MA4P HIPAX™ High Power PIN Diodes V9 Package Styles Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ High Power Handling Low Loss / Low Distortion Voltage Ratings up to 1000 Volts Passivated Chip for Low Leakage Current Low Theta (θ) Due to Full Face Chip Bonding Leadless Low Inductance MELF Packages Various Package Options Available as Chips Fully RoHS Compliant 401 & 402 1072 & 1091 Description Applications M/A-COM Technology Solutions MELF and HIPAX PIN diode series are designed for usage in switch and attenuator applications requiring high power handling and low distortion. The MELF and HIPAX PIN diodes incorporate a fully passivated PIN diode chip resulting in an extremely low reverse bias leakage current. The semiconductor technology utilized in the MELF and HIPAX families draws on M/A-COM’s substantial experience in PIN diode design and wafer fabrication. The result is a device which has a thick I-region and long carrier lifetime while maintaining low series resistance and capacitance values. The chips of the MELF and HIPAX PIN diodes are enclosed in a rugged ceramic package and is full face bonded to metal pins on both the anode and cathode. The result is a low loss PIN diode with low thermal resistance due to symmetrical thermal paths. The parts are offered in either a HIPAX , axial leaded or Metal Electrode Leadless Faced (MELF) surface mount packages that have a rectangular outline. These rectangular SMQ, PIN diodes are designed for high volume tape and reel assembly. This easy to use package design makes automatic pick and place, indexing and assembly, extremely easy. The parallel flat surfaces are suitable for most key jaw or vacuum pick-up techniques. All solderable surfaces are tin plated and compatible with industry standard reflow and vapor phase soldering processes. HIPAX PIN diodes are designed for use in a wide variety of switch and attenuator applications from HF through UHF frequencies and at power levels above 1kW, CW. The internal chip as well as each diode assembly has been comprehensively tested and characterized to ensure predictable and repeatable performance. Design Recommendations ♦Low Distortion Attenuators •MA4P4301B ♦Surface Mount Switches •MA4P7101F ♦Cellular Radio Antenna Switches • MA4P1200, MA4P1250 Absolute Maximum Ratings TAMB = +25°C (Unless Otherwise Noted) 1,2 Parameter D.C. Reverse Voltage Absolute Maximum (See Tables) Operating Chip Junction Temperature -55°C to +175°C Storage Temperature -55°C to +200°C Installation Temperature +280°C for 30 Seconds Notes 1. Operation of this device above any one of these parameters may cause permanent damage. 2. Please refer to application note M538 for surface mounting instructions. 1 • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 MA4P1000 Series Electrical Specifications @ TAMB = +25°C VR Reverse Voltage VDC Part Number CT Total Capacitance pF RS Series Resistance Ω RP Parallel Resistance kΩ Conditions Conditions Conditions Condition f = 1 MHz VR = 50 V IR = 10 μA MINIMUM f = 100 MHz VR = 0 V MAXIMUM TYPICAL MAXIMUM TYPICAL MAXIMUM RATING MINIMUM MA4P1200 - 401T 50 100 1.2 1.5 0.5 0.75 5 MA4P1250 -1072T 50 100 0.8 1.2 0.5 0.75 5 MA4P1450 -1091T 50 100 1.8 2.5 0.5 0.75 5 VF Forward Voltage TL Carrier Lifetime Condition Part Number IF = 50 mA TYPICAL MA4P1200 - 401T1 * f = 100 MHz IF = 50 mA Forward Bias Reverse Bias Harmonic Distortion Harmonic Distortion R(2a/a) * R(3a/a) R(2a/a) – R(3a/a) Conditions Conditions Conditions IF = 10 mA IR = 6 mA f = 100 MHz PIN = 30 W f = 100 MHz PIN = 0 dBm MAXIMUM 2 MINIMUM TYPICAL MINIMUM TYPICAL MINIMUM TYPICAL RATING 0.85 1.0 2 8 80 90 60 70 MA4P1250 -1072T 1 0.85 1.0 2 8 80 90 60 70 MA4P1450 -1091T 1 0.85 1.0 2 8 80 90 60 70 Notes: 1.) Also available in a non-magnetic package for MRI applications. Same electrical specifications as above. Non-magnetic version of the MA4P1200 - 401T = MA4P1200NM - 401T Non-magnetic version of the MA4P1250 - 1072T = MA4P1250NM -1072T 2.) Maximum forward current for all devices @ 1V is 1.5A Power Dissipation and Thermal Resistance Ratings @ TAMB = +25°C Package Style B Axial Lead F MELF CONDITION MA4P1200-401T MA4P1250-1072T MA4P1450-1091T PDISS PDISS θJC PDISS θJC — — — — — — — — No Heatsink 1.5 W Lead Length 1/4" 5.5W θJC 15°C/W No Heatsink 6W Infinite Heatsink 18W 15°C/W 10W 30W 5°C/W Specifications subject to change without notice 2 • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 Typical Performance Curves @ TAMB = +25°C MA4P1200 Series Capacitance vs. Frequency & Reverse Bias Capacitance Series Resistance Series Resistance @ 100 MHz vs. Forward Current Ω pF MHz Frequency Forward Current Heatsink Temperature vs. Max. Power Dissipation Ω MHz Frequency 3 Watts Maximum Power Dissipation Parallel Resistance Parallel Resistance vs. Frequency & Reverse Bias °C Heatsink Temperature • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 Typical Performance Curves @ TAMB = +25°C MA4P1250 Series Capacitance vs. Frequency & Reverse Bias Capacitance Series Resistance Series Resistance @ 100 MHz vs. Forward Current Ω MHz Frequency Forward Current Carrier Lifetime vs. Forward Bias Current Carrier Lifetime Parallel Resistance Parallel Resistance vs. Frequency & Reverse Bias Ω MHz Frequency 4 pF Forward Current • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 Typical Performance Curves @ TAMB = +25°C MA4P1450 Series Capacitance vs. Frequency and Reverse Bias Capacitance Series Resistance Series Resistance @ 100 MHz vs. Forward Current Ω pF MHz Forward Current Frequency Parallel Resistance Parallel Resistance vs. Frequency and Reverse Bias Ω MHz Frequency 5 • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 MA4P4000 - MA4P7000 Series Electrical Specifications @ TAMB = +25°C Parameter Symbol Maximum Series Resistance RS Maximum Total Capacitance CT Minimum Parallel Resistance RP Minimum Carrier Lifetime TL Maximum Forward Voltage VF Maximum Reverse Current IR Nominal I-Region Width μ MA4P4000 Series MA4P4300 Series MA4P7000 Series MA4P7100 Series 0.5 Ω 1.0 Ω 0.9 Ω 0.5 Ω 2.2 pF 2.0 pF 0.7 pF 1.0 pF 20 kΩ 50 kΩ 200 kΩ 100 kΩ 6 µs 8 µs 3 µs 2.5 µs 1.0 V 1.2 V 1.0 V 1.0 V At Maximum Rated Reverse Voltage 1 µA 1 µA 1 µA 1 µA — 175 µm 300 µm 175 µm 100 µm Condition IF = 100 mA f = 100 MHz VR = 100 V f = 1 MHz VR = 100 V f = 100 MHz IF = 10 mA IR = 6 mA IF = 100 mA Maximum Rated Reverse Voltage ( VR ) vs. Model Numbers Maximum Rated Reverse 100 Volts 200 Volts 400 Volts 600 Volts MA4P4000 Series MA4P4300 Series MA4P7000 Series MA4P4001B-402 MA4P4001F-1091T MA4P4002B-402 MA4P4002F-1091T MA4P4301B-402 MA4P4301F-1091T MA4P7001F-1072T — MA4P7002B-401T MA4P7002F-1072T — — MA4P4006B-402 MA4P4006F-1091T MA4P7100 Series — MA4P7101B-401/401T MA4P7101F-1072T MA4P7102B-401/401T MA4P7102F-1072T MA4P7104B-401/401T MA4P7104F-1072T MA4P7006B-401T MA4P7006F-1072T — — Power Dissipation and Thermal Resistance Ratings @ TAMB = +25°C Package Style MA4P4000 Series Condition MA4P4300 Series MA4P7000 Series MA4P7100 Series PDISS θJC PDISS θJC PDISS θJC PDISS θJC 1/4” Lead Length 12 W 12.5°C/W 10 W 15°C/W 5W 30°C/W 6W 25°C/W No Heatsink 2.5 W — 2.5 W — 1.5 W — 1.5 W — F MELF Infinite Heatsink 7.5 W 20°C/W 5W 30°C/W 3W 50°C/W 3W 50°C/W Both B and F Single 1 µs pulse 100 kW — 100 kW — 15 kW — 15 kW — Both B and F Single 100 µs pulse 5 kW 0.03°C/W 5 kW B Axial Leaded 0.03°C/W 300 W 0.5°C/W 300 W 0.5°C/W *Specifications subject to change without notice 6 • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 Typical Performance Curves @ TAMB = +25°C MA4P4000,MA4P4300, MA4P7000, MA4P7100 Series Series Resistance at 100 MHz vs. Forward Current MA4P7000, MA4P7100 Series Series Resistance Series Resistance Series Resistance at 100 MHz vs. Forward Current MA4P4000, MA4P4300 Series Ω Ω Forward Current Forward Current Carrier Lifetime vs. Forward Bias Current MA4P4000, MA4P4300, MA4P7000 & MA4P7100 Series Carrier Lifetime Thermal Resistance Thermal Resistance vs. Pulse Width MA4P4000, MA4P4300, MA4P7000 & MA4P7100 Series °C/W µS Forward Current Pulse Width 7 • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 Typical Performance Curves @ TAMB = +25°C MA4P4000, MA4P4300, MA4P7000, MA4P7100 Series Capacitance vs. Frequency & Reverse Bias MA4P4300 Series Capacitance Capacitance Capacitance vs. Frequency & Reverse Bias MA4P4000 Series pF pF MHz MHz Frequency Frequency Capacitance vs. Frequency & Reverse Bias MA4P7100 Series 8 Capacitance Capacitance Capacitance vs. Frequency & Reverse Bias MA4P7000 Series pF pF MHz MHz Frequency Frequency • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 Typical Performance Curves @ TAMB = +25°C MA4P4000, MA4P4300, MA4P7000, MA4P7100 Series Parallel Resistance vs. Reverse Bias & Frequency MA4P4300 Series Parallel Resistance Parallel Resistance Parallel Resistance vs. Reverse Bias & Frequency MA4P4000 Series Ω Ω Volts Reverse Bias Volts Reverse Bias Ω Volts Reverse Bias 9 Parallel Resistance vs. Reverse Bias & Frequency MA4P7100 Series Parallel Resistance Parallel Resistance Parallel Resistance vs. Reverse Bias & Frequency MA4P7000 Series Ω Volts Reverse Bias • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 Case Styles 401 Axial Leaded Packages 402 Axial Leaded Packages Cathode Band Cathode Band B C C C A INCHES A MA4P7002B-401T MA4P7006B-401T B MA4P7101B-401T MA4P7102B-401T C MA4P7104B-401T D MM MIN. MAX MIN. MAX. — 0.130 — 3.30 — 0.090 — 2.29 0.975 24.77 — 0.027 0.029 0.69 0.74 1091 MELF Surface Mount Packages MA4P4001B-402 MA4P4002B-402 MA4P4006B-402 MA4P4301B-402 MIN. MAX MIN. MAX. A — 0.230 — 5.84 B — 0.140 — 3.56 C 0.975 24.64 — D 0.039 0.041 0.76 1.02 INCHES Cathode B A B Solderable Surfaces Solderable Surfaces A C C MA4P4001F-1091T A MA4P4002F-1091T MA4P4006F-1091T B MA4P4301F-1091T C INCHES MM MIN. MAX. MIN. MAX. 0.138 0.155 3.51 3.94 0.180 0.200 4.57 5.08 0.008 0.030 0.203 0.762 Parts Available In 1072 Package (tape and reel only) Dimension Dimension Parts Available in 1091 Package (tape and reel only) MM 1072 MELF Surface Mount Packages Cathode A A C A Parts Available in 402 Package (bulk only) D Dimension Dimension Parts Available in 401 Package (tape and reel) B D INCHES MIN. MAX. MM MIN. MAX. MA4P7001F-1072T A 0.080 0.095 2.032 2.413 MA4P7002F-1072T MA4P7006F-1072T B 0.115 0.135 2.921 3.429 MA4P7101F-1072T MA4P7104F-1072T C 0.008 0.030 0.203 0.762 *Specifications subject to change without notice Data Sheets contain information regarding a product M/A-COM Technology Solutions 10 ADVANCED: is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 MELF Assembly Recommendations ♦ Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. Axial leads and solderable surfaces of MELF devices are tin plated 50 μM thick to ensure an optimum connection. ♦ For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM website. MELF Internal Construction Circuit Pad Layout for MELF Diodes Dimension Package Style 1072 Package Style 1091 inches mm inches mm A 0.093 2.36 0.150 3.81 B 0.050 1.27 0.050 1.27 C 0.060 1.52 0.100 2.54 A B C B Ordering Information MELF diodes are available in tape and reel in quantities as shown in table below Package Style Quantity 7” Reel Bulk Devices Per Bag 1072T 1500 N/A 1091T 500 N/A Tape and reel information can be found on the M/A-COM website at http://www.macomtech.com/Application Notes/pdf/M513.pdf *Specifications subject to change without notice Data Sheets contain information regarding a product M/A-COM Technology Solutions 11 ADVANCED: is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4P HIPAX™ High Power PIN Diodes V9 Axial Leaded HIPAX Assembly Recommendations ♦ Bends on case styles 401 and 402, axially leaded devices, must be made while holding the lead firm and forming the bend no closer than .060 inches from the body of the part. Bending the lead < 0.060 inches from the body of the part is not recommended and may cause internal damage to the chip. Appropriate fixturing should be used. ♦ Devices may be soldered using standard 60Sn/40Pb or any RoHS compliant solders. Axial leads are tin plated 50μm thick to ensure an optimum connection. ♦ For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM website. Case Style 401 & 402 Internal Construction Case Style 401 & 402 Minimum Bend Distance Cathode Band Passivated Chip .060” Min .060” Min Ordering Information Axial leaded diodes are available in tape and reel or bulk in quantities as shown in table below Package Style Quantity Per Reel Bulk Devices Per Bag 401T 500 N/A 402 N/A 100 Environmental Ratings HIPAX PIN diodes are designed to meet most environmental and electrical requirements and may be ordered screened to MIL-STD-750 specifications as described in the table below. TEST METHOD DESCRIPTION/ CONDITIONS Moisture Resistance High Temperature Storage HTRB Temperature Shock Fine Leak Constant Acceleration Solderability Tension1 Lead Fatigue1 1021 1031 1038 1051 1071 Cond. H 2006 2026 2036.3 Cond. A 2036.3 Cond. E 85°C, 85% Relative Humidity, 168 hrs +175°C , 250 Hours 80% of rated VR, 50°C, 96 Hours -65°C to +175°C, 20 Cycles 1 X 10-7 CC/Sec 20,000 G’s IPC/JDEC J-STD-02 2 Lbs., 30 Seconds 3 Cycles, 8 oz., 90°, Note: 1.Test applicable to HIPAX axially leaded devices only. Data Sheets contain information regarding a product M/A-COM Technology Solutions 12 ADVANCED: is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.