(1/4) Chip Beads(SMD) For Signal Line Conformity to RoHS Directive MMZ Series MMZ2012 Type FEATURES • Chip bead(impeder), MMZ series offers 4 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low DC resistance structure of electrode prevents wasteful electric power consumption. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. APPLICATIONS Removal of signal line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. MATERIAL CHARACTERISTICS R material: For wide frequency applications calling for broad impedance characteristics. For digital signal line applications calling requiring good waveform integrity. Impedance values selected for effectiveness at 10 to 200MHz. S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effectiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal frequency is far from the cutoff frequency. Impedance values selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low frequencies and sharply increasing impedance at high frequencies. Designed for high impedance at high frequencies (200 to 500MHz) for signal line applications. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions L× W (3) Material code (4) Nominal impedance 121:120Ω at 100MHz (5) Characteristic type (6) Packaging style T:Taping TYPICAL MATERIAL CHARACTERISTICS 2500 2000 Impedance(Ω) MMZ 2012 R 121 A T (1) (2) (3) (4) (5) (6) 1000 500 0 10 HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. Y 1500 D S R 100 Frequency(MHz) 1000 • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 007-02 / 20090921 / e9412_mmz2012.fm (2/4) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN ELECTRICAL CHARACTERISTICS Part No. MMZ2012R150A MMZ2012R300A MMZ2012R600A MMZ2012R121A MMZ2012R301A MMZ2012R601A MMZ2012R102A MMZ2012S400A MMZ2012S800A MMZ2012S121A MMZ2012S181A MMZ2012S301A MMZ2012S601A MMZ2012S102A MMZ2012Y150B MMZ2012Y300B MMZ2012Y600B MMZ2012Y121B MMZ2012Y301B MMZ2012Y601B MMZ2012Y102B MMZ2012Y152B MMZ2012Y202B MMZ2012D800B MMZ2012D121B MMZ2012D301B 1.2 1.25±0.2 2±0.2 0.8 1 0.8 0.85±0.2 0.5±0.3 Weight: 8mg Dimensions in mm TEMPERATURE RANGES Operating/storage –55 to +125°C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 4000 pieces/reel RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C Natural cooling 230˚C ∗ 180˚C 150˚C Preheating 60 to 120s Impedance (Ω)±25% [100MHz]∗ 15 30 60 120 300 600 1000 40 80 120 180 300 600 1000 15 30 60 120 300 600 1000 1500 2000 80 120 300 DC resistance (Ω)max. Rated current (mA)max. 0.05 0.05 0.1 0.12 0.15 0.2 0.3 0.1 0.1 0.15 0.15 0.2 0.3 0.35 0.05 0.05 0.1 0.12 0.15 0.2 0.3 0.4 0.5 0.3 0.3 0.5 1500 1500 1000 800 600 500 500 1000 800 800 600 600 500 500 1500 1500 1000 800 600 500 500 500 400 500 500 400 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C Soldering 30 to 60s Time(s) 120 100 100 100 80 60 40 Z 10 60 40 20 0 10000 1 400 400 Impedance(Ω) 500 300 200 0 1 10 10 100 1000 Frequency (MHz) R X Z R 100 10000 0 X 1 10 1 10 1000 900 800 700 600 500 400 300 200 100 X 100 1000 Frequency (MHz) R 100 1000 Frequency (MHz) 10000 MMZ2012R601A 300 200 0 10000 MMZ2012R301A 500 Z Z 40 X MMZ2012R121A 100 60 20 R X 100 1000 Frequency (MHz) 80 Impedance(Ω) 1 80 Z R 0 Impedance(Ω) 120 20 Impedance(Ω) MMZ2012R600A 120 Impedance(Ω) Impedance(Ω) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012R150A MMZ2012R300A 100 1000 Frequency (MHz) 10000 0 Z R X 1 10 100 1000 Frequency (MHz) 10000 • All specifications are subject to change without notice. 007-02 / 20090921 / e9412_mmz2012.fm (3/4) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012R102A MMZ2012S400A 1400 Impedance(Ω) 1000 800 Z 600 R X 150 100 200 150 100 Z Z 50 10 100 1000 Frequency (MHz) 10000 Z 100 R X 50 100 1000 Frequency (MHz) 0 10000 MMZ2012S601A 1000 900 800 700 600 500 400 300 200 100 100 1000 Frequency (MHz) 0 10000 Z R X 1 10 100 1000 Frequency (MHz) 0 10000 Impedance(Ω) Impedance(Ω) Impedance(Ω) 1000 Z 800 R 600 400 1 10 X 10000 MMZ2012Y300B 1 10 100 100 Impedance(Ω) 120 80 60 40 R 1 10 1 10 100 1000 Frequency (MHz) 10000 80 60 40 Z R 1 10 X 100 1000 Frequency (MHz) 10000 MMZ2012Y121B 700 80 Z 60 R 40 X 600 500 400 300 200 Z R 100 X X 100 1000 Frequency (MHz) X 0 10000 20 20 R 800 Z 0 100 1000 Frequency (MHz) MMZ2012Y600B 120 Z 20 200 100 1000 Frequency (MHz) 10000 100 1200 0 100 1000 Frequency (MHz) 120 1400 X 10 MMZ2012Y150B 1600 R 1 1000 900 800 700 600 500 400 300 200 100 MMZ2012S102A Z X MMZ2012S301A Impedance(Ω) 150 10 10 1000 900 800 700 600 500 400 300 200 100 200 1 1 X MMZ2012S181A 250 0 0 Impedance(Ω) 1 300 Impedance(Ω) 200 R MMZ2012S121A Impedance(Ω) 250 50 200 0 250 R 400 0 300 Impedance(Ω) Impedance(Ω) 1200 MMZ2012S800A 300 Impedance(Ω) 1600 10000 0 1 10 100 1000 Frequency (MHz) 10000 0 1 10 100 1000 Frequency (MHz) 10000 • All specifications are subject to change without notice. 007-02 / 20090921 / e9412_mmz2012.fm (4/4) 800 1600 700 700 1400 600 600 400 Z 300 R 300 200 10 0 10000 MMZ2012Y152B 1200 R 800 600 X 400 200 1 10 100 1000 Frequency (MHz) 10000 MMZ2012D121B 100 1000 Frequency (MHz) 0 10000 X X 10 10 100 1000 Frequency (MHz) 1000 900 800 700 600 500 400 300 200 100 R 1 1 10000 MMZ2012D800B Z 100 1000 Frequency (MHz) 0 10000 Z R X 1 10 100 1000 Frequency (MHz) 10000 MMZ2012D301B 4000 1400 3500 1200 3000 Impedance(Ω) 1600 1000 Z R R Z 2500 800 2000 600 1500 400 1000 10 100 1000 Frequency (MHz) 0 10000 1 10 PACKAGING STYLES REEL DIMENSIONS 100 1000 Frequency (MHz) 10000 TAPE DIMENSIONS Sprocket hole 1.5 +0.1 –0.0 Cavity 1.1max. 1.5±0.2 4.0±0.1 4.0±0.1 2.0±0.05 2.0±0.5 8.4 +2.0 –0.0 ø13±0.2 14.4max. 160min. Taping 2.3±0.2 ø60min. 8.0±0.3 1.0 3.5±0.05 1 X 500 X 1.75±0.1 200 0 10 Impedance(Ω) Z 1000 0 1 2600 2400 2200 2000 1800 1600 1400 1200 1000 800 600 400 200 0 1400 R 200 MMZ2012Y202B 1600 Z 600 400 X 100 100 1000 Frequency (MHz) 800 Impedance(Ω) 1 1000 R 400 X 100 Impedance(Ω) Z 500 200 0 1200 Impedance(Ω) 500 Impedance(Ω) MMZ2012Y102B 800 Impedance(Ω) Impedance(Ω) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012Y301B MMZ2012Y601B 200min. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 007-02 / 20090921 / e9412_mmz2012.fm