MSB710−RT1 Preferred Device PNP General Purpose Amplifier Transistor Surface Mount Features http://onsemi.com • Pb−Free Package is Available COLLECTOR 3 MAXIMUM RATINGS (TA = 25°C) Rating Symbol Value Unit Collector−Base Voltage V(BR)CBO −60 Vdc Collector−Emitter Voltage V(BR)CEO −50 Vdc Emitter−Base Voltage V(BR)EBO −7.0 Vdc IC −500 mAdc IC(P) −1.0 Adc Symbol Max Unit Power Dissipation PD 200 mW Junction Temperature TJ 150 °C Storage Temperature Tstg −55 to +150 °C Collector Current − Continuous Collector Current − Peak 2 BASE 1 EMITTER 3 THERMAL CHARACTERISTICS Characteristic 2 1 SC−59 CASE 318D Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. MARKING DIAGRAM ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Symbol Min Max Collector−Emitter Breakdown Voltage (IC = −10 mAdc, IB = 0) V(BR)CEO −50 − Collector−Base Breakdown Voltage (IC = −10 mAdc, IE = 0) V(BR)CBO −60 − Emitter−Base Breakdown Voltage (IE = −10 mAdc, IC = 0) V(BR)EBO −7.0 − Collector−Base Cutoff Current (VCB = −20 Vdc, IE = 0) ICBO − −0.1 DC Current Gain (Note 1) (VCE = −10 Vdc, IC = −150 mAdc) (VCE = −10 Vdc, IC = 500 mAdc) hFE1 hFE2 120 40 240 − Collector−Emitter Saturation Voltage (IC = − 300 mAdc, IB = − 30 mAdc) VCE(sat) − −0.6 Collector−Base Saturation Voltage (IC = − 300 mAdc, IB = − 30 mAdc) VBE(sat) − Output Capacitance (VCB = −10 Vdc, IE = 0, f = 1.0 MHz) 1 Unit CR M G G Vdc CR = Device Code M = Date Code* G = Pb−Free Package Vdc Vdc mAdc (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. − ORDERING INFORMATION Vdc Vdc pF Cob Package MSB710−RT1 SC−59 3000 / Tape & Reel SC−59 (Pb−Free) 3000 / Tape & Reel MSB710−RT1G −1.5 − 15 1. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%. Shipping † Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2006 January, 2006 − Rev. 4 1 Publication Order Number: MSB710−RT1/D MSB710−RT1 PACKAGE DIMENSIONS SC−59 CASE 318D−04 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. D 3 HE 2 DIM A A1 b c D E e L HE E 1 b e MIN 1.00 0.01 0.35 0.09 2.70 1.30 1.70 0.20 2.50 MILLIMETERS NOM MAX 1.15 1.30 0.06 0.10 0.43 0.50 0.14 0.18 2.90 3.10 1.50 1.70 1.90 2.10 0.40 0.60 2.80 3.00 MIN 0.039 0.001 0.014 0.003 0.106 0.051 0.067 0.008 0.099 INCHES NOM 0.045 0.002 0.017 0.005 0.114 0.059 0.075 0.016 0.110 MAX 0.051 0.004 0.020 0.007 0.122 0.067 0.083 0.024 0.118 C A L A1 SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.4 0.094 1.0 0.039 0.8 0.031 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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