MBR0530, NRVB0530 Surface Mount Schottky Power Rectifier Plastic SOD−123 Package The MBR0530 uses the Schottky Barrier principle with a large area metal−to−silicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. This package also provides an easy to work with alternative to leadless 34 package style. These state−of−the−art devices have the following features: Features • • • • • • • http://onsemi.com SCHOTTKY BARRIER RECTIFIER 0.5 AMPERES 30 VOLTS Guardring for Stress Protection Low Forward Voltage 125°C Operating Junction Temperature Epoxy Meets UL 94, V−0 @ 0.125 in Package Designed for Optimal Automated Board Assembly NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* SOD−123 CASE 425 STYLE 1 MARKING DIAGRAM Mechanical Characteristics • • • • • Polarity Designator: Cathode Band Weight: 11.7 mg (approximately) Case: Epoxy, Molded Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 1 B3 M G B3 MG G = Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† MBR0530T1G SMB (Pb−Free) 3,000 / Tape & Reel ** NRVB0530T1G SMB (Pb−Free) 3,000 / Tape & Reel ** MBR0530T3G SMB (Pb−Free) 10.000 / Tape & Reel *** NRVB0530T3G SMB (Pb−Free) 10.000 / Tape & Reel *** Device *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2013 September, 2013 − Rev. 7 1 ** 8 mm Tape, 7” Reel *** 8 mm Tape, 13” Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MBR0530T1/D MBR0530, NRVB0530 MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 30 V Average Rectified Forward Current (Rated VR, TL = 100°C) IF(AV) Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Storage Temperature Range Tstg −65 to +150 Operating Junction Temperature TJ −65 to +125 °C dv/dt 1000 V/ms Voltage Rate of Change (Rated VR) A 0.5 A 5.5 ESD Rating: Machine Model = C Human Body Model = 3B °C V > 400 > 8000 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance − Junction−to−Ambient (Note 1) RqJA 206 °C/W Thermal Resistance − Junction−to−Lead RqJL 150 °C/W Symbol Value Unit 1. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 2) (iF = 0.1 Amps, TJ = 25°C) (iF = 0.5 Amps, TJ = 25°C) vF Maximum Instantaneous Reverse Current (Note 2) (Rated DC Voltage, TC = 25°C) (VR = 15 V, TC = 25°C) IR V 0.375 0.43 mA 130 20 104 1 TJ = 125°C 75°C 25°C I R, REVERSE CURRENT (A) μ iF, INSTANTANEOUS FORWARD CURRENT (AMPS) 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2%. -40°C 0.1 TJ = 125°C 1000 100 75°C 10 25°C 1 0.01 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0 5 10 15 20 25 30 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current http://onsemi.com 2 35 40 MBR0530, NRVB0530 180 C, CAPACITANCE (pF) 160 TYPICAL CAPACITANCE AT 0 V = 170 pF 140 120 100 80 60 40 20 0 5 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Capacitance AVERAGE FORWARD CURRENT (AMP) 1 0.875 DC 0.75 0.625 SQUARE WAVE 0.5 =p 0.375 =5 0.25 = 10 0.125 Ipk/Iav = 20 0 60 67 74 81 88 95 102 109 116 123 130 LEAD TEMPERATURE (°C) P F(AV), AVERAGE POWER DISSIPATION (WATT) Figure 4. Current Derating (Lead) 0.35 0.315 TJ = 125°C SQUARE WAVE 0.28 DC =p 0.245 =5 = 10 0.21 Ipk/Iav = 20 0.175 0.14 0.105 0.07 0.035 0 0 0.1 0.2 0.3 0.4 0.5 0.6 IF(AV), AVERAGE FORWARD CURRENT (AMP) Figure 5. Power Dissipation http://onsemi.com 3 0.7 0.8 MBR0530, NRVB0530 PACKAGE DIMENSIONS SOD−123 CASE 425−04 ISSUE G D ÂÂÂÂ ÂÂÂÂ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A1 1 HE DIM A A1 b c D E HE L q E 2 MIN 0.037 0.000 0.020 --0.055 0.100 0.140 0.010 0° INCHES NOM 0.046 0.002 0.024 --0.063 0.106 0.145 ----- MAX 0.053 0.004 0.028 0.006 0.071 0.112 0.152 --10 ° STYLE 1: PIN 1. CATHODE 2. ANODE q L b MILLIMETERS MIN NOM MAX 0.94 1.17 1.35 0.00 0.05 0.10 0.51 0.61 0.71 ----0.15 1.40 1.60 1.80 2.54 2.69 2.84 3.56 3.68 3.86 ----0.25 --10 ° 0° C SOLDERING FOOTPRINT* ÉÉ ÉÉ ÉÉ 0.91 0.036 2.36 0.093 4.19 0.165 ÉÉ ÉÉ ÉÉ SCALE 10:1 1.22 0.048 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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