAMPLE: If offset= +10, Starting channel will be 2412
01B
MHz (ch. 10).
7:0
WAIT_RSSI_SCAN_TIM[7:0]
R/W
Set VCO & SYN setting time when scan different channel
6BH
RSSI
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July 2010
LT8900 Datasheet Revision 1.1
9.24. Register 48 – Read only
Table 27. Register 48 information
Bit
Name
R/W
Description
15
CRC_ERROR
R
Received CRC error
14
FEC23_ERROR
R
Indicate FEC23 error
13:8
FRAMER_ST
R
Framer status
7
SYNCWORD_RECV
R
6
PKT_FLAG
R
PKT flag indication
5
FIFO_FLAG
R
FIFO flag indication
4:0
(Reserved)
R
(Reserved)
default
1: syncword received, it is just available in receive status,
After out receive status, always keep ‘0’.
9.25. Register 50
Table 30. Register 50 information
Bit
Name
R/W
Description
default
For MCU read/write data between the FIFO.
15:0
TXRX_FIFO_REG
R/W
Reading this register removes data from FIFO; Writing to this
register adds data to FIFO.
00H
Note: FW (MCU) access to FIFO is byte-by-byte.
9.26. Register 52
Table 31. Register 51 information
Bit
Name
R/W
15
CLR_W_PTR
W
14
(Reserved)
W
13:8
FIFO_WR_PTR
R
7
CLR_R_PTR
W
6
(Reserved)
5:0
FIFO_RD_PTR
Page 23
R
Description
1: clear TX FIFO point to 0 when write this bit to “1”.
It is not available in RX status.
default
0B
FIFO write pointer.
1: clear RX FIFO point to 0 when write this bit to “1”.
It is not available in TX status.
0B
FIFO read pointer (number of bytes to be read by MCU).
July 2010
LT8900 Datasheet Revision 1.1
10.
Recommended Register Values
The following register values are recommended for most typical applications. Some changes may be
required depending on application.
Table 32. Recommended Register Values
Page 24
Register
number
Power-up
reset
value
(hex)
Recommended value for many
applications (hex)
0
1
2
4
5
6fef
5681
6619
5447
f000
6fef
5681
6617
9cc9
6637
7
0030
0030
8
9
10
11
12
13
22
23
24
25
26
27
28
29
30
31
71af
3000
7ffd
4008
0000
4855
c0ff
8005
307b
1659
1833
9100
1800
00x0
f413
1002
6c90
1840
7ffd
0008
0000
48bd
00ff
8005
0067
1659
19e0
1200
1800
read-only
read-only
read-only
32
1806
1806
33
34
35
36
37
38
39
40
6307
030b
1300
0000
0000
0000
0000
2107
63f0
3000
0380
Configures packet sequencing.
Configures packet sequencing.
AutoAck max Tx retries = 3
Choose unique sync words for
each over-the-air network.
Similar to a MAC address.
41
b800
b000
42
43
fd6b
000f
fd6b
000f
2107
Notes
Use for setting RF frequency,
and to start/stop Tx/Rx packets.
Sets Tx power level
Crystal osc. enabled.
RSSI enabled.
Calibrate VCO before each and every Tx/Rx.
No crystal trim.
Stores p/n, version information.
Stores p/n, version information.
Stores p/n, version information.
Packet data type: NRZ, no FEC,
BRCLK=12 div. by 4= 3MHz
Configure FIFO flag, sync threshold.
CRC on. SCRAMBLE off.
1st byte is packet length.
Configure scan_rssi.
July 2010
LT8900 Datasheet Revision 1.1
11.
Usage Notes
The LT8900 Low-Cost RF Transceiver can be used to add wireless capability to many applications. The
following notes are intended to answer common questions regarding the LT8900.
11.1. Power On and Register Initialization Sequence
Figure below shows the timing diagram of power-on sequence after VDD is ready.
Figure 5. Power on and register programming sequence
1.
After VDD power is ready, make sure to have valid reset on pin RST_n, which is active-low.
2.
After RST_n =1, BRCLK will be running at 12MHz clock.
3.
Wait T1 (1 to 5 ms) for crystal oscillator to stabilize, then MCU/application can perform register
initialization.
4.
After register initialization, LT8900 is ready to transmit or receive.
Figure 6. Initialization flowchart
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July 2010
LT8900 Datasheet Revision 1.1
11.2. Enter Sleep and Wake-Up
When MCU writes LT8900 register to enter sleep mode and pulls SPI_SS back to high, LT8900 will enter
sleep state where the current consumption is extremely low. When SPI_SS is pulled low, LT8900 will
automatically wake up from sleep state. MCU needs to keep SPI_SS low a certain time (the time required for
RFIC crystal to be stabilized) before driving SPI_CLK and SPI data.
11.3. Packet Data Structure
Each over-the-air LT8900 packet is structured as follows:
z
Preamble: 1~8 bytes, programmable.
z
SYNC: 16/32/48/64 bits, programmable as device syncword.
z
Trailer: 4~18 bits, programmable.
z
Payload: TX/RX data. There are 4 data types:
z
Raw data
8 bit / 10 bit line code
Manchester
Interleave with FEC option
CRC: 16-bit CRC is optional.
11.4. FIFO Pointer Clear
For transmit, it is required to clear FIFO write pointer before application writes data to FIFO for transmit. This
is accomplished by writing ‘0’ to Register 52[15].
After receiving a packet, the read pointer will indicate how many bytes of receive data are waiting in FIFO
buffer, waiting to be read by user MCU or application.
FIFO write pointer will automatically be cleared when receiver receives SYNC.
FIFO read pointer will automatically be cleared when receiver receives SYNC, or after transmitting SYNC in
transmit mode.
11.5. Packet Payload Length
LT8900 provides two ways to handle TX/RX packet length. If Register 41[13]= 1, the LT8900 internal framer
will detect packet length based on the value of the 1st payload byte. If Register 41[13]= 0, the 1st byte of the
payload has no particular meaning, and packet length is determined by either TX FIFO running empty, or
TX_EN bit cleared. See table below:
Page 26
July 2010
LT8900 Datasheet Revision 1.1
Table 33. Packet Payload Length
Register 41[13]
Register 41[12]
PACK_LENGTH_EN
FW_TERM_TX
0
0
(MCU/application handles
packet length)
Transmit stops only when Register 7 TX_EN= 0. See page 31 for
details.
Receive stops only when Register 7 RX_EN= 0. See page 33 for
details.
Transmit automatically stops whenever FIFO runs empty.
1
Receive stops only when Register 7 RX_EN= 0. See page 29 for
details.
1st byte of payload is regarded as packet length, 0 to
1
(LT8900 framer handles
packet length)
x
(don’t care)
255 bytes.
Transmit automatically stops when all 0 to 255 bytes are
transmitted.
See page 25 for details.
Detailed timing diagrams are shown below.
All timing diagrams show active-high for PKT and FIFO flags. Active-low is also available via Register 41[10]
setting.
Page 27
July 2010
LT8900 Datasheet Revision 1.1
11.6. Framer handles packet length
Framer of LT8900 will handle packet length by setting Register 41[13]=1. The first byte of payload is
regarded as packet length (this length byte is not counted in the packet length). Maximum allowed packet
length is 255 bytes. Framer will handle Tx/Rx start and stop.
11.6.1. Transmit Timing
Tx timing diagram is shown below. After MCU writes Register 7[8]=1 and selects transmit channel (refer to
Register 7 definition), the framer will automatically generate the packet using payload data from FIFO. MCU
needs to fill in transmit data before framer sends trailer bits.
If packet length exceeds FIFO length, the MCU will need to write FIFO data multiple times. FIFO flag
indicates whether FIFO is empty in transmit state or not.
Figure 7. Tx Timing Diagram when Register 41[13]= 1 (Framer Handles Packet Length).
PKT and FIFO flags are Active High
Page 28
July 2010
LT8900 Datasheet Revision 1.1
Figure 8. Example Tx packet flowchart
where FIFO and PKT flags are interrupt signals to MCU.
Page 29
July 2010
LT8900 Datasheet Revision 1.1
11.7. Receive Timing
Rx timing diagram is shown in figure below. When MCU writes Register 7[7]= 1 and selects receiving
channel, LT8900 framer will turn on the receiver and wait while attempting to detect a valid syncword.
If valid syncword is found, the LT8900 framer will process packet automatically. When received packet
processing is complete, LT8900 framer will set state to IDLE.
If received packet length is longer than 63 bytes, FIFO flag will go active, which means MCU must read out
data from FIFO.
A valid syncword will not always be found, due to weak signal, multipath signal cancellation, devices out of
range, etc. To accommodate such a condition and prevent lockup, the MCU/application should incorporate a
receive timeout timer. In most applications, receive packets are expected to arrive within a defined time
‘window’. If the packet does not arrive, the system can use either timer polling or timer-based interrupt to
take corrective or alternative action.
Figure 9. Rx Timing Diagram when Register 41[13]=1 (Framer Handles Packet Length).
PKT and FIFO flags are Active High
Write reg 7
SPI_SS
Internal Rx on
2us
Received data
PKT_flag
Receive on delay
Rx package
PKG_flag=1 when Rx packet has
been received by framer
FIFO_flag
FIFO_flag=1 when FIFO is full
Page 30
July 2010
LT8900 Datasheet Revision 1.1
Figure 10. Example Rx packet flowchart
where FIFO and PKT flag signals interrupt MCU.
RX Start
RX timeout
interrupt
Write Reg7 as RX on
and select RX
channel
Disable PKT_flag
interrupt
Wait 10us
Write Reg7
RX_EN=0
Set RX timeout timer
RETI
Enable interrupt
No
FIFO_flag interrupt
PKT_flag interrupt
Disable FIFO_flag
interrupt
Disable PKT_flag
interrupt
More data to
read in?
Read FIFO
Yes
No
Yes
Read FIFO
Read FIFO
Enable FIFO_flag
interrupt
Enable FIFO_flag
interrupt
RETI
RETI
11.8. MCU/Application handles packet length
When Register 41[13]= 0, the 1st byte of the payload data has no special significance. Instead, packet length
depends on Register 41[12].
Page 31
July 2010
LT8900 Datasheet Revision 1.1
11.8.1. FW_TERM_TX= 1
If Register 41[12] = 1, the LT8900 framer will continue to compare FIFO write point and FIFO read point
during packet transmission. If MCU/application stops writing data to FIFO, the framer eventually detects that
there is no data to send (FIFO empty), and LT8900 will exit cease transmission automatically. The timing
diagram is shown in Figure below.
Figure 11. Tx timing when Register 41[13:12]= ‘b01.
PKT and FIFO flags are set as active high.
Note: When Register 41[13] = 0 (MCU/application handles packet length), never let FIFO underflow or over flow. FIFO full/empty
thresholds can be controlled via Register 40 FIFO_EMPTY_THRESHOLD and FIFO_FULL_THRESHOLD settings. The best value will
depend on SPI speed, and speed at which MCU/application can stream the data into FIFO.
Page 32
July 2010
LT8900 Datasheet Revision 1.1
Figure 12. Example transmit flowcharts for Register 41[13:12]= ‘b01
using interrupts for PKT and FIFO flags.
Page 33
July 2010
LT8900 Datasheet Revision 1.1
11.8.2. FW_TERM_TX= 0 (Transmit)
When Register 41[13:12] = ‘b00, the LT8900 framer does not stop packet transmission until MCU/application
writes Register 7[8] TX_EN bit = 0. Packet transmission continues even if FIFO is empty. The timing diagram
is shown in Figure below.
Figure 13. TX timing diagram when Register 41[13:12] = ‘b00.
PKT and FIFO flags are shown high active.
Note: When Register 41[13] = 0 (MCU/application handles packet length), never let FIFO underflow or over flow. FIFO full/empty
thresholds can be controlled via Register 40 FIFO_EMPTY_THRESHOLD and FIFO_FULL_THRESHOLD settings. The best value will
depend on SPI speed, and speed at which MCU/application can stream the data into FIFO.
Page 34
July 2010
LT8900 Datasheet Revision 1.1
Figure 14. Example Transmit flowcharts for Register 41[13:12]= ‘b00
using interrupts for PKT and FIFO flags.
Page 35
July 2010
LT8900 Datasheet Revision 1.1
11.8.3. FW_TERM_TX= 0 (Receive)
When Register 41[13] =0, packet reception starts when MCU/application writes Register 7[7] RX_EN = 1. At
this time, the framer will automatically turn on the receiver to the frequency/channel specified in register 7.
After waiting for the internal synthesizer and receiver delays to transpire, the framer circuitry of the LT8900
will begin searching the incoming signal for a syncword. When detected, it will set PKT flag active, then start
to fill FIFO with receive data bytes. The PKT flag will remain active until MCU/application reads out the first
byte of data from FIFO register. After MCU/application reads the first byte of receive data, PKT flag goes
inactive until next Tx/Rx period.
With Register 41[13:12] = ‘b00 or ‘b01, the LT8900 framer will always need the MCU/application to write
Register 7[7] to 0 to stop Rx state.
Rx timing diagram is shown in Figure below.
Figure 15. RX timing diagram when Register 41[13:12] = ‘b00 or ‘b01.
PKT_flag and FIFO_flag are active high.
Page 36
July 2010
LT8900 Datasheet Revision 1.1
Figure 16. Example Receive flowcharts for Register 41[13:12]= ‘b00 or ‘b01
using interrupts for PKT and FIFO flags.
Page 37
July 2010
LT8900 Datasheet Revision 1.1
11.9. Crystal Oscillator
The LT8900 supports quartz crystal, or external clock input.
11.9.1. Quartz crystal application
Series resistor R2 limits power to the crystal, and contributes to the phase shift necessary for oscillation.
Crystal loading capacitors C7 and C8 largely determine the load seen by the crystal, which should match the
crystal vendor’s specification. These capacitor values can be trimmed, to fine-tune the frequency of
oscillation. Self- bias resistor R1, from buffer output to input, serves to self-bias the on-chip buffer to the
center of the linear region for maximum gain.
11.9.2. External clock application
Self-bias resistor R1 should still be used, but the external clock may be coupled to the XTALI pin via a series
DC blocking capacitor. See circuit below.
Output resistor R0 is used to sample a small amount of power from an existing oscillator or clock circuit. The
best value of R0 may need to be determined experimentally, but around 3k Ohms is a good starting point. In
the extreme case of R0 being much too large, the RFIC will fail to initialize to the IDLE state properly.
Regarding PCB layout: The CLK trace should be kept short and direct. The trace should be relatively narrow
(high impedance), and must route away from other traces on the PCB that may inject or couple noise onto
the CLK trace. The LT8900 will receive the clock signal relative to ground; therefore, the ground between
chips should be a good low-noise, low-inductance ground. Ideally, this GND return should be a single ground
plane on the PCB layout.
Figure 17. External Clock Application
Additional Notes:
1.
Clock duty cycle should be 50%. If not 50%, some additional drive voltage may be required (i.e. reduce R0).
2.
If received Bit Error Rate (BER) is high, it can be caused by insufficient clock drive to the RFIC (i.e. reduce R0).
3.
Another cause for high BER is phase noise on the clock signal. Try putting 0.1 and 2.2 uF ceramic bypass capacitors across
the baseband chip VDD/VSS pins that power the oscillator.
Page 38
July 2010
LT8900 Datasheet Revision 1.1
11.9.3. Minimum Pin Count
When a low cost MCU drives the LT8900, MCU pin count must be minimized. Consider the following:
z
FIFO: only needed when Tx or Rx packet length is greater than around 63 bytes, up to infinity. For short
packets (< 63 bytes), FIFO is not needed.
z
PKT: gives a hardware indication of a packet received. If the user is willing to poll register 48 for this
information, then this pin is not needed.
z
SPI lines: All 4 of these lines are needed.
z
RST_n: This line is sometimes connected through an RC filter to the VDD_IN, which makes the chip
self-reset when power is applied, thus eliminating an MCU pin.
11.9.4. CKPHA
On the LT8900 die, there is a CKPHA pad. When LT8900 is purchased in QFN package, this pad will
normally be connected by bond wire to a source of logic ‘1’. This is to save a pin, thus keeping packaged part
cost low.
The alternate configuration, CKPHA= 0, is available by special order.
Customers ordering bare unpackaged die will be able to bond CKPHA however desired.
11.9.5. Antenna Type and Location
Probably the greatest single factor affecting RF performance for the LT8900 or any other over-the-air RF
device is the antenna – not just type, but also placement and orientation. Antenna gain is normally measured
with respect to isotropic, that is, an ideal radiator that sends/receives power equally from/to any direction.
This ideal antenna would be described as 0 dBi, or zero dB’s above/below isotropic. Unfortunately, they don’t
really exist in practice. A simple dipole with a theoretical gain of +2 dBi is usually a good choice, but the
designer should exercise care when placing the antenna, since dipole antennas have a radiation pattern
described as a donut, whereby the null can be very deep.
For most wireless applications, the printed full-wave loop antenna shown on the schematic should perform
well, provided that the antenna is placed in the clear, away from other circuitry and wires, hands, etc. In
particular, the antenna must be kept away from human tissue, particularly sensitive spots like the heart, brain,
and eyes. Violating this design principle
will not only make the end product perform poorly and possibly become a long term danger to the user, but it
will likely not receive FCC or other regulatory agency approval. For best operation, design the product so the
main antenna radiation is away from the body, or at least not proximity loaded by the human body, or
dielectric objects within the product.
Also, be sure to keep the antenna away from clock lines and digital bus signals; otherwise, harmonics of the
clock frequency will jam certain receive frequencies. It’s best to just keep the antenna away from all wires
and metal objects!
Page 39
July 2010
LT8900 Datasheet Revision 1.1
11.10. PCB Layout
PCB layout is not too critical, but here are some helpful hints:
1. RF path: Since the LT8900 utilizes 2-conductor balanced transmission line at the RF port, ground plane
is not necessary along the balanced line length. Be sure to keep each of the two conductors equal length.
2. Clock traces: It is best to keep the clock traces simple and direct. The self-bias resistor should be close
to the XTALI and XTALO pins. The oscillation loop, consisting of the series resistor and crystal, should be a
simple, small loop. The crystal loading capacitors should be near the crystal. The ground connection to these
capacitors must be to a good, clean, quiet ground. This keeps noise from becoming injected into the
oscillator. This is a good reason to have one ground plane for the entire RF section.
3. Power distribution and decoupling: Capacitors should be located near the VDD pins, as shown in the
schematic.
4. Antenna Placement: If using an antenna manufactured by a particular company, be sure to follow the
manufacturer’s recommendation regarding layout.
5. Digital Interface: In order to provide a good ground return for the digital lines, it is a good idea to provide
at least 2 pins for ground, not just one. Good grounding between RF and MCU can help reduce noise ‘seen’
at the antenna, thus improving performance.
Page 40
July 2010
LT8900 Datasheet Revision 1.1
12.
Package Outline
QFN 24 Lead Exposed Pad Package, 4x4 mm, 0.5mm pitch. Dimensions in mm.
Table 28. Package Outline Dimension
Page 41
Dim.
Min. Nom.
Max.
A
0.70 0.75
A1
0
A3
0.203 REF
b
0.18 0.25 0.30
D/E
3.90 4.00 4.10
D2/E2
1.90 2.00 2.10
e
0.50 BSC
0.80
0.02 0.05
Dim.
Min. Nom. Max.
L
0.30 0.40 0.50
y
0.08
July 2010
LT8900 Datasheet Revision 1.1
13.
IR Reflow Standard
Follow : IPC/JEDEC J-STD-020 B
Condition :
Average ramp-up rate (183ºC to peak): 3 ºC/sec. max.
Preheat: 100~150ºC 60~120sec
Temperature maintained above 183ºC: 60~150 seconds
Time within 5ºC of actual peak temperature: 10 ~ 30 sec.
Peak temperature: 240+0/-5 ºC
Ramp-down rate: 6 ºC/sec. max.
Time 25ºC to peak temperature: 6 minutes max.
Cycle interval: 5 minutes
Figure 18. IR Reflow Diagram
Page 42
July 2010
LT8900 Datasheet Revision 1.1
14.
Document Revision History
Mar 2010:
Page 43
Release Preliminary Specification.
July 2010