ONSEMI NS3L500

NS3L500
3.3V, 8-Channel, 2:1 Gigabit
Ethernet LAN Switch with
LED Switch
Features
•
•
•
•
•
•
•
•
•
•
•
•
VCC Operating Range: +3.0 V to +3.6 V
Low ON−State Resistance (RON = 4 W Typical)
Low ON−State Capacitance (CON = 7 pF Typical)
Flat ON−State Resistance (RON(flat) = 0.5 W Typical)
Wide Bandwidth (800 MHz Typical)
Low Crosstalk (XTALK = −37 dB Typical)
Near−Zero Propagation Delay: 250 ps
Low Bit−to−Bit Skew (tsk(o) = 100 ps Max)
Three SPDT Channels for LED Signal Switching
Packaging: 56−Pin WQFN
Pin−to−Pin Compatible with PI3L500−A, TS3L500AE and
MAX4927
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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MARKING
DIAGRAMS
1
WQFN56
MT SUFFIX
CASE 510AK
A
WL
YY
WW
G
NS3L500
AWLYYWWG
The NS3L500 is a 8−channel 2:1 LAN switch with 3 additional
built−in SPDT switches for LED routing. This switch is ideal for
Gigabit LAN applications due to its low ON−state resistance and
capacitance giving the switch a typical bandwidth of 800 MHz. The
switch also has excellent ON−state resistance match, low bit−to−bit
skew, and low crosstalk among channels. The switch is bidirectional
and offers little or no attenuation of the high−speed signals at the
outputs.
This part can be used to replace mechanical relays in low−voltage
LAN applications that interface a physical layer over CAT 5 or CAT 6
unshielded twisted pair cable through an isolation transformer. The
NS3L500 is available in a 56−pin WQFN package and operates over
the extended −40°C to +85°C temperature range.
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
Typical Applications
•
•
•
•
10/100/1000 Base−T Ethernet Signal Switching
Notebooks and Docking Stations
Hub and Router Signal Switching
Differential (LVDS, LVPECL) Signal Switching
© Semiconductor Components Industries, LLC, 2010
July, 2010 − Rev. 0
1
Publication Order Number:
NS3L500/D
V
GND
50
49
CC
2L E D
51
2
2L E D
52
2
GND
53
GN D
LED
54
55
56
V
CC
1
NS3L500
GND
1
48
0B
A
2
47
1B
1
3
46
0B
CC
4
45
1B
0
A
V
1
1
2
2
N.C.
5
44
GND
GND
6
43
2B
A
2
7
42
3B
A
3
8
41
2B
GND
9
40
3B
V
CC
10
39
GND
A
11
38
VCC
37
4B
36
5B
14
35
4B
15
34
5B
GND 16
33
SEL 17
32
V
31
LED
19
30
6B
1 20
29
7B
4
A
5
Exposed Pad
on
Underside
(Must be electrically
connected to GND)
12
GND 13
A
6
A
7
18
CC
0
1
1
2
2
1
1
2
2
GND
6B
1
7B
1
Figure 1. Pinout
(Top View)
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2
28
GND
27
CC
V
1 L ED
2
26
25
2
0 L ED
GND 24
23
1
1
1LED
22
0 LE D
GND 21
LED
2
2
NS3L500
A0
A1
2
48
3
47
46
45
A2
A3
7
43
8
42
41
40
A4
A5
11
37
12
36
35
34
A6
A7
14
32
15
31
30
29
LED 0
19
22
25
LED 1
20
23
26
LED 2
52
54
51
SEL
0B 1
1B 1
0B 2
1B 2
2B 1
3B 1
2B 2
3B 2
4B 1
5B 1
4B 2
5B 2
6B 1
7B 1
6B 2
7B 2
0LED1
0LED2
1LED1
1LED2
2LED1
2LED2
17
Figure 2. Block Diagram
PIN DESCRIPTION
TRUTH TABLE
Pin Name
Description
SEL
Function
Ax
Data I/Os
L
Ax to xB1: LEDx to xLED1
xBy
Data I/Os
H
Ax to xB2: LEDx to xLED2
SEL
Select Input
LEDx
LED I/O Port
xLEDy
LED I/O Port
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3
NS3L500
MAXIMUM RATINGS
Symbol
Pins
Value
Unit
VCC
VCC
Positive DC Supply Voltage
Parameter
−0.5 to +5.5
V
VIN
SEL
Control Input Voltage
−0.5 to +5.5
V
VI/O
AX, xBY,
LEDX,
xLEDY
−0.5 to VCC +0.5
V
ICC
VCC
DC Output Current
$120
mA
IIK
SEL
Control Input Clamp Current
−50
mA
II/O
AX, xBY,
LEDX,
xLEDY
$120
mA
125
°C/W
−65 to +150
°C
Switch I/O Voltage Range
ON−State Switch Current
Thermal Resistance, Junction−to−Air
RqJA
TS
Storage Temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Pins
Parameter
Value
Unit
VCC
VCC
Positive DC Supply Voltage
+3.0 to +3.6
V
VIN
SEL
Control Input Voltage
0 to +5.5
V
VI/O
AX, xBY,
LEDX,
xLEDY
Switch I/O Voltage Range
0 to VCC
V
−40 to +85
°C
TA
Operating Temperature
Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for section, where applicable. These
conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions.
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4
NS3L500
DC ELECTRICAL CHARACTERISTICS (Typical: T = 25°C, VCC = 3.3 V)
−405C to +855C
Symbol
Pins
Parameters
Conditions
Min
Typ
Max
Unit
1000 BASE−T ETHERNET SWITCHING
VIH
SEL
Control Input HIGH
Voltage
2
5.5
V
VIL
SEL
Control Input LOW
Voltage
−0.5
0.8
V
VIK
SEL
Clamp Diode Voltage
VCC = Max, IIN = −18 mA
−1.2
V
IIH
SEL
Input HIGH Current
VCC = Max, VIN = VCC
−1
+1
mA
IIL
SEL
Input LOW Current
VCC = Max, VIN = GND
−1
+1
mA
IOFF
SEL
Off−Leakage Current
VCC = 0 V, VIN = 0 V to 3.6 V
$1.5
mA
ICC
VCC
Quiescent Supply Current
VCC = 3.6 V,, VIN = VCC or
GND, IO = 0 mA
600
mA
ILA(OFF)
AX, xBY
Off−Leakage Current
VCC = 3.6 V, VAX = 0.3 V, 3.3 V; VxB1
or VxB2 = 3.3 V, 0.3 V
−1
+1
mA
ILA_(ON)
AX, xBY
On−Leakage Current
VCC = 3.6 V, VAX = 0.3 V, 3.3 V; VxB1
or VxB2 = 0.3 V, 3.3 V, or floating
−1
+1
mA
RON
AX, xBY
On−Resistance
VCC = 3 V, 1.5 V v VIN v VCC,
IO = −40 mA
4
7
W
RON(FLAT)
AX, xBY
On−Resistance Flatness
VCC = 3 V, VIN = 1.5 V and VCC,
IO = −40 mA
0.5
DRON
AX, xBY
On−Resistance Match
Between Switch Pairs
VCC = 3 V, 1.5 V v VIN v VCC,
IO = −40 mA
0.4
−0.7
250
W
1
W
10/100 BASE−T ETHERNET SWITCHING
VIH
SEL
Control Input HIGH
Voltage
2
5.5
V
VIL
SEL
Control Input LOW
Voltage
−0.5
0.8
V
VIK
SEL
Clamp Diode Voltage
VCC = Max, IIN = −18 mA
−1.2
V
IIH
SEL
Input HIGH Current
VCC = Max, VIN = VCC
−1
+1
mA
IIL
SEL
Input LOW Current
VCC = Max, VIN = GND
−1
+1
mA
IOFF
SEL
Off−Leakage Current
VCC = 0 V, VIN = 0 V to 3.6 V
$1.5
mA
ICC
VCC
Quiescent Supply Current
VCC = 3.6 V, VIN = VCC or GND
IO = 0 mA
600
mA
ILA(OFF)
AX, xBY
Off−Leakage Current
VCC = 3.6 V, VAX = 0.3 V, 3.3 V; VxB1
or VxB2 = 3.3 V, 0.3 V
−1
+1
mA
ILA_(ON)
AX, xBY
On−Leakage Current
VCC = 3.6 V, VAX = 0.3 V, 3.3 V; VxB1
or VxB2 = 0.3 V, 3.3 V, or floating
−1
+1
mA
RON
AX, xBY
On−Resistance
VCC = 3 V, 1.25 V v VIN v VCC,
IO = −10 mA to −30 mA
4
6
W
RON(FLAT)
AX, xBY
On−Resistance Flatness
VCC = 3 V, VIN = 1.25 V and VCC,
IO = −10 mA to −30 mA
0.5
DRON
AX, xBY
On−Resistance Match
Between Switch Pairs
VCC = 3 V, 1.25 V v VIN v VCC,
IO = −10 mA to −30 mA
0.4
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5
−0.7
250
W
1
W
NS3L500
DC ELECTRICAL CHARACTERISTICS (Typical: T = 25°C, VCC = 3.3 V)
−405C to +855C
Symbol
Pins
Parameters
Conditions
Min
Typ
Max
Unit
25
W
LED SWITCHING
RON
LEDX,
xLEDY
On−Resistance
VCC = 3 V, 1.25 V v VIN v VCC,
IO = −40 mA
15
RON(FLAT)
LEDX,
xLEDY
On−Resistance Flatness
VCC = 3 V, VIN = 1.25 V and VCC,
IO = −40 mA
8
DRON
LEDX,
xLEDY
On−Resistance Match
Between Switch Pairs
VCC = 3 V, 1.25 V v VIN v VCC,
IO = −40 mA
1
W
2
W
AC ELECTRICAL CHARACTERISTICS (Typicals: T = 25°C, VCC = 3.3 V)*
−405C to +855C
Symbol
Parameters
Pins
Conditions
Min
Typ
Max
Unit
SWITCHING CHARACTERISTICS
tPLH, tPHL
Ax, xBy
tON
tOFF
Propagation Delay
VCC = 3.0 V to 3.6 V (Figure 3)
SEL, xLEDy
Line Enable Time − SEL
to xLEDY
Output: Closed to Open VCC = 3.0 V to
3.6 V (Figure 4)
SEL, xBy
Lines Enable Time − SEL
to xBy
SEL, xLEDy
Line Enable Time − SEL
to xLEDY
SEL, xBy
Lines Enable Time − SEL
to xBy
Output: Open to Closed VCC = 3.0 V to
3.6 V (Figure 4)
0.25
ns
0.5
15
ns
0.5
3
ms
0.5
9
ns
0.5
35
ns
tSK(O)
Ax, xBy
Output Skew between
center port to any other
port
VCC = 3.0 V to 3.6 V (Calculated,
Figure 3)
50
100
ps
tSK(P)
Ax, xBy
Skew between opposite
transition of the same
output (tPHL – tPLH)
VCC = 3.0 V to 3.6 V (Calculated,
Figure 3)
50
100
ps
DYNAMIC ELECTRICAL CHARACTERISTICS
BW
xBy, xLEDy
−3 dB Bandwidth
RL = 100 W (Figure 5)
800
MHz
OIRR
AX, LEDX
Off − Isolation
RL = 100 W, f = 250 MHz (Figure 6)
−37
dB
XTALK
AX to xBY
A(X+2) to
(X+2)BY
Crosstalk
RL = 100 W, f = 250 MHz (Figure 7)
−37
dB
CAPACITANCE
CIN
SEL
Control Pin Input
Capacitance
VIN = 0 V, f = 1 MHz
2
3
pF
CON
AX, xBy
ON Capacitance
VIN = 0 V, f = 1 MHz, Outputs Open,
Switch ON
7
10
pF
COFF
xBy
B Port Switch
Capacitance
VIN = 0 V, f = 1 MHz, Outputs Open,
Switch OFF
5
6
pF
*Guaranteed by design and/or characterization.
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6
NS3L500
VCC
VCC
ANALOG
IN
ON
(xBy, xLEDy)
50%
tPLH
tPHL
CL *
TEST
POINT
GND
SELECT
VOUT
ANALOG
OUT
(Ax, LEDx)
ANALOG OUT
ANALOG IN
50%
*Includes all probe and jig capacitance
Figure 3. Propagation Delay
VCC
NC
Vis
0.1 mF
Open
Input
DUT
50%
50%
0V
Output
VOUT
NO
50 W
VOH
90%
35 pF
90%
Output
VOL
SELECT
tON
Figure 4. tON/tOFF
50 W
DUT
Reference
Input
Output
50 W
VNA Source
Port 1
Control Line
Figure 5. Bandwidth
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7
50 W
VNA Return
Port 2
tOFF
NS3L500
DUT
NC
(Sense)
Transmitted
50 W
Generator
(Force)
COM
Output
50 W
NO
50 W
SEL
Figure 6. Off−Isolation
EXT TRIGGER
BIAS
VBIAS
Network Analyzer
(R&S VNA)
P1
P2
VCC
A0
0B1
A1
1B1
RL = 100 W
0B2
DUT
A2
1B2
2B1
RL = 100 W
A3
3B1
2B2
3B2
SEL
VSEL
1. CL includes probe and jig capacitance.
2. A 50 W termination resistor is needed to match the loading of the network analyzer.
Figure 7. Test Circuit for Crosstalk (XTALK)
Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSEL = 0 and A0 is the input, the output is
measured at 1B1. All unused analog input (A) ports are connected to GND, and output (B) ports are connected to GND through 50 W
pulldown resistors.
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8
NS3L500
APPLICATION INFORMATION
Logic Inputs
Power−Supply Sequencing
The logic control inputs can be driven up to +3.6 V
regardless of the supply voltage. For example, given a
+3.3 V supply, the output enables or select pins may be
driven low to 0 V and high to 3.6 V> Driving IN
Rail−to−Rail® minimizes power consumption.
Proper power−supply sequencing is advised for all CMOS
devices. It is recommended to always apply VCC before
applying signals to the input/output or control pins.
ORDERING INFORMATION
Device
NS3L500MTTWG
Package
Shipping†
WQFN56
(Pb−free)
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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9
NS3L500
PACKAGE DIMENSIONS
WQFN56 5x11, 0.5P
CASE 510AK−01
ISSUE A
ÉÉ
ÉÉ
ÉÉ
A B
D
PIN ONE
LOCATION
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
DETAIL A
ALTERNATE
CONSTRUCTIONS
ÉÉ
ÉÉ
E
EXPOSED Cu
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MOLD CMPD
DETAIL B
0.15 C
ALTERNATE
CONSTRUCTION
TOP VIEW
0.15 C
DETAIL B
(A3)
0.10 C
0.08 C
SIDE VIEW
NOTE 4
A
RECOMMENDED
SOLDERING FOOTPRINT*
A1
C
5.30
SEATING
PLANE
D2
56X
56X
0.63
2.50
0.10 C A B
DETAIL A
MILLIMETERS
MIN
MAX
0.70
0.80
−−−
0.05
0.20 REF
0.20
0.30
5.00 BSC
2.30
2.50
11.00 BSC
8.30
8.50
0.50 BSC
0.20 MIN
0.30
0.50
−−−
0.15
L
1
0.10 C A B
8.50
11.30
E2
PKG
OUTLINE
1
K
0.50
PITCH
56
e
56X
e/2
BOTTOM VIEW
b
0.10 C A B
0.05 C
NOTE 3
56X
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Rail−to−Rail is a registered trademark of Nippon Motorola, Ltd.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NS3L500/D