TLP2418 TOSHIBA PHOTOCOUPLER GaAℓAs Ired & PHOTO-IC TLP2418 PDP (Plasma Display Panel) Unit: mm 8 7 6 5 1 2 3 4 3.95 ± 0.25 FA (Factory Automation) Interfaces of measuring and control instruments Operate at high ambient temperatures up to 125°C The Toshiba TLP2418 consists of GaAℓAs infrared light emitting diodes and integrated high-gain, high-speed photodetectors. The TLP2418 is housed in the SO8 package. The output stage is an open collector type. The photodetector has an internal Faraday shield that provides a guaranteed common-mode transient immunity of ±15 kV/μs. 5.1 ± 0.2 1.27 ± 0.15 0.38 z Inverter logic type (Open collector output) z Package: SO8 z Guaranteed performance over: -40 to 125°C z Power supply voltage: 4.5 to 5.5 V z Input threshold current: IFHL = 5.0 mA (max) z Propagation delay time tpHL/tpLH: 75 ns (max) z Common-mode transient immunity: ±15 kV/μs (min) z Isolation voltage: 3750 Vrms (min) z UL under application : UL1577, File No.E67349 z c-UL under application : CSA Component Acceptance Service No. 5A, File No.E67349 z Option(V4) 0.1 ± 0.1 2.5 ± 0.2 6.0 ± 0.2 0.305 min 11-5K1 JEDEC ― JEITA ― TOSHIBA 11−5K1 Weight: 0.11 g(Typ.) VDE under application : EN 60747-5-2 Pin Configuration (Top View) Truth Table Input H L LED ON OFF Output L Schematic ICC IF IO VCC 1 H 2 7 3 6 4 8 VCC 8 GND SHIELD 5 1:NC 2:ANODE 3:CATHODE 4:NC 5:GND 6:VO(Output) 7:NC 8:VCC VO 2＋ 6 3－ SHIELD GND 5 1 2009-12-26 TLP2418 Absolute Maximum Ratings (Ta=25°C) Characteristic Symbol Forward Current LED Unit IF 25 mA ΔIF /°C -0.67 mA/°C IFPT 50 mA ΔIFPT /°C -1.34 mA/°C VR 5 V IO 25 mA Output Voltage VO 6 V Supply Voltage VCC 6 V PO 80 mW ΔPO /°C -2.0 mW/°C Forward Current Derating (Ta ≥ 110°C) Peak Transient Forward Current (Note 1) Peak Transient Forward Current Derating (Ta ≥ 110°C) Reverse Voltage Output Current Detector Rating (Ta ≤ 125℃) Output Power Dissipation Output Power Dissipation Derating (Ta ≥ 110°C) Operating Temperature Range Topr -40 to 125 °C Storage Temperature Range Tstg -55 to 150 °C Tsol 260 °C BVs 3750 Vrms Lead Soldering Temperature (10 s) Isolation Voltage (AC,1 min.,R.H.≤ 60%,Ta=25°C) (Note 2) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width ≤ 1ms, duty = 50%. Note 2: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together, as are pins 5, 6, 7 and 8. Recommended Operating Conditions Characteristic Symbol Min Typ. Max Unit Input Current , High Level IFH 7.5 - 15 mA Input Voltage , Low Level VFL 0 - 0.8 V Supply Voltage* VCC 4.5 - 5.5 V Operating Temperature Topr -40 - 125 °C * This item denotes operating range, not meaning of recommended operating conditions. Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. 2 2010-01-27 TLP2418 Electrical Characteristics (Unless otherwise specified, Ta=-40 to 125°C, VCC=4.5 to 5.5 V) Characteristic Symbol Test Condition Circuit Min Typ. Max Unit 1.40 1.57 1.80 V VF - IF = 10 mA , Ta = 25 °C ΔVF/ΔTa - IF = 10 mA - -1.8 - mV/°C Input Reverse Current IR - VR = 5 V , Ta = 25 °C - - 10 μA Input Capacitance CT - V = 0 , f = 1 MHz, Ta = 25 °C - 60 - pF Logic High Output Current IOH 1 VF = 0.8 V , VO = 5.5 V - - 250 Ta = 25 ℃ - 0.5 10 Logic Low Output Voltage VOL 2 IF = 10 mA, IO = 13 mA (Sinking) - 0.2 0.6 V Logic Low Supply Current ICCL 3 IF = 10 mA - 1.5 5 mA Logic High Supply Current ICCH 4 IF = 0 mA - 1.5 5 mA IFHＬ - IO = 13 mA (Sinking), VO < 0.6 V - 1.0 5.0 mA Input Forward Voltage Temperature Coefficient of Forward Voltage “H Level Output to L Level Output” Input Current μA *All typical values are at Ta=25°C, VCC=5 V unless otherwise specified Isolation Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Capacitance input to output CS VS = 0,f = 1 MHz (Note 2) Isolation resistance RS R.H. ≤ 60%,VS = 500 V (Note 2) 1×10 AC,1 minute Isolation voltage BVS ― 12 Typ. Max Unit 0.8 ― pF ― Ω 10 14 3750 ― ― AC,1 second,in oil ― 10000 ― DC,1 minute,in oil ― 10000 ― 3 Vrms Vdc 2010-01-27 TLP2418 Switching Characteristics (Unless otherwise specified, Ta=-40 to 125 °C, VCC=4.5 to 5.5V) Characteristic Symbol Test Circuit Condition Min Typ. Max Unit - 30 75 ns - 35 75 ns - - 35 ns -50 - 50 ns - 30 - ns - 30 - ns VCM=1000 Vp-p , IF=0 mA, VCC=5 V , Ta=25°C 15 - - kV/μs VCM=1000 Vp-p , IF=10 mA, VCC=5 V , Ta=25°C -15 - - kV/μs RL=350Ω CL=15pF Propagation delay time (H→L) tpHL IF=0→7.5 mA Propagation delay time (L→H) tpLH IF=7.5→0 mA (Note 4) Switching Time Dispersion |tpHL- between ON and OFF tpLH| Propagation Delay Skew (Note 5) tpsk RL=350Ω, IF=0 7.5 mA 5 CL=15pF (Note 4) RL=350Ω CL=15pF Fall Time (90 – 10 %) tf IF=0→7.5 mA Rise Time (10 – 90 %) tr IF=7.5→0 mA (Note 4) Common Mode transient Immunity at High Level Output Common Mode transient Immunity at Low Level Output CMH 6 CML *All typical values are at Ta=25°C Note 3: A ceramic capacitor (0.1 μF) should be connected from pin 8 (VCC) to pin 5 (GND) to stabilize the operation of the high gain linear amplifier. Failure to provide the bypass may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. Note 4: f = 5MHz, duty = 50%, input current tr = tf = less than 5ns, CL is approximately 15pF which includes probe and Jig/stray wiring capacitance. Note 5: Propagation delay skew is defined as the difference between the largest and smallest propagation delay times (i.e. tpHL or tpLH) of multiple samples. Evaluations of these samples are conducted under identical test conditions (supply voltage, input current, temperature, etc). TEST CIRCUIT 1: IOH Test Circuit TEST CIRCUIT 2: VOL Test Circuit 0.1μF VF 0.1μF IF VCC SHIELD ↑ V A VO IOH SHIELD TEST CIRCUIT 3: ICCL Test Circuit IF VCC VOL IO TEST CIRCUIT 4: ICCH Test Circuit ICCL ICCH A A 0.1 μF VCC 0.1 μF SHIELD VCC SHIELD 4 2010-01-27 TLP2418 TEST CIRCUIT 5: Switching Time Test Circuit IF = 7.5mA(P.G) (f = 5MHz , duty = 50%, tr = tf = less than 5ns) IF 50% 0.1μF P.G. tpHL RL=350Ω IF monitor VO SHIELD 90% VCC *CL=15pF VOL 1.5 V 10% tf RIN=100Ω *CL=15pF tpLH VO tr CL includes probe and stray capacitance. P.G.: Pulse generator TEST CIRCUIT 6: Common-Mode Transient Immunity Test Circuit 90% VCM 0.1 μF RL=350Ω A 10% IF SW 1000 V → B tf tr VCC ・SW B : IF=0 mA VO CMH 2V VO SHIELD 0.8 V CML ・SW A : IF=10 mA ＋ VCM － CM 5 H = 800(V ) t f ( μs) CM L = 800(V ) t r ( μs) 2010-01-27 TLP2418 PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING & GENERAL STORAGE (1) Precautions for Soldering 1) When Using Soldering Reflow z An example of a temperature profile when Sn-Pb eutectic solder is used: This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. z An example of a temperature profile when lead(Pb)-free solder is used: This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. z Reflow soldering must be performed once or twice. z The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) z Apply preheating of 150 deg.C for 60 to 120 seconds. z Mounting condition of 260 deg.C or less within 10 seconds is recommended. z Flow soldering must be performed once 3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) z Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds not exceeding 350 deg.C. z Heating by soldering iron must be only once per 1 lead 6 2010-01-27 TLP2418 (2) Precautions for General Storage 1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 degree C to 35 degree C, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used. 7 2010-01-27 TLP2418 Specification for Embossed–Tape Packing (TP) for SO8 Coupler 1. Applicable Package Package Product Type SO8 Photocoupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP2418 (TP) Tape type Device name 3. Tape Dimensions 3.1 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Tape feed Figure 1 Device Orientation 3.2 Tape Packing Quantity: 2500 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table 1 Empty Device Recesses Standard Occurrences of 2 or more successive empty device recesses Single empty device recesses Remarks Within any given 40-mm section of tape, not including leader and trailer 0 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. 8 2010-01-27 TLP2418 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2. F B D E G φ1.6 ± 0.1 K0 12.0 ± 0.3 +0.1 0.3 ± 0.05 φ1.5 −0 A 3.3 ± 0.1 Figure 2 Tape Forms Table 2 Tape Dimensions Unit: mm Unless otherwise specified: ±0.1 Symbol Dimension Remark A 6.5 ― B 5.6 ― D 5.5 Center line of indented square hole and sprocket hole E 1.75 F 8.0 G 4.0 K0 3.1 Distance between tape edge and hole center +0.1 Cumulative error -0.3 (max) per 10 feed holes Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space 9 2010-01-27 TLP2418 3.6 Reel A C U B (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3. E W1 W2 Figure 3 Reel Form Table 3 Reel Dimensions Unit: mm Symbol Dimension A Φ330 ±2 B Φ80 ±1 C Φ13 ±0.5 E 2.0 ±0.5 U 4.0 ±0.5 W1 13.5 ±0.5 W2 17.5 ±1.0 4. Packing Either one reel or five reels of photocoupler are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) TLP2418 (TP) 2500 pcs Quantity (must be a multiple of 2500) Tape type Device name 10 2010-01-27 TLP2418 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 11 2010-01-27