(1/2) Chip Beads(SMD Array) For Audio Signal Line Conformity to RoHS Directive MCZ Series MCZ1210-T Type(3-Line) FEATURES • Compact size and for three lines • Capable of removing both common and differential mode noises. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 1.25±0.1 5 4 1 2 3 0.225 0.5 0.5 1.0±0.1 6 0.225±0.1 0.5±0.1 This is a common type bead product that removes the noise components in a signal line and includes beads for three lines in a single chip. The product exhibits substantial impedance characteristics in the high frequency range and is therefore capable of effectively removing differential mode noises. Additionally, an appropriate amount of magnetic coupling is created between the beads of the three lines, giving the product the capability to remove not only differential mode noise but common mode noise as well. It is encased in a 1210 casing. This is an SMD product that allows for automatic mounting by taping. 0.25 Dimensions in mm 0.475±0.1 CIRCUIT DIAGRAM 6 5 4 APPLICATIONS Audio signal lines used in cell phones and mobile audio devices. PRODUCT IDENTIFICATION MCZ 1210 C T 201 T (1) (2) (3) (4) (5) (6) 1 2 3 • No polarity TEMPERATURE RANGES Operating/Storage (1) Series name (2) Dimensions L× W (3) Material code (4) Number of line (5) Impedance 201: 200Ω at 100MHz (6) Packaging style T:Taping –40 to +85°C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 4000 pieces/reel HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 001-05 / 20061022 / e9421_mcz1210_3.fm (2/2) ELECTRICAL CHARACTERISTICS Part No. Open mode impedance (Ω)[at 100MHz]∗ DC resistance (Ω)max. MCZ1210CT121T MCZ1210CT201T 120±25% 200±25% 0.6 0.8 ∗ Insulation resistance (MΩ)min. 1 1 Rated voltage (V)max. Rated current (mA)max. Thickness T (mm) 5 5 100 100 0.5 0.5 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent MCZ1210CT201T 400 400 350 350 300 300 Impedance(Ω) Impedance(Ω) TYPICAL ELECTRICAL CHARACTERISTICS IMPEDANCE vs. FREQUENCY CHARACTERISTICS MCZ1210CT121T 250 Open mode 200 150 100 200 150 100 50 0 Open mode 250 50 Common mode 1 10 100 1000 Frequency (MHz) 0 10000 Common mode 1 10 100 1000 Frequency (MHz) 10000 MEASURING CIRCUITS Impedance analyzer Impedance analyzer PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS Sprocket hole 1.5 +0.1 –0.0 Cavity 0.60±0.05 1.2±0.1 4.0±0.1 4.0±0.1 2.0±0.1 2.0±0.5 ø13±0.5 9.0±0.3 40min. Taping 1.45±0.1 ø60±2.0 8.0±0.2 1.0 3.5±0.1 Common mode 1.75±0.1 Open mode 100min. 13.0±1.4 ø21±0.8 ø178±2.0 Dimensions in mm Drawing direction 250min. Dimensions in mm • All specifications are subject to change without notice. 001-05 / 20061022 / e9421_mcz1210_3.fm