TOSHIBA TLP2168

TLP2168
Photocouplers
GaAℓAs Infrared LED & Photo IC
TLP2168
1. Applications
•
Plasma Display Panels (PDPs)
•
Factory Automation (FA)
•
Measuring Instruments
2. General
The TLP2168 consists of high-intensity GaAℓAs infrared light-emitting diodes (LEDs) optically coupled to a highgain, high-speed photoreceptor chip. The TLP2168 guarantees operation at up to 125 and on supplies from 2.7
V to 5.5 V. It is offered in the SO8 package. With two LED-photoreceptor pairs, the TLP2168 helps save board
space. An internal noise shield provides superior common-mode rejection for improved noise immunity.
3. Features
(1)
Inverter logic type (open collector output)
(2)
Package: SO8
(3)
Operating temperature: -40 to 125
(4)
Supply voltage: 2.7 to 5.5 V
(5)
Data transfer rate: 20 MBd (typ.)(NRZ)
(6)
Threshold input current: 5.0 mA (max)
(7)
Supply current: 8 mA (max)
(8)
Common-mode transient immunity: ±15 kV/µs (min)
(9)
Isolation voltage: 2500 Vrms (min)
(10) Safety standards
UL-approved: UL1577 File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349
Note:
VDE-approved: Option (V4) EN60747-5-2 (Note)
When an EN60747-5-2 approved type is needed, please designate the Option (V4)
(V4).
4. Packaging and Pin Configuration
1: Anode 1
2: Cathode 1
3: Cathode 2
4: Anode 2
5: GND
6: VO2 (Output 2)
7: VO1 (Output 1)
8: VCC
11-5K1S
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Rev.3.0
TLP2168
5. Internal Circuit
Fig. 5.1 Internal Circuit
6. Principle of Operation
6.1. Truth Table
Input
LED 1 (2)
Output 1 (2)
H
ON
L
L
OFF
H
6.2. Mechanical Parameters
Characteristics
Min
Unit
Creepage distances
4.0
mm
Clearance distances
4.0
Internal isolation thickness

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Rev.3.0
TLP2168
)
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25
25
Characteristics
LED
Input forward current
Symbol
Note
Rating
Unit
IF
(Note 1)
25
mA
∆IF/∆Ta
(Note 1)
-0.67
mA/
IFP
(Note 1),
(Note 2)
40
mA
∆IFP/∆Ta
(Note 1)
-1.0
mA/
VR
(Note 1)
5
V
IO
(Note 1)
25
mA
Output voltage
VO
(Note 1)
6
V
Supply voltage
VCC
Input forward current derating
(Ta ≥ 110)
Input forward current (pulsed)
Input forward current derating
(pulsed)
(Ta ≥ 110)
Input reverse voltage
Detector Output current
Output power dissipation
Output power dissipation
derating
(Ta ≥ 110)
Common Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
6
PO
(Note 1)
40
mW
∆PO/∆Ta
(Note 1)
-0.1
mW/
Topr
-40 to 125

Tstg
-55 to 150
(10 s)
Tsol
260
AC, 1 min, R.H. ≤ 60%
BVS
(Note 3)
2500
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Each channel
Note 2: Pulse width (PW) ≤ 1 ms, duty = 50%
Note 3: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
8. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Input on-state current
IF(ON)
(Note 1),
(Note 2)
7.5

14
mA
Input off-state voltage
V
VF(OFF)
(Note 1)
0

0.8
Supply voltage
VCC
(Note 3)
2.7
3.3/5.0
5.5
Operating temperature
Topr
-40

125

Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 8 and pin 5 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: Each channel
Note 2: The rise and fall times of the input on-current should be less than 0.5 µs.
Note 3: Denotes the operating range, not the recommended operating condition.
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9. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125
, VCC = 2.7 to 5.5 V)
125
Characteristics
Input forward voltage
Input forward voltage
temperature coefficient
Input reverse current
Symbol
Note
VF
(Note 1)
∆VF/∆Ta (Note 1)
Test
Circuit
Test Condition
Min
Typ.
Max

IF = 10 mA, Ta = 25
1.4
1.57
1.8
V

IF = 10 mA

-2.0

mV/

VR = 5 V, Ta = 25


10
µA
V = 0 V, f = 1 MHz, Ta = 25

60

pF
VF = 0.8 V, VO = 5.5 V,
VCC = 5.5 V


50
µA
VF = 0.8 V, VO = 5.5 V,
VCC = 5.5 V, Ta = 25


10
Fig.
12.1.2
IF = 10 mA,
IO = 13 mA (Sinking)

0.2
0.6
V
mA
IR
(Note 1)
Input capacitance
Ct
(Note 1)

High-level output current
IOH
(Note 1)
Fig.
12.1.1
(Note 1)
Unit
Low-level output voltage
VOL
Low-level supply current
ICCL
Fig.
12.1.3
IF1 = IF2 = 10 mA

3.8
8
High-level supply current
ICCH
Fig.
12.1.4
IF = 0 mA

3.4
8
Threshold input current (H/L)
IFHL
IO = 13 mA (Sinking),
VO < 0.6 V

1.0
5.0
Min
Typ.
Max
Unit

0.8

pF
1×1012
1014

Ω
Vrms
(Note 1)

Note: All typical values are at Ta = 25.
Note 1: Each channel
)
25
10. Isolation Characteristics (Unless otherwise specified, Ta = 25
Characteristics
Symbol
Note
Test Conditions
Total capacitance (input to
output)
CS
(Note 1) VS = 0 V, f = 1 MHz
Isolation resistance
RS
(Note 1) VS = 500 V, R.H. ≤ 60%
Isolation voltage
BVS
(Note 1) AC, 1 min
2500


AC, 1 s in oil

5000

DC, 1 min in oil

5000

Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
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TLP2168
11. Switching Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125
, VCC = 2.7 to 5.5 V (Each channel))
125
Characteristics
Symbol
Note
Propagation delay time
(H/L)
tpHL
(Note 1)
Propagation delay time
(L/H)
tpLH
Pulse width distortion
Test
Circuit
Min
Typ.
Max
Unit
IF = 0 → 7.5 mA, RL = 350 Ω,
CL = 15 pF

35
60
ns
(Note 1)
IF = 7.5 → 0 mA, RL = 350 Ω,
CL = 15 pF

35
60
|tpHLtpLH|
(Note 1)
IF = 0 ←→ 7.5 mA, RL = 350 Ω,
CL = 15 pF


35
tpsk
(Note 1),
(Note 2)
-40

40
Fall time
tf
(Note 1)
IF = 0 → 7.5 mA, RL = 350 Ω,
CL = 15 pF

30

Rise time
tr
(Note 1)
IF = 7.5 → 0 mA, RL = 350 Ω,
CL = 15 pF

30

VCM = 1000 Vp-p, IF = 0 mA,
VCC = 5 V, Ta = 25
15


VCM = 1000 Vp-p, IF = 10 mA,
VCC = 5 V, Ta = 25
-15


Propagation delay skew
(device to device)
Common-mode transient
immunity at output high
CMH
Common-mode transient
immunity at output low
CML
Fig.
12.1.5
Fig.
12.1.6
Test Condition
kV/µs
Note: All typical values are at Ta = 25.
Note 1: f = 5 MHz, duty = 50%, input current tr = tf = 5 ns or less, CL is approximately 15 pF which includes probe and
stray wiring capacitance.
Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH
that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).
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TLP2168
12. Test Circuits and Characteristics Curves
12.1. Test Circuits
Fig. 12.1.1 IOH Test Circuit
Fig. 12.1.2 VOL Test Circuit
Fig. 12.1.3 ICCL Test Circuit
Fig. 12.1.4 ICCH Test Circuit
Fig. 12.1.5 Switching Time Test Circuit and Waveform
Fig. 12.1.6 Common-Mode Transient Immunity and Waveform
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TLP2168
12.2. Characteristics Curves (Note)
Fig. 12.2.1 IF - VF
Fig. 12.2.2 IF - Ta
Fig. 12.2.3 VOL - Ta
Fig. 12.2.4 VOL - Ta
Fig. 12.2.5 VO - IF
Fig. 12.2.6 VO - IF
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TLP2168
Fig. 12.2.7 IFHL - Ta
Fig. 12.2.8 IFHL - Ta
Fig. 12.2.9 ICCH / ICCL - Ta
Fig. 12.2.10 ICCH / ICCL - Ta
Fig. 12.2.11 tpLH / tpHL - Ta
Fig. 12.2.12 |tpHL-tpLH| - Ta
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TLP2168
Fig. 12.2.13 tpLH / tpHL - Ta
Fig. 12.2.14 |tpHL-tpLH| - Ta
Fig. 12.2.15 tpLH / tpHL - IF
Fig. 12.2.16 |tpHL-tpLH| - IF
Fig. 12.2.17 tpLH / tpHL - IF
Fig. 12.2.18 |tpHL-tpLH| - IF
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLP2168
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow (See Fig. 13.1.1 and 13.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 13.1.1 An example of a temperature profile
when Sn-Pb eutectic solder is used
•
Fig. 13.1.2 An example of a temperature profile
when lead(Pb)-free solder is used
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,
respectively.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
When restoring devices after removal from their packing, use anti-static containers.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP2168
14. Land Pattern Dimensions for Reference Only
Fig. 14.1 Land Pattern Dimensions for Reference Only (unit: mm)
15. Marking
Fig. 15.1 Marking
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TLP2168
Package Dimensions
Unit: mm
Weight: 0.11 g (typ.)
Package Name(s)
TOSHIBA: 11-5K1S
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TLP2168
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
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written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
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• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
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AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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